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ISL1801IVZ Intersil Corporation sPMIC for Micro-Converter Bias and Drivers; TSSOP48; Temp Range: -40° to 85°C visit Intersil Buy
ISL1801IVZ-T Intersil Corporation sPMIC for Micro-Converter Bias and Drivers; TSSOP48; Temp Range: -40° to 85°C visit Intersil Buy
X9428WS16IT1 Intersil Corporation X9428WS16IT1, SOP-16 visit Intersil
X9428WS16 Intersil Corporation X9428WS16, SOP-16 visit Intersil
X9428WS16I Intersil Corporation X9428WS16I, SOP-16 visit Intersil
X5045S8-4.5A Intersil Corporation X5045S8-4.5A, SOP-8 visit Intersil

TSSOP48 outline

Catalog Datasheet MFG & Type PDF Document Tags

A22 SMD MARKING CODE

Abstract: SMD MARKING CODE 1D6 03-02-19 Fig 12. Package outline SOT362-1 (TSSOP48) 74LVC_LVCH16374A_6 © NXP B.V. 2009. All rights , 74LVC16374ABQ 74LVCH16374ABQ -40 °C to +125 °C -40 °C to +125 °C TSSOP48 -40 °C to +125 °C Name SSOP48 Description plastic shrink small outline package; 48 leads; body width 7.5 mm plastic thin shrink small outline package; 48 leads; body width 6.1 mm Version SOT370-1 SOT362-1 SOT1025-1 Type number HUQFN60U , shown for SSOP48 and TSSOP48 packages only. Pin numbers are shown for SSOP48 and TSSOP48 packages
NXP Semiconductors
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A22 SMD MARKING CODE SMD MARKING CODE 1D6 SMD MARKING CODE 1D7 SMD MARKING CODE 2d1 smd marking code b6 smd marking A26 74LVC16374A 74LVCH16374A 74LVCH16374ADGG 74LVC16374ADGG ICP1020807

TSSOP48

Abstract: TSSOP48 outline SMALL OUTLINE 0.035 b 0.17 0.27 0.0067 0.011 c 0.09 0.20 0.0035 0.0079 , 0.030 A TSSOP48 A2 A1 b K e L E c D E1 PIN 1 IDENTIFICATION 1 May 2004 1/4 TSSOP48 PACKAGE AND PACKING INFORMATION TAPE & REEL SHIPMENT INFORMATION TAPE , max. BASE QUANTITY BULK QUANTITY 2/4 2000 pcs. 2000 pcs. TSSOP48 PACKAGE AND PACKING , . 30.4 1.197 3/4 TSSOP48 PACKAGE AND PACKING INFORMATION FOOTPRINT RECOMMENDED DATA
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TSSOP48 outline TSSOP-48 48-LEAD

TSSOP48

Abstract: TSSOP48 outline 48-Pin Thin Shrink Small Outline Package TSSOP48 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 10 (0.5) 1 0.5 typ. 24 0.5 0.2 +0.07 ­0.06 0.45 0.75 0.1 M 12.8 max 0.1 ±0.05 1.0 ±0.05 12.5 ±0.1 0.1 Land Pattern Example 1.2 max Enlarged view of A A 7.5 0.95 min Unit , an actual design. TSSOP48­P­0061­0.50A JEITA package code Notes TSSOP48 - Package
Toshiba
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74HCXXX

Abstract: 74HCxx TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H (inch) W (tape width mm) P (mm) D (mm , -24, TSSOP48 SOT23-5L/8L, SOT323-5L, Flip-Chip4 LFBGA96 13 12 8 4 13 16 8 4 13 , -8, SO-14, SO-16, TSSOP16, TSSOP20, TSSOP24, TFBGA54 TSSOP48 2,000 pcs SO-16L, SO-20, SO-24 1 , tape and reel (EIA RS 481 outline) 2,500 pcs 3,000 pcs 3,500 pcs Through-hole packages , -5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H (inch) W (tape width mm) P
STMicroelectronics
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74HCXXX 74HCxx STMicroelectronics package outline dip CMOS4000 TC74HCTXXXAP M74HCXXXM1R TSSOP14 TFBGA42 DIP-20 DIP-24 DIP-16 DIP-14/16

4001 4011 cmos

Abstract: 4013 datasheet hct -24 Selection guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 , -8, TFBGA42 SO-14, SO-16, TSSOP14, TSSOP16, TFBGA54 SO-16L, TSSOP20, TSSOP24 SO-20, SO-24, TSSOP48 SOT23 , -16, TSSOP16, TSSOP20, TSSOP24, TFBGA54 TSSOP48 2,000 pcs SO-16L, SO-20, SO-24 SOT323-5L, SOT23-5L/8L, TFBGA42, Flip-Chip4 LFBGA96 SO, TSSOP, SOT23-XL and SOT323-XL tape and reel (EIA RS 481 outline , -8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package
STMicroelectronics
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4001 4011 cmos 4013 datasheet hct 4049 DIP14 lcx 574 CMOS 4541 str 4512 DIP-14 SGSTANDIG/1204

MARKING CODE 2B5

Abstract: 1a6 SMD diode ; 74LVCH162245A TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362 , 48 48 48 48 PACKAGE SSOP48 SSOP48 TSSOP48 TSSOP48 nDIR L H X nAn A=B inputs Z 74LVC162245A , 19 2B5 20 GND 21 2B6 22 2B7 23 2DIR 24 162245 Fig.1 Pin configuration SSOP48 and TSSOP48 , OUTLINES 74LVC162245A; 74LVCH162245A SSOP48: plastic shrink small outline package; 48 leads; body , Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION
Philips Semiconductors
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MARKING CODE 2B5 1a6 SMD diode LVCH162245A smd diode code 1B2 EIA/JESD22-A114-A EIA/JESD22-A115-A 74LVC162245ADGG 74LVCH162245ADGG

TSSOP48

Abstract: TSSOP48 outline Thin Shrink Small Outline Package 48pin TSSOP48 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 10 (0.5) 1 0.5 typ. 24 0.5 0.2 +0.07 ­0.06 0.45 0.75 0.1 M 12.8 max 0.1 ±0.05 1.0 ±0.05 12.5 ±0.1 0.1 A : mm 7.5 0.95 min 1.2 max A 0.5 0.4 TSSOP48­P­0061­0.50A JEITA TSSOP48 - 48 0.25 g 2008.04.01 -
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TSSOP48

Abstract: TSSOP48 outline Thin Shrink Small Outline Package 48pin TSSOP48 (EL) : mm 4.0 ±0.1 Y 11.5 ±0.1 X' 13.1 ±0.1 Y 2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 1.5 +0.1 ­0 1.75 ±0.1 2.0 ±0.1 Y' Y' 8.6 ±0.1 X 1.65 ±0.1 X' 1 100 ±1 : mm 330 ±2 13 ±0.2 25.5 ±0.5 29.5 ±1.0 TSSOP48­P­0061­0.50A JEITA TSSOP48 - EL 24 mm 1,000 / 2008.04.01 -
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TSSOP48

Abstract: TSSOP48 outline 48-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP48 Package Tape Dimensions Unit: mm 4.0 ±0.1 Y 11.5 ±0.1 X' 13.1 ±0.1 Y 2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 1.5 +0.1 ­0 1.75 ±0.1 2.0 ±0.1 Y' Y' 8.6 ±0.1 X 1.65 ±0.1 Feed direction X' Package orientation Pin #1 Feed direction 100 ±1 Unit: mm 330 ±2 , TSSOP48 - Tape type EL Carrier tape width 24 mm Packing unit 1,000 pcs / reel
Toshiba
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diode SMD MARKING CODE K6

Abstract: diode SMD MARKING CODE K6 06 OUTPUT nYn L H Z PACKAGE MATERIAL SSOP48 SSOP48 TSSOP48 TSSOP48 VFBGA56 VFBGA56 plastic plastic , configuration SSOP48 and TSSOP48. Fig.2 Pin configuration VFBGA56. 2003 Dec 08 5 Philips , small outline package; 48 leads; body width 7.5 mm SOT370-1 D E A X c y HE v M A Z 48 , are not included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC MO-118 JEITA EUROPEAN PROJECTION , 16-bit buffer/line driver; 5 V input/output tolerant; 3-state 74LVC16244A; 74LVCH16244A TSSOP48
Philips Semiconductors
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diode SMD MARKING CODE K6 diode SMD MARKING CODE K6 06 smd diode code g6 NXP MARKING *H5 smd code marking A6 diode SMD MARKING CODE K6 03 74LVCH16244ADL 74LVCH16244AEV

SMD marking code B10

Abstract: smd marking a26 -40 °C to +125 °C Package Name SSOP48 TSSOP48 HUQFN60U Description plastic shrink small outline , -state TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 D E A , PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 9. Package outline SOT362-1 (TSSOP48) © NXP B.V. 2008 , to +125 °C 74ALVC164245BQ -40 °C to +125 °C plastic thin shrink small outline package; 48 leads , 2DIR 24 74ALVC164245 Fig 3. Pin configuration SOT370-1 (SSOP48) and SOT362-1 (TSSOP48
NXP Semiconductors
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SMD marking code B10 74LVC162244ADGG 74LVCH162244ADGG

chip Marking 3A3

Abstract: ; 74LVCH162244A TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362 , PINS 48 48 48 48 74LVC162244A; 74LVCH162244A PACKAGE MATERIAL SSOP48 SSOP48 TSSOP48 TSSOP48 , /output; 3-state PACKAGE OUTLINES 74LVC162244A; 74LVCH162244A SSOP48: plastic shrink small outline , included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC MO-118 JEITA EUROPEAN PROJECTION ISSUE DATE , of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 REFERENCES IEC JEDEC MO
Philips Semiconductors
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chip Marking 3A3

BT163

Abstract: marking 1d4 outline package; 48 leads; body width 7.5 mm SOT370-1 1998 Feb 27 8 Philips Semiconductors Product specification 16-bit transparent latch (3-State) 74ABT16373B 74ABTH16373B TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm SOT362-1 1998 Feb 27 9 , 74ABT16373BDGG 16-Bit DType SOT362-1 Transparent (TSSOP48) Latch (3State) SOT370-1 (SSOP48) 16-Bit DType , None TTL High 16-Bit DType SOT362-1 Transparent 74ABTH16373BDGG 4~6 (TSSOP48) Latch with Bus
Philips Semiconductors
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BT163 marking 1d4 smd 1d4 smd 1le 1D4 SMD smd 1D5 ABT/H16

74LVT16244B

Abstract: 74LVT16244BDGG 74LVT16244BDL -40 °C to +85 °C SSOP48 plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 -40 °C to +85 °C TSSOP48 plastic thin shrink small outline package; 48 leads , 3.3 V 16-bit buffer/driver; 3-state TSSOP48: plastic thin shrink small outline package; 48 leads , 4Y3 001aae231 Pin numbers are shown for SSOP48 and TSSOP48 packages only. Fig 2. IEC logic , SSOP48 and TSSOP48 packages only. 1 © NXP B.V. 2009. All rights reserved. Rev. 07 - 26 March
NXP Semiconductors
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74LVT16244B 74LVTH16244B JESD78 JESD22-A114E 74LVT16244BEV 74LVT16244BDGG 74LVTH16244BDGG JESD22-A115-A

HXQFN60U

Abstract: 8304a0 -40 °C to +85 °C TSSOP48 plastic thin shrink small outline package; 48 leads; body width 6.1 mm , -bit buffer/driver; 3-state 12. Package outline TSSOP48: plastic thin shrink small outline package; 48 , 1 4 19 20 27 22 26 23 001aae506 Pin numbers are shown for TSSOP48 package , 001aae231 Pin numbers are shown for TSSOP48 package only. Fig 2. IEC logic symbol All information , SOT362-1 (TSSOP48) 74LVTN16244B_2 Product data sheet All information provided in this document
NXP Semiconductors
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HXQFN60U 8304a0 SOT1134-1 JESD78B JESD22-A114F 74LVTN16244BDGG 74LVTN16244BBQ

hxqfn60u

Abstract: 16-bit buffer/driver; 3-state 12. Package outline TSSOP48: plastic thin shrink small outline , . Package outline SOT362-1 (TSSOP48) 74LVTN16244B All information provided in this document is subject to , Package Temperature range 74LVTN16244BDGG 74LVTN16244BBX 40 C to +85 C 40 C to +85 C Name TSSOP48 Description plastic thin shrink small outline package; 48 leads; body width 6.1 mm Version SOT362-1 SOT1134 , for TSSOP48 package only. Pin numbers are shown for TSSOP48 package only. Fig 1. Logic symbol
NXP Semiconductors
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LVTH16245B

Abstract: 74LVT16245B V 16-bit transceiver; 3-state TSSOP48: plastic thin shrink small outline package; 48 leads; body , DATE 99-12-27 03-02-19 MO-153 Fig 10. Package outline SOT362-1 (TSSOP48) 74LVT , range Name Description Version -40 °C to +85 °C SSOP48 plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 -40 °C to +85 °C TSSOP48 plastic thin shrink small outline package; 48 leads; SOT362-1 body width 6.1 mm 74LVT16245BEV -40 °C to +85 °C
NXP Semiconductors
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74LVT16245B LVTH16245B 74LVT16245BDGG 74LVT16245BDL lvth16245 74LVTH16245BDGG 74LVTH16245B
Abstract: -state 12. Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm , -153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 8. Package outline SOT362-1 (TSSOP48 , 74LVTN16244BDGG 74LVTN16244BBX 40 C to +85 C 40 C to +85 C Name TSSOP48 Description plastic thin shrink small outline package; 48 leads; body width 6.1 mm Version SOT362-1 SOT1134-1 Type number HXQFN60U plastic , 26 4A3 4OE 4Y3 48 24 001aae231 Pin numbers are shown for TSSOP48 package only NXP Semiconductors
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chip Marking 3A3

Abstract: 74LVC16240A 16-bit buffer/line driver with 5 V tolerant inputs/outputs 13. Package outline TSSOP48 , ISSUE DATE 99-12-27 03-02-19 Fig 7. Package outline TSSOP48. 9397 750 12871 © Koninklijke Philips , Package Temperature range Name 74LVC16240ADGG 74LVC16240ADL -40 °C to +125 °C -40 °C to +125 °C TSSOP48 SSOP48 Description plastic thin shrink small outline package; 48 leads; body width 6.1 mm plastic shrink small outline package; 48 leads; body width 7.5 mm Version SOT362-1 SOT370-1 Type number 9397 750
Philips Semiconductors
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SMD MARKING CODE 1D6

Abstract: Handbook IC24 : plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 1998 Mar 17 8 , tolerant inputs/outputs (3-State) 74LVC16374A/ 74LVCH16374A TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm SOT362-1 1998 Mar 17 9 Philips Semiconductors , 74LVC16374ADGG SOT362-1 (TSSOP48) 3.3V 16-Bit DType FlipFlop; Postive- 4~6 Edge Trigger (3-State) 3.3V 16 , Applications TTL Medium SOT362-1 74LVCH16374ADGG (TSSOP48) Low 48 Low Power or Battery
Philips Semiconductors
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Handbook IC24 74LVC16374A/74LVCH16374A 74LVC16374ADG-T 74LVC16374ADL 74LVC16374ADL-T 74LVCH16374ADG 74LVCH16374ADGT
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