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    TXC-04226 Search Results

    TXC-04226 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    68604-226HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10145204-226KLF Amphenol Communications Solutions Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 26 Position,side to side double row,Top latch

    (For product qualification latest status, please submit Product Enquiry)
    Visit Amphenol Communications Solutions
    68004-226HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail. Visit Amphenol Communications Solutions

    TXC-04226 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Type PDF
    TXC-04226 TranSwitch Ethernet into STS-3/STM-1 SONET/SDH Mapper Original PDF
    TXC-04226AIOG TranSwitch Ethernet into STS-3/STM-1 SONET/SDH Mapper Original PDF
    TXC-04226BIBG TranSwitch Ethernet, EtherMap-3 Device Ethernet into STS-3/STM-1 SONET/SDH Mapper Original PDF