TLV2241 TLV2242 TLV2244 SLOS329C MSP430 SLOU060 TLV2211 TLV2241CD TLV2241ID - Datasheet Archive

 

FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 D D

 

TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 D D Micropower Operation . . . 1 µA/Channel Rail-to-Rail Input/Output Gain Bandwidth Product . . . 5.5 kHz Supply Voltage Range . . . 2.5 V to 12 V Specified Temperature Range ­ TA = 0°C to 70°C . . . Commercial Grade ­ TA = ­40°C to 125°C . . . Industrial Grade Ultrasmall Packaging ­ 5-Pin SOT-23 (TLV2241 TLV2241) ­ 8-Pin MSOP (TLV2242 TLV2242) Universal OpAmp EVM Operational Amplifier + ­ SUPPLY CURRENT vs SUPPLY VOLTAGE 1.4 I CC ­ Supply Current ­ µ A/Ch D D D D D description The TLV224x family of single-supply operational amplifiers offers very low supply current of only 1 µA per channel. AV = 1 VIN = VCC / 2 TA =25 °C 1.2 1.0 0.8 0.6 0.4 0.2 The low supply current is coupled with extremely low input bias currents enabling them to be used with mega- resistors making them ideal for portable, long active life, applications. DC accuracy is ensured with a low typical offset voltage as low as 600 µV, CMRR of 100 dB, and minimum open loop gain of 100 V/mV at 2.7 V. 0 0 2 4 6 8 10 12 VCC ­ Supply Voltage ­ V The maximum recommended supply voltage is as high as 12 V and ensured operation down to 2.5 V, with electrical characteristics specified at 2.7 V, 5 V and 12 V. The 2.5-V operation makes it compatible with Li-Ion battery-powered systems and many micropower microcontrollers available today including TI's MSP430 MSP430. FAMILY PACKAGE TABLE DEVICE PACKAGE TYPES NO OF Ch NO. PDIP SOIC SOT-23 TSSOP MSOP TLV2241 TLV2241 1 8 8 5 - - TLV2242 TLV2242 2 8 8 - - 8 TLV2244 TLV2244 4 14 14 - 14 - UNIVERSAL EVM Refer to the EVM Selection Guide (Lit# SLOU060 SLOU060) SELECTION OF SINGLE SUPPLY OPERATIONAL AMPLIFIER PRODUCTS DEVICE VDD (V) VIO (mV) BW (MHz) SLEW RATE (V/µs) IDD (PER CHANNEL) (µA) RAIL-TO-RAIL TLV240x 2.5­16 0.390 0.005 0.002 0.880 I/O TLV224x 2.5­12 0.600 0.005 0.002 1 I/O TLV2211 TLV2211 2.7­10 0.450 0.065 0.025 13 O TLV245x 2.7­6 0.020 0.22 0.110 23 I/O TLV225x 2.7­8 0.200 0.2 0.12 35 All specifications are typical values measured at 5 V. This device also offers 18-V reverse battery protection and 5-V over-the-rail operation on the inputs. O Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 TLV2241 TLV2241 AVAILABLE OPTIONS VIOmax AT 25°C TA 0°C to 70°C ­ 40°C to 125°C 3000 µV PACKAGED DEVICES SOT-23 SYMBOLS (DBV) SMALL OUTLINE (D) TLV2241CD TLV2241CD - TLV2241ID TLV2241ID PLASTIC DIP (P) - TLV2241IDBV TLV2241IDBV - VBEI TLV2241IP TLV2241IP This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2241CDR TLV2241CDR). This package is available in a 250 piece mini-reel. To order this package, add a T suffix to the part number (e.g., TLV2241DBVT TLV2241DBVT). This package is also available in a 3000 piece reel, add a R suffix to the part number (e.g., TLV2241DBVR TLV2241DBVR). TLV2242 TLV2242 AVAILABLE OPTIONS VIOmax AT 25°C TA 0°C to 70°C 3000 µV PACKAGED DEVICES MSOP SYMBOLS (DGK) SMALL OUTLINE (D) TLV2242CD TLV2242CD - PLASTIC DIP (P) - - ­ 40°C to 125°C TLV2242ID TLV2242ID TLV2242IDGK TLV2242IDGK xxTIALE TLV2242IP TLV2242IP This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2242CDR TLV2242CDR). TLV2244 TLV2244 AVAILABLE OPTIONS PACKAGED DEVICES VIOmax AT 25°C TA 0°C to 70°C ­ 40°C to 125°C SMALL OUTLINE (D) PLASTIC DIP (N) TLV2244CD TLV2244CD 3000 µV TSSOP (PW) - - TLV2244IN TLV2244IN TLV2244ID TLV2244ID TLV2244IPW TLV2244IPW This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2244CDR TLV2244CDR). TLV224x PACKAGE PINOUTS TLV2241 TLV2241 D OR P PACKAGE (TOP VIEW) TLV2241 TLV2241 DBV PACKAGE (TOP VIEW) OUT GND IN+ 1 5 VCC 2 3 4 IN ­ NC IN ­ IN + GND 1 7 3 6 4 NC VCC OUT NC 8 2 TLV2242 TLV2242 D, DGK, OR P PACKAGE (TOP VIEW) 5 NC ­ No internal connection TLV2244 TLV2244 D, N, OR PW PACKAGE (TOP VIEW) 1OUT 1IN ­ 1IN+ VCC 2IN+ 2IN ­ 2OUT 2 1 14 2 13 3 12 4 11 5 10 6 9 7 8 POST OFFICE BOX 655303 4OUT 4IN ­ 4IN+ GND 3IN+ 3IN ­ 3OUT · DALLAS, TEXAS 75265 1OUT 1IN ­ 1IN + GND 1 8 2 7 3 6 4 5 VCC 2OUT 2IN ­ 2IN+ TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VCC Input current, II (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ­ 40°C to 125°C Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ­ 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values, except differential voltages, are with respect to GND DISSIPATION RATING TABLE PACKAGE JC (°C/W) JA (°C/W) TA 25°C POWER RATING D (8) 38.3 176 710 mW 142 mW D (14) 26.9 122.6 1022 mW 204.4 mW TA = 125°C POWER RATING DBV (5) 55 324.1 385 mW 77.1 mW DGK (8) 54.2 259.9 481 mW 96.2 mW N (14) 32 78 1600 mW 320.5 mW P (8) 41 104 1200 mW 240.4 mW PW (14) 29.3 173.6 720 mW 144 mW recommended operating conditions MIN Supply voltage VCC voltage, Split supply Common-mode input voltage range, VICR C-suffix Operating free-air temperature, TA free air temperature I-suffix POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 MAX 2.5 12 ±1.25 ±6 0 Single supply 0 VCC 70 ­ 40 125 UNIT V V °C 3 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 electrical characteristics at recommended operating conditions, VCC = 2.7, 5 V, and 12 V (unless otherwise noted) dc performance PARAMETER VIO Input offset voltage VIO Offset voltage drift TEST CONDITIONS VIC = 0 to VCC, RS = 50 MAX 600 3000 4500 25°C VCC = 5 V VCC = 2 7 V VO( ) = 1 V RL = 500 k 2.7 V, O(pp) V, AVD TYP Full range VCC = 12 V Large-signal differential voltage g g g amplification MIN 25°C VO = VCC/2 V, V V, VIC = VCC/2 V RS = 50 VCC = 2 7 V 2.7 CMRR Common mode rejection ratio Common-mode TA VCC = 5 V V, VO( ) = 3 V RL = 500 k V, O(pp) VCC = 12 V V, VO( ) = 6 V RL = 500 k V, O(pp) 55 Full range µV µV/°C 3 25°C UNIT 50 25°C 60 Full range 53 25°C 60 100 Full range 100 dB 100 55 25°C 100 Full range 30 25°C 250 Full range 100 25°C 700 Full range 400 120 1000 V/mV 1500 Full range is 0°C to 70°C for the C suffix and ­40°C to 125°C for the I suffix. If not specified, full range is ­ 40°C to 125°C. input characteristics PARAMETER IIO TEST CONDITIONS Input offset current TLV224xC VO = VCC/2 V, , VIC = VCC/2 V, RS = 50 IIB Input bias current TLV224xI TYP MAX 25 250 300 pA 400 100 500 550 Full range 25°C UNIT pA 1000 300 M Ci(c) Common-mode input capacitance f = 100 kHz 25°C 3 Full range is 0°C to 70°C for the C suffix and ­40°C to 125°C for the I suffix. If not specified, full range is ­ 40°C to 125°C. Specifications at 5 V are ensured by design and device testing at 2.7 V and 12 V. pF 4 Differential input resistance MIN Full range 25°C TLV224xC TLV224xI ri(d) TA 25°C POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 electrical characteristics at recommended operating conditions, VCC = 2.7, 5 V, and 12 V (unless otherwise noted) (continued) output characteristics PARAMETER TEST CONDITIONS VCC = 2 7 V 2.7 VIC = VCC/2, , IOH = ­2 µA VCC = 5 V VCC = 12 V VOH High-level High level output voltage VCC = 2 7 V 2.7 , VIC = VCC/2, IOH = ­50 µA VCC = 5 V VCC = 12 V VIC = VCC/2 IOL = 2 µA /2, VOL Low-level Low level output voltage VIC = VCC/2 IOL = 50 µA /2, TA 25°C MIN TYP 2.65 2.68 Full range 2.63 25°C 4.95 Full range 11.95 Full range 11.93 25°C 2.62 Full range 2.6 25°C 4.92 Full range UNIT 4.93 25°C MAX 4.9 25°C 11.92 Full range 4.98 11.98 V 2.65 4.95 11.9 25°C 11.95 90 Full range 150 180 25°C 180 Full range 230 mV 260 IO Output current VO = 0.5 V from rail 25°C ±200 Full range is 0°C to 70°C for the C suffix and ­40°C to 125°C for the I suffix. If not specified, full range is ­ 40°C to 125°C. µA power supply PARAMETER TEST CONDITIONS VCC = 2.7 V or 5 V 27 ICC Supply current (per channel) VO = VCC/2 VCC = 12 V VCC = 2.7 to 5 V, VIC = VCC/2 V, No load, TLV224xC VIC = VCC/2 V, TLV224xI MIN TYP MAX 980 1200 Full range 1500 25°C 1000 Full range 25°C VCC = 5 to 12 V, No load PSRR Power supply rejection ratio (VCC/VIO) TA 25°C Full range 1250 UNIT nA 1550 70 100 65 60 25°C 70 Full range dB dB 100 70 dB Full range is 0°C to 70°C for the C suffix and ­40°C to 125°C for the I suffix. If not specified, full range is ­ 40°C to 125°C. Specifications at 5 V are ensured by design and device testing at 2.7 V and 12 V. POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 5 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 electrical characteristics at recommended operating conditions, VCC = 2.7, 5 V, and 12 V (unless otherwise noted) (continued) dynamic performance PARAMETER TEST CONDITIONS CL = 100 pF UGBW Unity gain bandwidth RL = 500 k, SR Slew rate at unity gain VO(pp) = 0.8 V, RL = 500 k, M Phase margin RL = 500 k k, TA 25°C CL = 100 pF 25°C CL = 100 pF Gain margin ts VCC = 2.7 or 5 V, V(STEP)PP = 1 V, AV = ­1, VCC = 12 V, V(STEP)PP = 1 V V, AV = ­1, Settling time CL = 100 pF, RL = 100 k MIN TYP UNIT 5.5 kHz 2 V/ms 60 25°C 15 0.1% dB 1.84 25°C ms 0.1% CL = 100 pF F, RL = 100 k MAX 6.1 0.01% 32 noise/distortion performance PARAMETER Vn TEST CONDITIONS Equivalent input noise voltage f = 100 Hz In Equivalent input noise current f = 100 Hz Specifications at 5 V are ensured by design and device testing at 2.7 V and 12 V. 6 TA f = 10 Hz POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 MIN TYP 800 25°C 500 8 MAX UNIT nV/Hz fA/Hz TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO Input offset voltage vs Common-mode input voltage 1, 2, 3 vs Free-air temperature 4, 6, 8 vs Common-mode input voltage 5, 7, 9 vs Free-air temperature 4, 6, 8 vs Common-mode input voltage 5, 7, 9 IIB Input bias current IIO Input offset current CMRR Common-mode rejection ratio vs Frequency VOH VOL High-level output voltage vs High-level output current 11, 13, 15 Low-level output voltage vs Low-level output current 12, 14, 16 VO(PP) Zo Output voltage peak-to-peak vs Frequency 17 Output impedance vs Frequency 18 ICC PSRR Supply current vs Supply voltage 19 Power supply rejection ratio vs Frequency 20 AVD Differential voltage gain vs Frequency 21 Phase vs Frequency 21 Gain-bandwidth product vs Supply voltage 22 SR Slew rate vs Free-air temperature 23 m Phase margin vs Capacitive load 24 Gain margin vs Capacitive load 25 Voltage noise over a 10 Second Period 10 26 Large-signal voltage follower 27, 28, 29 Small-signal voltage follower 30 Large-signal inverting pulse response 31, 32, 33 Small-signal inverting pulse response Crosstalk 34 vs Frequency POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 35 7 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 100 800 600 400 200 0 ­200 0.0 0 ­100 ­200 ­300 VCC = 5 V TA = 25 °C ­400 0.4 0.8 1.2 1.6 2.0 2.4 0 2.7 IIO 0 IIB ­100 ­200 ­40 ­25 ­10 5 I IB / I IO ­ Input Bias / Offset Current ­ pA 2 20 35 50 65 80 95 110 125 350 300 IIO 0 ­50 IIB ­100 ­150 0.0 ­0.2 0.4 1.0 1.6 2.2 2.8 3.4 4.0 4.6 5.2 VICR ­ Common Mode Input Voltage ­ V Figure 7 8 2 6 8 10 12 INPUT BIAS / OFFSET CURRENT vs FREE-AIR TEMPERATURE 600 200 150 100 50 IIO 0 ­50 IIB ­100 ­150 ­0.2 0.2 0.0 0.6 1.0 1.4 1.8 2.2 2.6 2.9 VCC = 5 V VIC = 2.5 V 500 400 300 200 100 IIO 0 IIB ­100 ­200 ­40 ­25 ­10 5 20 35 50 65 80 95 110 125 TA ­ Free-Air Temperature ­ °C Figure 6 Figure 5 INPUT BIAS / OFFSET CURRENT vs COMMON-MODE INPUT VOLTAGE INPUT BIAS / OFFSET CURRENT vs FREE-AIR TEMPERATURE 600 4 VICR ­ Common-Mode Input Voltage ­V VICR ­ Common Mode Input Voltage ­ V I IB / I IO ­ Input Bias / Offset Current ­ pA I IB / I IO ­ Input Bias / Offset Current ­ pA 100 ­300 0 700 VCC = 5 V TA = 25 °C ­200 Figure 3 VCC = 2.7 V TA = 25 °C Figure 4 200 ­100 5 250 INPUT BIAS / OFFSET CURRENT vs COMMON-MODE INPUT VOLTAGE 50 4 400 TA ­ Free-Air Temperature ­ °C 150 3 250 VCC = 12 V VIC = 7.5 V 500 400 300 200 100 IIO 0 ­100 ­200 ­40 ­25 ­10 5 IIB 20 35 50 65 80 95 110 125 TA ­ Free-Air Temperature ­ °C Figure 8 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 I IB / I IO ­ Input Bias / Offset Current ­ pA I IB / I IO ­ Input Bias / Offset Current ­ pA 100 0 INPUT BIAS / OFFSET CURRENT vs COMMON MODE INPUT VOLTAGE 600 200 100 Figure 2 INPUT BIAS / OFFSET CURRENT vs FREE-AIR TEMPERATURE 300 200 ­400 1 Figure 1 400 VCC =12 V TA = 25 °C 300 VICR ­ Common-Mode Input Voltage ­ V VICR ­ Common-Mode Input Voltage ­ V VCC = 2.7 V VIC = 1.35 V V IO ­ Input Offset Voltage ­ µV 1000 400 I IB / I IO ­ Input Bias / Offset Current ­ pA VCC = 2.7 V TA = 25°C 1200 V IO ­ Input Offset Voltage ­ µV V IO ­ Input Offset Voltage ­ µV 1400 500 INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE VCC =12 V TA = 25 °C 200 150 100 50 IIO 0 ­50 IIB ­100 ­150 0 2 4 6 8 10 VICR ­ Common-Mode Input Voltage ­V Figure 9 12 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 TYPICAL CHARACTERISTICS HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 1.50 100 RF=100 k RI=1 k 80 60 40 20 VCC = 2.7 V 2.4 TA = ­40°C 2.1 TA = ­0°C TA = 25 °C TA = 70 °C TA = 125 °C 1.8 1.5 1.2 0 10 100 1k f ­ Frequency ­ Hz 50 100 150 3.5 150 1.25 TA = 0 °C TA = ­40°C 1.00 0.75 TA = 25 °C TA = 70 °C TA = 125 °C 0.50 0.25 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 0 Figure 13 0.25 0 100 150 IOL ­ Low-Level Output Current ­ µA Figure 16 50 100 150 TA = ­40°C VCC = 12 V 0 200 50 200 10k VCC = 12 V 10 8 VCC = 5 V RL = 100 k CL = 100 pF TA = 25°C 4 2 VCC = 2.7 V AV=10 1k AV=1 100 0 VCC=2.7, 5, 12 V TA=25°C ­2 10 200 OUTPUT IMPEDANCE vs FREQUENCY 12 6 150 Figure 15 16 14 100 IOH ­ High-Level Output Current ­ µA Z o ­ Output Impedance ­ TA = ­0°C TA = 25 °C TA = 70 °C TA = 125 °C 50 13.5 OUTPUT VOLTAGE PEAK-TO-PEAK vs FREQUENCY V O(PP) ­ Output voltage Peak­to­Peak ­ V TA = ­40°C 0 TA = ­0°C TA = 25 °C TA = 70 °C TA = 125 °C 14.0 Figure 14 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 0.50 14.5 IOL ­ Low-Level Output Current ­ µA 1.25 200 13 200 VCC = 12 V 150 15.0 IOH ­ High-Level Output Current ­ µA 1.50 100 Figure 12 0 0.75 50 IOL ­ Low-Level Output Current ­ µA VCC = 5 V 3.0 1.00 0.25 0 V OH ­ High-Level Output Voltage ­ V TA = ­0°C TA = 25 °C TA = 70 °C TA = 125 °C 100 TA = 70 °C TA = 125 °C 0.50 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT VOL ­ Low-Level Output Voltage ­ V TA = ­40°C 4.5 50 0.75 200 1.50 0 1.00 Figure 11 5.0 4.0 TA =25 °C TA = 0 °C TA = ­40°C 1.25 IOH ­ High-Level Output Current ­ µA HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT VCC = 5 V VCC = 2.7 V 0 0 10k Figure 10 V OH ­ High-Level Output Voltage ­ V VOL ­ Low-Level Output Voltage ­ V VCC=2.7, 5, 12 V 1 VOL ­ Low-Level Output Voltage ­ V LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 2.7 120 V OH ­ High-Level Output Voltage ­ V CMRR ­ Common-Mode Rejection Ratio ­ dB COMMON-MODE REJECTION RATIO vs FREQUENCY 100 f ­ Frequency ­ Hz 1k Figure 17 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 10 100 1k f ­ Frequency ­ Hz 10k Figure 18 9 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SUPPLY VOLTAGE POWER SUPPLY REJECTION RATIO vs FREQUENCY PSRR ­ Power Supply Rejection Ratio ­ dB I CC ­ Supply Current ­ µ A/Ch 1.4 1.2 1.0 0.8 0.6 TA = 125°C TA = 70 °C TA =25 °C TA = 0 °C TA = ­40°C 0.4 0.2 AV = 1 VIN = VCC / 2 0 0 2 4 6 8 10 12 120 VCC = 2.7, 5, & 12 V TA = 25°C 110 100 90 80 70 60 50 40 VCC ­ Supply Voltage ­ V 100 1k f ­ Frequency ­ Hz Figure 19 Figure 20 DIFFERENTIAL VOLTAGE GAIN AND PHASE vs FREQUENCY GAIN BANDWIDTH PRODUCT vs SUPPLY VOLTAGE 90 30 45 20 10 0 0 VCC=2.7, 5, 12 V RL=500 k CL=100 pF TA=25°C ­10 100 1k f ­ Frequency ­ Hz TA = 25°C RL = 100 k CL = 100 pF f = 1kHz 6 5 4 3 2 1 0 ­45 10k ­20 10 GBWP ­Gain Bandwidth Product ­ kHz 50 40 10k 7 135 Phase ­ ° AVD ­ Differential Voltage Gain ­ dB 60 10 2 3 4 5 6 7 8 9 10 11 12 VCC ­ Supply Voltage ­V Figure 21 Figure 22 SLEW RATE vs FREE-AIR TEMPERATURE PHASE MARGIN vs CAPACITIVE LOAD 3.5 80 2.5 70 SR+ VCC = 5, 12 V 60 VCC = 2.7 V 2.0 1.5 SR­ 1.0 VCC = 2.7, 5, 12 V Phase Margin ­ ° SR ­ Slew Rate ­ V/ ms 3.0 50 40 30 20 0.5 10 0 ­40 ­25 ­10 5 VCC = 2.7, 5, & 12 V RL= 500 k TA = 25°C 0 20 35 50 65 80 95 110 125 TA ­ Free-Air Temperature ­ °C 100 1k CL ­ Capacitive Load ­ pF Figure 23 10 Figure 24 POST OFFICE BOX 655303 10 · DALLAS, TEXAS 75265 10k TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 TYPICAL CHARACTERISTICS GAIN MARGIN vs CAPACITIVE LOAD VOLTAGE NOISE OVER A 10 SECOND PERIOD 25 4 VCC = 12 V 15 10 VCC = 2.7, 5 V 5 2 1 0 ­1 ­2 ­3 0 ­4 10 100 1k CL ­ Capacitive Load ­ pF 0 10k 1 2 3 4 5 6 7 8 9 Figure 26 LARGE SIGNAL FOLLOWER PULSE RESPONSE LARGE SIGNAL FOLLOWER PULSE RESPONSE VIN ­2 VO 2 1 ­3 0 ­4 ­1 0 1 2 3 4 5 6 V V ­1 V ­ Output Voltage ­ V O VCC = 2.7 V AV = 1 RL = 100 k CL = 100 pF TA = 25°C IN 0 8 4 VCC = 5 V AV = 1 RL = 100 k CL = 100 pF TA = 25°C 7 3 VIN 6 2 5 1 0 4 4 3 ­1 3 2 VO 2 1 1 0 0 ­1 ­1 0 1 2 t ­ Time ­ ms 3 4 5 25 10 VIN 5 20 0 15 15 ­5 10 10 VO 5 5 0 0 ­5 0 2 4 6 8 10 12 14 16 IN VCC = 12 V AV = 1 RL = 100 k CL = 100 pF TA = 25°C 300 180 VIN 150 160 0 140 ­150 120 100 80 V 30 15 ­ Input Voltage ­ mV SMALL SIGNAL FOLLOWER PULSE RESPONSE V ­ Output Voltage ­ V O ­ Input Voltage ­ V Figure 28 LARGE SIGNAL FOLLOWER PULSE RESPONSE IN 6 t ­ Time ­ ms Figure 27 ­2 VO ­ Output Voltage ­ V 1 ­ Input Voltage ­ V 2 IN ­ Input Voltage ­ V Figure 25 V 10 t ­ Time ­ s 60 VO VCC = 2.7, 5, & 12 V AV = 1 RL = 100 k CL = 100 pF TA = 25°C 120 100 80 60 40 40 20 20 0 0 VO ­ Output Voltage ­ mV Gain Margin ­ dB 20 VCC = 5 V f = 0.1 Hz to 10 Hz TA = 25°C 3 Input Referred Voltage Noise ­ µV RL= 500 k TA = 25°C ­20 0 t ­ Time ­ ms Figure 29 100 200 300 t ­ Time ­ µs 400 500 Figure 30 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 11 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 TYPICAL CHARACTERISTICS LARGE SIGNAL INVERTING PULSE RESPONSE ­ Input Voltage ­ V VIN 1.5 2 1.0 1 VCC = 2.7 V AV = ­1 RL = 100 k CL = 100 pF TA = 25°C ­0.5 0.0 ­0.5 ­1.0 ­1.0 VO ­1.5 ­1.5 ­2 0 1 2 3 4 5 6 VIN 1.5 2 1.0 1 IN 0.5 0 ­0.5 ­1.5 ­2.5 ­3.0 ­3.0 ­3.5 ­3.5 ­1 7 0 1 2 3 4 0 ­2 ­4 ­6 ­6 ­8 ­8 VO ­10 ­10 ­12 10 15 20 25 30 ­ Input Voltage ­ mV IN VIN 100 150 0 100 VCC = 2.7, 5, & 12 V AV = ­1 RL = 100 k CL = 100 pF TA = 25°C ­100 50 0 ­50 ­150 ­200 ­100 0 200 400 600 t ­ Time ­ ms t ­ Time ­ ms Figure 33 Figure 34 CROSSTALK vs FREQUENCY 0 Crosstalk ­ dB ­40 ­60 VCC = 2.7, 5, & 12 V All Channels RL = 100 k CL = 100 pF VIN = 1 VPP VCC = 12V ­80 ­100 VCC = 2.7, 5 V ­120 ­140 10 100 1k 10k f ­ Frequency ­Hz Figure 35 12 0 ­50 ­100 35 ­20 50 VO ­12 5 200 200 V 2 V ­ Output Voltage ­ V O ­ Input Voltage ­ V IN V VCC = 12 V AV = ­1 RL = 100 k CL = 100 pF TA = 25°C 0 7 SMALL SIGNAL INVERTING PULSE RESPONSE VIN 8 6 6 3 ­5 6 Figure 32 10 9 ­4 5 t ­ Time ­ ms 12 12 ­2 ­1.5 VO LARGE SIGNAL INVERTING PULSE RESPONSE 0 ­1.0 ­2.0 ­2.5 Figure 31 2 ­3 0.0 ­0.5 ­2.0 t ­ Time ­ ms 4 0 0.5 VCC = 5 V AV = ­1 RL = 100 k CL = 100 pF TA = 25°C 0.0 ­1 ­1.0 ­2.0 ­1 2.0 3 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 ­150 800 1000 1200 V ­ Output Voltage ­ mV O 0.0 ­1 0.5 V 0.5 0 2.5 4 V ­ Output Voltage ­ V O 2.0 3 VO ­ Output Voltage ­ V V IN ­ Input Voltage ­ V LARGE SIGNAL INVERTING PULSE RESPONSE TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 APPLICATION INFORMATION offset voltage The output offset voltage, (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times the corresponding gains. The following schematic and formula can be used to calculate the output offset voltage: RF RG IIB­ V + ­ VI + VIO 1 ) R R " IIB) RS F G 1 ) R R F G " IIB­ RF VO + RS OO IIB+ Figure 36. Output Offset Voltage Model general configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 37). RG RF f V ­ VI O V I VO + R1 ­3dB 1 + 2pR1C1 + 1 R ) RF G 1 ) sR1C1 1 C1 Figure 37. Single-Pole Low-Pass Filter If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this task. For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth. Failure to do this can result in phase shift of the amplifier. C1 + _ VI R1 R1 = R2 = R C1 = C2 = C Q = Peaking Factor (Butterworth Q = 0.707) R2 f C2 RG RF ­3dB RG = + 2p1 RC ( RF 1 2­ Q ) Figure 38. 2-Pole Low-Pass Sallen-Key Filter POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 13 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 APPLICATION INFORMATION circuit layout considerations To achieve the levels of high performance of the TLV224x, follow proper printed-circuit board design techniques. A general set of guidelines is given in the following. D D D D D 14 Ground planes-It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. Proper power supply decoupling-Use a 6.8-µF tantalum capacitor in parallel with a 0.1-µF ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-µF ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1-µF capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. Sockets-Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. Short trace runs/compact part placements-Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at the input of the amplifier. Surface-mount passive components-Using surface-mount passive components is recommended for high performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 APPLICATION INFORMATION general power dissipation considerations For a given JA, the maximum power dissipation is shown in Figure 39 and is calculated by the following formula: P T ­T MAX A q JA PD = Maximum power dissipation of THS224x IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature (°C) JA = JC + CA JC = Thermal coefficient from junction to case CA = Thermal coefficient from case to ambient air (°C/W) MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 2 1.75 Maximum Power Dissipation ­ W Where: + D PDIP Package Low-K Test PCB JA = 104°C/W 1.5 1.25 SOIC Package Low-K Test PCB JA = 176°C/W TJ = 150°C MSOP Package Low-K Test PCB JA = 260°C/W 1 0.75 0.5 0.25 SOT-23 Package Low-K Test PCB JA = 324°C/W 0 ­55 ­40 ­25 ­10 5 20 35 50 65 80 95 110 125 TA ­ Free-Air Temperature ­ °C NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 39. Maximum Power Dissipation vs Free-Air Temperature POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 15 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using Microsim Parts TM Release 8, the model generation software used with Microsim PSpice TM. The Boyle macromodel (see Note 2) and subcircuit in Figure 40 are generated using the TLV224x typical electrical and operating characteristics at TA = 25°C. Using this information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases): D D D D D D D D D D D D Maximum positive output voltage swing Maximum negative output voltage swing Slew rate Quiescent power dissipation Input bias current Open-loop voltage amplification Unity-gain frequency Common-mode rejection ratio Phase margin DC output resistance AC output resistance Short-circuit output current limit NOTE 2: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, "Macromodeling of Integrated Circuit Operational Amplifiers", IEEE Journal of Solid-State Circuits, SC-9, 353 (1974). 3 99 VCC+ + egnd ree ro2 cee fb rp rc1 rc2 ­ c1 7 11 12 + 1 c2 vlim IN+ r2 + 9 6 ­ vc 2 8 + q1 q2 IN­ ­ vb ga ­ ro1 gcm ioff 53 dp 13 14 re1 VOUT re2 91 10 iee VCC­ 4 dc ­ dlp 90 + + vlp + 54 ­ ­ vln + de .subckt 224X_5V­X 1 2 3 4 5 * c1 11 12 9.8944E 8944E­12 c2 6 7 30.000E­12 cee 10 99 8.8738E 8738E­12 dc 5 53 dy de 54 5 dy dlp 90 91 dx dln 92 90 dx dp 4 3 dx egnd 99 0 poly(2) (3,0) (4,0) 0 .5 .5 fb 7 99 poly(5) vb vc ve vlp vln 0 61.404E6 404E6 ­1E3 1E3 61E6 ­61E6 ga 6 0 11 12 1.0216E 0216E­6 gcm 0 6 10 99 10.216E­12 iee 10 4 dc 54.540E­9 ioff 0 6 dc 5e­12 hlim 90 0 vlim 1K q1 11 2 13 qx1 q2 12 1 14 qx2 r2 6 9 100.00E3 rc1 rc2 re1 re2 ree ro1 ro2 rp vb vc ve vlim vlp vln .model .model .model .model .ends 3 3 13 14 10 8 7 3 9 3 54 7 91 0 dx dy qx1 qx2 Figure 40. Boyle Macromodels and Subcircuit PSpice and Parts are trademarks of MicroSim Corporation. 16 5 92 hlim ­ ve dln POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 11 978.81E3 12 978.81E3 10 30.364E3 364E3 10 30.364E3 364E3 99 3.6670E9 6670E9 5 10 99 10 4 1.4183E6 4183E6 0 dc 0 53 dc .88315 4 dc .88315 8 dc 0 0 dc 540 92 dc 540 D(Is=800.00E­18) D(Is=800.00E­18 Rs=1m Cjo=10p) NPN(Is=800.00E­18 Bf=27.270E21 270E21) NPN(Is=800.0000E 0000E­18 Bf=27.270E21 270E21) TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 MECHANICAL DATA D (R-PDSO-G*) PLASTIC SMALL-OUTLINE PACKAGE 14 PIN SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 14 0.010 (0,25) M 8 0.008 (0,20) NOM 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) Gage Plane 0.010 (0,25) 1 7 0°­ 8° A 0.044 (1,12) 0.016 (0,40) Seating Plane 0.069 (1,75) MAX 0.010 (0,25) 0.004 (0,10) PINS * 0.004 (0,10) 8 14 16 A MAX 0.197 (5,00) 0.344 (8,75) 0.394 (10,00) A MIN 0.189 (4,80) 0.337 (8,55) 0.386 (9,80) DIM 4040047 / D 10/96 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 17 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 MECHANICAL INFORMATION DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE PACKAGE 0,40 0,20 0,95 5 0,25 M 4 1,80 1,50 1 0,15 NOM 3,00 2,50 3 Gage Plane 3,10 2,70 0,25 0°­ 8° 0,55 0,35 Seating Plane 1,30 1,00 0,10 0,05 MIN 4073253-4/B 4073253-4/B 10/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions include mold flash or protrusion. 18 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 MECHANICAL INFORMATION DGK (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,38 0,25 0,65 8 0,25 M 5 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°­ 6° 4 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073329/B 4073329/B 04/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-187 MO-187 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 19 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 MECHANICAL INFORMATION N (R-PDIP-T*) PLASTIC DUAL-IN-LINE PACKAGE 16 PIN SHOWN PINS * 14 16 18 20 A MAX 0.775 (19,69) 0.775 (19,69) 0.920 (23.37) 0.975 (24,77) A MIN 0.745 (18,92) 0.745 (18,92) 0.850 (21.59) 0.940 (23,88) DIM A 16 9 0.260 (6,60) 0.240 (6,10) 1 8 0.070 (1,78) MAX 0.035 (0,89) MAX 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0°­ 15° 0.010 (0,25) NOM 14/18 PIN ONLY 4040049/C 4040049/C 08/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 MS-001 (20 pin package is shorter then MS-001 MS-001.) 20 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 MECHANICAL INFORMATION P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0°­ 15° 0.010 (0,25) M 0.010 (0,25) NOM 4040082 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 MS-001 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 21 TLV2241 TLV2241, TLV2242 TLV2242, TLV2244 TLV2244 FAMILY OF 1-µA/Ch RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SLOS329C SLOS329C ­ JULY 2000 REVISED - NOVEMBER 2000 MECHANICAL INFORMATION PW (R-PDSO-G*) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°­ 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS * 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 4040064/F 01/97 NOTES: A. B. C. D. 22 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 MO-153 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof. Copyright © 2000, Texas Instruments Incorporated