SNJ54154J - Datasheet Archive

 

Informational Notification of SFAB Platinum Thickness Change for TTL Products October 14, 1996 Abstract TTL products built in the

 

TEXAS INSTRUMENTS Informational Notification of SFAB Platinum Thickness Change for TTL Products October 14, 1996 Abstract TTL products built in the Sherman Wafer Fabrication site (SFAB) will be built using a thicker Platinum metal film. The film thickness is being increased from 250 angstroms to 850 angstroms on TTL products. The increase in thickness improves the technologies cold temperature performance and allows for Wafer Fab standardization of the metal process for both Consumer and Military products. Analysis Devices characterization of the thicker metal showed increased ability to withstand cold temperatures. All other databook parameters remained well within databook specification. Reliability test data (see table 1) showed excellent results with zero failures. While the change is primarily for Military product, performance all customers will benefit from the improved product performance. Table 1: Reliability Test Data - SNJ54154J SNJ54154J Tested Device TEST METHODS TEST CONDITION SAMPLE SIZE #REJ. OPLIFE Endpoints Elec. 1005 A/D 45 0 Conversion Schedule Sherman Wafer Fabrication conversion has begun. You may begin receiving this product in October 1996. Contact If you should have questions or wish additional information, please contact your local Field Sales Office or the contacts listed below. Contact Rin Key Guenter Gutwein Scott Jen Toshihide Takeda PCN # 5275 Location USA Europe Asia Pacific Japan Organization ASL QRA MSLP Customer Engineering AP Customer Satisfaction ASL Engineering Telephone (903) 868-5804 (+49) 8161 80 4253 886-2-9462691 9786-3-6114 Advanced System Logic E-Mail rkey@msg.ti.com ggut@msg.ti.com tiaq@msg.ti.com epu@msg.ti.com 1