STPS40100HR ESCC5000 STPS40100C2FSY1 STPS40100C2FSYHR T0-254 MIL-STD-750

Aerospace 2 x 20 A - 100 V Schottky rectifier Features Forward current: 2 x 20 A Repetitive peak voltage: 100 V Low forward

STPS40100HR STPS40100HR Aerospace 2 x 20 A - 100 V Schottky rectifier Features Forward current: 2 x 20 A Repetitive peak voltage: 100 V Low forward voltage drop: 0.9 V Maximum junction temperature: 175 °C Negligible switching losses Low capacitance High reverse avalanche surge capability Hermetic packages Target radiation qualification: 150 krad (Si) low dose rate 1 Mrad high dose rate ESCC qualified TO-254 Description This power Schottky rectifier is designed and packaged to comply with the ESCC5000 ESCC5000 specification for aerospace products. Housed in hermetically sealed packages both surface mount and through hole, it is ideal for use in applications for aerospace and other harsh environments. The STPS40100HR STPS40100HR is intended for use in medium voltage application and particularly, in high frequency circuits where low switching losses and low noise are required. Table 1. Device summary Order code STPS40100C2FSY1 STPS40100C2FSY1 STPS40100C2FSYHR STPS40100C2FSYHR March 2010 ESCC detailed specification Quality level Configuration Package Mass - Engineering model Double die, common cathode pin 2 T0-254 T0-254 10.0 g 5106/019/01 ESCC flight Doc ID 17306 Rev 1 EPPL Y 1/9 www.st.com 9 Characteristics 1 STPS40100HR STPS40100HR Characteristics Table 2. Absolute maximum ratings Symbol IFSM Characteristic Value Forward surge current (per diode)(1) Unit 300 A (2) 100 V (3) 1 A Average output rectified current (50% duty cycle):(4), (5) per diode per device 20 40 A IF(RMS) Forward rms current (per diode) 30 A TOP Operating temperature range(6) (case temperature) -65 to +175 °C +175 °C -65 to +175 °C VRRM IRRM IO TJ Repetitive peak reverse voltage Repetitive peak reverse current Junction temperature (6) TSTG Storage temperature range TSOL Soldering temperature: For TO-254(7) +260 dV/dt Critical rate of rise of reverse voltage 10000 °C V/µs 1. Sinusoidal pulse of 10 ms duration 2. Pulsed, duration 5 ms, F = 50 Hz 3. Pulsed, duration 2 µs, F = 1 kHz 4. For Tcase +132°C per device and Tcase +148°C per diode, derate linearly to 0 A at +175°C. 5. The "per device" ratings apply only when both anode terminals are tied together. 6. For devices with hot solder dip lead finish all testing performed at Tamb > +125 °C are carried out in a 100% inert atmosphere. 7. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. Table 3. Symbol Rth(j-c) (1) Thermal resistance Characteristic Thermal resistance, junction to case per diode per device 1. Package mounted on infinite heatsink 2/9 Doc ID 17306 Rev 1 Value Unit 1.5 1.2 °C/W STPS40100HR STPS40100HR Table 4. Symbol IR1 IR2 Characteristics s Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C Characteristic MIL-STD-750 MIL-STD-750 test method VF2 VF3 Zth(j-c)(2) 4011 DC method, VR = 100 V - 30 µA - 5 µA - 610 mV Pulse method, IF = 10 A - 730 mV Pulse method, IF = 20 A Forward voltage Max. Pulse method, IF = 5 A 4016 (1) C Units Min. DC method, VR = 50 V Reverse current VF1(1) (1) Values Test conditions - 900 mV - 1 nF Capacitance 4001 VR = 10 V, F = 1 MHz Relative thermal impedance, junction to case 3101 IH = 15 to 40 A, tH = 50 ms IM = 50 mA, tmd = 100 µs Calculate VF(3) °C/W 1. Pulse width 300µs, duty cycle 2% 2. Performed only during screening tests parameter drift values (initial measurements for HTRB), go-no-go. 3. The limits for VF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 MIL-STD-750 Method 3101 and shall guarantee the Rth(j-c) limits specified in maximum ratings. Table 5. Symbol Electrical measurements at high and low temperatures (per diode) Characteristic MIL-STD-750 MIL-STD-750 test method Values Test conditions(1) Units Min. Max. Tcase = +125 (+0, -5) °C DC method, VR = 100 V - 20 mA IR2 Tcase = +125 (+0, -5) °C DC method, VR = 50 V - 7.5 mA VF2(2) Tcase = +125 (+0, -5) °C pulse method, IF = 10 A - 660 mV Tcase = +125 (+0, -5) °C pulse method, IF = 20 A - 850 mV Tcase = -55 (+5, -0) °C pulse method, IF = 20 A - 950 mV IR1 Reverse current Forward voltage VF3 (2) 4016 4011 1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a 100% inspection may be performed. 2. Pulse width 300µs, duty cycle 2% Doc ID 17306 Rev 1 3/9 Configurations 2 STPS40100HR STPS40100HR Configurations Figure 1. Available device configuration STPS40100C2FSY1 STPS40100C2FSY1 STPS40100C2FSYHR STPS40100C2FSYHR 1 Terminal 1: Anode a Terminal 2: Common cathode Terminal 3: Anode b 4/9 Doc ID 17306 Rev 1 2 3 STPS40100HR STPS40100HR 3 Package Information Package Information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. Metal flange mount package (TO-254(a), 3 lead dimension definitions B R1 D E H ØF C G A 3 2 1 N ØM R2 L K ØI K J a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections Doc ID 17306 Rev 1 5/9 Package Information STPS40100HR STPS40100HR Table 6. Metal flange mount package (TO-254), 3-lead dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 13.59 13.84 0.535 0.545 B 13.59 13.84 0.535 0.545 C 20.07 20.32 0.790 0.800 D 6.3 6.7 0.248 0.264 E 1 3.9 0.039 0.154 ØF 3.5 3.9 0.138 0.154 G 16.89 17.4 0.665 0.685 H ØI (1) 6.86 BSC 0.89 0.270 BSC 1.14 0.035 0.045 J 3.81 BSC 0.150 BSC K 3.81 BSC 0.150 BSC L 12.95 14.5 ØM 0.510 3.05 Typ. 0.571 0.120 Typ. N - 0.71 - 0.028 R1(2) - 1 - 0.039 (3) 1.65 Typ. R2 1. 3 locations 2. Radius of heatsink flange corner - 4 locations 3. Radius of body corner - 4 locations 6/9 Doc ID 17306 Rev 1 0.065 STPS40100HR STPS40100HR Ordering Information 4 Ordering Information Table 7. Ordering information Order code STPS40100C2FSY1 STPS40100C2FSY1 ESCC detailed Package Lead finish specification - Gold TO-254 STPS40100C2FSYHR STPS40100C2FSYHR 5106/019/01 EPPL STPS40100C2FSY1 STPS40100C2FSY1 + BeO Packing Strip pack - 510601901 + BeO Mass (g) 10.0 Marking Y Solder dip Doc ID 17306 Rev 1 7/9 Revision history 5 STPS40100HR STPS40100HR Revision history Table 8. Document revision history Date 26-Mar-2010 8/9 Revision 1 Changes Initial release. Doc ID 17306 Rev 1 STPS40100HR STPS40100HR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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