Datasheet Search Results			1 - 1 of about 1 for Thermal
	Thermal	Advanced Micro Devices	Thermal Resistance Analysis Update	133.37 Kb,  59 Pages.

Fulltext Datasheet Results		1 - 50 of about 10000+ for Thermal
	First line: thermal diode ISL5216 A_15 A_14 A_13 A_12 A_11 A_10 A_09 A_08 A_07 A_06 A_05 A_04 A_03 A_02 A_01 A_00 ENIAb B_15 B_14 B_13 B_12 B_11 B_10 B_09 B_08 B_07 B_06 B_05 B_04 B_03 B_02 B_01 B_00 ENIBb C_15 C_14 C_13 C_12 C_11 C_10 C_09 C_08 C_07 C_06 C_05 C_04 C_03 C_02 C_01 C_00 ENICb D_15 D_14 D_13 D_12 Abstract: .. Thermal Thermal Thermal Thermal Thermal. Thermal Thermal Thermal Thermal Thermal. NC NC. NC. Dm1. NC NC. NC. Bm1 Am1. NC NC. ADD_2. INTRPT. GND GND. Vcc2 Vcc2 Vcc1 Vcc1. D_09. C_15 C_14 C_13 C_12 C_11 C_10 C_09 C_08 ..  Tags: thermal diode thermal transistor  Thermal  SD2C   ISL5216	5.26 Kb	1 Pages	Original
	First line: HSP50216 A_15 A_14 A_13 A_12 A_11 A_10 A_09 A_08 A_07 A_06 A_05 A_04 A_03 A_02 A_01 A_00 ENIAb B_15 B_14 B_13 B_12 B_11 B_10 B_09 B_08 B_07 B_06 B_05 B_04 B_03 B_02 B_01 B_00 ENIBb C_15 C_14 C_13 C_12 C_11 C_10 C_09 C_08 C_07 C_06 C_05 C_04 C_03 C_02 C_01 C_00 ENICb D_15 D_14 D_13 D_12 D_11 D_10 D_0 Abstract: .. Thermal Thermal Thermal. Thermal Thermal. Thermal Thermal. Thermal Thermal. Thermal Thermal. Thermal Thermal. Thermal Thermal. Thermal. Thermal Thermal. Thermal Thermal. Thermal Thermal. Thermal ..  Tags: thermal transistor  SD1C   HSP50216	5.14 Kb	1 Pages	Original
	First line: DEFLECTION BIPOLAR TRANSISTORS Multi-epitaxial Planar THERMAL OXIDE P-VAPOX Abstract: .. THERMAL OXIDE. BIPOLAR TRANSISTORSBIPOLAR TRANSISTORS. Applications DC/DC Converter General Fast Switching Motor Drive Horizontal Deflection Electronic Ignition. Features Icm up to 70A Vceo ..  Tags: DEFLECTION transistors planar  transistors equivalent  transistors  transistor*  thermal transistor  switching transistor  switching  SILICON GENERAL  motor  ignition DRIVE  ignition*   datasheet abstract..	22.71 Kb	1 Pages	Original
	First line: Amplifiers 2NXXX transistor pdf BDXXX*� BDXXX* BIPOLAR TRANSISTORS Epibase Technology GLASS THERMAL OXIDE P-VAPOX Abstract: .. THERMAL OXIDEGLASS Al P-VAPOX. yvon1SEC3. BIPOLAR TRANSISTORSBIPOLAR TRANSISTORS. Commodity Part Numbers. Features. More than 55 silicon lines. Icm up to 40A Vceo up to 150V 150V . Variety of package options ..  Tags: BDXXX* BDXXX*Â 2NXXX transistor pdf Amplifiers voltage regulators datasheets  transistors equivalent  transistors  transistor equivalent book  transistor*  thermal transistor  solenoid driver  Semiconductor Technology  Regulators  P diode  linear voltage regulators   datasheet abstract..	26.67 Kb	1 Pages	Original
	First line: thermal printer printer EPL1900 ept2000 Product Printer Unit Printer Unit Printer Unit Printer Unit Printer Unit Printer Unit Types Serial Thermal Printer Unit Serial Thermal Printer Unit Line Thermal Printer Unit Line Thermal Printer Unit Line Thermal Printer Unit Line Thermal Printer Unit Part EPT Abstract: .. Serial Thermal Printer Unit. Serial Thermal Printer Unit. Line Thermal Printer Unit. Line Thermal Printer Unit. Line Thermal Printer Unit. Line Thermal Printer Unit. CONTENTS. Product Types Page Part ..  Tags: ept2000 thermal printer  thermal diode  printer  epl1900*  epl* Thermal printer   EPT2000 EPT2200 EPL1900 EPL1800 EPL1600 EPL1700	7.02 Kb	1 Pages	Original
	First line: ASTM d4066 KEYSTONE d4066 ASTM-D4066 ASTM-D4066* 4-40 Lockwasher Shoulder Washer Heatsink (not supplied) TW12 Thermal Washer 4-40 7/16 Screw Package Product (not supplied) Customer Thru .031 .040 Abstract: .. TW12 TW12 Thermal Washer 1 Shoulder Washer 2 No. 4 Lockwasher 2 4-40 Hex Nut 2 SIP Package Product not supplied Ø.218. Ø.115 Thru. Ø.135 .031. .040. Shoulder Washer Dimensions Keystone Part No. ..  Tags: ASTM-D4066* ASTM-D4066 d4066 KEYSTONE ASTM d4066   datasheet abstract..	443.6 Kb	1 Pages	Original
	First line: heatsink Diamond Power Products NX-SERIES IGBTS Provide Customer Value Advantage Standard Package IGBTs with Lowest Thermal Resistance Abstract: .. Provide Customer Value Advantage Standard Package IGBTs with Lowest Thermal Resistance Powerex NX-Series IGBT modules feature high thermal conductivity Aluminum Nitride AlN ceramic to ..  Tags: heatsink   datasheet abstract..	155.57 Kb	1 Pages	Original
	First line: diode 1,5k transistor Abstract: .. Thermal Diode-Connected Transistor ..  Tags: transistor diode 1,5k	Kb	Pages	OCR Scan
	First line: shock sensor Reliability Testing TESTING USP2446 Previous Continue Appendix next pages outline test results Mechanical Shock, Sinusoidal Vibration Thermal Shock this device. U.S. Sensor 1832 Collins Orange, 92867 Tel: 800-777-6467 Tel: 714-639-1000 Fax: 714-639-1220 Email: sales@ussensor.com Abstract: .. pages outline the test results of Mechanical Shock, Sinusoidal Vibration and Thermal Shock for this device. � Previous Continue � Top ^. ..  Tags: shock sensor   USP2446	80.87 Kb	1 Pages	Original
	First line: Flasher* thermal fuse Part: FLR569 Series: Aftermarket Three Terminal Variable Thermal Flashers Automobiles Light Trucks Technology:Automotive Aftermarket Products PARAMETERS Package Type Mount Method Type Mount Boxed Amperage Rating Rating 0.00 Fuse Package Size Size Market Voltage Rating Flasher T Abstract: .. Part: FLR569 FLR569 . Series: Aftermarket - Three Terminal Variable Thermal Flashers For Automobiles and Light Trucks Technology:Automotive Aftermarket Products. PARAMETERS. Package Type Pkg Type ..  Tags: THERMAL Fuse  fuse box  Fuse  Flasher*  Electronic fuse  automotive   FLR569	25.99 Kb	1 Pages	Original
	First line: MO-241 Notes: dimensions Angles degrees. Coplanarity applies exposed well terminals. Refer JEDEC MO-241 Thermal soldering area (mesh stencil design recommended) DATE: 09/07/10 DESCRIPTION: 12-contact, Thin Quad Flat No-Lead (TQFN) PACKAGE CODE: ZK12 DOCUMENT CONTROL PD-2059 REVISION: Abstract: .. Thermal pad soldering area mesh stencil design is recommended ..  Tags: MO-241   MO-241 PD-2059	66.83 Kb	1 Pages	Original
	First line: FAX# (408) 944-0970 Recommended Land Pattern HMLF 3.0x3.5 Lead HMLF3035D-14LD-LP-1 units Tolerance 0.05 noted circle indicates Thermal Via. Size should .300-.350 diameter should connected plane maximum thermal performance. Abstract: .. Red circle indicates Thermal Via. Size should be .300-.350 mm in diameter and it should be connected to GND plane for maximum thermal performance. ..  Tags:   HMLF3035D-14LD-LP-1	15.75 Kb	1 Pages	Original
	First line: thermal analysis on pcb 105-FBGA-0808 105-FBGA-0808 Thermal Analysis Electrical Analysis Abstract: .. â â Thermal Analysis Thermal Analysis. â â Electrical Analysis Electrical Analysis. ❑ ❑ PCB layer standard 4layers. PCB layer standard 4layers. U N D E R U N D E R S I M U L AT I O N S I M U L AT I O N ..  Tags: thermal analysis on pcb   datasheet abstract..	27.44 Kb	2 Pages	Original
	First line: 49-FBGA-0606 49-FBGA-0606 Thermal Analysis Electrical Analysis Abstract: .. â â Thermal Analysis Thermal Analysis. â â Electrical Analysis Electrical Analysis. ❑ ❑ PCB layer standard 4layers. PCB layer standard 4layers. U N D E R U N D E R S I M U L AT I O N S I M U L AT I O N ..  Tags:   datasheet abstract..	24.23 Kb	2 Pages	Original
	First line: 128-FBGA-0808 128-FBGA-0808 Thermal Analysis Electrical Analysis Abstract: .. â â Thermal Analysis Thermal Analysis. â â Electrical Analysis Electrical Analysis. ❑ ❑ PCB layer standard 4layers. PCB layer standard 4layers. U N D E R U N D E R S I M U L AT I O N S I M U L AT I O N ..  Tags:   datasheet abstract..	28.43 Kb	2 Pages	Original
	First line: MO-220, DATE: 02/17/09 Notes: dimensions millimeters, angles degrees. Coplanarity applies exposed thermal well terminals. Refer JEDEC MO-220 Recommended Land Pattern reference only. Thermal Soldering Area DESCRIPTION: 42-contact Thin Fine Pitch Quad Flat No-Lead (TQFN) PACKAGE CODE: (ZH42) DOCUMENT Abstract: .. 2. Coplanarity applies to the exposed thermal pad as well as the terminals. 3. Refer JEDEC MO-220 MO-220 4. Recommended Land Pattern is for reference only. 5. Thermal Pad Soldering Area. 09-0116. ..  Tags: MO-220,   MO-220 PD-2035	226.9 Kb	1 Pages	Original
	First line: paint with TO-220 packages Part Number 6025B-TT Mechanical Outline Drawing Thermal Curves Abstract: .. Thermal Curves. Product Information. Part # Description Finish Board Mounting. 6025B-TT 6025B-TT Black paint with solderable tabs Black Paint View Hole Dimensions. This non-electronic component is functionally ..  Tags: TT 220  TO-220 package thermal resistance  thermal resistance  paint   datasheet abstract..	71.24 Kb	1 Pages	Original
	First line: Aluminum alloy - 8053 NTE406 Hardware Heat Sink TO202 Type Package Description: NTE406 compact, slide-on heat sink with device catch with TO202 type packages. Specifications: Finish Pre-Black Anodize Material Aluminum Alloy Thermal Resistance (Note 25.00 Note Thermal resistance value based +75°C Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 25.00 . . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. .300 7.62 Outer Dia. .850 21.6 .250 6.35 ..  Tags: Aluminum alloy - 8053   NTE406	40.6 Kb	1 Pages	Original
	First line: TO5 package diode 351 TO39 TO39 Package To5 transistor NTE401 Hardware Heat Sink TO5/TO39 Type Package Description: NTE401 cost, easily installed, push-on heat sink. This device installed after assembly takes little additional board space. Specifications: Finish Black Anodize Material Aluminum Alloy Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 40.00 . . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. .875 22.2 .351 8.9 .531 13.5 ..  Tags: To5 transistor TO39 Package TO39 diode 351 TO5 package   NTE401	40.57 Kb	1 Pages	Original
	First line: package to220 Aluminum alloy - 8053 NTE406A Hardware Heat Sink TO220 Type Package Description: NTE406A cost clip-on heat sink featuring locking with TO220 type packages. Specifications: Finish Pre-Black Anodize Material Aluminum Alloy Thermal Resistance (Note 23.00 Note Thermal resistance value base Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 23.00 . . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. .400 10.16 .268 6.81 .800 20.32 .650 16 ..  Tags: Aluminum alloy - 8053 package to220   NTE406A	40.45 Kb	1 Pages	Original
	First line: FAX# (408) 944-0970 Recommended Land Pattern HMLF 3.0x3.0 Lead HMLF33D-12LD-LP-1 units Tolerance 0.05 noted circle indicates Thermal Via. Size should .300-.350 diameter should connected plane maximum thermal performance. Abstract: .. Red circle indicates Thermal Via. Size should be .300-.350 mm in diameter and it should be connected to GND plane for maximum thermal performance. ..  Tags:   HMLF33D-12LD-LP-1	16.09 Kb	2 Pages	Original
	First line: FAX# (408) 944-0970 Recommended Land Pattern TMLF 2.5x2.5 Lead TMLF2525D-12LD-LP-1 units Tolerance 0.05 noted circle indicates Thermal Via. Size should .300-.350 diameter should connected plane maximum thermal performance. Abstract: .. Red circle indicates Thermal Via. Size should be .300-.350 mm in diameter and it should be connected to GND plane for maximum thermal performance. ..  Tags:   TMLF2525D-12LD-LP-1	15.72 Kb	1 Pages	Original
	First line: DATE: 02/11/09 Notes: dimensions millimeters, angles degrees. Coplanarity applies exposed thermal well terminals. Refer JEDEC MO-220 Recommended land pattern reference only. Thermal soldering area 09-0091 DESCRIPTION: 48-Pin, Thin Fine Pitch Quad Flat No-Lead (TQFN) PACKAGE CODE: ZB48 DOCUMENT CONTR Abstract: .. 2. Coplanarity applies to the exposed thermal pad as well as the terminals. 3. Refer JEDEC MO-220 MO-220 4. Recommended land pattern is for reference only. 5. Thermal pad soldering area. 09-0091. ..  Tags:   MO-220 PD-2080	266.88 Kb	1 Pages	Original
	First line: MO-137 Notes: dimensions Angles degrees. Coplanarity applies exposed thermal well terminals. Refer JEDEC MO-137 Recommended land pattern reference only. Thermal soldering area (mesh stencile design recommended). DATE: 10/05/10 DESCRIPTION: 56-Pin, Thin Fine Pitch Quad Flat No-lead, TQFN PACKAGE CODE Abstract: .. 2. Coplanarity applies to the exposed thermal pad as well as the terminals. 3. Refer JEDEC MO-137 MO-137 AE 4. Recommended land pattern is for reference only. 5. Thermal pad soldering area mesh stencile ..  Tags: MO-137   MO-137 PD-2008	74.48 Kb	1 Pages	Original
	First line: LM3551/2 COMP ERROR Duty Oscillator Cycle Limit Reset Reset Drive LOGIC Thermal FET-T FET-F Abstract: .. AMP Duty Oscillator Cycle Limit Set Reset Reset Drive LOGIC OVP UVP Thermal SD FET-T FET-F T/F SD /EN � SS f sw Load Current Measurement —> LM3551 LM3551 OVP jA/Y^ LM3552 LM3552 GND VC ï É FTO AGND SD/EN OVP V, M GND ..  Tags:   datasheet abstract..	38.95 Kb	1 Pages	OCR Scan
	First line: shock sensor Reliability Testing TESTING USP2373 Previous Continue Appendix next three pages outline results Salt Water Immersion testing well Thermal Shock testing 100,000 cycles U.S. Sensor 1832 Collins Orange, 92867 Tel: 800-777-6467 Tel: 714-639-1000 Fax: 714-639-1220 Email: sales@ussensor.com Abstract: .. pages outline the results of Salt Water Immersion testing as well as Thermal Shock testing at 200 and 100,000 cycles . � Previous Continue � Top ^. ..  Tags: shock sensor   USP2373	77.87 Kb	1 Pages	Original
	First line: thermal fuse fuse FLR536/552 Aftermarket Terminal Universal Variable Thermal Flashers Aftermarket Automobiles Manufactured Series: (boxed) Technology: Automotive Aftermarket Products PARAMETERS Package Type Mount Method Type Mount Boxed Amperage Rating Rating 0.00 Fuse Package Size Size Market Volta Abstract: .. Part: FLR536 FLR536 /552. Series: Aftermarket - Two Terminal Universal Variable Thermal Flashers Aftermarket - For Automobiles Manufactured in the USA boxed Technology: Automotive Aftermarket ..  Tags: THERMAL Fuse  fuse box  fuse  Flasher  Electronic fuse   FLR536 552	23.37 Kb	1 Pages	Original
	First line: θjc　* G30-88 JESD51-9 Thermal Characteristics Information(1) Definition Thermal Resistance general, thermal performance electronic package represented kinds thermal resistance,ja Heat dissipation path package equivalent thermal resistance network described following figures, respectively. Junctio Abstract: .. ○ In general, thermal performance of electronic package is represented by. two kinds of thermal resistance,θja and θjc. ○ Heat dissipation path in a package and the equivalent thermal resistance ..  Tags: JESD51-9 G30-88 θjcã��*   datasheet abstract..	44.27 Kb	2 Pages	Original
	First line: DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS POST OFFICE 3990 COLUMBUS, 43216-5000 REPLY REFER DSCC-VAC Abstract: .. SUBJECT: Dated Engineering Practices EP Study to Determine the Optimal Thermal Format Requirements - Project Number: 5961- 2363. Findings and recommendations Engineering Practices EP ..  Tags:   datasheet abstract..	11.76 Kb	3 Pages	Original
	First line: DO3 package Heatsink type TO-202 package. With added hardware. Trim, profile, minimum space. Thermal resistance value based 75°C rise natural convection. brand Info, Mechanical Outline Drawing Abstract: .. Thermal resistance value is based. on a 75 �C rise in natural convection. Info, Mechanical Outline Drawing. Part# Finish A size mm inch Therm. resist. �C/W Cross Aavid DO1 Black Anodize ..  Tags: TO-202 transistor  DO3 package  DO3 diodes equivalent   datasheet abstract..	62.58 Kb	1 Pages	Original
	First line: Aluminum alloy - 8053 NTE498 Hardware Heat Sink Plastic Power Type Package Description: NTE498 extruded heat sink with radial fins notched base specifically designed mount plastic case type semiconductors. Specifications: Finish Black Anodize Material Aluminum Alloy Thermal Resistance (Note 10.40 No Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 10.40 . . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. 1.000 25.4 1.375 35.0 .438 11.1 .625 15 ..  Tags: Aluminum alloy - 8053   NTE498	48.97 Kb	1 Pages	Original
	First line: TO126 package Aluminum alloy - 8053 to126 NTE493 Hardware Heat Sink TO126 Type Package Description: NTE493 cost, easy use, slip-in heat sink. This device installed before after assembly. Specifications: Finish Black Anodize Material Aluminum Alloy Thermal Resistance (Note 26.00 Note Thermal resistan Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 26.00 . . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. .320 8.13 .100 2.54 .312 7.92 .775 19 ..  Tags: to126 Aluminum alloy - 8053 TO126 package   NTE493	42.47 Kb	1 Pages	Original
	First line: Aluminum alloy - 8053 NTE400 Hardware Heat Sink TO5/TO39 Type Package Description: NTE400 cost, easily installed, push-on heat sink. This device installed after assembly takes little additional board space. Specifications: Finish Black Anodize Material Aluminum Alloy Thermal Resistance (Note 56.00 N Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 56.00 . . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. .315 8.0 .375 9.5 .400 10.16 .750 19.05 ..  Tags: Aluminum alloy - 8053   NTE400	39.5 Kb	1 Pages	Original
	First line: package to220 Aluminum alloy - 8053 NTE494 Hardware Heat Sink TO220 Type Package Description: NTE494 small, plug-in heat sink with fins both sides that provide excellent circulation mounted either horizontally vertically. Specifications: Finish Black Anodize Material Aluminum Alloy Thermal Resistanc Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 27.30 . . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. .750 19.05 .030 0.76 .032 0.81 .500 12 ..  Tags: Aluminum alloy - 8053 package to220   NTE494	41.88 Kb	1 Pages	Original
	First line: ALLOY 52 TO18 package Aluminum alloy - 8053 NTE412 Hardware Heat Sink TO18 Type Package Description: NTE412 very cost 1-peice heat sink plastic "D", plastic TO18, metal TO18 type transistors. Unit presses onto case requiring special assembly tool installed after sembly. Specifications: Fin Abstract: .. . . . . . . . . . . . . . . . . . . Thermal Resistance Note 1 100.00 . . . . . . . . Note 1. Thermal resistance value is based on. a +75 �C rise in natural convection. .500 12.7 .212 5.38 .178 4.52 .235 5.9 ..  Tags: Aluminum alloy - 8053 TO18 package ALLOY 52   NTE412	40.53 Kb	1 Pages	Original
	First line: FAX# (408) 944-0970 Recommended Land Pattern 1.6x1.6 Lead MLF1616D-6LD-LP-1 units Tolerance 0.05 noted circle indicates Thermal Via. Size should .300-.350 diameter should connected plane maximum thermal performance. Abstract: .. Red circle indicates Thermal Via. Size should be .300-.350 mm in diameter and it should be connected to GND plane for maximum thermal performance. ..  Tags:   MLF1616D-6LD-LP-1	15.49 Kb	1 Pages	Original
	First line: 6063 Model 077 MBH37 MBH37.5002 SERIES MECHANICAL DRAWING Process:Precision Forge Material:AL 6063 Finish:Black Anodize MBH37.5002-12W/2.6 MBH37.5002-21W/2.6 MBH37.5002-33W/2.6 Abstract: .. THERMAL PERFORMANCE CURVE: MBH37 MBH37 .5002 SERIES MECHANICAL DRAWING. MBH37 MBH37 .5002-12W 5002-12W /2.6. MBH37 MBH37 .5002-21W 5002-21W /2.6. MBH37 MBH37 .5002-33W 5002-33W /2.6. Material:AL 6063. Finish:Black Anodize. MODEL. 0. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10 ..  Tags: MBH37 Model 077 6063  5002   MBH37	95.9 Kb	1 Pages	Original
	First line: Model 077 MBH33002 SERIES MECHANICAL DRAWING Process:Precision Forge Material:AL 6063 Finish:Black Anodize MODEL MBH33002-12W/2.6 MBH33002-21W/2.6 MBH33002-33W/2.6 HEIGHT 11.6[0.457] 20.6 [0.811] 32.6 [1.283] Abstract: .. THERMAL PERFORMANCE CURVE: MBH33002 MBH33002 SERIES MECHANICAL DRAWING. MBH33002-12W MBH33002-12W /2.6. MBH33002-21W MBH33002-21W /2.6. MBH33002-33W MBH33002-33W /2.6. Material:AL 6063. Finish:Black Anodize. MODEL. 0. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 0 100 200 ..  Tags: Model 077 velocity  6063   MBH33002 MBH33002-12W 2 MBH33002-21W 2 MBH33002-33W 2	93.67 Kb	1 Pages	Original
	First line: Thermal Data SOT-223 leads Abstract: .. Thermal Resistance & Maximum Power Dissipation vs P.C.B. Copper Area. Tj = Ta + Pd*Rtj-a 2 oz. Copper. 0 200 400 600 800 1,000. 40. 60. 80. 100. 120. 140. 160. 0. 0.5. 1. 1.5. 2. 2.5. Area [mm^2] Rtja [ �/W] Pd[W] Tj-Ta ..  Tags: sot-223  copper thermal   datasheet abstract..	23.22 Kb	1 Pages	Original
	First line: 250VAC Circuit Breakers Series Abstract: .. Type Thermal Thermal. Switch Circuit Function. SPST, Series, Trip SPST, Series, Trip. Current Rating. 1 − 35A 250mA 250mA − 20A. Operating Voltage. 50VDC 50VDC , 250VAC 250VAC @ 50/60Hz 60Hz . 32VDC 32VDC , 250VAC 250VAC @ 50/60Hz 60Hz . Activator ..  Tags: ROCKER SWITCH*  reset switch  pushbutton*  circuit-breakers*  250VAC  250mA  "Rocker Switch"   datasheet abstract..	62.13 Kb	1 Pages	Original
	First line: thermal fuse FLR550 Aftermarket Three Terminal Variable Thermal Flashers Trucks Manufactured Automobiles Series: Manufactured Outside Technology: Automotive Aftermarket Products PARAMETERS Package Type Mount Method Type Mount Boxed Amperage Rating Rating 0.00 Fuse Package Size Size Market Voltage Ra Abstract: .. Part: FLR550 FLR550 . Series: Aftermarket - Three Terminal Variable Thermal Flashers For Trucks Manufactured in the US and Automobiles Manufactured Outside the US Technology: Automotive Aftermarket ..  Tags: THERMAL Fuse   FLR550	26.79 Kb	1 Pages	Original
	First line: infinity washers VHS-95 Extruded Heat Sink Features Designed half-brick converters Keeps converters cool with natural convection forced Includes mounting screws washers Black anodized finish Material: extruded 6063P5 aluminum Abstract: .. Thermal Data. Weight: 2.4oz 68g net Mounting Hardware: 4xM3x12mm 4xM3x12mm screw with washer. ..  Tags: washers infinity sink transistor  9615  68g diode   VHS-95	119.95 Kb	1 Pages	Original
	First line: PD-2032 Notes: dimensions Angles degrees. Coplanarity applies exposed well terminals. Refer JEDEC MO-241 Recommended land pattern reference only. Thermal soldering area (mesh stencil design recommended) DATE: 09/07/10 DESCRIPTION: 20-contact, Very Thin Quad Flat No-Lead (TQFN) PACKAGE CODE: ZH20 DOC Abstract: .. 5. Thermal pad soldering area mesh stencil design is recommended ..  Tags: PD-2032   MO-241 PD-2032	76.44 Kb	1 Pages	Original
	First line: SCR/GTO/Diode POW-R-BLOKTM Modules Ratings Characteristics Figure Reverse Recovery Waveform Parameter Definitions Figure 1.10 Transient Thermal Impedance Characteristic Curve Abstract: .. junction temperature can be calcu-lated using the total thermal resis-tance and the following equation. Tj = TA + PT* Ru J-A where: Ru J-A =Total thermal resistance junction-to-ambient ..  Tags: transient  thermal impedance   datasheet abstract..	26.1 Kb	1 Pages	Original
	First line: cpu fan Desktop Thermal Management Evaldo Marty Miranda Staff Design Engineer Thermal System Monitoring Group Analog Devices August 22-24, 2000 Fall 2000 Abstract: .. Thermal Thermal Thermal Thermal Management Management Management Management. for Desktop PCs for Desktop PCs for Desktop PCs for Desktop PCs. Evaldo Marty Evaldo Marty Miranda Miranda Staff ..  Tags: cpu fan temperature controlled fan  fan speed control using pwm  fan speed control  fan control  AUTOMATIC fan control  Analog devices  acpi*   datasheet abstract..	460.22 Kb	22 Pages	Original
	First line: S/ACC/5TH2xxx/A/12/09/2005 THERMAL Pads relays thermal resistance Easy 5TH21000 5TH23000 1LWP2300 Abstract: .. power components, it is usual to apply a thermally conducting media, such as thermal grease, between the power element and the heatsink. Thermal grease is considered problematic due to difficulties ..  Tags: sv relays  celduc   5TH21000 5TH23000	400.11 Kb	5 Pages	Original
	First line: Title: A.G.P.-Enabled Add-In Card Thermal Specification Release Date: Jun. 1997 Impact: Addition Spec Version: A.G.P. Status: Change Summary: This addition defines thermal specification A.G.P.-enabled add-in cards used uncontrolled thermal environments environments where thermal conditions undefined Abstract: .. ECR #: 37. Title: A.G.P.-Enabled Add-In Card Thermal Specification Release Date: Jun. 20, 1997 Impact: Addition Spec Version: A.G.P. 1.0 Status: Change Summary: This addition defines a thermal ..  Tags: set card   datasheet abstract..	7.77 Kb	2 Pages	Original
	First line: ational Semiconductor Corporation 2900 Semiconductor Drive Santa Clara, 95052-8090 408-721-5000 Abstract: .. = Thermal Vias = Thermal Vias under Mask. TOP ETCH. = Exposed FR4. = Exposed metal. = Mask over FR4. = Paste over FR4 0.1mm offset = Mask over Metal covering the vias. = Paste over Metal. = Thermal Vias = Thermal ..  Tags:   datasheet abstract..	150.16 Kb	14 Pages	Original
	First line: bimetal fuse thermal cutout Thermal Cutout/ Regulator/Limiter FEATURES Precision switching High sensitivity Broad application Wide range housings, connections fixings Designed dirty situations A3K2 A3K3 DESCRIPTION Types A3D, A3L, A3DL, A3DS, A3A, A3DA, A3SD, A3AS, A3K, A3K1 designed operations ther Abstract: .. Thermal Cutouts A3 03-02-02 1000-Y-397e 1000-Y-397e . Thermal Cutout/ Regulator/Limiter. FEATURES ‐ Precision switching ‐ High sensitivity ‐ Broad application ‐ Wide range of housings, connections and ..  Tags: bimetal fuse thermal cutout  T 514  mountain switch  bimetal temperature control  bimetal  A3KB*  290E   datasheet abstract..	486.67 Kb	12 Pages	Original
	First line: ational Semiconductor Corporation 2900 Semiconductor Drive Santa Clara, 95052-8090 408-721-5000 Abstract: .. = Thermal Vias = Thermal Vias under Mask. TOP ETCH. = Exposed FR4. = Exposed metal. = Mask over FR4. = Paste over FR4 0.1mm offset = Mask over Metal covering the vias. = Paste over Metal. = Thermal Vias = Thermal ..  Tags:   datasheet abstract..	220.19 Kb	19 Pages	Original
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