TSB42AC3 SLLA220 TSB12LV01B TSB42AC3PZT TSB42AC3PZTG4 MTQF012B S-PQFP-G100 - Datasheet Archive

 

www.ti.com SLLA220 ­ JUNE 2006 Overview of TSB42AC3 FEATURES · · · · · · ·

 

TSB42AC3 TSB42AC3 www.ti.com SLLA220 SLLA220 ­ JUNE 2006 Overview of TSB42AC3 TSB42AC3 FEATURES · · · · · · · · · · · · 50-MHz Host Interface Frequency Allows Direct Connection to Host With Bus Speeds up to 50 MHz Programmable 10K Byte Total for Asynchronous, Isochronous, and General Receive FIFO Separate ACK FIFO Register Decreases ACK-tracking Burden on the Host Additional Programmable Status Output to Pins, Including cd and paccom Bits to Aid External DMA Supports 1394 Transfer Rates of 100, 200, and 400 Mbit/s in Cable Environment Supports 1394 Transfer Rates of 50 and 100 Mbit/s in Backplane Environment Generic 32-Bit Host Bus Interface Completely Software Compatible With the TSB12LV01B TSB12LV01B IEEE 1149.1 JTAG Interface to Support Board Level Scan Testing Operates from a 3.3-V Power Supply Support Provisions of IEEE 1394­1995 (1394) Standard for High-Performance Serial Bus High Performance 100-Pin TQFP Package DESCRIPTION The TSB42AC3 TSB42AC3 is a 1394-1995 general purpose link layer ideal for a wide-range of applications, including motion control, motor control, video, and process control. The TSB42AC3 TSB42AC3 provides a high-performance interface with the capability of transferring data between the 32-bit host controller and the 1394 PHY-link interface. The 1394 PHY-link interface provides the connection to the 1394 physical layer device (PHY) and is supported by the link-layer controller (LLC). The LLC provides the control for transmitting and receiving 1394 packet data between the FIFO and PHY-link interface at rates of 50 (backplane only), 100, 200, and 400 Mbit/s. The TSB42AC3 TSB42AC3 has a 32-bit, 50-MHz host interface, which makes connection to most 32-bit hosts fairly easy. The LLC also provides the capability to receive status from the PHY and to access the PHY control and status registers by the application software. An internal 10K-byte memory is provided that can be configured as multiple variable-size FIFOs and eliminates the need for external FIFOs. Separate FIFOs can be user configured to support asynchronous transmit, isochronous transmit, and general 1394 receive transfer operations. These functions are accomplished by appropriately sizing the asynchronous transmit FIFO (ATF) and isochronous transmit FIFO (ITF). Once the ATF and ITF size are programmed, the remaining memory space is assigned to the general receive FIFO (GRF). The TSB42AC3 TSB42AC3 has a separate ACK FIFO register that is capable of retaining up to six acknowledges returned by external nodes in response to the asynchronous packets transmitted from the TSB42AC3 TSB42AC3. This allows host software to load multiple asynchronous packets in the ATF, then return at a later time to retrieve and process the acknowledges returned from the receiving destination nodes. New status bits were added to the programmable output status pins. The start/end of packet bit (cd bit) and the packet complete (paccom bit) may now be brought out to a pin for control of external hardware. NOTE: This product is for high-volume applications only. For a complete datasheet or more information contact support@ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TSB42AC3PZT TSB42AC3PZT ACTIVE TQFP PZT 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR TSB42AC3PZTG4 TSB42AC3PZTG4 ACTIVE TQFP PZT 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTQF012B MTQF012B ­ OCTOBER 1994 ­ REVISED DECEMBER 1996 PZT (S-PQFP-G100 S-PQFP-G100) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 76 50 100 26 0,13 NOM 25 1 12,00 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,25 0,05 MIN 1,05 0,95 0°­ 7° 0,75 0,45 Seating Plane 1,20 MAX 0,08 4073179 / B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. 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