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Part Manufacturer Description Datasheet BUY
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices

Toshiba NAND BGA 224

Catalog Datasheet MFG & Type PDF Document Tags

Toshiba NAND BGA 224

Abstract: toshiba TC200 TOSHIBA TC220/223 SLI ASIC 0.3µm Standard Cell, Embedded Arrays, Gate Arrays Description , of packaging options available, including BGA, TAB-BGA, heatspreader plastic, QFP, TAB-QFP, and others to suit all applications · 90ps loaded NAND gate delay for high-performance systems · , 176 260 348 TC220C140/640 200,000 327,000 192 284 380 TC220C160/660 224,000 360,000 208 312 420 TC220C180/680 260,000 418,000 224 336 452
Toshiba
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TC223 TC200 TC220C Toshiba NAND BGA 224 toshiba TC200 Toshiba BGA 224 ASIC tc220 TC220 TC220C040/540 TC220C060/560

Toshiba NAND BGA 224

Abstract: IC* MOD* ASIC TOSHIBA TC222C Standard Cell CMOS ASIC Series 0.3µm 2/3V ASICs The TC222C series is a low power , available on a die · A wide range of packaging options available including BGA, TAB-BGA, heatspreader , . TC222C Standard Cell Product Listing (additional Master Slices are available from Toshiba) Reference , 200,000 327,000 192 380 284 TC222C16/66 224,000 360,000 208 420 312 , Metal TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC. 1 TC222C Standard Cell CMOS ASIC Series
Toshiba
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IC* MOD* ASIC Toshiba R3900 TC222 AS31841096

toshiba emmc

Abstract: 153 ball eMMC memory e-MMC Module products housed in 153/169 ball BGA package. This unit is utilized advanced TOSHIBA NAND , Min Performance [MB/sec] TOSHIBA Part Number Density NAND Flash Type Read THGBM1G3D1EBAI8 , THGBM1GxDxEBAIx TOSHIBA e-MMC Module 1GB / 2GB / 4GB / 8GB / 16GB / 32GB INTRODUCTION , e-MMC Module Products ­ Part Numbers TOSHIBA Part Number THGBM1G3D1EBAI8 THGBM1G4D1EBAI7 , x 18.0mm x 1.4mm(max) 14.0mm x 18.0mm x 1.4mm(max) NAND Flash Type 1 x 8Gbit MLC 43nm 1 x 16Gbit MLC
Toshiba
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toshiba emmc 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G 4GB eMMC toshiba 16-GB 32-GB

Toshiba emmc

Abstract: THGBM Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM3G4D1FBAIG , e-MMC Module Products â'" Part Numbers TOSHIBA Part Number Density Package Size NAND Flash , ) TOSHIBA Part Number Density NAND Flash Type Interleave Operation Max Operating Current [mA
Toshiba
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P-TFBGA153-1113-0 eMMC data retention THGBM3G4D1FBAIG BGA 221 eMMC Toshiba emmc performance toshiba

Toshiba NAND 67 Bga

Abstract: TOSHIBA TC160G TOSHIBA System ASIC TC190 Series CMOS ASICs 0.6µ 3.0/3.3V ASIC Family The 0.6µm, 5V TC190 ASIC , packages are availible, including heat spreader plastic QFP, TABFP, BGA, tape BGA and others. ­ New , series ASIC family is manufactured using Toshiba's 0.6µm double and triple layer complimentary , offers Toshiba's high quality and high capacity manufacturing expertise. A partnership with Toshiba , requirement. New packages are continuously being developed. Contact your Toshiba sales representative for the
Toshiba
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TC190G Toshiba NAND 67 Bga TOSHIBA TC160G 568ps TC190G04 tc160g tc170g TC190E TC190C TC160G/170G

Toshiba NAND BGA 224

Abstract: Toshiba emmc Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM3G5D1FBAIE , size) TOSHIBA Part Number Density NAND Flash Type Interleave Operation Typ. Performance , 3.6V 1.65V to 1.95V / 2.7V to 3.6V Operating Current (RMS) TOSHIBA Part Number Density NAND
Toshiba
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THGBM3G THGB THGBM3G5 emmc jedec toshiba emmc 4.41 P-TFBGA169-1216-0

Toshiba NAND BGA 224

Abstract: AS3525C NAND flashes, MMC/SD cards and Memory Stick ensure most flexible system design possibilities. Hardware , voltages out of a single battery supply. CPU, NAND flash, SRAM, memory cards, LCD, LCD backlight and , dual port buffer RAM Nand Flash Interface MMC/SD Card host for multiple card support 4 data line , 7.3.10 I2SOUT - I2S output interface 7.3.11 NAND Flash Interface 7.3.12 DBOP - Data Block Output Port , and PDAs powered by single Li+, AA or AAA batteries. AS3525-A is the package variant with 224 balls
austriamicrosystems AG
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AS3525A/B/C AS3525C BGA-224 C22O22 C22O23 AS3525 200MIPS

TYAD00AC00BUGK

Abstract: SCR Handbook, rca Power Synchronous DRAMs and a 1,107,296,256-bit Nand E2PROM and a 1G-Byte Nand E2PROM device which has NAND memory controller function internally (GBNand). The TYAD00AC00BUGK is available in a 224-pin BGA package making it suitable for a variety of applications. Features Nand E2PROM Features · · , TYAD00AC00BUGK TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM, Nand E2PROM and Giga Byte Nand E2PROM Mixed Multi-Chip Package DESCRIPTION Lead-Free The
Toshiba
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P-FBGA224-1218-0 SCR Handbook, rca GBNAND THGV ACMD18 p-fbga224 001E600 001E800 123KB 003D400 005C000

BGA144 13x13 package

Abstract: DesignWare Hi-Speed USB On-The-Go Controller playback. Furthermore interfaces for NAND flashes, MMC/SD cards and Memory Stick ensure most flexible , management block generates 10 different supply voltages out of a single battery supply. CPU, NAND flash , master · I2S input and output with dual port buffer RAM Nand Flash Interface · 8 and 16bit flash , interface 7.3.9 SPDIF interface 7.3.10 I2SOUT - I2S output interface 7.3.11 NAND Flash Interface , powered by single Li+, AA or AAA batteries. AS3525-A is the package variant with 224 balls intended for
austriamicrosystems AG
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BGA144 13x13 package DesignWare Hi-Speed USB On-The-Go Controller SCR trickle charger circuit trickle battery charger circuit using scr Palmchip designware usb otg AS3525-A/-B ARM922TDMI 250MH

Toshiba NAND BGA 224

Abstract: BGA224 power management block generates 10 different supply voltages out of a single battery supply. CPU, NAND , supported Interrupt Controller Furthermore interfaces for NAND flashes, MMC/SD cards and Memory Stick , buffer RAM Nand Flash Interface â'¢ 8 and 16bit flash support â'¢ 3, 4 & 5 byte address support â , - I2S output interface 7.3.11 NAND Flash Interface 7.3.12 DBOP - Data Block Output Port 7.3.13 , is the package variant with 224 balls intended for full-featured harddisk players, AS3524-B is the
austriamicrosystems AG
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BGA224

hp laptop MOTHERBOARD pcb CIRCUIT diagram

Abstract: hp laptop battery pack pinout advanced surface-mount packaging in fine-pitch small-outline ball-grid-array (BGA) packages, quad flat , , MicroStar BGA, MicroStar Jr., NanoFree, NanoStar, OEC, SCOPE, Shrink Widebus, TI, TI-OPC, UBT, Widebus, and , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . , 2-24 2-24 2-24 2-26 2-26 2-27 2-27 2-28 2-28 2-29 Latches . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NAND Gates . .
Texas Instruments
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hp laptop MOTHERBOARD pcb CIRCUIT diagram hp laptop battery pack pinout hp laptop battery pinout SCBD002C sn74154 4052 IC circuit diagram

CD74HC4050 marking

Abstract: microstar ms 4011 advanced surface-mount packaging in fine-pitch small-outline ball-grid-array (BGA) packages, quad flat , , MicroStar BGA, MicroStar Jr., NanoFree, NanoStar, OEC, SCOPE, Shrink Widebus, TI, TI-OPC, UBT, Widebus, and , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . . , 2-21 2-21 2-23 2-23 2-24 2-24 2-24 2-26 2-26 2-27 2-27 2-28 TABLE OF CONTENTS (continued , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NAND Gates . . . . . . . .
Texas Instruments
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CD74HC4050 marking microstar ms 4011 PLL WITH VCO 4046 appli note philips semiconductors cross index 7 SEGMENT DISPLAY LT 543 PIN CONFIGURATION 8952 microcontroller

MCIMX51RM

Abstract: Reference Manual . 5-13 NAND Flash Controller (NFC) Preset Operation , 22.3.1 22.3.2 22.3.3 22.3.4 22.4 Overview , . 22-4 Functional Description
Freescale Semiconductor
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IMX51RMAD MCIMX51RM Reference Manual Samsung eMMC 4.41 hynix emmc toshiba emmc 4.4 spec mp3 player schematic diagram MCIMX51 EL516

T flip flop IC

Abstract: pin designation for CD40110B IC very small-outline package (TVSOP), and MicroStar BGATM low-profile fine-pitch BGA (LFBGA) package , guide for additional information. DOC, MicroStar BGA, OEC, SCOPE, Shrink Widebus, TI, UBT, Widebus , . . . 1­36 Low-Profile Fine-Pitch BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NAND Gates . . . . , . . . . . . . . . . . . . . . . . 2­21 2­21 2­22 2­23 2­23 2­24 2­24 2­25 2­25 2­25
Texas Instruments
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T flip flop IC pin designation for CD40110B IC 74LS series logic gates 3 input or gate FT 4013 d dual flip flop ic cmos 4011 CD4001* using NAND gates

SN502

Abstract: 163245 in fine-pitch small-outline and ball-grid-array (BGA) packages. The newest package for logic is the MicroStar JuniorTM very-thin, fine-pitch BGA. MicroStar Junior complements the MicroStar BGATM package to , DATA SHEETS http://www.ti.com/sc/logic DOC, MicroStar BGA, MicroStar Junior, OEC, SCOPE, Shrink , . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Texas Instruments
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SN502 163245 cd408 74HCT 4013 ic 4024 7-stage counter application notes signetics SN54F244 SN74F244 SDFS063A D2932 SCYT126 SDYU001O

74HCT 4013

Abstract: CD4078 surface-mount packaging in fine-pitch small-outline and ball-grid-array (BGA) packages. The newest package for logic is the MicroStar JuniorTM very-thin, fine-pitch BGA. MicroStar Junior complements the MicroStar , / cgi-bin/sc/support.cgi DATA SHEETS http://www.ti.com/sc/logic DOC, MicroStar BGA, MicroStar , . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Texas Instruments
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CD4078 SN74ALS679 4093 BF IC 40106 pin diagram philips 74hct data book sn74hcu04 SN54HC240 SN74HC240 SCLS128B HC240 SCET004 SZZU001B

SN502

Abstract: 40106 internal circuit diagram in fine-pitch small-outline and ball-grid-array (BGA) packages. The newest package for logic is the MicroStar JuniorTM very-thin, fine-pitch BGA. MicroStar Junior complements the MicroStar BGATM package to , DATA SHEETS http://www.ti.com/sc/logic DOC, MicroStar BGA, MicroStar Junior, OEC, SCOPE, Shrink , . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Texas Instruments
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40106 internal circuit diagram 88ti CD4527 vhct 244 CD4502 philips hl 5123 SN74LS04 SCAU001A SDYZ001A SN74LS04D SN74LS04DR SN74LS04J

hct 4047 bt

Abstract: SN74ALS679 in fine-pitch small-outline and ball-grid-array (BGA) packages. The newest package for logic is the MicroStar JuniorTM very-thin, fine-pitch BGA. MicroStar Junior complements the MicroStar BGATM package to , DATA SHEETS http://www.ti.com/sc/logic DOC, MicroStar BGA, MicroStar Junior, OEC, SCOPE, Shrink , . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Texas Instruments
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hct 4047 bt FCT Fast CMOS TTL Logic 7804 inverter 74LS 4075 SN74HC139 4069 CMOS hex inverter SN54/74LS123 SDLA006A SDYA012 SDYA010 SN74LS138D SN74LS138DR

ten segment display 74HC

Abstract: CD4000 SERIES BOOK small-outline and ball-grid-array (BGA) packages. The newest package for logic is the MicroStar JuniorTM very-thin, fine-pitch BGA. MicroStar Junior complements the MicroStar BGATM package to deliver high , ://www.ti.com/sc/logic DOC, MicroStar BGA, MicroStar Junior, OEC, SCOPE, Shrink Widebus, TI, TI-OPC, UBT , . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Texas Instruments
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ten segment display 74HC CD4000 SERIES BOOK nobel tv circuit SCLS298 SN74BCT126 ic HC 4066 AG SN54ALS373 SN54AS373 SN74ALS373A SN74AS373 SDAS083B SN74ALS373ADBLE

125c74

Abstract: TTL CI 7805 in fine-pitch small-outline and ball-grid-array (BGA) packages. The newest package for logic is the MicroStar JuniorTM very-thin, fine-pitch BGA. MicroStar Junior complements the MicroStar BGATM package to , DATA SHEETS http://www.ti.com/sc/logic DOC, MicroStar BGA, MicroStar Junior, OEC, SCOPE, Shrink , . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . NAND Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Texas Instruments
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125c74 TTL CI 7805 1A2 CPU TSSOP 20PIN LVCC3 cmos 555 30 pin lvds LG cable pinout SN54HC244 SN74HC244 SCLS130B HC244 SN74HC244DBR SN74HC244DW
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