NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
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| Abstract: Package outline Philips Semiconductors Plastic single-ended surface mounted package (LFPAK); 4 leads A2 A E SOT669 C c2 b2 E1 b3 L1 mounting base b4 D1 D H L2 1 2 3 e 4 w M A b X c 1/2 e A (A 3) A1 C L , maximum per side are not included. OUTLINE VERSION SOT669 REFERENCES IEC JEDEC JEITA ISSUE DATE 03-09-15 04-10-13 MO-235 MO-235 SOT669 PDF EUROPEAN PROJECTION © Koninklijke Philips ... | Original |
1 pages, |
SOT669 MO-235 datasheet abstract |
| Abstract: PDF: 2001 Aug 14 Philips Semiconductors Package outline Plastic single-ended surface mounted package (LFPAK); 4 leads SOT669 D A2 D1 A1 b1 mounting base HE E 1 2 3 4 e b c A 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b b1 max. c D D1 mm 1.2 0.30 0.24 1.10 0.95 0.50 0.35 4.65 0.25 0.19 5.3 4.9 5.0 4.8 OUTLINE VERSION SOT669 E e ... | Original |
1 pages, |
LFPAK package 5 LFPAK package LFPAK A2 diode lfpak outline sot669 package SOT669 datasheet abstract |
| Abstract: PDF: 2003 Feb 05 Philips Semiconductors Package outline Plastic single-ended surface mounted package (Philips version LFPAK); 4 leads A2 A E SOT669 C c2 b2 L1 E1 mounting base D1 D H L2 1 2 3 4 X e w M A b c 1/2 e A (A 3) A1 C L detail X 0 2.5 y C 5 mm scale DIMENSIONS (mm are the original , protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT669 REFERENCES IEC ... | Original |
1 pages, |
sot669 package MO-235 SOT669 datasheet abstract |
| Abstract: Package outline Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads SOT669 E b2 L1 A c2 A2 C E1 b3 mounting base D1 H D b4 L2 1 e 2 3 b 1/2 e 4 w M A c X A A1 C (A 3) detail X 0 2.5 scale 5 mm L y C DIMENSIONS (mm are the original dimensions) UNIT mm A A1 A2 A3 b b2 b3 2.2 2.0 b4 0.9 0.7 c c2 D (1) D1(1) E(1) E1(1) max 5.0 4.8 , protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT669 REFERENCES IEC JEDEC MO-235 MO-235 ... | Original |
1 pages, |
sot669 package datasheet abstract |
| Abstract: technology and innovative SOT669 package (LFPAK) to deliver outstanding power densities. LFPAK blends the , Performance Automotive MOSFET SOT669 (LFPAK) BUK9Y40-55B BUK9Y40-55B High Performance Automotive MOSFET SOT669 , MOSFET SOT669 (LFPAK) PH2625L PH2625L N-channel MOSFET SOT669 (LFPAK) PH6325L PH6325L N-channel MOSFET SOT669 (LFPAK) PHB45N03LTA PHB45N03LTA N-channel MOSFET SOT404 (D2-PAK) PH3120L PH3120L N-channel MOSFET SOT669 (LFPAK) PH4840S PH4840S N-channel MOSFET SOT669 (LFPAK) PH4530L PH4530L ... | Original |
8 pages, |
BUK9Y40-55B Diode SOD523 HIGH SPEED SWITCHING NPN SOT23 p-channel mosfet with diode sot89 P89LPC936 PBSS5520X PMEG1020EJ PMEG2020EJ BUK9Y19-55B Transistor smd BQ 22 SST*66 SOD123 footprint smd diode GW datasheet abstract |
| Abstract: performance along with low on-resistance. Semiconductors The innovative SOT669 LFPAK (Loss Free PAcKage , power to many applications previously limited to large discrete power packages. Philips' SOT669 LFPAK , u c t o r s . p h i l i p s . c o m The LFPAK (SOT669) applications PH7030L PH7030L circuit diagram ... | Original |
2 pages, |
BAT754C ISL6205 LFPAK footprint graphic card circuit diagram notebook circuit diagram ISL6207 PH5330E PH7030L SOT669 ph53 LFPAK package 5 sot669 footprint lfpak datasheet abstract |
| Abstract: v3.indd 1 The innovative SOT669 LFPAK (Loss Free PAcKage) enables a superior level of on-resistance , limited to large discrete power packages. NXP's SOT669 LFPAK offers outstanding thermal performance from , LFPAK (SOT669) applications In applications such as VRMs and power supplies for notebook and desktop ... | Original |
2 pages, |
sot669 package PH2525L PH2530L PH3330L PH4025L ph43 PH4830L PH5525L PH6030L PH8030L PH9025L lfpak PH6530 PCI compact PCB footprint sot669 footprint datasheet abstract |
| Abstract: introduction of the SOT669 Loss Free PAcKage (LFPAK) to ensure a superior level of on-resistance and thermal , The LFPAK (SOT669) package NXP's SOT669 LFPAK offers outstanding thermal performance from the ... | Original |
2 pages, |
7.5B 35 BUK7Y09-40B BUK7Y13-40B BUK9Y11-30B BUK9Y14-40B BUK9Y19-55B NXP MOSFETs SOT669 LFPAK footprint sot669 package datasheet abstract |
| Abstract: LFPAK (SOT669) SOT78/TO220AB SOT226/I2PAK Advanced TrenchMOS technology for improved , (SOT428) LFPAK (SOT669) LEADED TO220AB (SOT78) I2PAK (SOT226) BUK752R7-30B BUK752R7-30B BUK7E2R7-30B BUK7E2R7-30B , BUK964R4-40B BUK964R4-40B BUK765R2-40B BUK765R2-40B BUK9606-40B BUK9606-40B SURFACE MOUNT DPAK (SOT428) LFPAK (SOT669) LEADED TO220AB , (SOT669) LEADED TO220AB (SOT78) I2PAK (SOT226) BUK754R0-55B BUK754R0-55B BUK954R2-55B BUK954R2-55B BUK9506-55B BUK9506-55B BUK9E06-55B BUK9E06-55B , (SOT428) LFPAK (SOT669) LEADED TO220AB (SOT78) I2PAK (SOT226) BUK9506-75B BUK9506-75B BUK7506-75B BUK7506-75B ... | Original |
6 pages, |
cooling electric water pump car BUK9Y19-55B Catalytic Converter BUK752R7-30B BUK762R7-30B BUK7E2R7-30B BUK9207-30B BUK952R8-30B BUK962R8-30B Integrated Starter Alternator buk9508 BUK9507-30B BUK7507-55B datasheet abstract |
| Abstract: information Table 1: Pinning - SOT669 (LFPAK), simplified outline and symbol Pin Description 1,2 , (d) Symbol d mb g MBB076 MBB076 1 2 Top view 3 4 MBL286 MBL286 SOT669 (LFPAK) s , Description Plastic single-ended surface mounted package; 4 leads SOT669 4. Limiting values Table 3 , (Philips version LFPAK); 4 leads A2 A E SOT669 C c2 b2 E1 b3 L1 mounting base , of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT669 REFERENCES IEC JEDEC ... | Original |
11 pages, |
sot669 PH8230E MO-235 FOOTPRINT MO-235 LFPAK footprint M3D748 PH8230E abstract |
| Abstract: Reflow soldering footprint Footprint information for reflow soldering SOT669 4.7 4.2 0.9 (3Ã-) 0.6 (4Ã-) 0.25 (2Ã-) 0.25 (2Ã-) 3.45 0.6 (3Ã-) 2.55 2 3.5 0.25 (2Ã-) SR opening = Cu + 0.075 1.1 2.15 3.3 SP opening = Cu - 0.050 1.27 3.81 0.7 (4Ã-) solder lands solder resist solder paste 125 um stencil occupied area Dimensions in mm sot669_fr www.nxp.com © 2009 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the ... | Original |
1 pages, |
SOT669 sot669 footprint datasheet abstract |
| Abstract: Hola1 H A H Heatsinks for D PAK and others B C  copper heatsinks with excellent heat conductivity  direct mounting on printed circuit through solderable surface  especially suitable for SMD components of type D PAK (TO 252), D² PAK (TO 263), D³ PAK (TO 268), SOT 669 LF PAK, SO IC-8 FL MP Power SO-8, Power SO-10 SO-10, Power SO-20 SO-20, Power SO-36 SO-36, SO-14 SO-14, SO-16 SO-16, SOT 223 etc ,  available standard packing: loose parts or reel  special packing like magazine, tray etc. on request ... | Original |
1 pages, |
aluminium profile sot 669 so-10 lf 244 FK 330 TO-268 D-PAK Heatsinks FK 244 13 D2 PAK datasheet abstract |
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| Packages Information on package SOT669 Plastic single-ended surface mounted package (LFPAK); 4 leads Outline drawing Package version Package name Package description Drawing issue date SOT669 LFPAK Plastic single-ended surface mounted package (LFPAK); 4 leads 10/13/2004 General package information Soldering Information www.datasheetarchive.com/files/philips/packages/sot669-v1.html |
Philips | 17/06/2005 | 1.97 Kb | HTML | sot669-v1.html |
| Packages SOT669 ; Plastic single-ended surface mounted package (Philips version of LFPAK); 4 leads SOT669 LFPAK Plastic single-ended surface mounted package (Philips version of LFPAK); 4 leads 01-07-18 Soldering Information Handling precautions Thermal considerations www.datasheetarchive.com/files/philips/packages/sot669-v2.html |
Philips | 05/02/2002 | 5.07 Kb | HTML | sot669-v2.html |
| Packages Information on package SOT669 Plastic single-ended surface mounted package (LFPAK); 4 leads Outline drawing Package version Package name Package description Drawing issue date SOT669 LFPAK Plastic single-ended surface mounted package (LFPAK); 4 leads 10/13/2004 Chemical content Part Material www.datasheetarchive.com/files/philips/packages/sot669-v3.html |
Philips | 16/06/2005 | 4.08 Kb | HTML | sot669-v3.html |
| Packages Information on package SOT669 Plastic single-ended surface mounted package (Philips version of LFPAK); 4 leads Outline drawing Package version Package name Package description Drawing issue date SOT669 LFPAK Plastic single-ended surface mounted package (Philips version of LFPAK); 4 leads 03-02-05 Chemical content Part Material Weight (mg www.datasheetarchive.com/files/philips/packages/sot669.html |
Philips | 15/04/2003 | 3.62 Kb | HTML | sot669.html |
| PH5330-01 PH5330-01 PH5330-01 PH5330-01 Product information page PH5330 PH5330 PH5330 PH5330; N-channel enhancement mode field-effect transistor General info The latest generation N-channel enhancement mode field-effect power transistor in a SOT669 (LFPAK) package. Product availability: PH5330 PH5330 PH5330 PH5330 in SOT669 (LFPAK) Features Logic level compatible Low drive current High density 567 89118 Standard Marking * Reel Pack, SMD, 13" SOT669 RFS WWW View the www.datasheetarchive.com/files/philips/pip/ph5330-01.html |
Philips | 23/04/2003 | 2.62 Kb | HTML | ph5330-01.html |
| PH3230-02 PH3230-02 PH3230-02 PH3230-02 Product information page PH3230 PH3230 PH3230 PH3230; N-channel enhancement mode field-effect transistor General info The latest generation N-channel enhancement mode field-effect power transistor in a SOT669 (LFPAK) package. Product availability: PH3230 PH3230 PH3230 PH3230 in SOT669 (LFPAK). Features Logic level compatible Low drive current High density 567 90118 Standard Marking * Reel Pack, SMD, 13" SOT669 RFS WWW View the www.datasheetarchive.com/files/philips/pip/ph3230-02.html |
Philips | 23/04/2003 | 2.59 Kb | HTML | ph3230-02.html |
| PH3230-01 PH3230-01 PH3230-01 PH3230-01 Product information page PH3230 PH3230 PH3230 PH3230; N-channel enhancement mode field-effect transistor General info The latest generation N-channel enhancement mode field-effect power transistor in a SOT669 (LFPAK) package. Product availability: PH3230 PH3230 PH3230 PH3230 in SOT669 (LFPAK) Features Logic level compatible Low drive current High density 567 90118 Standard Marking * Reel Pack, SMD, 13" SOT669 RFS WWW View the www.datasheetarchive.com/files/philips/pip/ph3230-01.html |
Philips | 23/04/2003 | 2.62 Kb | HTML | ph3230-01.html |
| PH3230S-01 PH3230S-01 PH3230S-01 PH3230S-01 Product information page PH3230S PH3230S PH3230S PH3230S; N-channel TrenchMOS (tm) logic level FET General info The latest generation N-channel enhancement mode field-effect power transistor in a SOT669 (LFPAK) package. Product availability: PH3230S PH3230S PH3230S PH3230S in SOT669 (LFPAK). Features Logic level compatible Low drive current High density mounting Very low on-state resistance. Applications DC-to-DC converter Computer motherboards www.datasheetarchive.com/files/philips/pip/ph3230s-01.html |
Philips | 23/04/2003 | 1.95 Kb | HTML | ph3230s-01.html |
| PH3230S PH3230S PH3230S PH3230S - N-channel Trenchmos (tm) logic level FET no SOT669 1 PH3230S-03 PH3230S-03 PH3230S-03 PH3230S-03 false www.datasheetarchive.com/download/92820543-612994ZC/products.zip (P:\481.Concise Catalog CD-ROMs\catalog\products\45155.txt) |
Philips | 01/06/2005 | 1234.32 Kb | ZIP | products.zip |
| PH2925U PH2925U PH2925U PH2925U - N-channel Trenchmos (tm) ultra low level FET no SOT669 1 PH2925U-02 PH2925U-02 PH2925U-02 PH2925U-02 false www.datasheetarchive.com/download/92820543-612994ZC/products.zip (P:\481.Concise Catalog CD-ROMs\catalog\products\45969.txt) |
Philips | 01/06/2005 | 1234.32 Kb | ZIP | products.zip |