STPS1L40A/U DO-214AC STPS1L40A DO-214AA STPS1L40U

® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM Tj (max) 40 V 150 °C VF (max) 0.42 V

STPS1L40A/U STPS1L40A/U ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM Tj (max) 40 V 150 °C VF (max) 0.42 V FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLESWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT MINIATURE PACKAGE SMA (JEDEC DO-214AC DO-214AC) STPS1L40A STPS1L40A SMB (JEDEC DO-214AA DO-214AA) STPS1L40U STPS1L40U DESCRIPTION Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMA and SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) RMS forward current 8 A IF(AV) Average forward current TL = 130°C = 0.5 1 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 60 A IRRM Repetitive peak reverse current tp = 2 µs square F=1kHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 1 A Tstg Storage temperature range - 65 to + 150 °C 150 °C 10000 V/µs Tj dV/dt * : Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth(j-a) July 1999 - Ed: 3A 1/5 STPS1L40A/U STPS1L40A/U THERMAL RESISTANCES Symbol Parameter Value SMA 30 °C/W SMB Junction to lead Rth (j-l) Unit 25 STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions Tests Conditions IR * Reverse leakage current Tj = 25°C Min. Typ. Max. Unit 35 µA 6 10 mA 0.5 0.42 V 0.37 VR = 40 V Tj = 125°C VF * Forward voltage drop Tj = 25°C Tj = 125°C IF = 1 A Tj = 25°C IF = 2 A 0.63 Tj = 125°C Pulse test : 0.5 0.61 * tp = 380 µs, < 2% To evaluate the maximum conduction losses use the following equation : P = 0.23 x IF(AV) + 0.19 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (=0.5). PF(av)(W) 0.70 = 0.1 = 0.2 1.2 = 0.5 = 0.05 0.60 Rth(j-a)=Rth(j-l) 1.0 0.50 =1 0.20 0.4 T 0.10 =tp/T 0.00 0.0 0.2 0.4 0.6 IF(av) (A) 0.8 =tp/T 1.0 1.2 IM(A) 7 6 5 Ta=25°C 4 Ta=50°C 3 2 Ta=100°C IM t t(s) =0.5 1E-2 1E-1 T 0.2 tp Fig. 3-1: Non repetitive surge peak forward current versus overload duration (maximum values) (SMB). 2/5 Rth(j-a)=100 °C/W 0.6 0.30 0 1E-3 Rth(j-a)=120 °C/W 0.8 0.40 1 IF(av)(A) 1E+0 0.0 0 Tamb(°C) tp 25 50 75 100 125 150 Fig. 3-2: Non repetitive surge peak forward current versus overload duration (maximum values) (SMA). IM(A) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 IM 1.0 0.5 0.0 1E-3 Ta=25°C Ta=50°C Ta=100°C t t(s) =0.5 1E-2 1E-1 1E+0 STPS1L40A/U STPS1L40A/U Fig. 4-1: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(Cu)=35µm, recommended pad layout) (SMB). Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(Cu)=35µm, recommended pad layout) (SMA). Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.8 0.8 0.6 0.6 = 0.5 0.4 0.4 = 0.2 0.2 T =tp/T tp(s) Single pulse 1E-1 1E+0 1E+1 = 0.1 tp 1E+2 5E+2 0.0 1E-2 1E-1 =tp/T tp(s) Single pulse Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). 1E+0 1E+1 tp 1E+2 5E+2 Fig. 6: Junction capacitance versus reverse voltage applied (typical values). C(pF) IR(mA) 200 Tj=150°C F=1MHz Tj=25°C 100 Tj=100°C 1E+0 50 1E-1 1E-2 1E-3 T = 0.2 0.2 = 0.1 0.0 1E-2 2E+1 1E+1 = 0.5 20 Tj=25°C VR(V) 0 5 10 15 20 25 30 VR(V) 35 40 Fig. 7-1: Forward voltage drop versus forward current (typical values, high level). IFM(A) 10 2 5 10 20 50 Fig. 7-2: Forward voltage drop versus forward current (typical values, low level). 3.0 10.00 1 IFM(A) 2.5 Tj=125°C Tj=125°C 2.0 1.00 Tj=150°C Tj=25°C 1.5 Tj=25°C Tj=150°C 1.0 0.10 0.5 VFM(mV) 0.01 0 100 200 300 400 500 600 700 800 900 1000 VFM(mV) 0.0 0 100 200 300 400 500 600 700 800 3/5 STPS1L40A/U STPS1L40A/U Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness e(Cu)= 35µm) (SMB). Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness e(Cu)= 35µm) (SMA). Rth(j-a) (°C/W) Rth(j-a) (°C/W) 120 140 100 120 100 80 80 60 60 40 40 20 20 S(Cu) (cm ) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 S(Cu) (cm ) 0 1 2 3 4 PACKAGE MECHANICAL DATA SMA DIMENSIONS REF. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 D E A1 A2 C L b FOOT PRINT DIMENSIONS (in millimeters) 1.65 1.45 4/5 2.40 1.45 5 STPS1L40A/U STPS1L40A/U PACKAGE MECHANICAL DATA SMB DIMENSIONS REF. E1 Millimeters Inches Min. 0.05 0.20 0.002 0.008 1.95 2.20 0.077 0.087 0.15 0.41 0.006 0.016 5.10 5.60 0.201 0.220 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L b 0.096 E1 L 0.075 E A2 2.45 c C 1.90 b A1 Max. A2 E Min. A1 D Max. 0.75 1.60 0.030 0.063 FOOT PRINT DIMENSIONS (in millimeters) 2.3 1.52 2.75 1.52 Ordering type Marking Package Weight Base qty Delivery mode STPS1L40U STPS1L40U GC4 SMB 0.107g 2500 Tape & reel STPS1L40A STPS1L40A GB4 SMA 0.068g 5000 Tape & reel Band indicates cathode Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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