ST-03-Z-06E IRM047U6/EL/ IRM047U6 MCU39-4 LHF08CH1 LH28F008SCT-L85 LHF08CTE

Lead (Pb)free Packages October 15, 2004 This document updates PCN: ST-03-Z-06E issued January 23, 2004. Objective: Existing

Product Change Notice (PCN): Lead (Pb)free Packages October 15, 2004 This document updates PCN: ST-03-Z-06E ST-03-Z-06E issued January 23, 2004. Objective: Existing Memory ICs are changing from a lead (Pb) process to a lead-free process. Process Change Key Points 1) SHARP is changing the lead plating process from lead (Pb) to lead-free to meet the demands of government regulatory directives as well as the needs of customers. 2) The migration from with lead to lead-free will not be a difficult process for IC packages that connect to the circuit board via pins (packages such as TSOP, SSOP). These packages are compatible with lead-based solder paste and so do not require higher reflow temperatures. Lead-free devices that use ball-type connections will require Lead-free solder paste and consequently will have a higher reflow temperature. 3) New part numbers will be used to distinguish between the current and new processes. 4) All new products are being introduced are lead-free. Process Change Timeline New orders for existing lead process devices placed after December 1, 2004 will be NCNR. Device backlogs using the existing lead-based process will convert to NCNR after December 1, 2004. Last buy date for the existing lead-based process is December 31st, 2004. Last delivery date for existing lead-based process devices is March 31st, 2005. Orders for lead-free-process devices are subject to SHARP's standard Terms and Conditions. . Appendices A) Explanation of reasons and background for conversion to lead-free packages. B) Initial list of part numbers affected. We anticipate adding more part numbers as time goes on. Please contact the Factory if you are inquiring about a part number not on this list. All part numbers will eventually be changed to reflect the new lead-free process. Page 1 of 5 APPENDIX A Lead (Pb)free Packages Summary: SHARP is migrating Memory devices from a lead-based (Pb) process to a lead-free (Pb-free) process. We do not foresee this causing issue for customers currently using devices with pinout arrangements such as TSOP-, SSOP-, and QFPpackaged devices with Pb solder paste. Customers using solder-ball-based package types like BGA and CSP will need to use higher reflow temperatures. Since 1990, legislation in the US, Europe, and Japan has proposed restricting the use of harmful substances in electronics and electrical equipment. It was in the end of 2002 that legislation was approved from two European Council directives: a) Waste in Electrical and Electronics Equipment (WEEE) b) Restriction on Hazardous Substances (RoHS) These directives will be enforced by July 1, 2006. Products sold after this date must be Pb (lead) free and free from other chemicals in the RoHS directive. SHARP has been in the forefront of implementing these directives well ahead of time in order to allow customers time to eliminate Pb from their entire supply chain. WEEE DIRECTIVE This directive sets requirements for recycling waste in electrical and electronics equipment. It requires the recovery of electronic products and segregation of printed circuit boards, batteries, and mercury-containing components. ROHS DIRECTIVE This directive restricts the use of Pb (lead), Mercury, Cadmium, Hexavalent Chromium and flame retardants using Polybrominated Dipheyls (PBB) or Polybrominated Iphenyl Ethers (PBDE). The WEEE and RoHS Directives focus mainly on two issues: the recycling of products at the End of Life, and the elimination of certain hazardous elements and compounds. For semiconductor packages, the elimination of banned materials is the primary effort. The external finish of the connection pins used with plastic packaged semiconductors today is electroplated Tin-lead (Sn-Pb) alloy. This alloy has been the primary finish used by electronic components for many years mainly due to both the reliability of the Pb (lead) solder joint and the ease of manufacturing due to its favorable soldering characteristics. Sn-Pb plating for plastic packages usually consists of 10-20% Pb (lead). Pb-free means