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Part : SN63PB37 Supplier : - Manufacturer : Chip One Exchange Stock : 100 Best Price : - Price Each : -
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Sn63pB37

Catalog Datasheet MFG & Type PDF Document Tags

sn63pb37 solder wire

Abstract: SN63PB37 Profile® Sn63Pb37 Easy Profile® 256 256HA Sn62Pb36Ag2 Sn63Pb37 High activity no-clean , Sn63Pb37 R562 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 This highly-active, anti-slump paste is , Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 Sn63Pb37 Product , 7021020510 R562 Water Soluble, Type 3, 90% metal Alloy Sn63Pb37 Alloy Sn62Pb36Ag2 Sn63Pb37 Sn63Pb37 Sn62Pb36Ag2 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37
Kester
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sn63pb37 solder wire ROSIN FLUX TYPE ROL0 kester Sn63pB37 IPC/J-STD-004B 800-2-KESTER
Abstract: 256HA Sn63Pb37 Easy Sn62Pb36Ag2 Sn63Pb37 Profile® HydroMark 531 256 Sn62Pb36Ag2 , systems. systems. Sn63Pb37 R562 Sn62Pb36Ag2 Sn63Pb37 This highly-active, anti-slump paste , Solder Paste for Syringe Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 Sn63Pb37 Product Characteristics Provides optimal performance in all types of dispensing , Profile® 256HA No-Clean, Type 3, 90% metal Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 500g jar Kester
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EM907 EM828 GR-78-CORE IPC/J-STD-004 RF743 RF773

24-6337-8817

Abstract: 24-7068-1407 Characteristics Residue Removal Easy Profile® Sn63Pb37 Easy Profile® 256 256HA Sn62Pb36Ag2 Sn63Pb37 High activity no-clean paste specifically engineered to provide excellent solderability to , print head systems. HydroMark 531 Sn63Pb37 R562 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 This , Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 Sn63Pb37 Product , 7021020510 R562 Water Soluble, Type 3, 90% metal Alloy Sn63Pb37 Alloy Sn62Pb36Ag2 Sn63Pb37
Kester
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24-6337-8817 24-7068-1407 2460400010 24-6337-0027 K100LD sn62pb36ag2

GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 Formula Type Alloy Easy Profile 256HA Sn63Pb37 Sn62Pb36Ag2 Easy Sn63Pb37 Profile® 256 Sn63Pb37 HydroMark 531 Sn62Pb36Ag2 Water-Soluble R562 Sn63Pb37 Sn62Pb36Ag2 Sn62Pb36Ag2 High activity no-clean , Sn63Pb37 Provides optimal performance in all types of dispensing applications. R276 is packaged void-free , /J-STD-004 Classification ROL0 -325/+500 (Type 3) 87% 35g and 100g syringes R500 Sn63Pb37 The activator , Soluble, Type 3, 86% metal R500 Water Soluble, Type 3, 86% metal Alloy Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37
Kester
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J-STD-006A RF771 bellcore GR-78 959T TC-527 sac305 kester 2220-VF

Sn63pB37

Abstract: Sn62Pb36Ag2 , / . 33 , % 11,5 Sn63Pb37 62,5% - 63,5 %; - , °C , 250;Ø1 500; Ø1 500; Ø1,5 250;Ø1 500; Ø1 500; Ø1,5 ,% 4 , ° 5 6 Sn63Pb37 , , , -. . 250; Ø0,5. Sn63Pb37 FXM Sn60Pb40 c RMA Sn60Pb40 C RA Sn60Pb38Cu2 . , %) Sn96Ag3,5Cu0,5 217 FXN (1,4%) Sn63Pb37 ( ) , . ; 190 Sn96Ag4 , 221 FXN (1,4%) Sn63Pb37 ( ) . .
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SAC305 F60U15FP4 F60015E24 F60010E24 F60007E23 F60U10D23 Sn60Pb40 Sn96Ag4 Sn99Cu1 SN63-PB37 f63010fp3 F63010FP3 F63010FP4 F63015FP4 F60010FP3 F60010FP4

DIODE

Abstract: Automotive Device Material THD Conventional Sn90-Pb10/Sn63-Pb37 Sn63-Pb37 Lead-free Pure Tin (Sn 100 , conventional or lead-free solder mounting environment. Solder Paste Peak Temperature Sn63-Pb37 , Temperature Sn63-Pb37 Conventional (Sn63-Pb37, Dipping) Lead-free (SnAgCu, Dipping) 230 Sn96 , , Plating) Lead-free (Pure Tin Plating) 35 Joint Strength (N) Sn63-Pb37 40 35 Joint
KEC
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DIODE Automotive Device Sn63pB37 temp profile Sn90-Pb10 Sn90Pb10 SN63 PB37 QS9000

Sn63pB37 temp profile

Abstract: kester Sn62Pb36Ag02 hours. Data given for Sn63Pb37 86% metal, -325+500 mesh Viscosity (typical): 1000 poise Malcom , : Kester R500 is available in the Sn63Pb37 and Sn62Pb36Ag02 alloys with Type 3 powder. Type 3 powder mesh , 21-25°C (70-77°F) and 35-65% RH Kester Reflow Profile Alloy: Sn63Pb37 or Sn62Pb36Ag02 Recommended , reflow profile for R500 made with Sn63Pb37 and Sn62Pb36Ag02 alloys is shown here. This profile is
Kester
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kester Sn62Pb36Ag02 J-STD-005 IPC-TM-650 J-STD-004 IPC-TM-65
Abstract: Easy Profile ® 256 No-Clean Solderpaste Product Description Physical Properties (Data given for Sn63Pb37 90% metal, -325+500 mesh) Easy Profile® 256 is a no-clean, air or nitrogen , : Easy Profile® 256 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh , Reflow Profile Alloy: Sn63Pb37 or Sn62Pb36Ag02 Recommended Reflow Profile: 240 Peak Temp. 210 - , either the Sn63Pb37 or Sn62Pb36Ag02 is shown here. This profile is simply a guideline. Since EP256 is a Kester
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GR-78 D-82216

Sn63Pb37

Abstract: R276 Dispensable No-Clean Solderpaste for Leaded Alloys Product Description Physical Properties (Data given for Sn63Pb37 87% metal, -325+500 mesh) Kester R276 is a no-clean solder paste , in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is typically recommended, but Type 4 is , are 21-25°C (70-77°F) and 35-65% R.H. Kester Reflow Profile Alloy: Sn63Pb37 or Sn62Pb36Ag02 , recommended reflow profile for R276 made with either the Sn63Pb37 or Sn62Pb36Ag02 is shown here. This
Kester
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Kester 197

Abstract: ® R560 Water-Soluble Solder Paste Product Description Physical Properties (Data given for Sn63Pb37, 90% metal, -325+500 mesh) Kester R560 is an organic acid, water-soluble solder paste formula , available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but different powder , °C (70-77°F) and 35-65% RH Kester R560 Reflow Profile Alloy: Sn63Pb37 or Sn62Pb36Ag02 Recommended , reflow profile for R560 made with either the Sn63Pb37 or Sn62Pb36Ag02 is shown here. This profile is
Kester
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Kester 197

Sn63pB37 temp profile

Abstract: do-218 Material THD Conventional Sn90-Pb10/Sn63-Pb37 Sn63-Pb37 Lead-free Pure Tin (Sn 100 , conventional or lead-free solder mounting environment. Solder Paste Peak Temperature Sn63-Pb37 , Temperature Sn63-Pb37 Conventional (Sn63-Pb37, Dipping) Lead-free (SnAgCu, Dipping) 230 Sn96 , , Plating) Lead-free (Pure Tin Plating) 35 Joint Strength (N) Sn63-Pb37 40 35 Joint
KEC
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do-218 kec smd marking SOT-23 marking 12F sigma designs 8642 Niko Semiconductor KEC Product Information Label

kester 245 solder wire

Abstract: bellcore GR-78 Activated Rosin 245 No-Clean Sn63Pb37 194 (0.30) 335 (0.52) 348 (0.54) 245 Application Notes , most applications, Sn63Pb37 is used. Consult the alloy temperature chart in Kester's product catalog , Sn63Pb37 and Sn62Pb36Ag02 alloys. Heat both the land area and component lead to be soldered with the iron
Kester
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kester 245 solder wire kester 245 sn63pb37 solder wire shelf life Kester IPC-TM650 Sn62Pb36Ag02 MIL-F-14256

bellcore GR-78

Abstract: sn63pb37 solder wire (in2) Flux Core Solder Plastic Rosin Core 285 Mildly Activated Rosin 245 No-Clean Sn63Pb37 194 , wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37 is used , temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and Sn62Pb36Ag02 alloys. Heat both
Kester
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245 Rosin Flux Cored Solder 952-D6 sn63pb37 solder wire 245 952D kester 952-d6

date code mlcc samsung

Abstract: Samsung MLCC Capacitance change : within ±12.5% Bending to the limit (1mm) for 5 sec. with 1.0mm/sec. 1) Sn63Pb37 , ) Sn63Pb37 solder is to be soldered newly 235±5â"ƒ, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5â , Capacitance change : within ±12.5% Bending to the limit (1mm) for 5 sec. with 1.0mm/sec. 1) Sn63Pb37 , Capacitance change : within ±12.5% Bending to the limit (1mm) for 5 sec. with 1.0mm/sec. 1) Sn63Pb37 , Capacitance change : within ±12.5% Bending to the limit (1mm) for 5 sec. with 1.0mm/sec. 1) Sn63Pb37
Samsung Electro-Mechanics
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date code mlcc samsung Samsung MLCC SAMSUNG CL series date code CL10A105MP6NXNC CL31B474MADNXNE
Abstract: +245C RESULT Sn63Pb37 +245C RESULT Sn63Pb37 +215C 0734 7A09845M30 0/5 0/5 0/5 Micrel Semiconductor
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MIC4223/4224/4225 JESD-22 8A22793MEL 8A22798MNU 8A22796MNT 8A22797MNE

HGXO

Abstract: (Sn63Pb37) by keeping the temperature under 175 °C. 4.3 CX -01 crystals 2. Surface-mount devices , contain Sn63Pb37 solder while the SM4 and SM5 terminations contain a Pb-free Sn-based solder. In these , contain Sn63Pb37 solder, so keep the temperature under 175 °C to avoid melting this solder. 4.5.2 TO , Sn63Pb37 liquidus Pre-heat Ramp Up Ramp Down 150 100 50 0 0 60 120 Time [s] 180 240
STATEK
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HGXO

Sn62Pb36Ag02

Abstract: 959T Solder Sn96.5Ag3.0Cu0.5 Sn63Pb37 285 Mildly Activated Rosin 213 (0.33) 335 (0.52) 245 No-Clean 200 (0.31 , , Sn63Pb37or Sn96.5Ag3.0Cu0.5 is used. Consult the alloy temperature chart in Kester's product catalog for a , Considerations: Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and
Kester
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Kester 275

sn63pb37 solder wire shelf life

Abstract: kester 44 rosin most applications, Sn63Pb37. Consult the alloy temperature chart in Kesterâ'™s product catalog for a , commonly between 315-371°C (600-700°F) for Sn63Pb37 and Sn62Pb36Ag02 alloys. Heat both the land area and
Kester
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kester 44 rosin
Abstract: .5Ag3.0Cu0.5 Sn63Pb37 285 Mildly Activated Rosin 213 (0.33) 335 (0.52) 245 No-Clean 200 (0.31) 348 (0.54) 275 , wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37or Sn96 , Considerations: Solder iron tip temperatures should range between 260-370°C (500-700°F) for Sn63Pb37 and Kester
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2002/95/EC

ROSIN FLUX TYPE ROL0

Abstract: kester 186 percentages. For most applications, Sn63Pb37 or Sn96.5Ag3.0Cu0.5 is used. Consult the alloy temperature chart , : Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and
Kester
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kester 186 ROSIN 285 solder wire shelf life

SN95PB5

Abstract: 256HA Sn63Pb37 Easy Sn62Pb36Ag2 Sn63Pb37 Profile® HydroMark 531 256 Sn62Pb36Ag2 , systems. systems. Sn63Pb37 R562 Sn62Pb36Ag2 Sn63Pb37 This highly-active, anti-slump paste , Solder Paste for Syringe Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 Sn63Pb37 Product Characteristics Provides optimal performance in all types of dispensing , Profile® 256HA No-Clean, Type 3, 90% metal Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 500g jar
API Delevan
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SN95PB5 S1008 1008HF S1210 P1330 P1812 S1812

SN63

Abstract: SN63 PB37 Material THD Conventional Sn90-Pb10/Sn63-Pb37 Sn63-Pb37 Lead-free Pure Tin (Sn 100 , conventional or lead-free solder mounting environment. Solder Paste Peak Temperature Sn63-Pb37 , Temperature Sn63-Pb37 Conventional (Sn63-Pb37, Dipping) Lead-free (SnAgCu, Dipping) 230 Sn96 , , Plating) Lead-free (Pure Tin Plating) 35 Joint Strength (N) Sn63-Pb37 40 35 Joint
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IPC-J-STD-006 SN63 361F ingot ISO9001

LFCSP

Abstract: TM0011 hours. Data given for Sn63Pb37 86% metal, -325+500 mesh Viscosity (typical): 1000 poise Malcom , : Kester R500 is available in the Sn63Pb37 and Sn62Pb36Ag02 alloys with Type 3 powder. Type 3 powder mesh , 21-25°C (70-77°F) and 35-65% RH Kester Reflow Profile Alloy: Sn63Pb37 or Sn62Pb36Ag02 Recommended , reflow profile for R500 made with Sn63Pb37 and Sn62Pb36Ag02 alloys is shown here. This profile is
Analog Devices
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AN-772 EM-2000-011 LFCSP TM0011 ipc-SM-782* LFCSP IPC-SM-782 21502 5mm MO220MO229 AN-617 EM-99-19 EM-99-03 EM-98-57

SN62 PB36 ag2

Abstract: SN62 PB36 ag2 kester Easy Profile ® 256 No-Clean Solderpaste Product Description Physical Properties (Data given for Sn63Pb37 90% metal, -325+500 mesh) Easy Profile® 256 is a no-clean, air or nitrogen , : Easy Profile® 256 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh , Reflow Profile Alloy: Sn63Pb37 or Sn62Pb36Ag02 Recommended Reflow Profile: 240 Peak Temp. 210 - , either the Sn63Pb37 or Sn62Pb36Ag02 is shown here. This profile is simply a guideline. Since EP256 is a
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SN62 PB36 ag2 SN62 PB36 ag2 kester SN63 PB36 gefstoffv PB36 SN62 MP 91/155/EEG
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