| SOT920-1 |
|
NXP Semiconductors
|
Plastic rectangular-DIL-bent-SIL (reverse bent) |
|
Original |
PDF
|
| SOT922-1 |
|
NXP Semiconductors
|
Ceramic earless flanged cavity package; 2 leads |
|
Original |
PDF
|
| SOT923-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
|
Original |
PDF
|
| SOT923-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
|
Original |
PDF
|
| SOT925-1 |
|
NXP Semiconductors
|
Plastic ball grid array package; 364 balls; body 27 x 27 x 1.75 mm |
|
Original |
PDF
|
| SOT926-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm |
|
Original |
PDF
|
| SOT927-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 420 balls; body 13 x 13 x 1.1 mm |
|
Original |
PDF
|
| SOT928-1 |
|
NXP Semiconductors
|
Plastic thin quad flat package; 64 leads; body 7 x 7 x 1 mm |
|
Original |
PDF
|
| SOT929-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 272 balls; body 15 x 15 x 1 mm |
|
Original |
PDF
|
