TB6594FLG QON24 MA720 070122EBA

TOSHIBA BiCD Integrated Circuit Silicon Monolithic TB6594FLG Dual DC Motor Driver with Boost DC-DC Converter The TB6594FLG is a

TB6594FLG TB6594FLG TOSHIBA BiCD Integrated Circuit Silicon Monolithic TB6594FLG TB6594FLG Dual DC Motor Driver with Boost DC-DC Converter The TB6594FLG TB6594FLG is a dual DC motor driver IC using LDMOS output transistors with low ON-resistance. Four operation modes are selectable via IN1 and IN2: forward, reverse, short brake and stop. The TB6594FLG TB6594FLG incorporates boost DC-DC converter with a 5-V output, which can be used as a power supply for other ICs. Features · Power supply voltage: VM = 2.2 V to 5.5 V · Output current: IOUT = 0.8 A (max) (H-bridge output) · Output ON-resistance: 15 (upper and lower sum (typ.) @VM = 5 V) · Dedicated standby (power-save) pin · Forward, reverse, short brake and stop · Boost DC-DC converter: VOUT = 5.0 V (typ.) · Boost DC-DC converter efficiency: 80% (typ.) · Thermal shutdown (TSD) · Weight: 0.05 g (typ.) Small surface-mount package (QON24 QON24) *: This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. 1 2008-04-22 TB6594FLG TB6594FLG Block Diagram VOUT CONT 3 24 Soft start Vref VCC 23 PWM control fosc = 100 kHz 1 PGND STBY 20 AIN1 18 AIN2 17 4 VM STANDBY Control logic channel A 6 AO1 H-bridge channel A 8 AO2 TSD BIN1 15 BIN2 14 Control logic channel B 11 BO1 H-bridge channel B 13 BO2 9 MGND GND 16 Pin Functions Pin No. Symbol Function Remarks 1 PGND 2 (NC) 3 CONT 4 VM 5 (NC) No connect 6 AO1 Channel-A motor output 1 7 (NC) No connect 8 AO2 Channel-A motor output 2 9 MGND 10 (NC) No connect 11 BO1 Channel-B motor output 1 12 (NC) No connect 13 BO2 Channel-B motor output 2 14 BIN2 Channel-B motor control input 2 15 BIN1 Channel-B motor control input 1 16 GND Small signal ground 17 AIN2 Channel-A motor control input 2 18 AIN1 Channel-A motor control input 1 19 (NC) No connect 20 STBY Standby control input 21 (NC) No connect 22 (NC) No connect 23 VCC Small-signal power supply 24 VOUT DC-DC converter output DC-DC converter ground pin No connect DC-DC converter switching pin An external inductor is connected to this pin. Motor power supply pin VM = 2.2 to 5 V Motor ground L = Standby (Output: Off) VCC = 2.7 to 5 V 2 2008-04-22 TB6594FLG TB6594FLG Function Table for H-Bridge Control Input Output IN1 IN2 STBY OUT1 OUT2 Drive Mode H H H L L Short brake L H H L H Reverse/forward H L H H L Forward/reverse L L H OFF (high-impedance) H/L H/L L OFF (high-impedance) Stop Standby Functional Description of H-Bridge Driver To eliminate shoot-through current, a dead time (t2, t4) of 300 ns (design target only) is inserted when the PWM is turned on and off. VM OUT1 M VM OUT2 OUT1 M VM OUT2 GND OUT1 M GND t1 GND t3 t2 VM VM OUT1 M OUT2 OUT1 OUT2 M OUT2 GND GND t5 t4 VM t1 t5 OUT1 voltage wave t3 GND t2 t4 3 2008-04-22 TB6594FLG TB6594FLG Functional Description of DC-DC Converter STBY VOUT (DC-DC converter output) Remarks L Standby (Off) H-bridge transistors: Off H On (Constant voltage) VOUT reaches 5 V after the soft-start time. Control Input Sequence VM (1) STBY (3) Internal Reset (5) 5-V regulation VOUT 5V (4) Soft start (a few ms) (2) Release STBY (1) Turn on VM. (2) Release STBY (from Low to High). (3) The internal logic is reset. (4) A soft-start operation is started. (5) VOUT reaches 5 V. Note: If the VOUT output voltage falls below the undervoltage lockout (UVLO) trip threshold due to an overload condition or a short-circuit, UVLO circuitry is activated to prevent large inrush currents. As a result, the TB6594FLG TB6594FLG operates in the following sequence: 1. Resets the internal logic. 2. Soft-start operation. 3. VOUT reaches 5 V. 4 2008-04-22 TB6594FLG TB6594FLG Absolute Maximum Ratings (Ta = 25°C) Characteristics Supply voltage Input voltage Symbol Rating Unit VM 5.5 VCC 5.5 VIN -0.2 to 5.5 Remarks V V VOUT 5.5 VCONT 5.5 IOUT 0.8 ICONT 0.5 Power dissipation PD 0.78 W Operating temperature Topr -20 to 85 °C Storage temperature Tstg -55 to 150 AIN1, AIN2, BIN1, BIN2 and STBY pins °C Output voltage Output current V A AO1, AO2, BO1 and BO2 pins CONT pin AO1, AO2, BO1 and BO2 pins CONT pin Operating Ranges (Ta = -20 to 85°C) Characteristics Supply voltage Output current (H-bridge) Symbol Min Typ. Max Unit VCC 2.7 3 5 V VM 2.2 3 5 V IOUT 0.6 A 5 2008-04-22 TB6594FLG TB6594FLG Electrical Characteristics (unless otherwise specified, VCC = 3 V, VM = 5 V, Ta = 25°C) Section Characteristics Output voltage Input voltage Symbol Test Condition Min Typ. Max VOUT 4.75 5 5.25 VIN Unit 5 Turn-on voltage VST1 IOUT = 1 mA 2.2 Oscillation start voltage VST2 No load, VOUT = variable 2 Undervoltage lockout (UVLO) threshold VLD IOUT = 1 mA, VIN = variable 1.9 No load, VOUT = 4.75 V 420 600 STBY = 0 V 0 0.5 1 2 A Output current IOUT1 IOUT (STB) VM = 2.4 V V A DC-DC H-bridge transistor Converters ON-resistance Rsw (on) VCONT = 0.4 V H-bridge transistor leakage current ILCONT VOUT = VCONT = 5.5 V 0 1 Line regulation VOUT VM = 2.2 V to 3 V 10 60 Load regulation Vo load IOUT = 10 A to 50 mA 150 250 Obtained by monitoring the VCONT waveform. 70 100 130 78 87 92 80 2.5 5 7.5 ms mA Oscillation frequency fosc Maximum duty cycle Maxduty Efficiency EFFI Soft-start time Tss RL = 5 k ICC STBY = VCC Supply current ICC (STB) 0.23 0.5 0 1 0 1 VIH 2 VIL -0.2 0.8 (Design target only) 0.2 IIH VIN = 3 V 5 15 25 IIL VIN = 0 V 0 1 VIH (STB) 2 VCC + 0.2 VIL (STB) H-Bridge Drivers Standby input voltage -0.2 Standby input current Output saturation voltage Output leakage current Diode forward voltage TSD % 0.8 VIN (his) Control input voltage kHz VCC + 0.2 IM (STB) Control input voltage mV STBY = 0 V IIH (STB) VIN = 3 V 15 40 80 IIL (STB) VIN = 0 V 0 1 IO = 0.2 A 0.2 0.4 IO = 0.6 A 0.6 1.2 IL (U) VM = AO1, AO2, BO1, BO2 = 5.5 V 0 1 IL (L) VM = 5.5 V, AO1, AO2, BO1, BO2 = 0 V -1 0 0.9 1.2 0.9 1.2 Vsat (U + L) VF (U) VF (L) Thermal shutdown threshold TSD Thermal shutdown hysteresis IF = 0.6 A TSD (Design target only) 6 170 20 A V A V A V A V °C 2008-04-22 TB6594FLG TB6594FLG Application Circuit Example VOUT CONT 24 Vref VCC 23 3 220 F L = 100 H SBD C1 C2 47 F 0.1 F C3 +5 V Soft start +2.2 V to 5 V PWM control fosc = 100 kHz AIN1 AIN2 20 4 STANDBY VM C4 STBY PGND 18 17 H-bridge channel A 6 H-bridge channel B Control logic channel A 11 8 AO1 AO2 0.1 F 1 M MCU TSD BIN1 BIN2 GND 15 14 Control logic channel B 16 13 9 BO1 BO2 M MGND L: CD54 inductor with an inductance of 100 H from Sumida Corporation (or its equivalent) SBD: MA720 MA720 from Matsushita Electric Industrial Co., Ltd. (or its equivalent) C2: Tantalum electrolytic capacitor with a capacitance of 47 F from Nichicon Corporation (or its equivalent) Note: Bypass capacitors should be places as close to the IC as possible. Usage Considerations · Though the TB6594FLG TB6594FLG has thermal shutdown (TSD) circuitry, a large current might abruptly flow through the IC in case of a short-circuit across its outputs, a short-circuit to power supply or a short-circuit to ground, leading to a permanent damage of the IC. These possibilities should be fully considered in the design of the output, VCC and ground lines. · The IC should be installed correctly. Otherwise, the IC or peripheral parts and devices may be degraded or permanently damaged. 7 2008-04-22 TB6594FLG TB6594FLG Package Dimensions Weight: 0.05 g (typ.) 8 2008-04-22 TB6594FLG TB6594FLG QON Package Considerations Package Appearances (Top View) (Bottom View) Please follow the following guidelines for the QON package. Guidelines: (1) (2) The solder plated pads at the four corners of the package (shaded areas in the bottom view) should not be soldered for the purpose of improving the mechanical strength of solder joints. When using the TB6594FLG TB6594FLG, it should be ensured that the thermal pad and solder plated pads (shaded areas in the top and bottom views) are electrically insulated (Note). Note: Care should be taken in the board design to prevent solder for through-hole joints from flowing to the solder plated pads on the bottom of the package (shaded areas in the bottom view). · When mounting or soldering this package, care must be taken to avoid electrostatic discharge or electrical overstress to the IC. (This is to avoid electrical leakage and a buildup of electrostatic charge in the end product.) · It should be ensured that no voltage is directly applied to the solder plated pads when designing the PC board. 9 2008-04-22 TB6594FLG TB6594FLG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 10 2008-04-22 TB6594FLG TB6594FLG Points to Remember on Handling of ICs (1) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (2) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (3) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 11 2008-04-22 TB6594FLG TB6594FLG About solderability, following conditions were confirmed · Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux RESTRICTIONS ON PRODUCT USE 070122EBA 070122EBA_R6 · The information contained herein is subject to change without notice. 021023_D · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B · The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C · Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF · The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 12 2008-04-22