| SOT1220 |
|
NXP Semiconductors
|
Plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals |
|
Original |
PDF
|
| SOT1220_115 |
|
NXP Semiconductors
|
DFN2020MD-6; reel pack; Standard orientation; 12NC ending 115 |
|
Original |
PDF
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| SOT1220_125 |
|
NXP Semiconductors
|
DFN2020MD-6; Tape reel SMD; reversed product orientation 12NC ending 125 |
|
Original |
PDF
|
| SOT1221-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 6 leads(flat) |
|
Original |
PDF
|
| SOT1222-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 6 leads |
|
Original |
PDF
|
| SOT1223-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 4 leads(flat) |
|
Original |
PDF
|
| SOT1224-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 4 leads |
|
Original |
PDF
|
| SOT1225 |
|
NXP Semiconductors
|
Plastic extremely thin small outline package; no leads; 8 terminals; body 1.6 x 1.2 x 0.4 mm |
|
Original |
PDF
|
| SOT1226 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals |
|
Original |
PDF
|
| SOT1227A |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 2 leads |
|
Original |
PDF
|
| SOT1227B |
|
NXP Semiconductors
|
Earless Flanged ceramic package; 2 leads |
|
Original |
PDF
|
| SOT1228A |
|
NXP Semiconductors
|
Flanged LDMOST ceramic package; 2 mounting holes; 4 leads |
|
Original |
PDF
|
| SOT1229 |
|
NXP Semiconductors
|
Footprint information for reflow soldering of DFN1212-6 package |
|
Original |
PDF
|
| SOT122D |
|
NXP Semiconductors
|
studless ceramic package; 4 leads |
|
Original |
PDF
|
|
|
| SOT122E |
|
NXP Semiconductors
|
studded ceramic package; 4 leads |
|
Original |
PDF
|
| SOT122F |
|
NXP Semiconductors
|
studded ceramic package; 4 leads |
|
Original |
PDF
|
