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SOD128 Datasheet

Part Manufacturer Description PDF Type
SOD128 NXP Semiconductors Footprint for reflow soldering SOD128 Original
SOD128 NXP Semiconductors Plastic surface-mounted package; 2 leads Original

SOD128

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Package outline Plastic surface-mounted package; 2 leads D E A SOD128 A c HE 1 2 0 2.5 scale 5 mm bp DIMENSIONS (mm are the original dimensions) UNIT w A mm A 1.1 0.9 bp 1.9 1.6 c 0.22 0.10 D 4.0 3.6 E 2.7 2.3 HE 5.0 4.4 Lp 0.6 0.3 w 0.13 (1) M Lp OUTLINE VERSION SOD128 Lp REFERENCES IEC JEDEC JEITA Note 1. The marking bar indicates the cathode EUROPEAN PROJECTION ISSUE DATE 06-03-03 07-09-12 www.nxp.com © 2008 NXP B.V. All rights reserved NXP Semiconductors
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SOD-128
Abstract: sod128_fr SOD128 Market comparison NXP rectifiers and competitor rectifiers in equivalent FlatPower , rectifiers are housed in new SOD123W and SOD128. They offer high power ratings similar to standard SMA/SMB , NXP low VF (MEGA) Schottky rectifiers in SOD123W and SOD128 FlatPower Schottky rectifiersâ , } SOD128 : 3.8 x 2.5 x 1.0 mm Key applications } Power management circuits, especially DC/DC converters , rectifiers, single SOD128 SOD123W Size (mm) 3.8 x 2.5 x 1.0 2.6 x 1.7 x 1.0 P tot (mW NXP Semiconductors
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AEC-Q101 B340LB SL23/SS2
Abstract: ) 1.4 (2 ) SOD128 sod128_fr SOD128 Market comparison NXP 400-W TVS diodes in SOD123W , NXP TVS diodes and low VF (MEGA) Schottky rectifier in SOD123W and SOD128 FlatPower packages , absorbing high transient currents Body dimensions } SOD123W: 2.6 x 1.7 x 1.0 mm } SOD128: 3.8 x 2.5 x 1.0 mm Medium-power Schottky rectifiers, single SOD128 SOD123W Size (mm) 3.8 x 2.5 x 1.0 , diode PMEG4010EP PTVS10VS1UR 1 A / 40 V, SOD128 MEGA Schottky rectifier 400 W / 10 V NXP Semiconductors
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PMEG2010ER SOD123W tvs diode sma sod123 PTVSxS1UR TVS 400 PMEG2010BER PMEG3010EP PMEG3010ER PMEG3010BEP PMEG3010BER
Abstract: 1.2 (2×) 1.4 (2×) 07-09-12 Dimensions in mm sod128_fr Largest package: FlatPower SOD128 FlatPower SOD128* compared with standard SMA package -50% www.nxp.com *â'‰ inside , offer high current in small packages (500 mA in leadless SOD882; up to 5 A in FlatPower SOD128 , PMEG4050EP 5 A, 40 V in FlatPower SOD128 Have a look at NXPâ'™s complete low VF (MEGA) Schottky NXP Semiconductors
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Abstract: maximum peak of 260º C • Very low leakage current SOD128 MECHANICAL DATA • Case: SOD128. , Package Outline Dimensions: (mm) SOD128 1.9 1.5 0.05 0 4.9 4.5 8º 1.3 0.9 0.25 0.1 Fagor
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FSSH16Z 2011/65/EU 2002/96/EC J-STD-020 MIL-STD-750 J-STD-002
Abstract: paste occupied area Dimensions in mm 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , PMEG4010EP Description Version - plastic surface-mounted package; 2 leads SOD128 4. Marking , 2 1.9 1.6 Dimensions in mm 0.22 0.10 07-09-12 Fig 14. Package outline SOD128 , Package Description Packing quantity 3000 PMEG4010EP [1] SOD128 4 mm pitch, 12 mm tape NXP Semiconductors
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PMEG4010
Abstract: Dimensions in mm 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only recommended soldering , , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , 07-09-12 Fig 14. Package outline SOD128 PMEG3020CEP_1 Product data sheet © NXP B.V. 2009. All , Description Packing quantity 3000 PMEG3020CEP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 NXP Semiconductors
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Abstract: (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig 15. Reflow , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , Description Version - plastic surface-mounted package; 2 leads SOD128 4. Marking Table 4 , . Package outline SOD128 PMEG6010EP_1 Product data sheet All information provided in this document , PMEG6010EP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 For further information and the NXP Semiconductors
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Abstract: (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig 15. Reflow , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features Ì Ì , - plastic surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes , 4.0 3.6 2 1.9 1.6 Dimensions in mm 0.22 0.10 07-09-12 Fig 14. Package outline SOD128 , ordering code.[1] Type number Package Description Packing quantity PMEG3030EP SOD128 4 NXP Semiconductors
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Abstract: mm 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig , , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , Simplified outline Graphic symbol 2 SOD128 [1] The marking bar indicates the cathode. 3. Ordering , package; 2 leads Version SOD128 Type number 4. Marking Table 4. Marking codes Marking code C2 Type , Dimensions in mm 0.22 0.10 07-09-12 Fig 14. Package outline SOD128 PMEG4020ETP All information NXP Semiconductors
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Abstract: Schottky rectifier in SOD128. As a rule of thumb the junction temperature will decrease by 5 % to 10 % , Rev Date Description 2 20130408 Added Table 3 â'Schottky rectifiers in SOD128 for LPA , rectifier in NXP Semiconductors FlatPower SOD128 package, with focus on most important parameter for , PCB, via conduction through the leads and heat sinks. 4. Schottky rectifier in FlatPower SOD128 package for 5.0 W - 7.5 W LPA NXP Semiconductors MEGA Schottky rectifiers in FlatPower SOD128 package are NXP Semiconductors
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AN11310 PMEG4050ETP
Abstract: ×) 1.2 (2×) 1.4 (2×) sod128_fr Fig. 19. Reflow soldering footprint for SOD128 PMEG6030ETP All , , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , cathode[1] anode Simplified outline 1 2 Graphic symbol 1 2 sym001 SOD128 [1] The marking bar , SOD128 Description plastic surface-mounted package; 2 leads Version SOD128 Type number 4. Marking , Dimensions in mm 0.22 0.10 07-09-12 Fig. 18. Package outline SOD128 10. Soldering 6.2 4.4 4.2 NXP Semiconductors
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Abstract: 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , outline SOD128 PMEG4010EP_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 , 3000 PMEG4010EP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 For further information NXP Semiconductors
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Abstract: 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , outline SOD128 PMEG3020BEP_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 , 3000 PMEG3020BEP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 For further NXP Semiconductors
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Abstract: (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig 15. Reflow , , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features Ì , - plastic surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes , 4.0 3.6 2 1.9 1.6 Dimensions in mm 0.22 0.10 07-09-12 Fig 14. Package outline SOD128 , ordering code.[1] Type number Package Description Packing quantity PMEG3050EP SOD128 4 NXP Semiconductors
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Abstract: ×) sod128_fr Reflow soldering is the only recommended soldering method. Fig 15. Reflow soldering , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , outline SOD128 PMEG4020EP_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 , PMEG4020EP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 For further information and the NXP Semiconductors
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Abstract: ×) 3.4 2.5 solder paste occupied area Dimensions in mm 1.2 (2×) 1.4 (2×) sod128_fr , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , outline SOD128 PMEG6020EP_1 Product data sheet All information provided in this document is , .[1] Type number Package Description Packing quantity 3000 PMEG6020EP [1] SOD128 NXP Semiconductors
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Abstract: occupied area Dimensions in mm 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only , (TVS) in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package, designed for , surface-mounted package; 2 leads SOD128 The series consists of 35 types with reverse standoff voltages from , 07-09-12 Package outline SOD128 All information provided in this document is subject to legal , ] Package Description Packing quantity 3000 PTVSxP1UP series SOD128 4 mm pitch, 12 mm tape and NXP Semiconductors
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Abstract: 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig , a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , outline SOD128 PMEG3010EP_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 , 3000 PMEG3010EP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 For further information NXP Semiconductors
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Abstract: 3.4 2.5 1.9 2.1 (2×) (2×) solder paste occupied area Dimensions in mm 1.2 (2×) 1.4 (2×) sod128_fr , Transient Voltage Suppressor (TVS) in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic , surface-mounted package; 2 leads Version SOD128 - The series consists of 35 types with reverse standoff , Fig 6. Package outline SOD128 PTVSXP1UTP_SER All information provided in this document is , ] Package SOD128 Description 4 mm pitch, 12 mm tape and reel Packing quantity 3000 -115 For further NXP Semiconductors
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marking SMD CODES 2670
Abstract: , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , Simplified outline Graphic symbol 2 SOD128 [1] The marking bar indicates the cathode. 3. Ordering , package; 2 leads Version SOD128 Type number 4. Marking Table 4. Marking codes Marking code C1 Type , Dimensions in mm 0.22 0.10 07-09-12 Fig 14. Package outline SOD128 PMEG4010ETP All information , Package SOD128 Description 4 mm pitch, 12 mm tape and reel Packing quantity 3000 PMEG4010ETP [1] The NXP Semiconductors
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Abstract: , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , sym001 SOD128 [1] The marking bar indicates the cathode. 3. Ordering information Table 3 , plastic surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number , 1.9 1.6 0.22 0.10 Dimensions in mm 07-09-12 Fig 14. Package outline SOD128 10 , SOD128 4 mm pitch, 12 mm tape and reel -115 3000 [1] For further information and the NXP Semiconductors
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Abstract: , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , SOD128 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , 2 1.9 1.6 0.22 0.10 Dimensions in mm 07-09-12 Fig 14. Package outline SOD128 , number Package Description Packing quantity 3000 PMEG4020ETP [1] SOD128 4 mm pitch NXP Semiconductors
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Abstract: , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , Simplified outline Graphic symbol 2 SOD128 [1] The marking bar indicates the cathode. 3. Ordering , package; 2 leads Version SOD128 Type number 4. Marking Table 4. Marking codes Marking code C3 Type , 5.0 4.4 4.0 3.6 2 1.9 1.6 Dimensions in mm 0.22 0.10 07-09-12 Fig 14. Package outline SOD128 10. Packing information Table 8. Ordering information Package SOD128 Description 4 mm pitch, 12 mm NXP Semiconductors
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marking code C3 PMEG4030ETP
Abstract: , encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and , SOD128 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering , surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code , SOD128 PMEG4010ETP Product data sheet All information provided in this document is subject to , ] SOD128 4 mm pitch, 12 mm tape and reel -115 For further information and the availability of NXP Semiconductors
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