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Part Manufacturer Description Datasheet BUY
ISL28113SOT23EVAL1Z Intersil Corporation Single General Purpose Micropower, RRIO Operational Amplifier; Package: Eval Board visit Intersil
ISL28114SOT23EVAL1Z Intersil Corporation Single General Purpose Micropower, RRIO Operational Amplifiers; Package: Eval Board visit Intersil
HM1-65642B/883 Intersil Corporation 8KX8 STANDARD SRAM, 150ns, CDIP28 visit Intersil
24502BVA Intersil Corporation 1KX4 STANDARD SRAM, 120ns, CDIP18 visit Intersil
8403603JA Intersil Corporation 2KX8 STANDARD SRAM, 90ns, CDIP24, CERAMIC, DIP-24 visit Intersil
HM1-65162C/883 Intersil Corporation 2KX8 STANDARD SRAM, 90ns, CDIP24, CERAMIC, DIP-24 visit Intersil

SOT23 JEDEC standard orientation

Catalog Datasheet MFG & Type PDF Document Tags

SOT23 JEDEC standard orientation

Abstract: SOT23 JEDEC standard ) JEDEC board, horizontal orientation Electrical: Body Size Pad Size Pkg (mm) (mm) Lead SOT23 2.9 x 1.6 x 0.9 5 SOT23 2.0 x 1.6 x 0.9 6 SC70 2.0 x 1.66 x 0.9 5 SC70 2.0 x , SOT23 fused Standard Outline Transistor (SOT23) and Single Chip (SC70) Packages: Pkg Type , packages offer: · JEDEC and EIAJ compliant body sizes · Available in 3, 5, 6 or 8 lead for SOT23 and 5 or , - 0.84 x 1 41223 MO-223A SC70 *3 leaded SOT23 follows the standard body dimensions
Amkor Technology
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MO-193D SOT23 JEDEC standard orientation SOT23 JEDEC standard SOT23 JEDEC standard orientation pad size c 3421 transistor JEDEC 95 sot packages 193d

SOT23 JEDEC standard orientation

Abstract: w3 sot23 Packaging type Qty per Reel/Tube/Bag Reel Size Standard (no flow code) TNR 3,000 D87Z SOT23 , SEMICONDUCTOR CORPORATION (F63TNR) 193mm x 183mm x 80mm Pizza Box for Standard Option SOT23-3L Tape , SOT-23 Std Tape and Reel Data SOT23-3L Packaging Configuration: Figure 1.0 Customized Label Packaging Description: SOT23-3L parts are shipped in tape. The carrier tape is made from a dissipative , . These reeled parts in standard option are shipped with 3,000 units per 7" or 177cm diameter reel. The
Fairchild Semiconductor
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w3 sot23 CBVK741B019 MMSZ5221B D0 sot23 SOT23-3L JEDEC standard RS-481

KA7812

Abstract: SOT23 JEDEC standard Unit Orientation SOT-23 Packaging Information Standard Packaging Option Packaging type 5 Reels , SOT-23 Tape and Reel Data SOT-23 Packaging Configuration: Figure 1.0 Packaging Description: SOT-23 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled , standard option are shipped with 3,000 units per 7" or 17.7cm diameter reel. The reels are clear in color , inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown
Fairchild Semiconductor
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KA7812 7103 A0 SOT-23 KA7812 INTEGRATED CIRCUIT polystyrene film

SOT-23 AAAA

Abstract: marking AAAA sot23 JEDEC (TO-236) Typical Applications ORDERING INFORMATION Device NCP803SNxxxT1 Package SOT-23 , 20 mV) http://onsemi.com 4 NCP803 TAPING FORM Component Taping Orientation for 3L SOT-23 (JEDEC-236) Devices USER DIRECTION OF FEED DEVICE MARKING PIN 1 Standard Reel Component Orientation (Mark Right Side Up) Tape & Reel Specifications Table Package SOT-23 SOT-23 Carrier Width (W) 8 , RESET output. The output of the NCP803 is guaranteed valid down to VCC = 1.0 V and is available in a SOT-23
ON Semiconductor
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SOT-23 AAAA marking AAAA sot23 NCP803SN293T1G sot-23 MARKING CODE 431 431 marking code sot NCP803SN232 NCP803/D

MPSA65

Abstract: bel 188 transistor Option Packaging type Qty per Reel/Tube/Bag Standard (no flow code ) TNR 3,000 D87Z SOT-23 , ) Standard (no flow code) TNR 2,500 D84Z SOT-223 Unit Orientation TNR 500 13" Dia 7" Dia , MMBTA65 PZTA65 C C E E C B TO-92 SOT-23 E C B B SOT-223 Mark , Information table 2.0 K / BOX 2.0 K / BOX NO EOL CODE TO-92 STANDARD STRAIGHT FOR: PKG 92, 94 (NON PROELECTRON SERIES), 96 L34Z TO-92 STANDARD STRAIGHT FOR: PKG 94 (PROELECTRON SERIES
Fairchild Semiconductor
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MPSA64 MPSA65 bel 188 transistor PN2222N

SJ 38

Abstract: qsc 1110 ), JEDEC BGA54A BGA96A BGA114A M5 SOT-23 P5 SC70 (5-Lead) MAA05A MA05B L6 , Pack No Leads, JEDEC 3000 240 2500 M5 SOT-23 MA05B Not Available 250 M5X , www.fairchildsemi.com 6 Small Outline Package Comparison Package (Code) Dim SOIC JEDEC A 14 , (6.20) (MTC) (6.60) (6.20) (6.60) (6.20) (6.60) (6.20) (6.60) SSOP JEDEC , -Pin Dim Min SSOP A (MEA) Max Min Max SOT-23 0.395 0.420 0.395 0.420
Fairchild Semiconductor
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SJ 38 qsc 1110 MicroPak-10 SJ38 dqfn8 MLP24B MS012540 MLP08C MLP016C MLP014A MLP016E MLP020B

marking code s5 SOT23-6

Abstract: esd diode sot23-6 marking s5 Suppressor Array diodes for surge and ESD protection applications, in compact chip package SOT23-6 size. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment , Combo Mechanical Characteristics This is a molded JEDEC SOT23-6 package with 100 % Matte Sn on the , Information The product is packaged in tape and reel format per EIA-481 standard. P 0 P 1 PART ORIENTATION , (INCHES) How to Order Typical Part Marking CD SOT23 - SRV 05 - 4 Common Code CD = Chip Diode
Bourns
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CDSOT23-SRV05-4 marking code s5 SOT23-6 esd diode sot23-6 marking s5 sot23-6 marking code cd sot23-6 0051 SOT23-6 .S5 Marking D2 SOT23-6

Code sot-23 on semiconductor

Abstract: wc sot23 3P 3P 3P 3P SOT-23 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Standard (no flow code ) TNR 3,000 D87Z SOT-23 Unit Orientation TNR 10,000 , SOT-23 Tape and Reel Data SOT-23 Packaging Configuration: Figure 1. 0 Customized La bel Packaging Description: SOT-23 parts are shipped in tape. The carrier tape is made from a dissipative , ard SOT-23 Tape Leader and Trailer Configuration: Figure 2. 0 Carrier Tape Cover Tape
-
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Code sot-23 on semiconductor wc sot23 rd sot23

sot23-6 0051

Abstract: Vf MARKING CODE SOT23-6 SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick , Array Mechanical Characteristics This is a molded JEDEC SOT23-6 package with lead free 100 % Tin (Sn , packaged in tape and reel format per EIA-481 standard. P 0 P 1 PART ORIENTATION Index Hole 120 ° F W B , MILLIMETERS (INCHES) How to Order Typical Part Marking CD SOT23 - SR 208 Common Code CD = Chip Diode Package SOT23 = SOT23-6 Package Model SR = Steering Diode Model Number 208 CDSOT23-SR208
Bourns
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Vf MARKING CODE SOT23-6

qsc 1110

Abstract: soic 16 Jedec package outline JEDEC (M, WM) A 14-Pin 16-Pin 20-Pin 24-Pin Min A Max Min Max Min , ) SSOP JEDEC (aka QSOP) (QSC) 0.169 0.177 0.169 0.177 0.169 0.177 0.169 0.177 , -Pin Min SSOP (MEA) A Max Min 0.395 0.420 0.395 Dim SOT-23 (M5) B 0.299 , -Lead M5 SOT-23 P5 SC70 (5-Lead) MAA05A MA05B P6 SC70 (6-Lead) MAA06A N Molded Dual-In-Line Package N14A N16A N20A M Molded Small Outline Package, JEDEC M14A
Fairchild Semiconductor
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soic 16 Jedec package outline M24B M14D M16D MTC14 MTC16 MTD48 MTD56

marking code s5 SOT23-6

Abstract: esd diode sot23-6 marking s5 Array diodes for surge and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment , . CDSOT23-SRV05-4 ­ Steering Diode TVS Array Combo Mechanical Characteristics This is a molded JEDEC SOT23 , ) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Specifications are subject to change
Bourns
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NI SOT23-6 20 sot23-6 esd
Abstract: compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The , Mechanical Characteristics This is a molded JEDEC SOT23-6 package with lead free Nickel-Paladium-Gold (Ni/Pd , ) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Specifications are subject to change Bourns
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SOT23-6 .S5

Abstract: esd diode sot23-6 marking s5 Array diodes for surge and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment , . CDSOT23-SRV05-4 ­ Steering Diode TVS Array Combo Mechanical Characteristics This is a molded JEDEC SOT23 , ) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Specifications are subject to change
Bourns
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IPA0508 marking code 10 sot23 sot23 marking code pp

sot23-6 marking code cd

Abstract: jedec sot23 diodes for EFT and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and , molded JEDEC SOT23-6 package with lead free 100 % Tin (Sn) on the lead frame. It weighs approximately 15 , ) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Specifications are subject to change
Bourns
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IPA0522 jedec sot23 SOT23-6 package

SOT23 JEDEC standard orientation

Abstract: SOT23 JEDEC standard diodes for EFT and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and , molded JEDEC SOT23-6 package with lead free 100 % Tin (Sn) on the lead frame. It weighs approximately 15 , ) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Specifications are subject to change
Bourns
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sot23 transistor chip code sot23-6 marking code 27

SR724

Abstract: SOT23-6 package for Surge and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their , Characteristics This is a molded JEDEC SOT23-6 package with lead free 100 % Tin (Sn) on the lead frame. It weighs , ± 0.3 (.31 ± .01) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here
Bourns
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CDSOT23-SR724 SR724

CDSOT23-SR724

Abstract: sot23-6 marking code cd for Surge and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their , Steering Diode Array Mechanical Characteristics This is a molded JEDEC SOT23-6 package with lead free 100 , ) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Specifications are subject to change
Bourns
Original
SOT23-6 Marking PL

marking code s5 SOT23-6

Abstract: esd diode sot23-6 marking s5 Suppressor Array diodes for surge and ESD protection applications, in compact chip package SOT23-6 size. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment , Combo Mechanical Characteristics This is a molded JEDEC SOT23-6 package with 100 % Matte Sn on the , . (0.010) 0.9 ± 0.1 (.035 ± .004) 3.9 ± 0.1 (.154 ± .004) ORIENTATION OF COMPONENT IN POCKET , standard RS-481-A and specifications shown here. Specifications are subject to change without notice
Bourns
Original

marking code s5 SOT23-6

Abstract: compact chip package SOT23-6 size for Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns , . CDSOT23-SRV05-4 - Steering Diode TVS Array Combo Mechanical Characteristics This is a molded JEDEC SOT23 , ± .01) R 0.25 TYP. (0.010) 0.9 ± 0.1 (.035 ± .004) 3.9 ± 0.1 (.154 ± .004) ORIENTATION OF , accordance with EIA standard RS-481-A and specifications shown here. Specifications are subject to change
Bourns
Original

sot23-6 marking code cd

Abstract: SR SOT23 for Surge and ESD protection applications, in compact chip package SOT23-6 size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their , Characteristics This is a molded JEDEC SOT23-6 package with lead free 100 % Tin (Sn) on the lead frame. It weighs , ± 0.3 (.31 ± .01) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Devices are packed in accordance with EIA standard RS-481-A and specifications shown here
Bourns
Original
SR SOT23 Firewire 800 code tp sot23-6
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