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SSC-12840 SSC-12840-4R7 SSC-12840-6R8 SSC-12840-8R2 EIA-481 - Datasheet Archive
CPU INDUCTORS MODEL NO. FEATURES: : SSC-12840 SERIES * SUPERIOR QUALITY FOR AN AUTOMATED PRODUCTION LINE. * PICK AND PLACE
SMD CPU INDUCTORS MODEL NO. FEATURES: : SSC-12840 SSC-12840 SERIES * SUPERIOR QUALITY FOR AN AUTOMATED PRODUCTION LINE. * PICK AND PLACE COMPATIBLE. * TAPE AND REEL PACKING. APPLICATION : * NOTEBOOK COMPUTERS * VGA CARD * DC/DC CONVERTER INDUCTANCE VS DC BIAS: ELECTRICAL SPECIFICATION: PART NO INDUCTANCE (uH) ±20% DCR MAX (m) INDUCTANCE (uH) TYP @ RATED CURRENT SSC-12840-4R7 SSC-12840-4R7 4.7 12.0 3.7 9.5 SSC-12840-6R8 SSC-12840-6R8 6.8 21.0 6.2 6.3 SSC-12840-8R2 SSC-12840-8R2 8.2 23.0 7.4 6.2 SSC-12840-4R7 SSC-12840-4R7 L(uH) RATED CURRENT (A) SSC-12840-6R8 SSC-12840-6R8 10 9 8 7 6 5 4 3 2 1 0 SSC-12840-8R2 SSC-12840-8R2 0 1 2 3 4 5 6 7 (ADC) TEST FREQUENCY: 100 KHZ,1VRMS. PHYSICAL DIMENSION : (UNIT:mm) PCB PATTERN TAIPEI MULTIPOWER ELECTRONICS CO., LTD. 2ND. FL., 542-7 CHUNG-CHENG ROAD, HSIN-TIEN CITY,TAIPEI, TAIWAN ,R.O.C TEL : (02) 8667-2078 FAX : (02)8667-2006 A PACKING Tape and Reel Orientation SSC-12840 SSC-12840 SSC-12840 SSC-12840 SSC-12840 SSC-12840 -XXX -XXX -XXX SSC-12840 SSC-12840 -XXX TMP XXXX TMP XXXX TMP XXXX TMP XXXX USER DIRECTION OF FEED NOTE : Top view shown with cover tape removed. TAPE WIDTH REEL 24mm WIDTH COMPONENT 29.5mm PITCH UNITS 16mm PER REEL 400 TAPE SPECIFICATIONS: Carrier Tape Type : Conductive. Cover Tape Type : Antistatic. Cover Tape Adhesion to Carrier : 20 - 100 grams. REEL SPECIFICATIONS: Antistatic. Diameter (flange) : 13" (330.2mm) STANDARDS : All embossed carrier tape packaging will be accomplished in compliance with latest revision of EIA-481 EIA-481 "Taping of surface Mount Components for Automatic Placement". ENVIRONMENTAL PERFORMANCE ITEM 1 TEST Thermal Shock CONDITION One cycle shall consist of : (1) 30 minutes at temperature 30. (2) 15 seconds maximum at room ambient. (3) 30 minutes at temperature +125. (4) 15 seconds maximum at room ambient. Subject samples to 10 cycles. Test per applicable specification after a 4 hours stabilization at room ambient. 2 Vibration Inductance deviation within ±3.0% after vibration for 1 hour. In each of three orientations at sweep vibration (105010Hz) with 1.5mm P-P amplitude. 3 Solderability Solder pot at 230±5, with kester 1544 solder flux. 5 second ±1 second. 4 Operating Dip parts into solder pot containing 63/37 molten alloy for Wetting must occur on a minimum of 90% of the terminations. -30 +105 ( coil contain heat) Temperature 5 Humidity Inductance deviation within±5.0% After 96 hour in 9095% relative humidity at 40±2and 1 hour drying under normal condition. 6 2 Mechanical Shock Inductance deviation within±5.0% after drop down with 981m/s (100G)shock. Attitude upon a rubber block method shock testing machine, for 1 time, in each of three orientations.