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ATH006A0X4 GE Critical Power Austin Microlynx II SIP Non-isolated Power Modules visit GE Critical Power
AXA003A0X4Z GE Critical Power Austin Minilynx 12V SIP Non-isolated Power Module visit GE Critical Power
AXH005A0X GE Critical Power Austin Microlynx SIP Non-isolated Power Module visit GE Critical Power
AXA003A0X GE Critical Power Austin Minilynx 12V SIP Non-isolated Power Module visit GE Critical Power
AXH003A0X4-Z GE Critical Power Austin Minilynx SIP Non-isolated Power Module visit GE Critical Power
AXH010A0X3Z GE Critical Power Austin Lynx SIP Non-isolated Power Module, Programmable visit GE Critical Power

TSSOP14 package Datasheet

Part Manufacturer Description PDF Type
TSSOP 14 Package N/A Scan

TSSOP14 package

Catalog Datasheet MFG & Type PDF Document Tags

TSSOP14 package

Abstract: TSSOP14 8° 0.024 TSSOP14 0.030 A2 A1 b e K c L E D E1 PIN 1 IDENTIFICATION 1 November 2002 1/4 TSSOP14 PACKAGE AND PACKING INFORMATION TAPE & REEL SHIPMENT , . TSSOP14 PACKAGE AND PACKING INFORMATION TAPE & REEL SHIPMENT INFORMATION REEL SPECIFICATIONS T 40mm , 0.646 +0.079/-0 T max. 22.4 0.882 3/4 TSSOP14 PACKAGE AND PACKING INFORMATION FOOTPRINT , 0.8 b PACKAGE AND PACKING INFORMATION MAX. 0.047 0.15 0.002 0.004 0.006 1.05
STMicroelectronics
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TSSOP14 package TSSOP14 reel 14-LEAD

M74HC14B1R

Abstract: M74HC14 TSSOP14 package information Figure 8. TSSOP14 package mechanical drawing Table 12. TSSOP14 , Package information Figure 9. TSSOP14 tape and reel information 1. Drawing is not to scale Table 13 , : tPLH ≠tPHL â'¢ Wide operating voltage range: VCC (opr) = 2 to 6 V DIP14 SO14 TSSOP14 , voltage. Table 1. Device summary Order code Package Packaging M74HC14B1R DIP14 Tube M74HC14RM13TR S014 M74HC14YRM13TR(1) SO14 (automotive grade) M74HC14TTR TSSOP14 M74HC14YTTR(1
STMicroelectronics
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M74HC04 ID1901
Abstract: . 12 TSSOP14 package information . 13 , . 12 Table 10: TSSOP14 package mechanical data , . 12 Figure 6: TSSOP14 package mechanical outline , /15 0.026 8 ° (max.) DocID001885 Rev 2 M74HC08 4.2 Package information TSSOP14 package information Figure 6: TSSOP14 package mechanical outline Table 10: TSSOP14 package mechanical STMicroelectronics
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74HC08Y M74HC08RM13TR 74HC08 M74HC08TTR HC08Y M74HC08YRM13TR

TS339C

Abstract: STMicroelectronics includes GND P TSSOP14 (thin shrink small outline package) â'¢ High input impedance: 1012 Ω typ , . . . . . . 8 TSSOP14 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , package Rthja = 175 °C/W for TSSOP14 package. 6. Human body model, 100pF discharged through a 1.5 kÎ , Package information TSSOP14 package information Figure 3. TSSOP14 package outline Table 6. TSSOP14 , °C, 125 °C February 2014 This is information on a product in full production. Package
STMicroelectronics
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TS339C STMicroelectronics TS339 LM339 TS3704 TS339CD/CDT TS339IDT TS339IPT

M74HC14 equivalent

Abstract: TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 , information 4.2 M74HC14 TSSOP14 package information Figure 7. TSSOP14 package mechanical drawing Table 11. TSSOP14 package mechanical data Dimensions Ref Millimeters Min. Typ. A Inches , M74HC14 Package information Figure 8. TSSOP14 tape and reel information 1. Drawing is not to scale , â'" CDM: 1 kV â'" HBM: 2 kV â'" MM: 200 V TSSOP14 Features Description â'¢ High speed
STMicroelectronics
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M74HC14 equivalent 74HC14 74HC14Y HC14Y

74HC28

Abstract: ° 8° DocID1938 Rev 2 11/14 14 Package information 4.2 M74HC280 TSSOP14 package information Figure 7. TSSOP14 package mechanical drawing Table 10. TSSOP14 package mechanical data , with 74 series 280 â'¢ ESD performance â'" HBM: 2 kV â'" MM: 200 V â'" CDM: 1 kV SO14 TSSOP14 , code Temp. range Package -55 °C to 125 °C S014 -40 °C to 125 °C SO14 (automotive grade) M74HC280TTR -55 °C to 125 °C TSSOP14 M74HC280YTTR(1) -40 °C to 125 °C
STMicroelectronics
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74HC28 ID1938

s339i

Abstract: s339c range 0 °C, +70 °C Package DIP14 SO14 -40 °C, +125 °C DIP14 SO14 TSSOP14 (thin shrink outline package , package Rthja = 175 °C/W for TSSOP14 package. 6. Human body model, 100pF discharged through a 1.5 k , 8/11 Doc ID 4065 Rev 3 TS339 Package information 4.3 TSSOP14 package Figure 5. TSSOP14 package outline ! ! ! B E + C , % $ % 0).)$%.4)&)#!4)/. $ Table 7. TSSOP14 , typ. for 5 mV overdrive Pin-to-pin and functionally compatible with bipolar LM339 device P TSSOP14
STMicroelectronics
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s339i s339c IC marking code T11 TS339CN S339C TS339IN S339I

TSSOP14

Abstract: 74hc132y TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 5 , 10/13 0.68 8° 8° DocID1896 Rev 3 M74HC132 4.2 Package information TSSOP14 package information Figure 6. TSSOP14 package mechanical drawing Table 10. TSSOP14 package mechanical , range: VCC (opr) = 2 V to 6 V â'¢ Pin and function compatible with 74 series 132 SO14 TSSOP14 , delays: tPLH ≠tPHL Table 1. Device summary Order code Temp. range Package M74HC132RM13TR
STMicroelectronics
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74hc132y M74HC00 M74HC132YRM13TR M74HC132TTR M74HC132YTTR 74HC132 74HC132Y
Abstract: TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4 , TSSOP14 package information Figure 15. TSSOP14 package outline Table 9. TSSOP14 package mechanical , -8, TSSOP8, DIP14, SO-14, and TSSOP14 package). Updated Table 1 (added values of DIP8 and DIP14 packages , '¢ Available in SOT23-5 micropackage, SO8, TSSOP8, SO14, and TSSOP14 packages Applications â'¢ Set-top , -pin SOT23 package that makes it well suited for battery powered systems. This micropackage simplifies the STMicroelectronics
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TS951 TS952 TS954 TS951ILT TS951ID TS952ID-TS952IPT
Abstract: TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 , information 4.2 M74HC126 TSSOP14 package information Figure 7. TSSOP14 package mechanical drawing Table 11. TSSOP14 package mechanical data Dimensions Ref Millimeters Min. Typ. A Inches , compatible with 74 series 126 SO14 TSSOP14 Features â'¢ ESD performance â'" CDM: 1 kV â'" HBM: 2 , . Table 1. Device summary Order code Temp. range Package -55 °C to 125 °C S014 -40 °C STMicroelectronics
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M74HC126TTR M74HC126YTTR M74HC126RM13TR M74HC126YRM13TR 74HC126 74HC126Y

M74HC04B1

Abstract: . . . . . . . . . 9 TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . , 8° (max.) DocID001882 Rev 3 M74HC04 4.3 Package information TSSOP14 package information Figure 7. TSSOP14 package mechanical outline Table 11. TSSOP14 package mechanical data Ref , hex inverter manufactured using silicon gate C2MOS technology. DIP14 SO14 TSSOP14 Features , summary Order code Temperature range Package Packaging Marking M74HC04B1R -55 °C to
STMicroelectronics
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M74HC04B1 M74HC04YRM13TR 74HC04Y M74HC04RM13TR 74HC04 M74HC04TTR
Abstract: . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5 TSSOP14 package information . . , TSSOP14 package information Figure 17. TSSOP14 package outline Table 9. TSSOP14 package mechanical , . 5 Updated Features (added SO8, TSSOP8, SO14, and TSSOP14 package). Updated titles of Figure 2 , LMV324ID/IDT-LMV324IPT (SO14, TSSOP14) The LMV321/358/324 family (single, dual, and quad) answers the , device is housed in the space saving 5-pin SOT23-5 package, which simplifies board design. The SOT23 STMicroelectronics
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LMV321 LMV358 LMV324 LMV321ILT LMV321RILT LMV321L
Abstract: information . 16 3.6 TSSOP14 package , Package information TSSOP14 package information Figure 24: TSSOP14 package outline Table 10: TSSOP14 package mechanical data Symbol Dimensions Millimeters Min. Typ. A Inches Max , -Sep-2012 6 Updated Features (added SO-8, SO-14, TSSOP8, TSSOP14, and MiniSO-8 package). Updated â'Pin , operate with voltages as low as 2.5 V and feature both I/O rail-to-rail. SO14, TSSOP14 The common STMicroelectronics
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TSV321 TSV358 TSV324 TSV321A TSV358A TSV324A

tssop14 0.65 land pattern

Abstract: TSSOP14 package 14-Pin Thin Shrink Small Outline Package TSSOP14 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 6.4 ±0.2 4.4 ±0.1 0.15 -0.01 8 14 0 10 1 7 0.22 , datasheet when creating an actual design. TSSOP14­P­0044­0.65A JEITA package code Notes TSSOP14 - Package type Surface-mount type Pin count 14 Weight (typ.) 0.06 g 2008.04.01 , min Unit: mm 0.65 0.23 0.35 Toshiba package name Toshiba package code · The above
Toshiba
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tssop14 0.65 land pattern

sot23-5 package marking k101

Abstract: MARKING AAA sot23-5 , SO-8, TSSOP8, DIP14, SO-14, and TSSOP14 package TS951ID Applications Set-top boxes , Doc ID 5561 Rev 9 TS951, TS952, TS954 Package information 3.7 TSSOP14 package information Figure 17. TSSOP14 package outline Table 11. TSSOP14 package mechanical data Dimensions Symbol , -8, TSSOP8, DIP14, SO-14, and TSSOP14 package). Updated Table 1 (added values of DIP8 and DIP14 packages for , specified for 3 V and 5 V operation. The TS951 device is housed in the space saving 5-pin SOT23 package that
STMicroelectronics
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sot23-5 package marking k101 MARKING AAA sot23-5 st DIP14 marking code 5561 st TS954IN-TS954ID-TS954IPT TS952IN-TS952ID-TS952IPT

SMD sot23-5 marking E1

Abstract: LM393 SMD . Doc ID 16866 Rev 3 13/17 Package information LMV331, LMV393, LMV339 4.6 TSSOP14 package information Figure 16. TSSOP14 package mechanical drawing Table 10. TSSOP14 package , devices General-purpose low voltage applications LMV339 SO14 / TSSOP14 Description The LMV331, LMV393 , www.st.com 17 Package pin connections LMV331, LMV393, LMV339 1 Package pin connections Figure 1. Pin connections for each package (top view) IN + 1 + - 5 VCC + Out1 In1In1+ 1 2 3 4 _ +
STMicroelectronics
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SMD sot23-5 marking E1 LM393 SMD 339I SOT323-5 smd codes a2 sot23 K50 sc70-5 marking SC70-5 LM393

q001

Abstract: tssop14 st automotive supply voltage N DIP14 (Plastic package) TTL, DTL, ECL, MOS, CMOS compatible outputs D SO-14 (Plastic micropackage) P TSSOP14 (Thin shrink small outline package) Pin connections , 8° (max.) LM2901 5.3 Package information TSSOP14 package information Figure 23. TSSOP14 package mechanical drawing A A2 A1 K e b L c E D E1 PIN 1 IDENTIFICATION 1 Table 6. TSSOP14 package mechanical data Dimensions Ref. Millimeters Min
STMicroelectronics
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q001 tssop14 st automotive JESD97 LM2901D LM2901DT LM2901N

TSSOP14 package

Abstract: LM2901 -14 (Plastic Micropackage) P TSSOP14 (Thin Shrink Small Outline Package) Pin connections (top view , SO-14 -40°C, +125°C Tube or tape & reel TSSOP14 (Thin shrink outline package) Tape & reel , . . . . . . . . . . 12 TSSOP14 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , -14 package, Rthja = 175°C/W for TSSOP14 package. 3. Human body model, 100pF discharged through a 1.5k , 0.026 8 ° (max.) PO13G 13/16 Package mechanical data 4.3 LM2901 TSSOP14 package
STMicroelectronics
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LM2901PT LM2901YPT

marking k171

Abstract: 1871AI immunity Available in ­ SOT23-5 micropackage ­ MiniSO-8, SO-8, SO-14 ­ TSSOP8, TSSOP14 package TS1871ID , . . . . . . . . . . . . . 20 TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . , , TS187xA Package information 3.5 TSSOP14 package information Figure 53. TSSOP14 package outline Table 11. TSSOP14 package mechanical data Dimensions Symbol Min. A A1 A2 b c D E E1 e L L1 k aaa , 13: Order codes. Updated Features (added MiniSO-8, SO-8, SO-14, TSSOP8, and TSSOP14 package). Updated
STMicroelectronics
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marking k171 1871AI k172 k182 TS187 TS1871ILT TS1871ID/IDT TS1872ID/IDT-TS1872IST-TS1872IPT TS1874ID/IDT-TS1874IPT VCC10

TS3704C

Abstract: STMicroelectronics Pin-to-pin and functionally compatible with bipolar LM339 N DIP14 (Plastic package) D SO14 (Plastic micropackage) P TSSOP14 (Thin shrink small outline package) Description Pin connections , Rthja = 175°C/W for TSSOP14 package 6. Human body model: A 100pF capacitor is charged to the specified , TSSOP14 package mechanical data Figure 2. TSSOP14 package Dimensions Ref. Millimeters Min , input Power dissipation DIP14 SO14 TSSOP14 (4) (5) (7) MM: machine model (8) CDM
STMicroelectronics
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TS3704C 3704I st 3704c 3704C TS3704I TS3704M
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