TXC-06830 100/H TXC-06826 TXC-06830-MC TXC-05427C TXC-02030 TXC-03103 TXC-03305 - Datasheet Archive

 

Channelized DS3 Access Solution TXC-06830 PRODUCT INFORMATION DESCRIPTION · Complete single-chip channelized DS3 solution

 

TEProTM Device Channelized DS3 Access Solution TXC-06830 TXC-06830 PRODUCT INFORMATION DESCRIPTION · Complete single-chip channelized DS3 solution · RISC processor with royalty-free DD-AMPSTM firmware (Drivers, Data link, Alarms, Messaging, Performance/configuration objects, and Signaling) · Host communication via royalty-free, message-based, POSIX-compatible API · Integrated 672 x 4,096-channel DS0 cross connect supports grooming, broadcast, off-bus hairpinning, and bonding · Integrated DS1/E1 cross connect · Integrated G.747 function to Mux/De-Mux 21 E1s to/ from DS3. · 28 DS1 or 21 E1 line interfaces or 1 DS3 line interface · Combination of unframed DS1/E1, transmission DS1/ E1, link channel interface (LCI), and either MVIP or H.100/H 100/H.110 as terminal side interfaces · Selectable DS3 clear channel functionality · On-chip maintenance of 15-minute performance objects per IETF RFCs 2495, 2496, and 2494. · Support 2 SS7 and 28 ISDN-PRI signaling channels · Two DS1/E1 monitor ports for monitoring any DS1/E1 clock and data · Test Access Port (IEEE 1149.1 boundary scan) · +3.3 volt input/output leads, +5 volt tolerant · +3.3 volt and +1.8 volt power supplies · 456-lead plastic ball grid array package (27 mm x 27 mm); pin- and API-compatible with T3BwP (TXC-06826 TXC-06826) LINE SIDE DS1/E1 Monitor Port LIU control & Indication 145 APPLICATIONS · T-carrier termination equipment: muxes, inverse muxes, cross connects, groomers · CT (Computer Telephony) network interface boards · VoP (Voice over Packet/Cell) gateways · MSADs (Multi-Service Access Devices) · DSLAMs (Digital Subscriber Loop Access Multiplexers) · ECUs (Echo Cancellation Units) Ground, +1.8V, +3.3V Spare 4 DS1/E1/DS3 interface, TEProTM (TXC-06830 TXC-06830) is a RISC processor-based device that supports the requirements of next-generation channelized DS3 access systems. TEPro integrates an M13 multiplexer, G.747 Mux/DeMux framer, 28 DS1 / 21 E1 framers, T1/E1 cross connect and a 672 x 4,096-channel DS0 cross connect with an embedded highperformance microprocessor to provide a complete channelized DS3 solution on a single chip. The embedded processor firmware handles device drivers, data links, alarms, messaging, MIB performance objects, and signaling functions and allows communication to an external host via high-level API messages. The firmware is provided by TranSwitch and loaded from an external serial EEPROM at device boot-up. The TEPro can be configured to support a variety of modes of operation, which allows for design flexibility. TEPro supports a combination of unframed DS1/E1, transmission DS1/E1 and H.100/H 100/H.110 bus or MVIP interfaces on the terminal side and either DS3 or DS1/E1 on the line side. For TDM applications, all 672 DS0 channels can be switched to any of the 4,096 H.100/ H.110 bus channels. The TEPro can also be enabled to provide DS3 C-bit parity for unchannelized services. The on-chip firmware provides the control and management plane functionality to the host to configure, control and monitor all DS3, DS1, E1, DS0 and digital cross connect functions. The standards-based MIB functionality is provided for network management. 90 TERMINAL SIDE Control Inputs 9 175 TEPro Channelized DS3 Access Device Transmission, Unframed DS1/E1 MVIP, H.100/H 100/H.110, LCI TXC-06830 TXC-06830 5 Boot EEPROM clock, and data 5 JTAG Test Access Port 23 Host interface Copyright 2002 TranSwitch Corporation TEPro is a trademark of TranSwitch Corporation TranSwitch and TXC are registered trademarks of TranSwitch Corporation MVIP is a registered trademark of GO-MVIP, Inc. SLC is a registered trademark of AT&T TranSwitch Corporation · 3 Enterprise Drive · Shelton, Connecticut 06484 Tel: 203-929-8810 · Fax: 203-926-9453 · www.transwitch.com Document Number: TXC-06830-MC TXC-06830-MC Ed. 1, April 2002 · USA Proprietary TranSwitch Corporation Information for use Solely by its Customers FEATURES TEPro, TXC-06830 TXC-06830 APPLICATION DIAGRAMS H.100 DS1 T1 LIU DS1 · · · T1 LIU COBRA TXC-05427C TXC-05427C UTOPIA Interface UTOPIA Interface COBRA TXC-05427C TXC-05427C Proprietary TranSwitch Corporation Information for use Solely by its Customers DS3 DART TXC-02030 TXC-02030 · · · Analog Lines TEPro TXC-06830 TXC-06830 TEPro TXC-06830 TXC-06830 TEPro TXC-06830 TXC-06830 PCM Codec Modem Pool Interface Modems Tone Send/Receive Control Processor Telephony Application DS3 DART TXC-02030 TXC-02030 TEPro TXC-06830 TXC-06830 672-Channel HDLC DS3 Remote Access Concentrator Application RELATED PRODUCTS · TXC-02030 TXC-02030 · TXC-03103 TXC-03103 · TXC-03305 TXC-03305 · TXC-03452B TXC-03452B · TXC-03453 TXC-03453 · TXC-04222 TXC-04222 · TXC-05150 TXC-05150 · TXC-05427C TXC-05427C · TXC-06101 TXC-06101 · TXC-06103 TXC-06103 Advanced E3/DS3 Receiver/Transmitter VLSI Device (DART) Quad T1 Framer-Plus VLSI Device (QT1F-Plus) DS3/DS1 Mux/Demux VLSI Device (M13X) Level 3 Mapper VLSI Device (L3M) Triple Level 3 Mapper VLSI Device (TL3M) 21/28 Channel Dual Bus High Density mapper VLSI Device (TEMx28) Cell Delineation Block VLSI Device (CDB) COnstant Bit Rate ATM Adaptation Layer 1 VLSI Device (COBRA) SONET STS-1 Overhead Terminator (PHAST-1) STM-1/STS-3/STS-3c SDH/SONET Overhead Terminator with Telecom Bus Interface VLSI Device (PHAST-3N) FURTHER INFORMATION Contact TranSwitch for technical and ordering information on these products, including details of available operational firmware. TranSwitch reserves the right to make changes to the product(s) or circuit(s) described herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product or circuit. TranSwitch Corporation · 3 Enterprise Drive · Shelton, Connecticut 06484 Tel: 203-929-8810 · Fax: 203-926-9453 · www.transwitch.com Document Number: TXC-06830-MC TXC-06830-MC Ed. 1, April 2002 · USA