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SOT86* Datasheet

Part Manufacturer Description PDF Type Ordering
SOT860-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink
ri

1 pages,
295.11 Kb

Original Buy
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SOT861-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 280 balls; body 14 x 14 x 0.7 mm
ri

1 pages,
304.33 Kb

Original Buy
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SOT862-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm
ri

1 pages,
259.05 Kb

Original Buy
datasheet frame
SOT862-2 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1 mm
ri

1 pages,
259.06 Kb

Original Buy
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SOT863-1 NXP Semiconductors Plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.4 mm
ri

1 pages,
221.51 Kb

Original Buy
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SOT864-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
ri

1 pages,
224.53 Kb

Original Buy
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SOT865-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm
ri

1 pages,
221.28 Kb

Original Buy
datasheet frame
SOT865-2 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm
ri

1 pages,
228.33 Kb

Original Buy
datasheet frame
SOT865-2 NXP Semiconductors Footprint information for reflow soldering of HVQFN32 package
ri

1 pages,
237.64 Kb

Original Buy
datasheet frame
SOT865-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm
ri

1 pages,
224.28 Kb

Original Buy
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SOT86*

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: compliant SOT-86 surface mount package in bulk quantity Matte Tin plated RoHS compliant SOT-86 surface , Evaluation Board for SOT-86 packaged device with SMA connectors We also offer the plastic packages with ... Mimix Broadband
Original
datasheet

8 pages,
488.07 Kb

PB-CGB7005-SP-0000 CGB7005-BD CGB7005-SC CGB7005-SC-0G00 CGB7005-SC-0G0T CGB7005-SP-0G00 CGB7005-SP-0G0T MCH185A101JK PA 1515 PB-CGB7005-SC-0000 7492 circuit diagram TEXT
datasheet frame
Abstract: compliant SOT-86 surface mount package in bulk quantity Matte Tin plated RoHS compliant SOT-86 surface , Evaluation Board for SOT-86 packaged device with SMA connectors We also offer the plastic packages with ... Mimix Broadband
Original
datasheet

8 pages,
769.27 Kb

CGB7011-BD CGB7011-SC CGB7011-SC-0G00 CGB7011-SC-0G0T CGB7011-SP-0G00 CGB7011-SP-0G0T MCH185A101JK PB-CGB7011-SC-0000 PB-CGB7011-SP-0000 la 7646 SN 16880 TEXT
datasheet frame
Abstract: housed in a SOT-86 (micro-X) industry-standard SMT lead-free/green/RoHScompliant package. DC ­ 6000 , Supply Green SOT-86 SMT Package Internally matched to 50 : Product Description Units Min , (lead-tin SOT-86 Pkg) (lead-free/green/RoHS-compliant SOT-86 Pkg) * This package is being phased out , AG604-86 AG604-86 The Communications Edge TM Product Information InGaP HBT Gain Block AG604-86 AG604-86 (SOT-86 , Information InGaP HBT Gain Block AG604-86G AG604-86G (Green / Lead-free Sot-86 Package) Mechanical Information ... WJ Communications
Original
datasheet

6 pages,
429.19 Kb

JESD22-A114 SOT 86 MARKING 03 mmic marking "SOT-86" AG604-86PCB J-STD-020A GaAs Amplifier Micro-X Marking k AG604-86G sot-86 AG604-86 marking K sot-86 TEXT
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Abstract: Gain at 900 MHz Single Voltage Supply Green SOT-86 SMT Package Internally matched to 50 , temperatures of +85 qC & is housed in a SOT-86 (micro-X) industry-standard SMT lead-free/green/RoHScompliant , Fully Assembled Eval. Board (lead-tin SOT-86 Pkg) (lead-free/green/RoHS-compliant SOT-86 Pkg , Product Information InGaP HBT Gain Block AG302-86 AG302-86 (SOT-86 Package) Mechanical Information This , Product Information InGaP HBT Gain Block AG302-86G AG302-86G (Green / Lead-free Sot-86 Package) Mechanical ... WJ Communications
Original
datasheet

6 pages,
456.92 Kb

sot-86 marking _1 mmic marking D "SOT-86" JESD22-A114 J-STD-020A AG302-86PCB AG302-86G sot-86 mmic marking "SOT-86" AG302-86 TEXT
datasheet frame
Abstract: GHz 4.0 dB Noise Figure at 2 GHz Available in SOT-363, SOT-86, and lead-free / green SOT , device is ideal for wireless applications and is available in low-cost, surface-mountable plastic SOT-86 , Product Description InGaP HBT Gain Block (SOT-86 Pkg) InGaP HBT Gain Block (SOT-363 Pkg) 700 ­ 2400 , ECG006 ECG006 The Communications Edge TM Product Information InGaP HBT Gain Block ECG006C ECG006C (SOT-86 ... WJ Communications
Original
datasheet

8 pages,
377.15 Kb

ECG006F-PCB ECG006F ECG006C-PCB ECG006C ECG006B-PCB ECG006B-G ECG006B ECG006 marking 449 sot89 mmic C4 sot 89 SOT 363 darlington mobile rf power amplifier MMIC SOT 89 marking CODE SOT 86 MARKING 03 MMIC SOT 89 marking CODE c4 mmic marking "SOT-86" MMIC SOT 363 marking CODE 68 MMIC SOT 363 marking CODE 77 MMIC SOT 363 marking CODE 86 J-STD-020 MSL Rating TEXT
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Abstract: Figure at 2 GHz · Available in SOT-86 and SOT-89 Package Styles · Internally matched to 50 , wireless applications and is available in low-cost, surface-mountable plastic SOT-86 and SOT-89 packages , InGaP HBT Gain Block (SOT-89 Pkg) InGaP HBT Gain Block (SOT-86 Pkg) 700 ­2400 MHz Fully Assembled Eval , Information ECG005C ECG005C (SOT-86 Package) Mechanical Information Outline Drawing Product Marking The ... WJ Communications
Original
datasheet

6 pages,
185.98 Kb

wj model marking code DEVICE MARKING CODE 8308 ECG005 ECG005B ECG005B-PCB ECG005C ECG005C-PCB JESD22-A114 mmic marking "SOT-86" MMIC SOT 89 marking CODE sot-86 marking _1 SOT89 MARKING CODE 459 489 Marking Code sot 89 MMIC "SOT 89" marking 86 Block Diagram of 8279 sot-86 TEXT
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Abstract: the package. STANFORD MICRODEVICES ECB-100330 ECB-100330 Rev B SOT-86 Eval Board Evaluation Board Layout ... Stanford Microdevices
Original
datasheet

6 pages,
347.62 Kb

SNA-686 nga686 NGA-686 DC-6GHz TEXT
datasheet frame
Abstract: SBA4086Z SBA4086Z SBA4086Z SBA4086Z DCto5GHz, CASCADABLE InGaP/GaAs HBT MMIC AMPLIFIER Package: SOT-86 Product Description Features RFMD’s SBA4086Z SBA4086Z is a high performance InGaP/GaAs Heterojunction Bipolar Transistor MMIC Amplifier. A Darlington configuration designed with InGaP process technology provides broadband performance up to 5GHz with excellent thermal performance. The heterojunction increases breakdown voltage and minimizes leakage current between junctions. Cancellation of emitter junction ... RF Micro Devices
Original
datasheet

6 pages,
414.65 Kb

SBA4086Z TEXT
datasheet frame
Abstract: SGA4386Z SGA4386Z SGA4386ZDC SGA4386ZDC to 4500MHz, Cascadable SiGe HBT MMIC Amplifier DC to 4500MHz, CASCADABLE SiGe HBT MMIC AMPLIFIER Package: SOT-86 Product Description Features The SGA4386Z SGA4386Z is a high performance SiGe HBT MMIC Amplifier. A Darlington configuration featuring one-micron emitters provides high FT and excellent thermal performance. The heterojunction increases breakdown voltage and minimizes leakage current between junctions. Cancellation of emitter junction non-linearities results in ... RF Micro Devices
Original
datasheet

6 pages,
338.87 Kb

SGA4386Z SGA4386ZDC TEXT
datasheet frame
Abstract: SGA4586Z SGA4586Z SGA4586ZDC SGA4586ZDC to 4000MHz, Cascadable SiGe HBT MMIC Amplifier DC to 4000MHz, CASCADABLE SiGe HBT MMIC AMPLIFIER Package: SOT-86 Product Description Features The SGA4586Z SGA4586Z is a high performance SiGe HBT MMIC Amplifier. A Darlington configuration featuring one-micron emitters provides high FT and excellent thermal performance. The heterojunction increases breakdown voltage and minimizes leakage current between junctions. Cancellation of emitter junction non-linearities results in ... RF Micro Devices
Original
datasheet

6 pages,
344.64 Kb

SGA4586Z SGA4586ZDC TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
No abstract text available
/datasheets/files/philips/search/docindex-v1.txt
Philips 16/06/2005 2589.32 Kb TXT docindex-v1.txt
Packages Information on package SOT861-1 plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm   Outline drawing Package version Package name Package description Drawing issue date SOT861-1 TFBGA393 TFBGA393 plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm 7/19/2004 General package information Soldering Information Thermal considerations
/datasheets/files/philips/packages/sot861-1.html
Philips 16/06/2005 1.93 Kb HTML sot861-1.html
Packages Information on package SOT869-1 plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm   Outline drawing Package version Package name Package description Drawing issue date SOT869-1 BGA288 BGA288 plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm 5/11/2005 General package information Soldering Information Thermal considerations
/datasheets/files/philips/packages/sot869-1.html
Philips 16/06/2005 1.9 Kb HTML sot869-1.html
Packages Information on package SOT864-1 plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; exposed die pad   Outline drawing Package version Package name Package description Drawing issue date SOT864-1 HTSSOP24 HTSSOP24 plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; exposed die pad 9/23/2004 General package information
/datasheets/files/philips/packages/sot864-1.html
Philips 16/06/2005 1.98 Kb HTML sot864-1.html
)  2/5/2003 -  SOT862-1   LFBGA336 LFBGA336  plastic low profile fine-pitch ball grid array
/datasheets/files/philips/packages/plastic/surfacemount/array/zzz_other/lfbga-v2.html
Philips 16/06/2005 20.08 Kb HTML lfbga-v2.html
; body 12 x 12 x 0.8 mm  - (EIAJ) MO-195 MO-195 (JEDEC) - (IEC)  2/8/2002 -  SOT868-1   IC-7316-001 IC-7316-001 (EIAJ) MO-195 MO-195 (JEDEC)  12/27/2004 -  SOT861-1   TFBGA393 TFBGA393  plastic thin fine-pitch
/datasheets/files/philips/packages/plastic/surfacemount/array/zzz_other/tfbga-v2.html
Philips 16/06/2005 18.03 Kb HTML tfbga-v2.html
Packages Information on package SOT860-1 plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink   Outline drawing Package version Package name Package description Drawing issue date SOT860-1 HBGA624 HBGA624 plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink 9/27/2004 General package information Soldering Information Thermal
/datasheets/files/philips/packages/sot860-1.html
Philips 16/06/2005 1.96 Kb HTML sot860-1.html
grid array package; 304 balls; body 31 x 31 x 1.75 mm 7/28/2004 121 SOT869-1 BGA288 BGA288 SOT860-1 HBGA624 HBGA624 plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm 1.4 mm 11/21/2003 186 SOT863-1 HLLGA48 HLLGA48 plastic thermal enhanced low profile land balls; body 7 x 7 x 0.9 mm 9/16/2003 225 SOT862-1 LFBGA336 LFBGA336 plastic low profile SOT868-1 TFBGA240 TFBGA240 plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm
/datasheets/files/philips/packages/package-v2.html
Philips 16/06/2005 169.96 Kb HTML package-v2.html
5 x 5 x 0.85 mm  - (EIAJ) MO-220 MO-220 (JEDEC) - (IEC)  10/22/2002 -  SOT866-1   mm  - (EIAJ) MO-220 MO-220 (JEDEC) - (IEC)  9/20/2004 -  SOT865-1   HVQFN32 HVQFN32  plastic
/datasheets/files/philips/packages/plastic/surfacemount/quad/thermalenhanced/hvqfn-v2.html
Philips 16/06/2005 24.28 Kb HTML hvqfn-v2.html
SOT864-1   HTSSOP24 HTSSOP24  plastic thermal enhanced thin shrink small outline package; 24
/datasheets/files/philips/packages/plastic/surfacemount/dual/thermalenhanced/htssop-v2.html
Philips 16/06/2005 12.46 Kb HTML htssop-v2.html