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SOT323 Marking LE

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: ­70/SOT­323 SC­70/SOT­323 SC­70/SOT­323 SC­70/SOT­323 SC­70/SOT­323 SC­70/SOT­323 SC­70/SOT­323 Marking 6A , housed in the SC­70/SOT­323 package which is designed for low power surface mount applications. http , Space Reduces Component Count The SC­70/SOT­323 package can be soldered using wave or reflow. The , VCBO VCEO IC Value 50 50 100 Unit Vdc Vdc mAdc 2 SC­70/SOT­323 CASE 419 STYLE 3 THERMAL , .) 618 (Note 1.) 403 (Note 2.) 280 (Note 1.) 332 (Note 2.) ­55 to +150 Unit mW MARKING DIAGRAM 6x M ON Semiconductor
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100 6n

Abstract: Device marking 6k housed in the SC­70/SOT­323 package SOT­323 (SC­70) which is designed for low power surface mount , Count · The SC­70/SOT­323 package can be soldered using wave or reflow. COLLECTOR (OUTPUT) R1 , Device Code X M =(See Marking Table) =Date Code DEVICE MARKING INFORMATION See specific marking information in the device marking table on page2 of this data sheet. MAXIMUM RATINGS (TA = 25 , MARKING AND RESISTOR VALUES Device Package Marking R1 (K) R2 (K) Shipping MUN5111T1
Leshan Radio Company
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100 6n Device marking 6k mun5113t1 MUN5112T1 MUN5113T3 MUN5114T1 70/SOT MUN5137T1
Abstract: Marking R1 (K) R2 (K) Shipping MUN5111RT1 SC­70/SOT­323 6A 10 10 3000/Tape & , both system cost and board space. The device is housed in the SC­70/SOT­323 package which is designed for low power surface mount applications. 3 1 2 CASE 419, STYLE 3 SOT­323 (SC­70) PIN 1 , SC­70/SOT­323 package can be soldered using wave or reflow. PIN 2 COLLECTOR (OUTPUT) R1 R2 , Marking Table) =Date Code DEVICE MARKING INFORMATION See specific marking information in the device Leshan Radio Company
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MUN5137RT1

c639

Abstract: c33840 -23 SOT-23 SOT-23 SOT-23 SOT-323 SOT-23 SOT-23 Semiconductor Group 15 Marking Sorted by , -363 SOT-323 Semiconductor Group 17 Marking Sorted by Code Marking Type Package , Marking Code Sorted by Type Type Package Marking Type Package Marking BA 582 , -23 SOT-323 SOT-23 SOT-23 SOT-23 SOT-143 SOT-23 Blue S White R Blue S White R Yellow R PA JC , 14-099R BAT 15-03W BAT 15-099 BAT 15-099R BAT 17 BAT 17-04 SOT-23 SOT-323 SOT-23 SOT-323 SOT
Siemens
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c639 c33840 transistor C639 c33725 c877 C63716 OD-323

transistor sc 308

Abstract: MUN5111T1 housed in the SC­70/SOT­323 package which is designed for low power surface mount applications. · · · · · Simplifies Circuit Design Reduces Board Space Reduces Component Count The SC­70/SOT­323 , mAdc Collector Current THERMAL CHARACTERISTICS Characteristic SC­70/SOT­323 CASE 419 STYLE 3 MARKING DIAGRAM Symbol Max Unit PD 202 (Note 1.) 310 (Note 2.) 1.6 (Note 1 , , Tstg ­55 to +150 °C 6x = Specific Device Code x = (See Marking Table) M = Date Code
ON Semiconductor
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transistor sc 308 MUN5115T1 MUN5116T1 MUN5130T1 MUN5111T1/D

SOT323 Marking LE

Abstract: bat54j sod323 K2 A1 A1 Pr te le BAT54CW od A1 A1 BAT54SW SOT-323 uc od Pr e , diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with , = 25°C SOD-323 SOT-323 Maximum storage temperature range Tj Maximum operating junction , (*) 550 SOD-323 Unit °C/W °C/W SOT-323 (*) Mounted on epoxy board, with recommended pad layout , Tj = 25°C 900 VR = 30 V Tj = 100°C Pulse test : te le * tp = 380 µs, < 2% * tp =
STMicroelectronics
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BAT54J BAT54W BAT54AW SOT323 Marking LE bat54j sod323 sot323 marking BS 30 TJ-50C DU SOT323

marking FR PNP SOT323

Abstract: PNP transistor in a plastic SOT323 (S-mini) package. MARKING TYPE NUMBER BF824W MARKING CODE -F 8 VcEO , UAU037 Fig.1 Simplified outline (SOT323) and symbol. QUICK REFERENCE DATA SYMBOL V cB O , t Tam b T stg Tj mA mW °C °C °C -6 5 -6 5 - Note 1. Refer to SOT323 standard mounting , BF824W THERMAL CHARACTERISTICS SYMBOL ^th j-a Note 1. Refer to SOT323 standard mounting conditions , ; lc = -1 0 nA; lE = 0 open collector; lE = -1 0 nA; lc = 0 Ie 3 7 0; Vcb - - 30 V lE = 0; VCb = -3 0
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marking FR PNP SOT323

MUN5113T3

Abstract: MUN5113T3G . The use of a BRT can reduce both system cost and board space. The device is housed in the SC-70/SOT-323 , Simplifies Circuit Design Reduces Board Space Reduces Component Count The SC-70/SOT-323 package can be , ) PIN 3 COLLECTOR (OUTPUT) R1 R2 PIN 2 EMITTER (GROUND) 3 1 2 SC-70/SOT-323 CASE , ) 310 (Note 2) 1.6 (Note 1) 2.5 (Note 2) mW MARKING DIAGRAM 6x M G G 6x = Device Code M = , : MUN5111T1/D MUN5111T1 Series ORDERING INFORMATION AND RESISTOR VALUES Package Marking R1 (K
ON Semiconductor
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MUN5113T3G MUN5111T1G MUN5112T1G MUN5113T1G SOt323 marking code 6X SC-70/SOT-323

BAS70-07S

Abstract: BAS70-08S -08S SCHEMATIC DIAGRAM BAS70-07S SCHEMATIC DIAGRAM 3 uc d SOT323-6L s) t( te le 1 so Ob , DIMENSIONS (millimeters) 0.3mm te le 1mm 2.9mm (s) ct 1mm 0.35mm du o MARKING , Schottky diode in SOT323-6L package. This diode is intented to be used in RF application for signal , . 70 ELECTRICAL CHARACTERISTICS Symbol Parameter te le Tests Conditions C Junction , ). Zth(j-a)(°C/W) te le so Ob - ct u 60 Fig. 4: Junction capacitance versus
STMicroelectronics
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BAS70-08S

LMUN5113T1G

Abstract: LMUN5111T1G RESISTOR VALUES Device Package Marking R1 (K) R2 (K) Shipping LMUN5111T1G SC­70/SOT­323 , housed in the SC­70/SOT­323 package SOT­323 (SC­70) which is designed for low power surface mount , Count · The SC­70/SOT­323 package can be soldered using wave or reflow. (INPUT) COLLECTOR , Device Package Shipping 6X =Specific Device Code X M =(See Marking Table) =Date Code LMUN51xxT1G SOT323 3000/Tape&Reel LMUN51xxT3G SOT323 10000/Tape&Reel MAXIMUM RATINGS (TA =
Leshan Radio Company
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LMUN5113T1G LMUN51xxT1G LMUN5112T1G LMUN5114T1G LMUN5112 LMUN5113T1 LMUN51 3000/T SC-70
Abstract: switching applications. MARKING CODE: 1PC SOT-323 CASE MAXIMUM RATINGS: (TA=25°C) SYMBOL , CONDITIONS VCB=60V Vc b =60V, Ta =125°C V e b =3.0V Vc e =60V, V e b =3.0V lc =10pA lc=10mA lE=10pA lQ , hfe hoe hoe rb'Cc NF td `r 's tf 0 a =25°C unless otherwise noted) MIN TEST CONDITIONS VCB=10V, lE , =1.0kHz VCE=10V, lc = 1.0mA, f= 1.0kHz VCE=10V, lc =10mA, t=1.0kHz VCB=10V, lE=20mA, f=31,8MHz VCE=10V, lc , 150 4.0 10 25 225 60 UNITS pF PF kQ ki2 x10'4 x10'4 pmhos ^jmhos ps dB ns ns ns ns SOT-323 -
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CMST2222A 100MH CP191
Abstract: transistor in a plastic SOT323 package, for general switching and amplification. PINNING - SOT323 PIN DESCRIPTION 1 base 2 emitter 3 collector QUICK REFERENCE DATA MARKING CODES SYMBOL , operating ambient temperature see Fig.2 Note 1. Refer to SOT323 standard mounting conditions , ambient Note 1. Refer to SOT323 standard mounting conditions. March 1993 312 THERMAL , m SYMBOL PARAMETER CONDITIONS collector-base cut-off current MIN. MAX. UNIT lE -
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BC807W BC808W BC807-25W BC807-40W BC807-16W BC808-16W

SOT323 Marking LE

Abstract: T31G APPLICATIONS · General purpose switching and amplification. DESCRIPTION PNP transistor in a SOT323; SC70 , DESCRIPTION R1 2 MARKING TYPE NUMBER 2PB1219AQ 2PB1219AR 2PB1219AS QUICK REFERENCE DATA SYMBOL V CBO V CEO ICM Plot hFE t i, MARKING CODE DtQ DtR DtS Top view t i, MAM048 Fig.1 Simplified outline (SOT323; SC70) and symbol. PARAMETER collector-base voltage collector-emitter voltage peak , . Refer to SOT323; SC70 standard mounting conditions. THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Refer
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T31G 2PD1820A 2PB1219A

SOT323 Marking LE

Abstract: SMUN5111T1G (Pb-Free) SC-70/SOT-323 (Pb-Free) Marking 6A 6B 6C 6C 6C 6D 6E 6F 6G 6H 6J 6K 6L 6M 6N 6P R1 (K) 10 22 47 , device is housed in the SC-70/SOT-323 package which is designed for low power surface mount applications , Design Reduces Board Space Reduces Component Count The SC-70/SOT-323 package can be soldered using wave , and are RoHS Compliant* SC-70/SOT-323 CASE 419 STYLE 3 PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) PIN 1 BASE (INPUT) R1 R2 MARKING DIAGRAM 6x MG G 1 6x M G = Device Code = Date Code
ON Semiconductor
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SMUN5111T1G SMUN5112T1G MUN5137T1G SMUN5111T1 NSVMUN5111T1S AEC-Q101
Abstract: a plastic SOT323 (SC70) package. PINNING - SOT323 PIN Top view DESCRIPTION 1 base 2 emitter 3 MBC670 collector Fig.1 Simplified outline and symbol. MARKING CODES , temperature Ti "^"amb operating ambient temperature see Fig.2 Note 1. Refer to SOT323 standard , resistance from junction to ambient Note 1. Refer to SOT323 standard mounting conditions. October 1992 , collector-base cut-off current lE = 0; VC8 = 30 V; T, = 150 °C - ' ebo emitter cut-off current lc -
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BC846W BC847W BC848W BC846AW BC846BW BC847AW

BC856CW

Abstract: SOT323 package. PINNING - SOT323 PIN 1 2 3 base emitter collector DESCRIPTION MARKING CODES BC856W , operating ambient temperature 1. Refer to SOT323 standard mounting conditions. THERMAL RESISTANCE SYMBOL , ) THERMAL RESISTANCE max. 625 K/W Note 1. Refer to SOT323 standard mounting conditions. September 1994 , ; BC857AW; BC858AW BC856BW; BC857BW; BC858BW BC856CW; BC857CW; BC858CW CONDITIONS lE = 0; VC B = -3 0 V lE = 0; VC B = -3 0 V; T( = 150 °C lc = 0; = -5 V - MIN. MAX. -15 -4 -500 -750 -820 -300 -650 5
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BC857W BC858W BC856AW
Abstract: and amplification. DESCRIPTION NPN transistor in a SC70; SOT323 plastic package. PNP complements: BC856W and BC857W. MARKING TYPE NUMBER MARKING CODE«1) TYPE NUMBER MARKING CODE , = 150 °C 01 < < m m II p MAX. UNIT - Ie = 0; Vqb = 30 V lE = 0; VCB = , 5V 580 - 700 mV lB = = Cc lE = ie = fT transition frequency lc = , PACKAGE OUTLINE Plastic surface mounted package; 3 leads SOT323 R I detail X 0 1 2 mm 1 -
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BC847BW BC847CW

transistor 6c x

Abstract: MUN5111T1 Collector Current SC­70/SOT­323 CASE 419 STYLE 3 THERMAL CHARACTERISTICS Characteristic MARKING , RESISTOR VALUES Device Package Marking R1 (K) R2 (K) Shipping MUN5111T1 SC­70/SOT­323 , housed in the SC­70/SOT­323 package which is designed for low power surface mount applications. · · · · · Simplifies Circuit Design Reduces Board Space Reduces Component Count The SC­70/SOT­323 , +150 °C 6x x M = Specific Device Code = (See Marking Table) = Date Code DEVICE MARKING
ON Semiconductor
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transistor 6c x

SMUN5111T1G

Abstract: NSVMUN5132 (Pb-Free) SC-70/SOT-323 (Pb-Free) Marking 6A 6B 6C 6C 6C 6D 6E 6F 6G 6H 6J 6K 6L 6M 6N 6P R1 (K) 10 22 47 , device is housed in the SC-70/SOT-323 package which is designed for low power surface mount applications , Design Reduces Board Space Reduces Component Count The SC-70/SOT-323 package can be soldered using wave , and are RoHS Compliant* SC-70/SOT-323 CASE 419 STYLE 3 PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) PIN 1 BASE (INPUT) R1 R2 MARKING DIAGRAM 6x MG G 1 6x M G = Device Code = Date Code
ON Semiconductor
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NSVMUN5132 NSVMUN5111T1GS

BF822W

Abstract: equipment. MARKING TYPE NUMBER BF820W BFB22W BF820W; BF822W MARKING CODE -1 V -1X DESCRIPTION NPN transistors in a plastic SOT323 (S-mini) package. PINNING PIN 1 2 3 base emitter collector Fig.1 Simplified outline (SOT323) and symbol. DESCRIPTION QUICK REFERENCE DATA SYMBOL VcBO PARAMETER collector-base , " and "Thermal characteristics" 1. Refer to SOT323 standard mounting conditions. Decem ber 1994 , collector-base breakdown voltage BF820W BF822W CONDITIONS open emitter; lc = 10 nA; lE = 0 MIN. MAX
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