T5551 T5551-PAE T555101-PAE 88/540/EEC 91/690/EEC D-74025

Micromodule Description The micromodule T5551 is the standard package for Atmel Wireless & Microcontrollers' contactless

T5551 T5551 Micromodule Description The micromodule T5551 T5551 is the standard package for Atmel Wireless & Microcontrollers' contactless identification IC family. This package simplifies the soldering or welding handling and enables smart card applications. The micromodule is 400 µm thin, thus opening the way to contactless card applications. The module includes the IC e5551 and an internal capacitor. Features D Universal metal leadframe packaging for all identification applications, especially for contactless cards and small coins D With internal capacitor D Optimized mechanical stability D Overall thickness 400 µm D Designed for high volumes 1 Antenna C Data 2 Port 2 Controller Port 1 Power Coil interface T5551 T5551 Memory e5551 Figure 1. Block diagram Ordering Information Extended Type Number Package Remarks T5551-PAE T5551-PAE Micromodule Reeled (35 mm, 3 rows), 12-15 k per reel, 415 pF T555101-PAE T555101-PAE Micromodule Reeled (35 mm, 3 rows), 12-15 k per reel, 330 pF Rev. A3, 30-Mar-01 1 (4) Preliminary Information T5551 T5551 Pin Description Pin Symbol Function 1 Port 1 Power supply and data transmission coil 1 2 Port 2 Power supply and data transmission coil 2 General The micromodule is a special package suitable for contactless R/W-identification applications. It is a plastic encapsulated package on a copper leadframe substrate and includes: Read/write IDIC e5551 with EEPROM Chip capacitor The chip capacitor is connected in parallel to coil 1 and coil 2 of the e5551 and to Pin 1 and Pin 2 of the package. Electrical Characteristics Absolute Maximum Ratings Parameter Symbol Value Unit Max. DC current into coil 1/ coil 2 Icoil 10 mA Max. AC current into coil 1/ coil 2 icoil 20 mApp Power dissipation (dice) Ptot 100 mW Operating ambient temperature range Tamb 40 to +85 _C Storage temperature range Tstg 40 to +125 _C Maximum assembly temperature > 5 min Tsld +150 _C Capacitor Chip Parameter Test Conditions / Pins Capacitance 415 pF Tolerance $8.5% Capacitance 330 pF Tolerance $5% Q-factor 500 mV, 125 kHz 1) 2) Min. VBR Breakdown voltage Symbol Typ. 60 Unit C 380 415 450 pF C 315 330 345 pF V Q 300 T Temperature coefficient Max. 68 ppm/K e5551: for electrical characteristics, please refer to the e5551 data sheet 1) 2) Tolerance on one reel $5% around average value Tolerance on one reel $3.5% around average value 2 (4) Rev. A3, 30-Mar-01 Preliminary Information T5551 T5551 Micromodule Dimensions in mm Specification Pitch Module size Mold dimension Lead frame Bond pad size Surface plating Module thickness Temperature Profile for Processing 9.5 mm 5 8 mm 5.1 4.9 mm CuSn6 100 µm 5 1.5 mm 2.5 µm Ag 400 µm maximum 150_C / 5 min 390_C / 3 s 500_C / 25 ms Rev. A3, 30-Mar-01 3 (4) Preliminary Information T5551 T5551 Ozone Depleting Substances Policy Statement It is the policy of Atmel Germany GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Atmel Germany GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC 88/540/EEC and 91/690/EEC 91/690/EEC Annex A, B and C (transitional substances) respectively. Atmel Germany GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. 6. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Atmel Wireless & Microcontrollers products for any unintended or unauthorized application, the buyer shall indemnify Atmel Wireless & Microcontrollers against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Data sheets can also be retrieved from the Internet: http://www.atmelwm.com Atmel Germany GmbH, P.O.B. 3535, D-74025 D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2594, Fax number: 49 (0)7131 67 2423 4 (4) Rev. A3, 30-Mar-01 Preliminary Information