NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Application Note October 2001 INTRODUCTION Designing in the 8mm x 14mm TSOP Package SST offers an 8mm x 14mm TSOP package for our bulk erase, Byte-Program SuperFlash MTP products and the , PCB to accommodate the 8mm x 14mm TSOP package to realize the space savings provided by this , describe the advantages of the 8mm x 14mm TSOP package for board layout and provides information to make conversion to the 8mm x 14mm TSOP package or use of either package easier. The following diagram (Figure ... | Original |
2 pages, |
TSOP 50 Package land pattern for land pattern for TSOP 2 land pattern for TSOP datasheet abstract |
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| Abstract: · 40-pin TSOP Package · 48-pin TSOP Package · 48-ball Fine-pitch BGA Package · Standard and , Industrial (-40 oC to +85 oC) I PACKAGING MATERIAL SET A F = Standard = Pb-Free PACKAGE TYPE T B = TSOP Package = Fine-pitch BGA Package SPEED OPTIONS 70 90 = 70 ns = 90 ns , , 2, or 3. 2. TSOP package marking omits packing type designator from ordering part numbers 3. BGA , Number Speed Option S29AL032D S29AL032D Package & Material Temperature 70, 90 TAI, TFI BAI, BFI ... | Original |
2 pages, |
tsop package TS048 TRAY spansion tape S29AL032D AMD top marking spansion marking spansion part marking spansion top marking ISO/TS16949 ISO9001 ISO14001 S29AL032D abstract |
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| Abstract: Solder Reflow Profile ° TSOP Package Family (All assembly sites for these packages) CYPRESS , Profile, TSOP Package Family Assembly: Philippines CSPI-R /ASE Taiwan QTP# 99344, V. 2.0 Page 2 of 6 , for other packages availability Cypress Semiconductor Package: 235°C Solder Reflow Profile, TSOP , availability Cypress Semiconductor Package: 235°C Solder Reflow Profile, TSOP Package Family Assembly , Package: 235°C Solder Reflow Profile, TSOP Package Family Assembly: Philippines CSPI-R /ASE Taiwan ... | Original |
6 pages, |
JESD22 8361H datasheet abstract |
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| Abstract: : CY7C1009/CY7C199 CY7C1009/CY7C199 Package: SOJ/TSOP QTP# 97174, V. 1.0 Page 2 of 7 Jun, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: 28-pins SOJ 28-pins TSOP Mold Compound Name , / 1.0 mil JESD22-A112 JESD22-A112 Moisture Sensitivity Level Level 1 (SOJ package) Level 3 (TSOP package , Device: CY7C1009/CY7C199 CY7C1009/CY7C199 Package: SOJ/TSOP QTP# 97174, V. 1.0 Page 3 of 7 Jun, 1997 RELIABILITY , Sensitivity Level 1 (168 Hrs , 85/85%RH) P High Accelerated Saturation Test (HAST) - TSOP Package ... | Original |
4 pages, |
JESD22 8361H cel 9200 9200 9200/9200U CY7C1009/CY7C199 9200/9200U abstract |
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| Abstract: is housed in a small 5-pin TSOP package. Features · · · · · · · · · Ultra Low Noise: 40 , Platform Ready: ON @ 900 mV High Level 1.5% Output Precision Thermal Shutdown 5-Pin TSOP Package Benefits · Space and Weight Savings x Small 5-Pin TSOP Package x Requires No External Bypass Capacitor · , Package TSOP-5 TSOP-5 TSOP-5 Voltage 2.5 V 2.8 V 3.0 V Literature A complete data sheet ... | Original |
2 pages, |
NPFSMC33761/D MC33761 NPFSMC33761/D abstract |
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| Abstract: AND8080/D AND8080/D TSOP vs. SC70 Leadless Package Thermal Performance Prepared by David Billings ON , can handle the same size of silicon device. The TSOP5 package typically uses a eutectic gold die , Thermal Comparison The Leadless package has a 2025% lower thermal resistance than the TSOP package , Construction Comparison The main difference between these two package styles is the leads. The TSOP package , package again out performs the TSOP5 package as can be seen in the graph below (Figure 3). The SC70LL SC70LL ... | Original |
4 pages, |
NCP500 38.3008 AND8080/D AND8080/D abstract |
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| Abstract: 4Gb x8 NAND Flash Memory Errata Scope Errata MT29F4G08AAAWP MT29F4G08AAAWP:A Scope This errata applies exclusively to the MT29F4G08AAAWP MT29F4G08AAAWP:A, a 4Gb x8 NAND Flash memory device in a TSOP type 1 package , manufacture. (Micron logo) 29F4G08AAA 29F4G08AAA WP TSOP package. Summary Table of Changes Table 2 summarizes the , identified and a new package will be released to address this issue. The part number for the replacement TSOP package is MT29F4G08AAAWC MT29F4G08AAAWC:A. When this part is released to production, the MT29F4G08AAAWP MT29F4G08AAAWP:A will ... | Original |
3 pages, |
"nand flash memory" 29F4G Errata MANUFACTURE LOGO Micron NAND MT29F4G08A MT29F4G08AAAWP NAND flash memory MT29F4G08 29F4G08AAA MT29F4G08AAAWP abstract |
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| Abstract: TAPE & REEL SPECIFICATIONS 32-pin TSOP Package Carrier Tape Critical Dimensions 2.0�1 �55�05 0.3�05 4.0�1 Y E F �6 �1 W B2 B0 R 0.3 Typical Y K1 K0 P1 K B1 SECTION Y-Y Lead Count Package 32 TSOP Carrier Tape Dimensions (mm) W F E B0 B1 B2 K K0 K1 Pitch (P1) Thickness 24.0 � 0.3 11.5 1.75 , ) 481-7000 www.ramtron.com June 2009 Page 1 TAPE & REEL SPECIFICATIONS 32-pin TSOP Package ... | Original |
2 pages, |
datasheet abstract |
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| Abstract: allow customers to migrate to the smaller SST29SF040 SST29SF040 TSOP package. Advantages of the SST29SF040 SST29SF040 · Smaller TSOP package The SST29SF040 SST29SF040 is offered in an 8mmx14mm, 32-TSOP package while the SST28SF040A SST28SF040A is offered in an 8mmx20mm 32-TSOP package. The smaller package saves valuable space on the PCB. · Smaller , PDIP package to the SST29SF040 SST29SF040 in either the PLCC or TSOP packages will need to redesign the PCB , SST29SF040 SST29SF040 due to its higher performance. 32-TSOP Packages HARDWARE COMPARISON Existing designs ... | Original |
2 pages, |
SST29SF040 SST28SF040A SST28SF040A abstract |
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| Abstract: IDT71256SA IDT71256SA FAST CMOS STATIC RAM 256K (32K x 8-BIT) IN TSOP PACKAGE COMMERCIAL TEMPERATURE RANGE FAST CMOS STATIC RAM 256K (32K x 8-BIT) IN TSOP PACKAGE IDT71256SA IDT71256SA Integrated Device Technology , V 3566 tbl 05 2 IDT71256SA IDT71256SA FAST CMOS STATIC RAM 256K (32K x 8-BIT) IN TSOP PACKAGE , TSOP PACKAGE COMMERCIAL TEMPERATURE RANGE TIMING WAVEFORM OF READ CYCLE NO. 2(1,2,4) tRC , Available in 28-pin 300 mil TSOP Type I. The IDT71256SA IDT71256SA is a 262,144-bit high-speed Static RAM organized ... | Original |
6 pages, |
IDT71256SA 71256SA25 IDT71256SA abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| EPROM in the plastic PDIP, PLCC and TSOP packages, and features a fast random access time of 45ns at 5V supply, with a standby current of 100uA and an active current of 50mA at 5MHz. The 40 pin DIP and TSOP packages are pin compatible with the 1 Mbit and 4 Mbit densities, and the 44 pin PLCC type is pin , PLCC and TSOP packages to further reduce customer overhead costs. Top www.datasheetarchive.com/files/stmicroelectronics/stonline/press/news/year1999/w409m.htm |
STMicroelectronics | 31/05/2000 | 2.6 Kb | HTM | w409m.htm |
| Web TSOP Package Dimensions and Land-Pad Drawings Intel Corp. (Folsom) Architecture: Type /11/96 3:41:00 PM Vendor Information Tool Description: Provides package and land-pad dimensions for all lead count TSOP packages. Tool Features: Document 2290 contains information about This Small Outline Packages (TSOP). Including package and land-pad drawings and tables with : Part & Package 28F004S3 28F004S3 28F004S3 28F004S3 - TSOP-40 ld 28F004S5 28F004S5 28F004S5 28F004S5 - TSOP-40 ld 28F004SC 28F004SC 28F004SC 28F004SC - TSOP-40 ld www.datasheetarchive.com/files/intel/design/flcomp/devtools/4315a1a6.htm |
Intel | 08/11/1997 | 3.9 Kb | HTM | 4315a1a6.htm |
| FlashWeb TSOP Package Dimensions and : Provides package and land-pad dimensions for all lead count TSOP packages. Tool Features: Document 2290 contains information about This Small Outline Packages (TSOP). Including package and Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - TSOP-40 ld 28F002BV/BE 28F002BV/BE 28F002BV/BE 28F002BV/BE - TSOP-40 ld 28F002BX/BL 28F002BX/BL 28F002BX/BL 28F002BX/BL - TSOP-40 ld 28F004BV/BE 28F004BV/BE 28F004BV/BE 28F004BV/BE - TSOP-40 ld 28F004BX 28F004BX 28F004BX 28F004BX www.datasheetarchive.com/files/intel/products/design/flcomp/devtools/3f456_~1.htm |
Intel | 23/10/1996 | 3.63 Kb | HTM | 3f456_~1.htm |
| FlashWeb TSOP Package Dimensions and Land : Provides package and land-pad dimensions for all lead count TSOP packages. Tool Features: Document 2290 contains information about This Small Outline Packages (TSOP). Including package and Supported Device Detail Matrix: Part & Package 28F004S3 28F004S3 28F004S3 28F004S3 - TSOP-40 ld 28F004S5 28F004S5 28F004S5 28F004S5 - TSOP-40 ld 28F004SC 28F004SC 28F004SC 28F004SC - TSOP-40 ld 28F008S3 28F008S3 28F008S3 28F008S3 - TSOP-40 ld 28F008S5 28F008S5 28F008S5 28F008S5 - TSOP-40 ld 28F008SA 28F008SA 28F008SA 28F008SA www.datasheetarchive.com/files/intel/design/flcomp/devtools/4f7f2_~1.htm |
Intel | 31/01/1997 | 3.24 Kb | HTM | 4f7f2_~1.htm |
| Web TSOP, SSOP, and PSOP Package Dimensions and Land-Pad Drawings Intel Corp. (Folsom -pad dimensions for all lead count 32,40,48, and 56L TSOP, 44L PSOP, and 56L SSOP packages. Tool Features: TSOP package and land-pad dimensions located on attachment file 2290.doc SSOP package and land 2232.DOC - PSOP package and land-pad dimensions 2290.DOC - TSOP package and land-pad dimensions Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC www.datasheetarchive.com/files/intel/design/flcomp/devtools/68a161a6.htm |
Intel | 02/08/1998 | 4.37 Kb | HTM | 68a161a6.htm |
| Web TSOP, SSOP, and PSOP Package Dimensions and Land-Pad Drawings Flash Packaging Web Page Information 10/1/98 4:39:21 PM Vendor Information Tool Description: Provides package and land-pad dimensions for all lead count 32,40,48, and 56L TSOP, 44L PSOP, and 56L SSOP packages. Tool Features: TSOP package and land-pad dimensions located on attachment file 2290.doc land-pad dimensions 2232.DOC - PSOP package and land-pad dimensions 2290.DOC - TSOP package and www.datasheetarchive.com/files/intel/design/flcomp/devtools/6d96a1a6.htm |
Intel | 05/11/1998 | 4.57 Kb | HTM | 6d96a1a6.htm |
| Web TSOP, SSOP, and PSOP Package Dimensions and Land-Pad Drawings Intel Corp. (Folsom -pad dimensions for all lead count 32,40,48, and 56L TSOP, 44L PSOP, and 56L SSOP packages. Tool Features: TSOP package and land-pad dimensions located on attachment file 2290.doc SSOP package and land 2232.DOC - PSOP package and land-pad dimensions 2290.DOC - TSOP package and land-pad dimensions Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC www.datasheetarchive.com/files/intel/design/flcomp/devtools/50782_1a.htm |
Intel | 13/05/1998 | 4.32 Kb | HTM | 50782_1a.htm |
| Web TSOP, SSOP, and PSOP Package Dimensions and Land-Pad Drawings Intel Corp. (Folsom Information 12/23/97 3:38:16 PM Vendor Information Tool Description: Provides package and land-pad dimensions for all lead count 32,40,48, and 56L TSOP, 44L PSOP, and 56L SSOP packages. Tool Features: TSOP package and land-pad dimensions located on attachment file 2290.doc land-pad dimensions 2232.DOC - PSOP package and land-pad dimensions 2290.DOC - TSOP package and www.datasheetarchive.com/files/intel/design/flcomp/devtools/4b5761a6.htm |
Intel | 05/02/1998 | 4.33 Kb | HTM | 4b5761a6.htm |
| Web TSOP, SSOP, and PSOP Package Dimensions and Land-Pad Drawings Flash Packaging Web Page Information 10/1/98 4:39:21 PM Vendor Information Tool Description: Provides package and land-pad dimensions for all lead count 32,40,48, and 56L TSOP, 44L PSOP, and 56L SSOP packages. Tool Features: TSOP package and land-pad dimensions located on attachment file 2290.doc land-pad dimensions 2232.DOC - PSOP package and land-pad dimensions 2290.DOC - TSOP package and www.datasheetarchive.com/files/intel/design/flcomp/devtools/6d9821a6.htm |
Intel | 05/11/1998 | 4.42 Kb | HTM | 6d9821a6.htm |
| Web TSOP, SSOP, and PSOP Package Dimensions and Land-Pad Drawings Intel Corp. (Folsom -pad dimensions for all lead count 32,40,48, and 56L TSOP, 44L PSOP, and 56L SSOP packages. Tool Features: TSOP package and land-pad dimensions located on attachment file 2290.doc SSOP package and land 2232.DOC - PSOP package and land-pad dimensions 2290.DOC - TSOP package and land-pad dimensions Supported Device Detail Matrix: Part & Package 28F010 28F010 28F010 28F010 - TSOP-32 ld 28F010 28F010 28F010 28F010 www.datasheetarchive.com/files/intel/design/flcomp/devtools/50792_1a.htm |
Intel | 13/05/1998 | 4.17 Kb | HTM | 50792_1a.htm |