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Sn63pB37*

Catalog Datasheet Results Type PDF Document Tags
Abstract: surface is to be soldered newly 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5 ... Original
datasheet

2 pages,
121.25 Kb

sn63pb37 solder Sn63pB37 CL05B103KB5NNNC CL05B103 CL05B CL05B103KB5NNNC abstract
datasheet frame
Abstract: terminal surface is to be soldered newly 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5 ... Original
datasheet

3 pages,
242.96 Kb

CL10B224 date code capacitor samsung CL10B SAMSUNG CL series date code date code mlcc samsung CL10B224MO6NXNC CL10B224MO6NXNC abstract
datasheet frame
Abstract: surface is to be soldered newly 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5 ... Original
datasheet

2 pages,
121.63 Kb

CL10B CL10B225KQ8NNNC CL10B225KQ8NNNC abstract
datasheet frame
Abstract: Bending to the limit (1mm) with 1.0mm/sec. 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder ... Original
datasheet

2 pages,
121.8 Kb

CL05C CL05C270JB5NNNC CL05C270JB5NNNC abstract
datasheet frame
Abstract: surface is to be soldered newly 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5 ... Original
datasheet

2 pages,
121.24 Kb

1206 ceramic capacitor samsung CL31B CL31B333KBCNNNC CL31B333KBCNNNC abstract
datasheet frame
Abstract: Bending to the limit (1mm) with 1.0mm/sec. 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder ... Original
datasheet

2 pages,
121.61 Kb

CL10C2R7CB8ANNC CL10C2R7CB8ANNC abstract
datasheet frame
Abstract: surface is to be soldered newly 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5 ... Original
datasheet

2 pages,
121.32 Kb

CL31B10 CL31B CL31B104KCFNNNE CL31B104KCFNNNE abstract
datasheet frame
Abstract: soldered newly Bending to the limit (1mm) with 1.0mm/sec. 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2 ... Original
datasheet

2 pages,
121.79 Kb

CL05C101JB CL05C CL05C101JB5NNNC CL05C101JB5NNNC abstract
datasheet frame
Abstract: soldered newly 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5, 3±0.3sec. (preheating : 80 ... Original
datasheet

3 pages,
244.71 Kb

CL21B223MB8NXNC date code mlcc samsung CL21B CL21B223MB8NXNC abstract
datasheet frame
Abstract: Bending to the limit (1mm) with 1.0mm/sec. 1) Sn63Pb37 solder 235±5, 5±0.5sec. 2) SnAg3.0Cu0.5 solder ... Original
datasheet

2 pages,
121.62 Kb

CL10C2R2CB8ANNC CL10C2R2CB8ANNC abstract
datasheet frame

Datasheet Content (non pdf)

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No abstract text available
www.datasheetarchive.com/download/26555896-2732ZC/fulltext.dic
Allied Electronics 31/07/2001 4264.14 Kb DIC fulltext.dic
be minimized. The eutectic Sn63Pb37 bumps make this package compatible with standard reflow the figure 1 below. Bumps are in Sn63Pb37 alloy with an eutectic melting point of 1835C 1835C 1835C 1835C. Die size compatible with the use of eutectic Sn63Pb37 solder paste with no clean flux. ST's recommendations for
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272-v1.htm
STMicroelectronics 18/08/2000 18.26 Kb HTM 7272-v1.htm
parasitic inductances coming from the redistribution metal tracks to be minimized. The eutectic Sn63Pb37 provided through a product example in the figure 1 below. Bumps are in Sn63Pb37 alloy with an eutectic fully compatible with the use of eutectic Sn63Pb37 solder paste with no clean flux. ST's
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7272.htm
STMicroelectronics 20/10/2000 18.62 Kb HTM 7272.htm