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Part Manufacturer Description Datasheet BUY
HM1-65642B/883 Intersil Corporation 8KX8 STANDARD SRAM, 150ns, CDIP28 visit Intersil
24502BVA Intersil Corporation 1KX4 STANDARD SRAM, 120ns, CDIP18 visit Intersil
8403603JA Intersil Corporation 2KX8 STANDARD SRAM, 90ns, CDIP24, CERAMIC, DIP-24 visit Intersil
HM1-65162C/883 Intersil Corporation 2KX8 STANDARD SRAM, 90ns, CDIP24, CERAMIC, DIP-24 visit Intersil
ISL6842IBZ Intersil Corporation Improved Industry-Standard Single-Ended PWM Controller; SOIC8; Temp Range: -40° to 85°C visit Intersil Buy
ISL8500IRZ-T Intersil Corporation 2A Standard Buck PWM Regulator; DFN12; Temp Range: -40° to 85°C visit Intersil Buy

SOT 343 JEDEC standard

Catalog Datasheet MFG & Type PDF Document Tags

78 sot-89

Abstract: 723 voltage regulator .SOT-23A-3 SOT-89-3 TO-92 Short Circuit Protected Standard 3.0V, 3.3V and 5.0V Output Voltages Custom Voltages Available from 2.1V to 6.0V in 0.1V Steps. PIN CONFIGURATIONS *SOT-23A-3 SOT-89-3 TO , °C to +85°C ­ Package Type and Pin Count: CB: SOT-23A-3 (equivalent to JEDEC (TO-236) MB: SOT , -23B (JEDEC TO-236) Devices User Direction of Feed Device Marking PIN 1 Standard Reel Component , ) .070 (1.78) .010 (0.25) .005 (0.13) *NOTE: SOT-23B-3 is equivalent to JEDEC (TO-236) SOT
TelCom Semiconductor
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A1B sot

Abstract: JESD22-A114 -8343X power amplifier is packaged in a plastic encapsulated SOT-343 package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. The SOT-343 is a similar package differing only by having two fewer leads than the SOT-363. Figure 1: Image of SOT-343 Encapsulated Plastic Package SGA , based on JEDEC test methods common to the semiconductor industry. The manufacturing test specifications
Sirenza Microdevices
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metal detector plans

Abstract: AN-5378 the volume and 10% of the PCB area required by a standard SOT-342 package. Compared to many standard , performance at a low cost. VMMK devices are very small; twenty VMMK devices will fit inside the tiny SOT-343 , following a few simple design and layout cautions. Figure 4. Twenty VMMK packages fit inside a SOT-343 , /convection reflow profile investigated and recommended for VMMK parts is based on JEDEC/IPC standard J-STD , provided the time of exposure at peak reflow temperature is not excessive, as per the JEDEC standard. By
Avago Technologies
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marking 17 sot343

Abstract: 55 ic Sot-343 Linear and non linear operation Transition frequency 42 GHz Ultra miniature SOT-343 (SC70) lead free package SOT-343 Applications PA for dect or PHS PA stage for wireless LAN , 3rd generation bipolar process, it offers the highest power, gain and efficiency in SOT-343 for , Marking Package Packaging START499ETR E99 SOT-343 Tape and reel February 2008 Rev , equivalent circuit, the two emitter leads of SOT-343 package are combined in one electrical connection
STMicroelectronics
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marking 17 sot343 55 ic Sot-343 start499etr spice START499E st P 1806

SGA-3563Z

Abstract: SGA5263Z encapsulated SOT-363 package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. The SOT-363 is a similar package differing only by having two more leads than the SOT-343. Figure 1: Image of SOT-363 Encapsulated Plastic Package (left) and a SOT-343 Encapsulated Plastic Package (right , qualification testing is based on JEDEC test methods common to the semiconductor industry. A FMEA approach is
Sirenza Microdevices
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SGA-8343Z SGA-3563Z SGA5263Z SGA-4563Z SGA-5263z A102 TRANSISTOR sga8343z SGA-5263Z SGA-4563Z/4463Z/4363Z/4263Z/4163Z SGA-3563Z/3463Z/3363Z/3263Z SGA-2463Z/2363Z/2263Z/2163Z SGA-1263Z/1163Z SGA-0363Z/0163Z

SGA-2463Z

Abstract: A102 TRANSISTOR in a plastic encapsulated SOT-363 package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. The SOT-363 is a similar package differing only by having two more leads than the SOT-343. Figure 1: Image of SOT-363 Encapsulated Plastic Package (left) and a SOT-343 Encapsulated Plastic , qualification testing is based on JEDEC test methods common to the semiconductor industry. A FMEA approach is
Sirenza Microdevices
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SGA-2463Z JESD22-A103 SGA-8343Z/8543Z SGL-0263Z/0163Z RQR-103792 D22B102

TRANSISTOR A104b

Abstract: transistor a102 standard thermally and electrically conductive silver epoxy. The SOT-343 is a similar package differing only by having two fewer leads than the SOT-363. Figure 1: Rendering of SOT-363 Encapsulated Plastic , . Package Type The SGA-4463 power amplifier is packaged in a plastic encapsulated SOT-363 package that is , qualification testing is based on JEDEC test methods common to the semiconductor indus try. The manufacturing , the part as JEDEC 22-A113B Moisture Sensitivity Level 1 (MSL-1). MSL-1 indicates that no special dry
Sirenza Microdevices
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SGA-2163 SGA-2363 SGA-3463 SGA-3563 TRANSISTOR A104b transistor a102 transistor a103 a103 transistor A104 transistor A104B SGA-2263 SGA-2463 SGA-3263 SGA-3363
Abstract: on Data Sheets requiring this package) 38 SOT-23B-3 JEDEC (TO-236) .021 (0.54) .015 (0.37 , ) .080 (2.05) .070 (1.78) .010 (0.25) .005 (0.13) NOTE: THE SOT-23B IS EQUIVALENT TO JEDEC (TO , FORM DIMENSIONS, USE TABLE ON PAGE 49. 51 Component Taping Orientation for 3L SOT-23B (JEDEC TO , (4.19) 32 SOT-89-3 .181 (4.60) .173 (4.40) .063 (1.60) .055 (1.40) .072 (1.83) .055 (1.40 , (0.44) .017 (0.44) .014 (0.35) .062 (1.60) .056 (1.40) .019 (0.48) .014 (0.36) 33 SOT TelCom Semiconductor
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SPF-3143Z

Abstract: SPF3143Z SOT-343 package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. The SOT343 is a similar package differing only by having two fewer leads than the SOT-363. Figure 1: Image of SOT-343 , mechanisms stressed. The qualification testing is based on JEDEC test methods common to the semiconductor , Condition/ Standard Sample Size Results 223 Pass Preconditioning MSL1 Reflow @ 270oC
Sirenza Microdevices
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SPF-3143Z JESD22-A104B JESD22-A108B JESD22-B102C SPF3143Z SPF-3143 B1A SOT RQR-105311 JESD22-A110B JESD22-A109A

SGC-4563Z

Abstract: SGC4563 plastic encapsulated SOT-363 package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. The SOT-363 is a similar package differing only by having two more leads than the SOT-343. Figure 1: Image of SOT-363 Encapsulated Plastic Package (left) and a SOT-343 Encapsulated Plastic , based on JEDEC test methods common to the semiconductor industry. A FMEA approach is used to determine
RF Micro Devices
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SGC-4563Z SGC4563 reliability testing report SGA0363Z SGA-2163Z SGC4563Z SGC-2363Z/2463Z/4363Z/4463Z/4563Z SGL-0163Z/0263Z/0363Z

TC02VZB

Abstract: mark CA °C to +100°C NOTE: *SOT-23B-3 is equivalent to JEDEC (TO-236) . PIN CONFIGURATION VCC = 2.2V to 12V MICROCONTROLLER VCC *SOT-23B-3 (Top View) TO-92-3 1 2 3 A/D CONVERTER GND , ) .080 (2.05) .070 (1.78) .010 (0.25) .005 (0.13) *NOTE: SOT-23B-3 is equivalent to JEDEC (TO , Small Packages . TO-92-3 and SOT-23B-3 APPLICATIONS s s s s s Power Supply , Output Voltage At 25°C TC02VNB TC02VZB TC03VNB TC03VZB *SOT-23B-3 TO-92 *SOT-23B-3 TO
TelCom Semiconductor
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mark CA TC02 TC03 TC02/03 TC02/03-04

sga8343z

Abstract: SGA-3563Z in a plastic encapsulated SOT-363 package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. The SOT-363 is a similar package differing only by having two more leads than the SOT-343. Figure 1: Image of SOT-363 Encapsulated Plastic Package (left) and a SOT-343 Encapsulated Plastic , qualification testing is based on JEDEC test methods common to the semiconductor industry. A FMEA approach is
Sirenza Microdevices
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SGL0363z SGA 4563Z SGL-0363 SGA-0163Z sgl-0363z SGA2463Z SGC-2363Z/2463Z/4363Z/4463Z

Voltage Converters

Abstract: TC02 TC03VNB VOUT NOTE: *SOT-23B-3 is equivalent to JEDEC (TO-236) TC02/03-3 4/17/98 TelCom , Taping Orientation for 3L SOT-23B (JEDEC TO-236) Devices User Direction of Feed Device Marking , : SOT-23B-3 is equivalent to JEDEC (TO-236) TO-92-3 .165 (4.19) .125 (3.18) .210 (5.33) .170 , -92-3 and SOT-23B-3 APPLICATIONS s s s s s Power Supply Thermal Shut-Down Temperature-Controlled , *TC02VZB TC03VNB TC03VZB SOT-23B-3 TO-92 SOT-23B-3 TO-92 750mV 750mV 250mV 250mV Temp
TelCom Semiconductor
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Voltage Converters

SPF-5043Z

Abstract: spf5043z plastic encapsulated SOT-343 package that is assembled using a highly reproducible automated assembly process. The die is mounted using an industry standard thermally and electrically conductive silver epoxy. . Figure 1: Image of SOT-343 Package 2 SPF-5043Z Reliability Qualification Report V , package failure mechanisms stressed. The qualification testing is based on JEDEC test methods common to , level of moisture resistance that a device can be classified according to the above mentioned standard
Sirenza Microdevices
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spf5043z spf-5043 5043Z SPF 5043Z JESD22-A114 JESD22-A-108-B RQR-105880 JESD22-A102C JESD22-A103B

Voltage Converters

Abstract: SOT-23B-3 TC03VNB VOUT NOTE: *SOT-23B-3 is equivalent to JEDEC (TO-236) TC02/03-2 7/10/97 TelCom , ) .080 (2.05) .070 (1.78) .010 (0.25) .005 (0.13) *NOTE: SOT-23B-3 is equivalent to JEDEC (TO , -92-3 and SOT-23B-3 APPLICATIONS s s s s s Power Supply Thermal Shut-Down Temperature-Controlled , *TC02VZB TC03VNB TC03VZB SOT-23B-3 TO-92 SOT-23B-3 TO-92 750mV 750mV 250mV 250mV Temp , availability. . PIN CONFIGURATION VCC = 2.2V to 12V MICROCONTROLLER VCC *SOT-23B-3 (Top View
TelCom Semiconductor
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SOT-23B-3 SOT23B-3 TO-92-3

mark A E sot-89-3

Abstract: SOT-23A-3 Orientation for 3L SOT-23B (JEDEC TO-236) Devices User Direction of Feed Device Marking PIN 1 , GENERAL DESCRIPTION Precise Detection Thresholds . Standard ± 2.0% Custom ± 1.0% Small Packages . SOT-23A-3, SOT-89, TO-92 Low Current Drain . Typ. 1µA Wide , CONFIGURATIONS SOT-89-3 *SOT-23A-3 TO-92 ORDERING INFORMATION VIN 2 TC54 3 VSS 1 VOUT , XXX 1 2 3 Extra Feature Code: Fixed: 0 *SOT-23A-3 is equivalent to EIAJ (SC-59) Tolerance
TelCom Semiconductor
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mark A E sot-89-3 SOT-23A-3 Voltage Detector SOT-89 Voltage Detector SOT-89 marking TC54 TC54VN

Marking 723 3pin

Abstract: using the TC54 voltage detector : Standard Taping RT: Reverse Taping No Suffix: TO-92 Bulk VREF VSS 3 * 3-Pin SOT-23A is equivalent , Component Taping Orientation for 3-Pin SOT-23B (JEDEC TO-236) Devices User Direction of Feed Device , TC54 Series VOLTAGE DETECTOR FEATURES s s s s s Precise Detection Thresholds . Standard ± 2.0% Custom ± 1.0% Small Packages .3-Pin SOT-23A, 3-Pin SOT-89, 3-Pin TO-92 Low Current Drain , in Battery Backup Level Discriminator PIN CONFIGURATIONS *3-Pin SOT-23A VIN 2 1 2 3 3-Pin SOT
TelCom Semiconductor
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Marking 723 3pin using the TC54 voltage detector sot-89 MARK n c 723 3pin Mark CA SOT89 MARKING 11 3PIN TC54-13 D-82152

TMP36GRT

Abstract: TMP35 -Lead Plastic Surface-Mount Package (SOT-23) 8-Lead Standard Small Outline Package (SOIC) 8-Lead Standard , ) 8-Lead Standard Small Outline Package (SOIC) 5-Lead Plastic Surface-Mount Package (SOT-23) 5-Lead Plastic Surface-Mount Package (SOT-23) 8-Lead Standard Small Outline Package (SOIC) 8-Lead Standard , -Pin Plastic Header-Style Package (TO-92) 5-Lead Plastic Surface-Mount Package (SOT-23) 8-Lead Standard Small , /TMP37 are all available in low cost 3-pin TO-92, and SO-8 and 5-pin SOT-23 surface mount packages
Analog Devices
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TMP36 TMP35 TMP37 TMP36GRT TMP36FSZ T6G SOT23-5 TMP37GT9-REEL TMP36GRT-REEL7 TMP35/TMP36/TMP37 LM35/LM45

PSA4-5043

Abstract: SPF 9001 Reel Standard quantities available on reel MMM1362 Plastic molded SOT-343 package, lea finishi , internally matched to 50 ohms and is supplied in a super small SC-70 (SOT-343) MSL 1 package. Key Features , Internally Matched SOT-343 Package High Reliability Class 1B ESD (500V, HBM) Notes: a. Suitability for , required to achieve the advertised noise and output power over the full band Small size, industry standard , subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, "Standard Terms
Mini-Circuits
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PSA4-5043 SPF 9001 SPF-5043Z s2p TB-471 MARKING SPF5043Z MMIC 5043 J-STD-020D C/85RH
Abstract: at +5V, is internally matched to 50 ohms and is supplied in a super small SC-70 (SOT-343) MSL 1 , to achieve the advertised noise and output power over the full band SOT-343 Package Small size, industry standard package High Reliability Low, small signal operating current of 53mA nominal , -653+ Environmental Ratings ENV08T2 Plastic molded SOT-343 package, lea finishi: matte tin ESD Rating Human , covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and Mini-Circuits
Original
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