TLP1242 11-15E2 UL94V-2 UL94V-0 AWG26 AWG22 030619EAC - Datasheet Archive

 

TOSHIBA Photo-Interrupter Infrared LED+Phototransistor TLP1242(C6,F) Lead Free Product Copiers, Printers, Fax Machines

 

TLP1242 TLP1242(C6,F) TOSHIBA Photo-Interrupter Infrared LED+Phototransistor TLP1242 TLP1242(C6,F) Lead Free Product Copiers, Printers, Fax Machines Air-Conditioners Game Machines The TLP1242 TLP1242(C6,F) is a compact photo-interrupter which has a built-in connector and which uses a high-radiant-intensity GaAs infrared LED and an Si phototransistor. The TLP1242 TLP1242(C6,F) is housed in a highly reliable package which eliminates the need for a printed circuit board or for soldering. It is ideal as a paper carrier location sensor for copiers and printers.The device can operate at temperatures of up to 95°C. Thus the device can be used in high-temperature applications such as a paper-out sensor. Open-collector output can be enabled using the phototransistor. TOSHIBA 11-15E2 11-15E2 Weight: 1.3 g (typ.) · Highly reliable package(device need not be attached to a PCB) · Small package · Snap-in installation · Three board thicknesses supported: 1.0mm,1.2mm and 1.6mm · Gap: 5mm · Resolution: Slit width = 0.5mm · High-temperature operation: Topr = 95°C(max) · High current transfer ratio: IC / IF = 5%(min) · CT connector (2-mm pich, MT receptacle type, MT crimp receptacle typ II) made by Tyco electronics AMP, ltd. · Package material: Polycarbonate(UL94V-2 UL94V-2, black) · Connector material: 66 nylon(UL94V-0 UL94V-0,white) 1 2004-01-26 TLP1242 TLP1242(C6,F) Marking 9A: 42 6 Connector classification Monthly lot number Product No. Month of manufacture January to December denoted by letters A to L respectively Year of manufacture Last digit of year of manufacture Maximum Ratings (Ta = 25°C) Characteristic Symbol Forward current derating (Ta > 25°C) (Ta > 85°C) Reverse voltage Unit IF Forward current Rating 50 mA IF / °C -0.33 -2 mA / °C VR 6 V Collector-emitter voltage VCEO 35 V Emitter-collector voltage VECO 5 V Collector power dissipation PC 75 mW Collector power dissipation derating (Ta > 25°C) PO / °C -1 mW / °C IC 50 mA Operating temperature range Topr -30~95 °C Storage temperature range Tstg -40~100 °C Collector current Optical And Electrical Characteristics (Ta = 25°C) Characteristic LED Forward voltage Symbol VF Test Condition IF = 10mA Min Typ. Max Unit 1.00 1.15 1.30 V IR VR = 5V 10 µA Peak emission wavelength Detector Reverse current P IF = 10mA 940 nm VCE = 24V, IF = 0 0.001 0.1 µA 870 nm VCE = 2V, IF = 10mA 5 100 % IF = 20mA, IC = 0.5mA 0.1 0.35 V Dark current Peak sensitivity wavelength Coupled Current transfer ratio Collector-emitter saturation voltage ID(ICEO) P IC / IF VCE(sat) Rise time tr VCC = 5V, IC = 1mA 15 50 Fall time tf RL = 1k 15 50 2 µs 2004-01-26 TLP1242 TLP1242(C6,F) Pin Strength (Ta = 25°C) Characteristic Test Condition Direction Pulling Weight Time Direction Bending Weight Time Limit A B 19.6N 5s / once B No defect in electrical characteristics A 9.8N 5s / three times CT Connector CT connector manufactured by Tyco Electronics AMP(2mm pitch MT receptacle type) Model Number Terminal Material AWG Size External Diameter of Insulation Coating 173977-3 Housing-terminal en block type Phosphor bronze AWG26 AWG26~28 0.85~1.05mm CT connector manufactured by Tyco Electronics AMP(2mm pitch MT receptacle type II) Housing 179228-3 Model Number 179518-1 Loosen 179227-1 Model number of terminal Produt Type Plugged togethe Material AWG Size External Diameter Of Insulation Coating Phosphor bronze AWG22 AWG22~26 0.93~1.5mm For more details of connector characteristics, please contact the relevant connector manufacturer. Precautions 1. Keep the device away from external light. Although the photo-IC is of low optical sensitivity, the device may malfunction if external light with a wavelength of 700 nm or more is allowed to impinge on it. 2. Care must be taken in relation to the environment in which the device is to be installed. Oil or chemicals may cause the package to melt or crack. 3. When attaching the device to the metal board, always hold the body of the device. Do not hold it by the connector. Ensure that the board is flat, and not warped or twisted. Attach the device to a metal board at room temperature. 4. TOSHIBA recommend attaching the device to the smoother side of the board. 5. TOSHIBA recommend testing the attachment strength beforehand by actually attaching a device to the board. 6. Do not apply solder to the pins of the device's connector. Make sure that the connector is plugged into the CT connector. 7. When inserting or removing the CT connector, always grasp it and its cable firmly and either plug it straight into or pull it straight out of the device's connector. If the CT connector is inserted or removed at an angle, both the device's connector and the CT connector may get damaged, resulting in an unreliable connection. 8. Conversion efficiency falls over time due to the current which flows in the infrared LED. When designing a circuit, take into account this change in conversion efficiency over time. The ratio of fluctuation in conversion efficiency to fluctuation in infrared LED optical output is 1: 1. IC /IF (t) PO (t) = IC /IF (0) PO (0) 3 2004-01-26 TLP1242 TLP1242(C6,F) Package Dimensions: TOSHIBA 11-15E2 11-15E2 Unit in mm Weight : 1.3 g (typ.) Pin Connection 3. Anode 1. Collector 2. Cathode,Emitter 4 2004-01-26 TLP1242 TLP1242(C6,F) IF ­ Ta 60 40 20 0 0 40 20 PC ­ Ta 80 Allowable collector power dissipation PC (mW) Allowable forward current IF (mA) 80 80 60 Ambient temperature Ta 60 40 20 0 0 100 20 (°C) 40 I F ­ VF 100 100 (°C) (typ.) Ta = 25 °C VCE=2V 50 30 Ta IC / IF ­I F (typ.) 50 80 60 Ambient temperature VCE=0.4V Current transfer ratio IC / IF (%) Forward current IF (mA) 30 Ta = 75 °C 10 50 5 0 25 3 -25 1 0.8 0.9 1.0 1.2 1.1 Forward voltage VF 1.3 Sample 2 10 Sample 1 5 3 1 1 1.4 3 5 (V) IC­ IF VCE=2V VCE=0.4V Collector current IC 3 Collector current IC (mA) 5 1 Sample 2 Sample1 0.5 0.3 3 5 10 Forward current 30 IF 50 20 4 15 3 10 2 IF=5mA 0 2 4 6 Collector-emitter voltage (mA) 5 100 (typ.) 5 0 100 50 (mA) Ta = 25 °C 1 0.1 1 IF IC ­ VCE 6 Ta = 25 °C (mA) 10 30 10 Forward current 8 10 VCE (V) 12 2004-01-26 TLP1242 TLP1242(C6,F) Relative IC ­ Ta (typ.) (typ.) 1 VCE=24V ID(ICEO) (µA) 0.8 0.6 0.2 -40 -20 0 20 60 40 Ambient temperature Ta 80 Dark Current VCE = 2V IF=20mA IF=10mA IF=5mA 0.4 100 10 10 1 5 2 10 3 10- (°C) 4 10- VCE(sat) ­ Ta 0.20 Collector-emitter saturation Voltage VCE(sat) (V) ID(ICEO) ­ Ta 5 1. 0 Relative collector current 1. 2 20 40 60 (typ.) Ta 120 100 80 Ambient temperature IC = 0.5mA IF=20mA (°C) Switching Time Test Circuit 0.16 IF 0.12 RL VCC IF VOUT 0.08 90% 10% VOUT td 0.04 0 -40 0 tr -20 0 20 60 40 Ambient temperature Ta 80 tf ts 100 (°C) 6 2004-01-26 TLP1242 TLP1242(C6,F) Switching Characteristics (Non Saturated Operation) 500 300 Switching Characteristics (Saturated Operation) (typ.) 3000 Ta=25°C tr,tf VCC=5V IF=20mA VOUT=1V 1000 100 VCC=5V VOUT4.65V 500 50 ts 300 30 td Switching time (µs) Switching time (µs) (typ.) tf Ta=25°C ts 10 5 100 50 tr 30 3 10 1 td 5 3 1 0.5 0.3 0.1 1 0.3 0.5 5 3 10 30 3 50 10 5 50 30 Load resistance RL 300 500 100 (k) Load resistance R L (k) Detection Position Characteristics(1) 1.2 1.0 0 + Relative collector current - d 0.8 Shutter 0.6 Detection position d=0±0.3mm 0.4 (typ.) 1.2 IF=10mA VCE=2V Ta=25°C 1.0 Relative collector current Detection Position Characteristics(2) (typ.) IF=10mA VCE=2V Ta=25°C 0.8 0.4 d Metal board 1.2mm thickness 0.2 0.2 Shutter 0.6 Detection position 0 -3 -2 -1 0 Distance 1 2 3 0 8 4 d=10.3 9 10 11 12 13 +1.4 -1.1 mm 14 15 Distance d (mm) d (mm) 7 2004-01-26 TLP1242 TLP1242(C6,F) Relative Positioning Of Shutter And Device For normal operation position the shutter and the device as shown in the figure below. By considering the device's detection direction characteristic and switching time, determine the shutter slit width and pitch. Shutter A Metal board b a Center of sensor A' Cross section between A and A' Unit: mm a Dimension b Dimension 1.0 11.9min 9.4max 1.2 11.7min 9.2max 1.6 11.3min 8.8max Recommended Size Of Connection Holes 6.2 ±0.1 Attachment method 7.5 ±0.1 17.1 ±0.1 Metal board 3.7 ±0.1 Insert 7.5 ±0.1 7.6±0.1 17.1 ±0.1 7.6±0.1 6.2 ±0.1 3.7 ±0.1 7.6±0.1 (Unit: mm) 17.1 ±0.1 Thickness of Metal Board 1.2mm Thick Metal board 1.0mm Thick Metal board 1.6mm Thick Metal board For instruction on how to attach the device to a metal board of a type other than the ones shown above, please contact your local TOSHIBA sales office. 8 2004-01-26 TLP1242 TLP1242(C6,F) RESTRICTIONS ON PRODUCT USE 030619EAC 030619EAC · The information contained herein is subject to change without notice. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. · TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. · GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. 9 2004-01-26