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Part Manufacturer Description Datasheet BUY
X9428WS16IT1 Intersil Corporation X9428WS16IT1, SOP-16 visit Intersil
X9428WS16 Intersil Corporation X9428WS16, SOP-16 visit Intersil
X9428WS16I Intersil Corporation X9428WS16I, SOP-16 visit Intersil
7008L35G Integrated Device Technology Inc PGA-84, Tray visit Integrated Device Technology Buy
723611L20PQFI9 Integrated Device Technology Inc PQFP-132, Tray visit Integrated Device Technology
7052L25G Integrated Device Technology Inc PGA-108, Tray visit Integrated Device Technology Buy

Tray package so-16

Catalog Datasheet MFG & Type PDF Document Tags

composite to rgb

Abstract: PGA-120 -44 Tray TMC2242AR2C Digital Half-Band Interpolating/Decimating Filter 12-bit In/16-bit Out 60MHz , /Decimating Filter 12-bit In/16-bit Out 60MHz 12 16 55 40 Yes Yes MQFP-44 Tray , 12-bit In/16-bit Out 60MHz 12 16 55 60 Yes Yes MQFP-44 Tray TMC2242AR2C2 , -bit In/16-bit Out 60MHz 12 16 55 30 Yes Yes MQFP-44 Tray TMC2242BR2C , -bit In/16-bit Out 60MHz 12 16 55 40 Yes Yes MQFP-44 Tray TMC2242BR2C1 Digital
Fairchild Semiconductor
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ML6417CHX CCIR601 TMC22153 composite to rgb PGA-120 CCIR 601 matrix Video Filters polar modulator 24 RGB ML6415CS ML6415CSX ML6416CS ML6416CSX LQFP32

POWER INVERTER ON KA7500B

Abstract: KA3525 Consumption Package Packing Tray mW FMS9874AKGC100* 8 3 108 0.5 0.8 ­ 3.3 , Consumption Package Packing Tray mW FMS3110KRC 10 3 100 0.3 0.3 5 655 , Voltage Gain (Typ) V/mV Output Output Slew Gain Package Voltage Voltage Rate BW Swing (low , 700 2.3 200 14 0.5 SIP-9 KA224 Quad 16|32 -25 85 -65 150 5 30 150 0.7 100 5 28 DIP-14 KA224A Quad 16|32 -25 85 -65 150
Fairchild Semiconductor
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POWER INVERTER ON KA7500B KA3525 SMPS KA3525A SENSORS LM358N KA7500B KA7500B application note 247TM

CCGA

Abstract: 938 SO-16 120 24 5 PQFP 24 16 PDIP PD 18 P PD P Devices per Tray Trays , The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each , . Tray OPN Pkg Code AMD Pkg Code Pin/Lead/ Ball Count Pkg Family A BGA 272 A , PBGA BGA 569 PLH 28 Devices per Tray Trays per Box Devices per Box PBGA
Advanced Micro Devices
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CCGA 938 SO-16 tray datasheet bga LQFP 48 Package Box CBF 420 tray BGA 520

T0220FP-5-V5

Abstract: reel Package S 0 P 8 ,14,16,18,20,22,24 SS0 P-A 1 6 ,A 2 0 ,A 24 ,A 3 2 ,P3 2 H SO P2 5 ,2 8 « Quantity 2,000 2,000 2,000 Unit pcs ·E m b o s sed tape and reel Package SM P5 SO P8 SO P 14 SO P 16 , Packaging Specifications Monolithic 1C ^ Package DIP/SDIP SIP/HSIP/ZIP/SZIP Monolithic ICs , reference of packaging specifications SO P/SSO P/HSO P Paper tape on reel Em bossed tape on reel Tray , Tray (dry pack) Em bossed tape on reel VP T0220FP R P M / SM P 5 Polyethylene bag Tube
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T0220FP-5-V5 DIP14 DIP18 IP-24 130X70X510

1895 ic

Abstract: 40DA be (1) corrugated cardboard packing box (2) inside box (3) magazine (or tray or tape). The magazine, tray, or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 1. Cardboard packing box Tape (blue) PP band 2. Inside box Tray Cardboard Magazine Corrugated , Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown
Hitachi Semiconductor
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TFP-32D 1895 ic 40DA tfp 370 IC 404 2620D FP-32D FP-40D FP-44D TFP-32DR TTP-32D

tray matrix bga

Abstract: tray datasheet bga Profile Quad Flat Package (LQFP) All leadcounts Standard: Tray (5 trays) \W or none required , Publication Revision A (3/1/03) 1-6 u Chapter 1 Codes and Carrier Options AMD's IC Package Codes , Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A , Chapter 2 Package Design A 3/1/03 Chapter 3 Board Assembly A 3/1/03 Chapter 4 Package Materials A 3/1/03 Chapter 5 Package Characterization A 3/1/03 Chapter 6 Summary of
Advanced Micro Devices
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tray matrix bga PLCC JEDEC tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD BGA package tray codes

CP-20DA

Abstract: TSOP II 44 REEL Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown , tray, or tape, with the IC being housed inside. In the unsealed mode, the order o f operations should be (1 ) corrugated cardboard packing box - » ( 2 ) inside box - » (3 ) magazine (o r tray or tape). The magazine, tray, or tape is designed so that the p a c k a g e is n o t s u b je c te d to d a m a g e d u rin g transport. W hen the seal is opened, the package should be handled with great care so
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CP-20DA TSOP II 44 REEL CP-32D CP-40D CP-44 CP-52 CP-68 CP-84

IC 404

Abstract: be (1) corrugated cardboard packing box -» ( 2 ) inside box - > (3) magazine (or tray or tape). The magazine, tray, or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 1 , Emboss tape: Tape width 16 to 24 mm Tape withdraw direction Package SOP TSOP 1 Package Code FP , Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown
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FP-28D FP-28DA TFP-28DA TFP-28DAR TFP-28DB TFP-32DA

corrugated carton

Abstract: FP-32D package ) magazine (or tray or tape). The magazine, tray, or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care , Packing Specifications Contents 1. Forms of Package Packing 2. Moistureproof Packing 3. Taping for IC 4. Taping for IC Memorys Packing Specifications 1. Forms of Package Packing The forms of , box in which there is a magazine, a tray, or tape, with the IC being housed inside. In the unsealed
Hitachi Semiconductor
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corrugated carton FP-32D package IC Packing and Labelling Specification TTP-28/24D TTP-28DR TTP-28DA TTP-44/40DA TTP-44/40DAR TTP-44D

bga trays

Abstract: tray 20 x 14 quantities are specified below. Table II. Tray Quantities by Package Type Device Package Type Number , 420 450 420 300 200 135 120 ­3­ a Table II. Tray Quantities by Package Type (continued , Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride , resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type Device Package , Units 300 mil PDIP 8 14 16 18 20 24 28 50 25 25 20 18 15 13 20 20 20 20 20
Analog Devices
Original
bga trays tray 20 x 14 BGA 31 x 31 tray bga tray tray bga 17 E04102
Abstract: be (1) corrugated cardboard packing box - » (2) inside box - » (3) magazine (or tray or tape). The magazine, tray, or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 1. Cardboard packing box Tape (blue) 2. Inside box Corrugated cardboard 3. Magazine, tray or , Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown -
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TFP-32DAR TTP-26/20D TTP-2620DR TTP-32DR TTP-32DB TTP-50/44DC

tfp 370

Abstract: be (1 ) corrugated cardboard packing box -» (2 ) inside box -» (3 ) magazine (or tray or tape). The magazine, tray, or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 2 , width 16 to 24 mm Package SOP TSOP 1 Package Code FP-28D FP-28DA TFP-28DA TFP-28DAR TFP-28DB TFP , Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown
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CP-28DA TTP-50D TTP-50DA TTP-28D TTP-44/40DB TTP-44DB

csp defects

Abstract: handling damage escape from package tray. · Becare of tray handling (Move it on tray bended) Revision 4 (FEB, 2007 , preventing excessive down pressure of nozzle Pick-up nozzle Tray or Reel & Tape pocket H1 Package , USER'S MANUAL (Chip Scale Package) · To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package's characteristics and manuals to maintain high , Handling, No Manual Handling process - Page 1 - Main contents It says understanding of CSP package
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csp defects handling damage LGA socket MANUAL PCB Samsung MCP HCFC141B
Abstract: 19(TRAY) UV R ESIN d SO LD E R DIP 17 UV SEAL 16 SE A L 15 C O IL W IRE , -148D2H 1 0 7 -7 9 0 19(TRAY) n 9 -1 4 4 0 0 0 3 - 5 P C H -1 2 4 D 2 H 24V PCH-124D2H 1 0 7 -7 9 0 19(TRAY) m 1 4 6 1 4 1 0 -3 P C H -1 1 8 D 2 H 18V PCH-118D2H 1 0 7 -7 9 0 19(TRAY) I 9 -1 4 4 0 0 0 3 - 3 P C H -1 1 2 D 2 H 12V PCH-112D2H 1 0 7 -7 9 0 19(TRAY) k , 6 D 2 H 6V PCH-106D2H 1 0 7 -7 9 0 19(TRAY) i 1 0 7 -7 9 0 19(TRAY) 1 9 -1 4 4 0 0 0 3 -
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04ADD CONTACT13

600V igbt dc to dc buck converter

Abstract: TRANSISTOR SMD CODE PACKAGE SOT89 -channel for TDM applications, tray SOCRATESTM (SDC-16i): 2nd generation symmetrical DSL controller for 16 , DUSLICTM-SP: Dual channel subscriber line interface circuit in a single package, 0° C to 70° C, tray DUSLICTM-SP1: Single channel subscriber line interface circuit in a single package, 0° C to 70° C, tray SMD , Package Description C165U: 16-bit microcontroller with HDLC and IOMTM-2, large packing unit 60 pcs, tray C165U: 16-bit microcontroller with HDLC and IOMTM-2, large packing unit 360 pcs, tray C165H: 16
Infineon Technologies
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600V igbt dc to dc buck converter TRANSISTOR SMD CODE PACKAGE SOT89 bts 2140 1b data sheet TRANSISTOR SMD CODE PACKAGE SOT23 PSB 6970 HL V1.3 PEF 24628 E V1.2-G B192-H6780-G11-X-7600 SP000316315 SP000262119 SP000314997 SP000013996 SP000012557

VQFP-100

Abstract: 065j condition DIP/SDIP Package DIP 8 DIP 14,16 Tube SDIP 18,22,24 DIP 18 DIP 28 SCHP30,32 D f>20 ,22 Tube SK -D , x 3 x 460 12.9 x > .3 x 4 6 0 12.9 x > 3 x 4 6 0 SOP/SSOP/HSOP Package SOP8 SOP14,16 Tube , Case (pcs) 200 0 200 500 Tray package Case dimensions 47 , 0. 5+ 0. I O' 15" |[o's±o. 1 O' ~ I 5 ' DIP 16 DIP 18 19 . 4 ± 0. 3 l?6_ o ' , ) 1.27 0 .4 ± 0 . SOP 14 SOP 16 HRHHHHH HTHTBTH .27 0 .4 ± 0 . I SOP 18 SOP2Q
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VQFP-100 065j Tray SOP24 vqfp100 package SQFP-144 BA4558F-T1 DIP20 DIP22 DIP24 DIP28 QFP44 QFP-A64

FAN8035L

Abstract: FAN8035 VREF FOCUS TRACKING INPUT INPUT [SERVO PRE AMP] 16 SLED INPUT SPINDLE INPUT TRAY , drives the tracking actuator, focus actuator, sled motor, spindle motor, and tray motor of the CDP , Disk Player Digital Video Disk Player 48-QFPH-1414 Ordering Information Device Package , REV 16 FWD 15 CTL 14 OUT5 IN5- 13 MUTE12 25 DO6+ FAN8035 Pin , OUT5 O CH5 Op-amp Output 15 CTL I CH6 Motor Speed Control 16 FWD I CH6
Fairchild Semiconductor
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FAN8035L 10MAX 00MAX

cxa1372aq

Abstract: CXA1571M 15 16 · When playing is stopped or the tray is open, the pitch control becomes off. ­ 21 ­ , selected, performs tray loading function. (ii) With portable type selected, displays detection of weak , 17 16 15 SL+ SL0 SL­ FSET ISET 24 23 22 21 20 R3 R4 14 13 12 11 10 , FDFCT FE FZC ATSC TDFCT 1 GND GND GND GND 19 18 17 16 15 14 13 12 GND 25 26 27 28 , NC EO EI TE FE BIAS 11 12 13 14 15 16 RFO FE 17 RFI 19
Sony
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CXP1021Q SPC500 cxa1372aq CXA1571M CXA1372Q CXA1372 KSL 2101 CXD2500BQ CDL-40 80PIN QFP080-P-1420-A QFP-80P-L01

DAEWON tray tsop 48LD

Abstract: nikon v12B failures. 5.2.4 Inspect each package to ensure pin-1 dimple marks are correctly oriented to tray , . Using Non-Precision Vacuum Wand 5.3.3 When removing package from tray, carefully raise device in , lower package towards output tray pocket with correct orientation [based on tray cutout (chamfer) and , . (for package guides) 1(800) 879-4683 (Mt. Prospect, IL) Tray/Tape-In-Tube Packaging Information , Programming Procedures Tray Unstrap Incoming Visual Inspection Tray-to-Programmer Transfer
Intel
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DAEWON tray tsop 48LD nikon v12B 6n1 tube nikon IPC-J-STD-001 GRAINGER

4-1734073-2

Abstract: SPEC. 114 Tyco -1734073-6 TAPE REEL àa-1734073-4 TAPE REEL 2-1734073-2 HARD TRAY 1-1734073-2 WITH 2.5 18.45 1.5 1.8 TAPE REEL 4-1734073-2 HARD TRAY 3-1734073-2 LATCH TAB VOLTAGE D5 D4 D3 PACKAGE TYPE PART NUMBER nm , : 3.1 PRIMARY PACKING: 16 PCS/TRAY 3.2 SECONDARY PACKING: 20 TRAY/BOX(320PCS) 4. WEIGHT: 4.1 NET WEIGHT , REVISIONS 1.6 m ^ LATCH TAB 5-2J 2.17±0.2 1.62±0.2 _£à à 0.05±0.1 io in m 0.7 REVERSE TYPE THIS , QUALIFICATION TEST REPORT NOTES : 1. MATERIAL: 1.1 TRAY: ABS, BLACK COLOR 1.2 SHIPPING BOX: CORRUGATED
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4-1734073-2 SPEC. 114 Tyco corrugated box spec w335 EZ31 1-1734073-2 UL94V-0 31MAR2000 A2-1734073-6 150PCS/REEL 300PCS
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