NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: purposes only and may be trademarks of their respective companies. FBGA User's Guide Chapter 1 , Impact of Die Size Changes on FBGA Package Size . . . . . . . . . . . . . . . . . . . . . . . . . 9 The Impact of Die Size Changes on FBGA Package Size . . . . . . . . . . . . . . . . . . . . . . . . 10 FBGA , offers three families of CSP: Fine-Pitch Ball Grid Array (FBGA), Fortified-BGA and Stacked-MCM Table , Size Changes on FBGA Package Size There are many costs associated with the manufacturing of ... | Original |
97 pages, |
SMD MARKING CODE A12 84 FBGA thermal smd mark code zzz smd marking A26 tsop Ir sensor BGA Solder Ball 0.6mm MAKING A10 BGA SMD MARKING CODE l6 smd marking g8 SMD MARKING CODE A20 IC SOCKET TSOP48 SMT gold metal detectors datasheet abstract |
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| Abstract: JEDEC-standard ball-out · Low-profile package · TC of 0°C to 95°C 0°C to 85°C: 8192 refresh cycles in 64ms , x 8 banks x 2 ranks 32 Meg x 8 x 8 banks x 2 ranks · FBGA package (lead-free) 82-ball FBGA (12.5 x 15 x 1.35mm) Rev. A 78-ball FBGA (9 x 11.5 x 1.2mm) Rev. D · Timing cycle time1 1.5ns , · Operating temperature Commercial (0°C TC 95°C) · Revision (82-ball FBGA) · Revision (78-ball FBGA) 1G4 512M8 512M8 THU THD -15 -15E -187 -187E -187E -25 -25E None None :A :D Notes ... | Original |
14 pages, |
Theta JC of FBGA MT41J512M4 78 ball fbga thermal resistance MT41J1G4 DDR3-1333 DDR3-1066 srt 8n 2Gb DDR3 SDRAM twindie MT41J512 MT41J256M8 "2Gb DDR3 SDRAM" MT41J512M8 MT41J1G4 abstract |
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| Abstract: Meg x 4 x 8 banks x 2 ranks 32 Meg x 8 x 8 banks x 2 ranks · FBGA package (Pb-free) 63-ball FBGA (12mm x 14mm) Rev. A 63-ball FBGA (9mm x 11.5mm) Rev. C · Timing cycle time1 2.5ns @ CL = , · VDD = VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball FBGA · Low-profile package 1.35mm MAX , Figure 1: 63-Ball FBGA x4, x8 Ball Assignments (Top View) 1 2 3 4 5 6 7 8 9 , reserved. 4Gb: x4, x8 TwinDie DDR2 SDRAM Ball Assignments and Descriptions Table 3: FBGA 63-Ball ... | Original |
16 pages, |
TN-00-08 DDR2-533 DDR2-667 DDR2-800 IDD3P marking WMM MICRON 63 MT47H1G4 SAC305 63-ball MT47H512M8 MT47H1G4 abstract |
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| Abstract: VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball FBGA · Low-profile package 1.35mm MAX thickness , · Configuration 64 Meg x 4 x 8 banks x 2 ranks 32 Meg x 8 x 8 banks x 2 ranks · FBGA package (Pb-free) 63-ball FBGA (12mm x 14mm) Rev. A 63-ball FBGA (9mm x 11.5mm) Rev. C · Timing cycle time1 , and Descriptions Figure 1: 63-Ball FBGA x4, x8 Ball Assignments (Top View) 1 A B C D E VDDL , Ball Assignments and Descriptions Table 3: FBGA 63-Ball Descriptions Symbol A[14:0] Type Input ... | Original |
16 pages, |
IDD3P MT47H512M8 68 ball fbga thermal resistance MT47H1G4 MT47H1G4 abstract |
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| Abstract: · 1.35V center-terminated push/pull I/O · JEDEC-standard ball-out · Low-profile package · TC of 0°C , of the 4Gb DDR3L SDRAM). Refer to Micron's 4Gb DDR3L SDRAM data sheet for the specifications not , Configuration 128 Meg x 4 x 8 banks x 2 ranks 64 Meg x 8 x 8 banks x 2 ranks · FBGA package (Pb-free) 78-ball FBGA (10.5mm x 12mm x 1.2mm) 78-ball FBGA (9.5mm x 11.5mm x 1.2mm) · Timing cycle time1 , Ball Assignments and Descriptions Ball Assignments and Descriptions Figure 1: 78-Ball FBGA Ball ... | Original |
13 pages, |
MT41K2G4 MT41K1G8 MT41K2G4 abstract |
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| Abstract: TC of 0°C to 95°C 0°C to 85°C: 8192 refresh cycles in 64ms 85°C to 95°C: 8192 refresh cycles in , two ranks of the 2Gb DDR3L SDRAM). Refer to Micron's 2Gb DDR3L SDRAM data sheet for the specifications , Meg x 4 x 8 banks x 2 ranks 32 Meg x 8 x 8 banks x 2 ranks · FBGA package (Pb-free) 78-ball FBGA (9mm x 11.5mm x 1.2mm) 78-ball FBGA (8mm x 11.5mm x 1.2mm) · Timing cycle time1 1.25ns @ CL = 11 , Assignments and Descriptions Ball Assignments and Descriptions Figure 1: 78-Ball FBGA Ball Assignments ... | Original |
13 pages, |
MT41K512M8 DDR3L sac305 MT41K1G4 MT41K1G4 abstract |
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| Abstract: banks x 2 ranks 16 Meg x 8 x 8 banks x 2 ranks · FBGA package (lead-free) 78-ball FBGA (9mm x 11.5mm) 78-ball FBGA (8mm x 11.5mm) · Timing cycle time1 1.5ns @ CL = 10 (DDR3-1333 DDR3-1333) 1.5ns @ , TC of 0°C to 95°C 0°C to 85°C: 8192 refresh cycles in 64ms 85°C to 95°C: 8192 refresh cycles in , FBGA Ball Assignments (Top View) 1 2 3 4 5 6 7 8 9 VSS VDD NC , 3: 78-Ball FBGA Ball Descriptions Symbol Type Description A13, A12/BC A12/BC#, A11, A10/AP A10/AP ... | Original |
11 pages, |
TN-00-08 DDR3-1066 DDR3-1333 MT41J128M8 "DDR3 SDRAM" MT41J256M4 MT41J512M4 srt 8n 2Gb DDR3 SDRAM twindie MT41J256M8 MT41J512M4 abstract |
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| Abstract: 8 x 8 banks x 2 ranks · FBGA package (lead-free) 63-ball FBGA (9mm x 11.5mm) · Timing cycle , Figure 1: 63-Ball FBGA Assignments x4, x8 (Top View) 1 2 3 4 5 6 7 VDD NF , Descriptions Table 3: 63-Ball FBGA Ball Descriptions x4, x8 Symbol Type Description A[13:0 , out of the memory array in the respective bank. A10 sampled during a precharge command determines , are sampled on the crossing of the positive edge of CK and the negative edge of CK#. Clock enable ... | Original |
11 pages, |
TN-00-15 DDR2 SDRAM Meg x 16 x 16 banks DDR2-533 DDR2-667 DDR2-800 marking micron ddr2 marking WMM MICRON 63 MT47H256M8 MT47H512M4 TN-00-08 63 ball fbga thermal resistance micron MT47H512M4 abstract |
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| Abstract: ranks · FBGA package (lead-free) 65-ball FBGA (9.0mm x 11.5mm) · Timing cycle time 5.0ns @ CL = 3 , Assignments and Descriptions Ball Assignments and Descriptions Figure 1: 65-Ball FBGA Ball Assignments , Descriptions Table 3: 65-Ball FBGA Ball Descriptions Symbol Type Description A[13:0] Input , column address and auto precharge bit (A10) for READ/WRITE commands, to select one location out of the , is considered part of the command code. Clock: CK and CK# are differential clock inputs. All address ... | Original |
11 pages, |
TN-00-08 SAC305 DDR2-667 DDR2-533 DDR2-400 MT47H1G4 MT47H512M8 MT47H1G4 abstract |
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| Abstract: Meg x 8 x 8 banks x 2 ranks · FBGA package (lead-free) 63-ball FBGA (8mm x 10mm) · Timing cycle , Ball Assignments and Descriptions Figure 1: 63-Ball FBGA Assignments x4, x8 (Top View) 1 A VDD , Table 3: Symbol A[13:0] 63-Ball FBGA Ball Descriptions x4, x8 Type Input Description Address , ) for READ/WRITE commands, to select one location out of the memory array in the respective bank. A10 , control, command, and address input signals are sampled on the crossing of the positive edge of CK and the ... | Original |
10 pages, |
TN-00-08 63-ball MT47H512M4 MT47H256M8 MT47H512M4 abstract |
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