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TB379

Catalog Datasheet MFG & Type PDF Document Tags

TB334

Abstract: TB363 Characterization of Packages for ICs (TB379) www.intersil.com/data/tb/tb3/tb379/TB379.pdf · Guidelines for
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ISL83740EVAL ISL83740REF-CD ISL837030REF-CD ISL83700EVAL AN9940 TB363 TB334 AN993 FN8013 ISL837030/ISL83740 AN9935 AN9934 ISL83700EVAL/

TB379

Abstract: TB363 ISL9211A ¬ 2009 4 2 FN6702.0 ISL9211A ICIC ISL9211AN-MOSFET · 24V · 2.0A · IC · +150°CN- MOSFET · ICISL9211A · 1µs · · ICNFET · NFET · RoHS ISL9211A · · · PDA · · · Technical Brief TB363" " · Technical Brief TB379 " · Technical Brief TB389 "QFN PCB (°C) ISL9211A (8 LD µTDFN) PKG. DWG. # ISL9211AIRU48XZ-T* 4XE -40 ~+85 & ( ) 8
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ISL9211AIRU58XZ-T ISL9211AIRU68XZ-T TB347 2X2B TB-347 Technical Brief TB389 STD-020 1-888-INTERSIL

IS80101

Abstract: ISL80101IR15Z of Packaged Semiconductor Devices TB379 8. JC 9 , COUT = 10F TJ = +25 Technical Brief TB379 -40 , Technical Brief TB379 -40 +125 MIN MAX 11 TYP 11 f = 1kHz, ILOAD = 1A
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ISL80101 ISL80101IRAJZ IS80101 ISL80101IR15Z x05v ISL80101IR33Z-T ISL80101IR18Z FN6931 ISO9000

spartan 3a

Abstract: TB379 . . . . . . . . . . . . . . . . . . . . -10°C +125°C " " 1JA"" TB379 2JC"" TB379
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ISL65426 ISL65426HRZ ISL65426IRZA spartan 3a fn640 EN2710 FN640 ISL65426IRZ ISL6542

6520cb

Abstract: TB379 " features. See Tech Brief TB379. 3. For JC, the "case temp" location is the center of the exposed metal , thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. JA is measured in free
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ISL6520 FN9009 6520cb ISL6520CB ISL6520CBZ ISL6520CR ISL6520IB 5M-1982

acbz

Abstract: 6520ACBZ conductivity test board with "direct attach" features. See Tech Brief TB379. 3. For JC, the "case temp , component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for
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ISL6520A FN9016 acbz 6520ACBZ 6520ACB 6520 ACB 20AIRZ 6520 acbz
Abstract: ©³ç´°ã¯ãƒã'¯ãƒ'ã'«ãƒ«ï½¥ãƒãƒªãƒ¼ãƒ•ã'ŒThermal Characterization of Packaged Semiconductor Devices (TB379)ã'ã''å'ç§ã—てくだã , ƒ©ã'¤ãƒ³ã«å¾"ã'ãªã'ã'Œã°ãªã' ませã'"ã''13 ペーã'¸ã®ã'Œæ¶è²»é›»å›ã'とãƒã'¯ãƒ'ã'«ãƒ«ï½¥ãƒãƒªãƒ¼ãƒ• TB379 , ®ã'Œæ¶è²»é›»å›ã'とãƒã'¯ãƒ'ã'«ãƒ«ï½¥ãƒãƒªãƒ¼ãƒ• TB379 ã''å'ç§ã—てくださã"ã'' 太字のリãƒãƒƒãƒå'¤ã¯ã'¸ãƒ£ãƒ³ã'¯ã'·ãƒ§ãƒ³æ¸©åº¦ (TJ , ®ã'Œæ¶è²»é›»å›ã'とãƒã'¯ãƒ'ã'«ãƒ«ï½¥ãƒãƒªãƒ¼ãƒ• TB379 ã''å'ç§ã—てくださã"ã'' 太字のリãƒãƒƒãƒå'¤ã¯ã'¸ãƒ£ãƒ³ã'¯ã'·ãƒ§ãƒ³æ¸©åº¦ (TJ Intersil
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ISL28127 ISL28227 ISL80111 ISL80112 ISL80113 ISL80111/ISL80112/ISL80113

smd 58a transistor 6-pin

Abstract: ISL75051SRH . Please refer to â'Applications Informationâ' on page 11 of the datasheet and Tech Brief TB379. Pulse , and Tech Brief TB379. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits , temperature. Please refer to â'Applications Informationâ' on page 11 of the datasheet and Tech Brief TB379. , board with â'direct attachâ' features. See Tech Brief TB379 6. For θJC, the â'case tempâ
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ISL75051SRH smd 58a transistor 6-pin SMD 5962-11212 FN7610

ISL9211IRU58XZ-T

Abstract: ISL9211IRU68XZ-T " features. See Tech Brief TB379. 3. JC, "case temperature" location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications Typical values are , Technical Brief TB379 "Thermal Characterization of Packaged Semiconductor Devices" BATTERY PACK ·
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ISL9211 ISL9211IRU58XZ-T ISL9211IRU68XZ-T ISL6292 FN6658

TB379

Abstract: 187AA 3. qJA TB379 VDD IDD1 VDD VDD=5.0V IDD2 V2MON
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ISL88031 187AA ISL88031EVAL1 ISL88031IU8HFZ FN8227 1888INTERSIL 18884683774I STD020 ISL88031IU8H

093 425

Abstract: "direct attach" features. See Tech Brief TB379. 3. JC, "case temperature" location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications PARAMETER , GND FAULT VB RVB BATTERY PACK · Technical Brief TB379 "Thermal Characterization of Packaged
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093 425
Abstract: thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 3. JC, "case temperature" location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. , GND FAULT VB RVB BATTERY PACK · Technical Brief TB379 "Thermal Characterization of Packaged Intersil
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Abstract: conductivity test board with "direct attach" features. See Tech Brief TB379. 5. For JC, the "case temp , worst case junction temperature. Please refer to "Functional Description" on page 7 and Tech Brief TB379. , refer to "Functional Description" on page 7 and Tech Brief TB379. Boldface limits apply over the Intersil
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ISL80101A ISL80121-5 FN7712

jedec package MO-220 vggc

Abstract: MO-220-VGGC temp" is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379. , in free air. See Tech Brief TB379 for details. 3. JA is measured in free air with the component
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ISL6700 ISL6700IB ISL6700IR MO-220 jedec package MO-220 vggc MO-220-VGGC FN9077 80VDC 96VDC
Abstract: Brief TB379. Electrical Specifications VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO , air. See Tech Brief TB379 for details. 4. θJA is measured in free air with the component mounted on Intersil
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PUB95

28 ld qfn 4x4 intersil

Abstract: ISL8104 Tech Brief TB379. 3. For JC, the "case temp" location is the center of the exposed metal pad on the , test board in free air. See Tech Brief TB379 for details. 2. JA is measured in free air with the
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ISL8104 28 ld qfn 4x4 intersil ISL8104CBZ ISL8104IRZ ISL8104CRZ ISL8104IBZ FN9257

TB379

Abstract: ISL88021 TB379 VDD 5.5 V IDD1 VDD VDD
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ISL88021 ISL88022 ISL88021ISL88022 FN8226 22EVAL1 6ISL88021

6227CAZ

Abstract: 6227CA board with "direct attach" features. See Tech Brief TB379. 4. For JC, the "case temp" location is the , a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3
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ISL6227 FN9094 6227CAZ 6227CA 5L-B qfn 5x5 thermal resistance
Abstract: TB379. Electrical Specifications VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO, Unless , test board in free air. See Tech Brief TB379 for details. 3. JA is measured in free air with the Intersil
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baara

Abstract: ic baara EL7532 MSOP10 MSOP10 JA 115/W JA 4 100/W 2 125/W TB379 PC · · VINPGND · PC -
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EL7532IY EL7532IY-T7 EL7532IY-T13 EL7532IYZ EL7532IYZ-T7 EL7532IYZ-T13 baara ic baara el75321 JESD22-A114-B FN7435 2EL7532
Abstract: â'direct attachâ' features. See Tech Brief TB379. 8. For θJC, the â'case tempâ' location is the , ' on page 13 and Tech Brief TB379. . Pulse load techniques used by ATE to ensure TJ = TA where , refer to â'Power Dissipationâ' on page 13 and Tech Brief TB379. . Pulse load techniques used by ATE , worst-case junction temperature. Please refer to â'Power Dissipationâ' on page 13 and Tech Brief TB379. . Intersil
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FN7841

transistor TIP 31A

Abstract: ISL80111 test board with "direct attach" features. See Tech Brief TB379. 8. For JC, the "case temp" location is , 13 and Tech Brief TB379. Boldface limits apply over junction temperature (TJ) range, -40°C to +125°C. , TB379. Boldface limits apply over junction temperature (TJ) range, -40°C to +125°C. Pulse load , TB379. Boldface limits apply over junction temperature (TJ) range, -40°C to +125°C. Pulse load
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transistor TIP 31A JESD22-115A

9576 GM

Abstract: ISL75051SRH conductivity test board with "direct attach" features. See Tech Brief TB379 6. For JC, the "case temp , "Applications Information" on page 11 of the datasheet and Tech Brief TB379. Boldface limits apply over the , datasheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to , . Please refer to "Applications Information" on page 11 of the datasheet and Tech Brief TB379. Boldface
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9576 GM ISL75051 0.2uf 50V Ceramic Capacitor ISL75051SRHQF 5962R1121201VXC Ceramic Capacitors 0.2UF 50V

TB379

Abstract: x05v Tech Brief TB379. 8. For JC, the "case temp" location is the center of the exposed metal pad on the , "ISL78310 Schematic Block Diagram" on page 4 and Tech Brief TB379. Boldface limits apply over the operating , junction temperature. Please refer to "ISL78310 Schematic Block Diagram" on page 4 and Tech Brief TB379
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AEC-Q100 ISL78310ARAJZ ISL78310ARAJZ-TR5303 TS16949 FN7810

ISL80101IR33Z-T

Abstract: ISL80101IR15Z "direct attach" features. See Tech Brief TB379. 8. For JC, the "case temp" location is the center of the , temperature. Please refer to Applications section of the datasheet and Tech Brief TB379. Boldface limits , junction temperature. Please refer to Applications section of the datasheet and Tech Brief TB379
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CAPACITOR F 2.2k 100V LD 100V

Abstract: ' features. See TechBrief TB379 6. For θJC, the â'case tempâ' location is the center of the exposed , and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to +125°C. , and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to +125°C. , sheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to
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CAPACITOR F 2.2k 100V LD 100V ISL75052SEH FN8456
Abstract: board with "direct attach" features. See Tech Brief TB379. 6. For JC, the "case temp" location is the , temperature. Please refer to "Functional Description" on page 7 and Tech Brief TB379. Boldface limits apply , TB379. Boldface limits apply over the operating temperature range, -40°C to +125°C. Pulse load Intersil
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FN7713

ISL80101-ADJ

Abstract: MV10UF conductivity test board with "direct attach" features. See Tech Brief TB379. 7. For JC, the "case temp , temperature. Please refer to "Applications Information" on page 8 and Tech Brief TB379. Boldface limits apply , refer to "Applications Information" on page 8 and Tech Brief TB379. Boldface limits apply over the
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ISL80101-ADJ MV10UF TB-36 JESD78C FN7834
Abstract: board with â'direct attachâ' features. See Tech Brief TB379. 7. For θJC, the â'case tempâ , junction temperature. Please refer to â'Applications Informationâ' on page 8 and Tech Brief TB379 , . Please refer to â'Applications Informationâ' on page 8 and Tech Brief TB379. Turn-on Threshold Intersil
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JESD78C

Abstract: JESD-78C conductivity test board with "direct attach" features. See Tech Brief TB379. 7. For JC, the "case temp , temperature. Please refer to "Applications Information" on page 8 and Tech Brief TB379. Boldface limits apply , refer to "Applications Information" on page 8 and Tech Brief TB379. Boldface limits apply over the
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JESD-78C

to48c

Abstract: FN7713 Tech Brief TB379. 6. For JC, the "case temp" location is the center of the exposed metal pad on the , Description" on page 7 and Tech Brief TB379. Boldface limits apply over the operating temperature range , junction temperature. Please refer to "Functional Description" on page 7 and Tech Brief TB379. Boldface
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to48c ISL80121IR50Z JESD22-A114
Abstract: effective thermal conductivity test board with â'direct attachâ' features. See Tech Brief TB379. 8. For , Block Diagramâ' on page 4 and Tech Brief TB379. DC Output Voltage Accuracy VOUT VOUT Options , temperature. Please refer to â'ISL78310 Schematic Block Diagramâ' on page 4 and Tech Brief TB379 Intersil
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