TLP109 114L1 UL1577 E67349 EN60747-5-2 - Datasheet Archive

 

TOSHIBA Photocoupler GaAAs Ired & Photo-IC TLP109(IGM) Intelligent Power Module (IPM) Digital Logic Isolation Industrial

 

TLP109 TLP109(IGM) TOSHIBA Photocoupler GaAAs Ired & Photo-IC TLP109 TLP109(IGM) Intelligent Power Module (IPM) Digital Logic Isolation Industrial Inverters Unit: mm 5 4 4.55 +0.25 -0.15 6 The Toshiba TLP109 TLP109(IGM) mini-flat coupler is a small-outline coupler suitable for surface-mount assembly. The TLP109 TLP109(IGM) consists of a high-output-power GaAAs light emitting diode optically coupled to a high-speed photodiode-transistor chip. The TLP109 TLP109(IGM) is housed in the SO6 package and guarantees a creepage distance of 5.0 mm, a clearance of 5.0 mm and an insulation thickness of 0.4 mm. Therefore, the TLP109 TLP109(IGM) meets the reinforced insulation class requirements of international safety standards. The TLP109 TLP109(IGM) guarantees minimum and maximum of propagation delay time, switching time dispersion, and high common mode transient immunity. Therefore TLP109 TLP109(IGM) is suitable for isolation interface between IPM(Intelligent Power Module) and control IC circuits in motor control application. · Common mode transient immunity: ±10 kV/s(min) @VCM=1500 V · +0.25 3.7 -0.15 0.4 0.15 0.1 2.1 ± 0.1 7.0 ± 0.4 0.5 min 1.27 2.54 TOSHIBA 114L1 114L1 Weight: 0.08 g (Typ.) Isolation voltage: 3750 Vrms (min) · 3 1 Switching time: tpHL, tpLH=0.1 s(min) =0.8 s(max) Pin Configuration (Top View) @IF=10 mA, VCC=15 V, 1: ANODE 3: CATHODE 4: EMITTER (GND) 5: COLLECTOR (OUTPUT) 6: V CC RL=20 k, Ta=25°C · Switching time dispersion: 0.7 s(max) (|tpLH-tpHL|) · TTL compatible · UL approved :UL1577 UL1577, File No.E67349 E67349 · c-UL approved :CSA Component Acceptance Service Schematic No. 5A, File No.E67349 E67349 · Option (V4) IF VDE approved : DIN EN60747-5-2 EN60747-5-2 1 Maximum Operating Insulation Voltage : 707 VPK Highest Permissible Over Voltage (Note) : When a EN60747-5-2 EN60747-5-2 approved type is needed, Please designate "Option(V4)" · IO VF : 6000 VPK 3 ICC 6 5 SHIELD 4 VCC VO GND Construction Mechanical Ratings Creepage distance: 5.0 mm (min) Clearance distance: 5.0 mm (min) Insulation thickness: 0.4 mm (min) 1 2010-04-02 TLP109 TLP109(IGM) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit (Note 1) IF 20 mA Pulse forward current (Note 2) IFP 40 mA Peak transient forward current (Note 3) IFPT 1 A Reverse voltage VR 5 V Output current IO 8 mA Peak output current IOP 16 mA Supply voltage VCC -0.5 to 30 V Output voltage VO -0.5 to 20 V PO 100 mW Operating temperature range Topr -55 to 125 °C Storage temperature range Tstg -55 to 125 °C Lead solder temperature (10 sec.) Tsol 260 °C BVS 3750 Vrms Detector LED Forward current Output power dissipation (Note 4) Isolation Voltage (AC,1 min., R.H. 60°%) (Note 5) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 1) Derate 0.36 mA / °C above 95°C. (Note 2) 50% duty cycle, 1 ms pulse width. Derate 0.72 mA / °C above 95°C. (Note 3) Pulse width 1 s, 300 pps. (Note 4) Derate 1.8 mW / °C above 95°C. (Note 5) Device considered a two-terminal device: Pins 1 and 3 shorted together, and pins 4, 5 and 6 shorted together. 2 2010-04-02 TLP109 TLP109(IGM) Electrical Characteristics (Ta = 25°C) Characteristic LED Forward voltage Forward voltage temperature coefficient Symbol Test Condition Min Typ. Max Unit VF IF = 16 mA 1.50 1.64 1.85 V VF / Ta IF = 16 mA -1.8 mV /°C IR VR = 3 V 10 A Capacitance between terminals CT VF = 0 V, f = 1 MHz 60 pF IOH (1) Detector Reverse current IF = 0 mA, VCC = VO = 5.5 V 3 500 nA IOH (2) IF = 0 mA, VCC = 30 V, VO = 20 V 5 50 High level output current IOH High level supply current IF = 0 mA, VCC = 30 V, VO = 20 V, Ta = 100°C A ICCH IF = 0 mA, VCC = 30 V 0.01 1 A Supply voltage VCC ICC = 0.01 mA 30 V Output voltage VO IO = 0.5 mA 20 V Min. Typ. Max. Unit IF = 10 mA, VCC = 4.5 V VO = 0.4 V 25 35 75 IF = 10 mA, VCC = 4.5 V VO = 0.4 V, Ta = -25 to 100 °C 15 IF = 16 mA, VCC = 4.5 V IO = 2.4 mA 0.4 Min Typ. Max Unit 0.8 pF Coupled Electrical Characteristics (Ta = 25°C) Characteristic Current transfer ratio Low level output voltage Symbol IO / IF VOL Test Condition % V Isolation Characteristics (Ta = 25°C) Characteristic Symbol Capacitance input to output CS Isolation resistance RS Test Conditions V = 0 V, f = 1 MHz R.H. 60%, VS = 500 V AC,1 minute Isolation voltage BVS (Note 5) (Note 5) 1×10 12 10 14 3750 AC,1 second, in oil 10000 DC,1 minute, in oil 10000 3 Vrms Vdc 2010-04-02 TLP109 TLP109(IGM) Switching Characteristics (Ta = 25°C, VCC = 15 V) Characteristic Symbol Test Cir- Cuit 1 Switching time dispersion between on and off |tpLH-tpHL| Common mode transient immunity at logic high output Common mode transient immunity at logic low output 2 CML (Note 6) 0.45 0.8 0.1 0.45 0.9 IF=10 mA, RL=20 k Ta=-25~100°C 0.1 0.45 1.0 IF=10 mA, RL=20 k 0.15 0.7 0.25 0.8 0.25 0.9 10000 15000 V / s -10000 -15000 V / s IF=0 mA, VCM=1500 Vp-p CMH (Note 6) 0.1 IF=10 mA, RL=20 k Ta=0 to 85°C tpLH Max. IF=10 mA, RL=20 k Ta=-25 to 100°C Propagation delay time (L H) Typ. IF=10 mA, RL=20 k Ta=0 to 85°C tpHL Min. IF=10 mA, RL=20 k Propagation delay time (H L) Test Condition RL=20 k IF=10 mA, VCM=1500 Vp-p RL=20 k Unit s s (Note 6) CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 1 V). CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 4 V). (Note 7) Maximum electrostatic discharge voltage for any pins: 100 V (C = 200 pF, R=0). 4 2010-04-02 TLP109 TLP109(IGM) Test Circuit 1: Switching Time Test Circuit IF Pulse input VCC = 15V 1 6 PW = 100s Duty ratio = 1/10 VO 15V VO Output monitor 1.5V 100 4 0.1F 3 IF monitor 0 RL 5 IF 1.5V VOL tpHL tpLH Test Circuit 2: Common Mode Transient Immunity Test Circuit VCC = 5V IF 1 6 0.1F 4 1500V VCM VO 5 3 90% RL 10% Output monitor tr 0V tf VCM Pulse gen ZO = 50 VO (IF = 0mA) 15V 4V 1V VO VOL (IF = 10mA) CMH = 1200( V ) 1200( V ) , CML = t r (s ) t f (s ) 5 2010-04-02 TLP109 TLP109(IGM) PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering 1) When Using Soldering Reflow An example of a temperature profile when Sn-Pb eutectic solder is used: An example of a temperature profile when lead(Pb)-free solder is used: Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 deg.C for 60 to 120 seconds. Mounting condition of 260 deg.C or less within 10 seconds is recommended. Flow soldering must be performed once. 3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds not exceeding 350 deg.C. Heating by soldering iron must be only once per lead. 6 2010-04-02 TLP109 TLP109(IGM) (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 degree C to 35 degree C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. 7 2010-04-02 TLP109 TLP109(IGM) Specification for Embossed­Tape Packing (TPL)(TPR) for SO6 Coupler 1. Applicable Package Package Product Type SO6 Mini-flat coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP109 TLP109 (IGM-TPL) Tape type IGM specification Device name 3. Tape Dimensions 3.1 Specification Classification Are as Shown in Table 1 Table 1 Tape Type Classification Tape type Classification Quantity (pcs / reel) TPL L direction 3000 TPR R direction 3000 3.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Direction of Tape L direction R direction Figure 1 Device Orientation 8 2010-04-02 TLP109 TLP109(IGM) 3.3 Empty Device Recesses Are as Shown in Table 2. Table 2 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer 0 Single empty device recesses 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3. +0.1 1.5 -0 G A K0 12.0 ± 0.3 B D E 0.3 ± 0.05 F 1.6 ± 0.1 2.95 ± 0.2 Figure 2 Tape Forms Table 3 Tape Dimensions Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 4.0 B 7.6 D 5.5 Center line of indented square hole and sprocket hole E 1.75 F 8.0 G 4.0 K0 2.6 Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 9 2010-04-02 TLP109 TLP109(IGM) 3.6 Reel A C U B (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4. E W1 W2 Figure 3 Reel Form Table 4 Reel Dimensions Unit: mm Symbol Dimension A 380 ±2 B 80 ±1 C 13 ±0.5 E 2.0 ±0.5 U 4.0 ±0.5 W1 13.5 ±0.5 W2 17.5 ±1.0 4. Packing Either one reel or five reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLP109 TLP109 (IGM-TPL) 3000 Quantity (must be a multiple of 3000) Tape type IGM specification Device name 10 2010-04-02 TLP109 TLP109(IGM) RESTRICTIONS ON PRODUCT USE · Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. · This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. · Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. · Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. · Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. · Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. · The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. · ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. · GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. · Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. · Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 11 2010-04-02