| SOT860-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink |
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Original |
PDF
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| SOT861-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 280 balls; body 14 x 14 x 0.7 mm |
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Original |
PDF
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| SOT862-1 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm |
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Original |
PDF
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| SOT862-2 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1 mm |
|
Original |
PDF
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| SOT863-1 |
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NXP Semiconductors
|
Plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.4 mm |
|
Original |
PDF
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| SOT864-1 |
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NXP Semiconductors
|
Plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad |
|
Original |
PDF
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| SOT865-1 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
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| SOT865-2 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
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| SOT865-2 |
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NXP Semiconductors
|
Footprint information for reflow soldering of HVQFN32 package |
|
Original |
PDF
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| SOT865-3 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
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| SOT865-3 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT865-3 |
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Original |
PDF
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| SOT866-1 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm |
|
Original |
PDF
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| SOT868-1 |
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NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm |
|
Original |
PDF
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| SOT869-1 |
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NXP Semiconductors
|
Plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm |
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Original |
PDF
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