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SN63PB37 - - 100 (Sep 2016) Chip One Exchange Buy

Sn63pB37*

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: - DBW - Dice on solder bumped wafer, thickness 390 um Sn63Pb37 on 5 um Ni/Au, height 70 um ... White Electronic Designs
Original
datasheet

17 pages,
798.31 Kb

W3E32M64S-XBX W3E16M64S-XBX TEXT
datasheet frame
Abstract: Sn63Pb37 · Laser cutting · Sn60Pb40. · Electroforming. COMPONENT PLACEMENT Of the three ... Atmel
Original
datasheet

34 pages,
596.5 Kb

T5557 T5554 MOA2 TEXT
datasheet frame
Abstract: temperature (oC) Sn42Bi58 138 160 - 180 Sn43Pb43Bi14 144 - 163 165 - 185 Sn63Pb37 183 ... Philips Semiconductors
Original
datasheet

30 pages,
240.47 Kb

SSOP24 300 1 footprint SSOP24 SSOP16 sot89 stencil PowerMos transistors TO220 package ssop24 footprint TEXT
datasheet frame
Abstract: using a eutectic (Sn63Pb37) solder, to a 2-layer PCB that is considered typical of some automotive and ... Agilent Technologies
Original
datasheet

8 pages,
307.4 Kb

Sn95.8Ag3.5Cu0.7 Sn91 RG200D ML200D GETEK ACPF-7002 Sn42Bi58 Sn95Sb5 Sn43Pb43Bi14 TEXT
datasheet frame
Abstract: R276 Dispensable No-Clean Solderpaste for Leaded Alloys Product Description Physical Properties (Data given for Sn63Pb37 87% metal, -325+500 mesh) Kester R276 is a no-clean solder paste , in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is typically recommended, but Type 4 is , are 21-25°C (70-77°F) and 35-65% R.H. Kester Reflow Profile Alloy: Sn63Pb37 or Sn62Pb36Ag02 , recommended reflow profile for R276 made with either the Sn63Pb37 or Sn62Pb36Ag02 is shown here. This ... Motorola
Original
datasheet

24 pages,
371.96 Kb

JESD51-5 MC33892 MO-220 MC33984 MC33982 PQFN package power freescale DUAL ROW QFN leadframe ADHESIVE GAP PAD PQFN 5 leads MC33982FC AN2467 MC33982PNA PQFN PQFN footprint AN2467/D AN2467/D AN2467/D TEXT
datasheet frame
Abstract: terminal surface 1) Sn63Pb37 solder is to be soldered newly Solderability 235±5℃, 5±0.5sec ... Kester
Original
datasheet

2 pages,
50.25 Kb

Sn63Pb37 TEXT
datasheet frame
Abstract: terminal surface 1) Sn63Pb37 solder is to be soldered newly Solderability 235±5℃, 5±0.5sec ... Samsung Electro-Mechanics
Original
datasheet

2 pages,
134.59 Kb

CL03X104KR3NNNC TEXT
datasheet frame
Abstract: ) Sn63Pb37 solder 235±5℃, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5℃, 3±0.3sec. (preheating : 80 ... Samsung Electro-Mechanics
Original
datasheet

2 pages,
134.54 Kb

CL05B221KB5NCNC TEXT
datasheet frame
Abstract: terminal surface 1) Sn63Pb37 solder is to be soldered newly Solderability 235±5℃, 5±0.5sec ... Samsung Electro-Mechanics
Original
datasheet

2 pages,
134.47 Kb

CL03C5R6BA3GNNC TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
metal tracks to be minimized. The eutectic Sn63Pb37 bumps make this package compatible with standard below. Bumps are in Sn63Pb37 alloy with an eutectic melting point of 1835C 1835C. Die size and bumps count are of 150mm. Flip-Chip CSPs are fully compatible with the use of eutectic Sn63Pb37 solder paste with no
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7272.htm
STMicroelectronics 20/10/2000 18.62 Kb HTM 7272.htm
parasitic inductances coming from the redistribution metal tracks to be minimized. The eutectic Sn63Pb37 provided through a product example in the figure 1 below. Bumps are in Sn63Pb37 alloy with an eutectic fully compatible with the use of eutectic Sn63Pb37 solder paste with no clean flux. ST's
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7272-v1.htm
STMicroelectronics 18/08/2000 18.26 Kb HTM 7272-v1.htm