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Part Manufacturer Description Datasheet BUY
STL00911500PCN (1589053-1) TE Connectivity (1589053-1) STL00911500PCN = SOLDER CUP visit TE Connectivity
STM03711500SCQ (1-1589054-9) TE Connectivity (1-1589054-9) STM03711500SCQ = Solder Cup visit TE Connectivity
STM02511500SCN (1589054-9) TE Connectivity (1589054-9) STM02511500SCN = SOLDER CUP visit TE Connectivity
STL00911500PC (2-1589053-2) TE Connectivity (2-1589053-2) STL00911500PC = SOLDER CUP visit TE Connectivity
1217302-1 TE Connectivity (1217302-1) SOLDER TAB .041 MAG-MATE visit TE Connectivity
SSL01511500PCN (1589051-5) TE Connectivity (1589051-5) SSL01511500PCN = SOLDER CUP visit TE Connectivity

Solder paste RMA-20-21

Catalog Datasheet MFG & Type PDF Document Tags

AVR-M1608C080M-AAB

Abstract: rma-20-21 Temperature profile: 230°C max. Number of soldering: 1 time Solder paste: Tamura Corporation(Tokyo, Japan) RMA-20-21 Measurement shall be made 24 hours after soldering. 2 : Packaging style(T: Taping/B
TDK
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Solder paste RMA-20-21

Abstract: tamura rma time Solder paste: Tamura Corporation(Tokyo, Japan) RMA-20-21 Measurement shall be made 24 hours after
TDK
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rma-20-21

Abstract: tamura rma °C max. Number of soldering: 1 time Solder paste: Tamura Corporation(Tokyo, Japan) RMA-20-21 Measurement
TDK
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Tamura kaken

Abstract: tamura solder paste PROFILE condition Temperature profile: 230°C max., Number of soldering: 1 time, Solder paste: Tamura Kaken Corporation(Tokyo, Japan) RMA-20-21 2 : Packaging style(T: Taping/B: Bulk) · Operating and storage
TDK
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1501a

Abstract: MATERIAL SAFETY Solder powder property 1 ~ 2 Solder Ball Test Range 1 ~ 3 Solder Paste Residue Adhesive Test after Reflow No , percentage Ag 0 Others < 0.5 wt% RMA-15-01A Solder Paste Solder Paste Composition De-oxygen True , : Follow the Lead poisoning prevention regulations Solder Paste RMA ­ 15 ­ 01A Low-activated RMA , surface of solder paste will harden and may influence parts adhesion. 7. Reflow Conditions: The following diagram is a reference for reflowing. Follow it to minimize solder paste collapse & balls
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1501a MATERIAL SAFETY Solder powder Rosin Flux Type RMA 150-1A

CU-106A

Abstract: entek plus cu 106a , CASTIN Pb-free solder paste, and ENTEK® PLUS Organic Solderability Preservative (OSP) as the PWB surface , finishes is visual only. By using TI 4-layer Ni/Pd finished IC components, AIM CASTIN Pb-free solder paste , paste for surface mount operations and bar solder for wave soldering operations. Elimination of Pb in , finished IC components, a Pb-free solder paste, and a non-Sn/Pb coating on the Cu land patterns the IC , . Table 1: L9 Designed Experiment Run Lead Finish Solder Paste 1 Sn/Pb Sn/Pb RMA 2
Texas Instruments
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CU-106A entek plus cu 106a anova general cross references TI Cross Reference Search HC373 PC100/PC133
Abstract: implied is made in regards to the following recommendations. 1 Solder Paste Printing 2 , the optimum solder paste for the pattern, printing process, and solder joint quality. The , Typical solder paste alloy is 63Sn/37Pb. RMA,No-Clean or Halide Free Water Soluble fluxes should be , . CAUTION CAUTION Since solder paste usually contains a high percentage of activators, you must ensure adequate cleaning to remove all residues. Consult your solder paste supplier for cleaning Bourns
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24-6337-8817

Abstract: 24-7068-1407 Products Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products , , lead-free, no-clean solder paste. NXG3 is engineered for the high thermal demands of assembling with , solder paste. NXG5 is engineered for the high thermal demands of assembling with lead-free alloys , ' expectations for high yield le Formula NXG33 Zero halogen, lead-free, no-clean solder paste. NXG3 is , Designator ROL0 Suggested Packaging Style 500g jar or 600g cartridges STANDARD SOLDER PASTE REFLOW
Kester
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24-6337-8817 24-7068-1407 2460400010 24-6337-0027 K100LD sn62pb36ag2 IPC/J-STD-004B 800-2-KESTER

sn63pb37 solder wire

Abstract: SN63PB37 Materials Table of Contents Table of Contents Products Solder Paste Fluxes Solder Wire Bar , Product Characteristics Sn96.5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste. NXG3 is , .5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste. NXG5 is engineered for the high thermal demands of , , no-clean solder paste. NXG3 is engineered for manufacturing. NXG33 is engineered for the high thermal de , 600g cartridges STANDARD SOLDER PASTE REFLOW PROFILE STANDARD SOLDER PASTE REFLOW PROFILE FOR
Kester
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sn63pb37 solder wire SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232

GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 Core Size 66 66 66 66 66 Solder Paste No-Clean Solder Paste for Stencil Printing Applications , , 600g, 1400g cartridges Solder Paste for Syringe Dispensing Applications Formula Type Alloy Product , for Antimony, which is specified to a maximum of 0.2%. Page 7 Page 8 Solder Paste Kester , , Kovar Zinc, Mild Steel, Chromium, Inconel, Monel, Stainless Steel Solder Paste and Tacky Soldering , (Category 1, 2, 3, or 4). STANDARD SOLDER PASTE REFLOW PROFILE FOR KESTER PASTE CONTAINING ALLOYS: Sn96
Kester
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GR-78-CORE J-STD-006A RF771 bellcore GR-78 959T TC-527 2220-VF EM907

QQ-S-571E

Abstract: IPC-J-STD-004 of proper handling and operating conditions. All information pertaining to solder paste is produced , RMA Cored Wire Solder Rosin Mildly Activated Cored Wire Solder Features: - Good Activity Level , mildly activated, general-purpose wire solder for use in applications requiring good activation. RMA , solder joints. RMA wire will leave slight to moderate post-process residues that may be left on , be available upon special request. Application: - Solder iron tip temperature should be between
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QQS-571-E IPC-J-STD-004 SN100C AIMTERGE-520A QQ-S-571E QQ-S-571 MSDS QQ-S571E QQ-S-571 C-400 F-750 F-800

SN63PB37

Abstract: Sn96.5Ag3.0Cu0.5 .062 66 24-9574-6411 K100LD .062 Page 7 Solder Paste Water-Soluble No-Clean Solder Paste for Stencil Printing Applications Formula Type Alloy Easy Profile , Solder Paste for Syringe Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 , to a maximum of 0.2%. Page 8 Solder Paste Kester Part # Description Alloy Packaging , quickly bring the assembly up to a temperature where solder paste can become highly chemically active
Kester
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EM828 IPC/J-STD-004 RF743 RF773

senju printing speed

Abstract: senju solder paste 2.3.1 SOLDER PASTE (1) Material Composition Soldering paste is mainly made from soldering powder and , influences soldering paste viscosity and solder thickness after reflow. Suitable soldering powder and flux , deformation) No separation of flux and solder powder No paste surface solidification after manufacture , . · If paste is too viscous, solder does not separate from the die plate easily, possibly causing , MOUNTING PROCESS 2.3.2 SOLDER SUPPLY PROCESS (1) Soldering paste printability Soldering paste is
Mitsubishi
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senju printing speed senju solder paste Senju metal solder paste viscometer Senju flux solder powder

rma 291

Abstract: Solder paste RMA-291 preferable Thorough cleaning of boards after soldering is required Reflow Soldering Screen solder paste on board and attach components to board Solder paste with RMA flux is recommended Bake boards at , solder paste with vapor phase method the solder paste temperature must be maintained at or above 200 C , solder paste temperature must be maintained at or above 200 C for at least 30 seconds The components , soldering is recommended for DIP packages Solder plated boards are recommended Rosin mildly activated (RMA
Elantec
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rma 291 Solder paste RMA-291 SOL28 package SOL-28 MDP0038

IPC-6012

Abstract: reflow temperature bga laptop producing an opening by which contaminants may enter. Screen print solder paste on side #1 Normally , Combined Wave Solder and Solder Reflow Screen print solder paste on side #1 More mature products , components and selected these SM components accordingly. Attach SMT components Reflow solder paste , Screen print solder paste on side #1 Fine Pitch SM Solder Reflow Side 1 and Side 2 Fine pitch SM , volume of solder paste incorporated in the component interconnection. Apply adhesive on side #1
National Semiconductor
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IPC-6012 reflow temperature bga laptop IPC 6012 micron tsop 48 PIN tray PCB design for very fine pitch csp package epoxy adhesive paste cte table

TB370

Abstract: to252 footprint wave soldering and layout of a circuit board. The main suggested method of attachment is to use a solder paste. ing , single step. Solder pastes are composed of solder Power outline, stencil thickness, flux/solder paste , critical as for IR reflow. Solder Paste Reflow Profile The following profile is intended as an ideal , components start activation and begin to reduce the oxides on component leads, PCB pads, and solder paste , temperature. Zone 3: Reflow Stage (180-235oC) Solder paste is brought to approximately 30oC above the
Harris Semiconductor
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TB370 TB334 to252 footprint wave soldering stencil tension
Abstract: (wave) soldering is not appropriate for this device. The type of solder paste selected for reflow , fluxes. Metal content of the paste for screen and/or stencil applications is generally 85-90% by weight, slightly lower for nozzel dispensing applications. When screening or stenciling, solder paste thickness of , °C MAX 250 200 150 100 50 PREHEAT SOLDER FLUX MELT/ACTIVATION PASTE SOLDER SPHERE MELT , reflow temperature be approximately 10-30°C (20-55°F) above solder liquidus temperature. Typical M/A-COM
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EIA-481-1

J-STD-003

Abstract: J-STD-005 paste consisting of very small solder particles suspended in flux · Metal content ­ The amount of , and Test Methods for Solder Paste IPC-TM-650 - Test Methods Manual IEC-1191-1 - Generic Standard , Considerations/Topics ­ ­ ­ ­ ­ ­ ­ ­ ­ PWB footprint (layout) Solder mask use/layout Type of solder Temperature profile Type of soldering equipment Stencil Flux Cleanup Standards , preferences, the PWB footprint will be: ­ the same size as the part solder pad layout, or ­ slightly larger
RF Monolithics
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ANSI/IPC-A-610 QQ-S-571F ISO-9453-1990 J-STD-003 J-STD-005 heller 1700 J-STD-004 SM20H SM20L ANSI/IPC-SM-782 ANSI/J-STD-001
Abstract: A suggested solder mask pattern is shown in Figure 3. The solder paste should be applied to all the , solder paste pattern. The second need is to supply a miniature packaged circuit which can be tested , devices which are to be surface mounted, should have their solder paste screened on at the same time , of solder paste application in this instance should be taken into account in the stencil design , the substrate. Solder paste is appl ied using a teflon or polyurethane squeegee as shown in Fig. 7 -
OCR Scan
LP508 3T357 110XJ20 3T3S763

Alpha WS609 solder

Abstract: Kester steam aging system Water Soluble and No-Clean Solder Paste Study Degradation by Moisture Pre-Conditioning PDIP Board , No-Lead Solder Paste Compatibility Other Component Suppliers Acknowledgements 66 References 67 , Reflow (IR) furnace or Vapor Phase Reflow (VPR) is used to heat the solder paste to the melting , board temperature rises to 215-220°C and quickly drops off after the solder paste is reflowed. The , encounter during the solder reflow process. This test procedure begins with screening solder paste onto a
Texas Instruments
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Alpha WS609 solder Kester steam aging system solder paste alpha WS609 kester solder paste WS609 mountaingate 7406D
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