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Part : SN96,5/AG3/CU0,5WS/0,78MM Supplier : Amtech Manufacturer : TME Electronic Components Stock : 21 Best Price : $72.45 Price Each : $80.33
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SN96,5/AG3/CU0,5WS/0,78MM

Catalog Datasheet MFG & Type PDF Document Tags

U8439-1

Abstract: AUS703 Assembly Materials Underfill: Namics U8439-1 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 , -8 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63/Pb37 (Standard) Substrate , Substrate: Solder Balls: Sn96.5/Ag3.0/Cu0.5 Die Bump: 95Pb5Sn Underfill: NAU-8 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63/Pb37 (Standard) Substrate , -7772-4_2 DCL-5 Heat Spreader Adhesive: Heat Spreader Adhesive: Ablestik I/AMC723_1.5 DCL-5 Die
Integrated Device Technology
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AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 A1006-03 FCBGA-1156 FCBGA-900 JESD22-A118 JESD22-A104 JESD22-A103

SN95PB5

Abstract: /Pb37 100R 103R 105R Sn95.5/Ag3.8/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn63/Pb37 , 4448R 4470R 4494R 4501R Sn95.5/Ag3.8/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn99.3/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn99.3/Cu0.7 Sn95.5/Ag3.8/Cu0.7 Sn95.5/Ag3
API Delevan
Original
SN95PB5 S1008 1008HF S1210 P1330 P1812 S1812
Abstract: . Solderability JIS-C5202-6.11 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 Robustness , ) c 1.2~1.8 RL 11. Recommend IR ­ Reflow profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 , dwell. Changed to 245 5 solder, 2 0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 ± ± , Power Rating F Tolerance TN Packaging R100 Nominal Resistance 12-1206(3216) 1/2W ±5% G , 0.55 ±0.10 5.Ratings & Characteristics : Characteristics Power Ratings (W) Resistance Value (m TA-I Technology
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TRL-120S004B
Abstract: solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 Robustness of Termination (Bending Strength , 11. Recommend IR ­ Reflow profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 ) Peak : 250 +5 , solder, 2 ± 0.5 sec dwell. Changed to 245 5 solder, 2 0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 , -±2% F-±1% J- 5% TN-Lead Free &Paper Tape 4 Digits e.g., (E24) R020=20m TA-I TECHNOLOGY CO , ±0.20 t 0.50 ±0.10 5.Ratings & Characteristics : Characteristics Power Ratings (W) Resistance TA-I Technology
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TRL-12OS011B
Abstract: JIS-C5202-6.11 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 At least 95% of surface , profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 ) Peak : 250 Pre ­ heat Zone : 150 to 180 , , 2 0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 ± ± Resistance to Dry Heat Test Limits , - ±5% G- ±2% F- ±1% E : Embossed Tape +N : Lead-Free 4 Digits e.g.,: (E24) R100=0.1 (E96 , 0.55±0.10 5.Ratings & Characteristics : Characteristics Power Ratings (W) Resistance Value (m) T.C.R TA-I Technology
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TRL-200S005C
Abstract: : Sn96.5 / Ag3.0 / Cu0.5 Robustness of Termination (Bending Strength) JIS - C5202 - 6.1 3mm , / Ag3 / Cu0.5 ) Peak : 250 +5 -0 , 5 sec Pre ­ heat Zone : 150 to 180 , 90±30 sec Soldering , ± 5 solder, 2 ± 0.5 sec dwell. Changed to 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3 , - ±5% G- ±2% F- ±1% TN-Lead Free &Paper Tape 4 Digits e.g., (E24) R100=0.1 TA-I TECHNOLOGY CO , 0.50 ±0.10 5.Ratings & Characteristics : Characteristics Power Ratings (W) Resistance Value (m TA-I Technology
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TRL-100S003C
Abstract: . Solderability JIS-C5202-6.11 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 Robustness , (2512 ) 7.6~8.6 11. Recommend IR ­ Reflow profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 , ) Reliability Tests: 245 5 solder, 2 0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 Owner ± ± , Power Rating F Tolerance EN Packaging R100 Nominal Resistance 25-2512(6432) , 1W ±5% G , ±0.25 t 0.55 ±0.10 5.Ratings & Characteristics : Characteristics Power Ratings (W) Resistance TA-I Technology
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TRL-250S006B
Abstract: . Solder : Sn96.5/Ag3/Cu0.5 2.0 X rated voltage, 2s DC : 3000 V Max , AC (RMS) : 2122V Max Test Substrate , Reflow profile : (solder : Sn96.5 / Ag3 / Cu0.5) Peak : 250 +5 -0 , 5 sec Pre ­ heat Zone , ± 5 solder, 2 ± 0.5 sec dwell. Changed to 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3 , (5025), 1/2W J- ±5% TE-Lead Free & Emboss Tape e.g., 106=10M 5% TA-I TECHNOLOGY CO , -200S003C 2/10 UNIT: mm Type RH20 L 5.00 ±0.20 W 2.50 ±0.20 C 0.40 ±0.25 d 0.50 ±0.25 t 0.55 ±0.10 5 TA-I Technology
Original
TRH-200S003C

KEG1250LKDS

Abstract: aus303 : GE100LFCS KE-G1250LKDS Substrate: HL832NX/ AUS303 HL832NX/ AUS303 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (Green) Solder Balls: Sn96.5/Ag3.0/Cu0.5 (Green) Page 2 of 4 Integrated Device Technology, Inc
Integrated Device Technology
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FPBGA-484 KEG1250LKDS G1250LKDS KE-G1250 GE-100-LFC HL832NX a1008 A1008-06 82P20516DBFG 82P20516DBFG8 JESD22-A110 JESD22-A113
Abstract: , 2±0.5 sec dwell. JIS-C5201-4.17 Solder : Sn96.5 / Ag3.0 / Cu0.5 Robustness of Termination (Bending , profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 ) Peak : 250 5 , 5 sec 0 Pre ­ heat Zone , solder, 2 0.5 sec dwell. Changed to 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 , Nominal Resistance 12-1206(3216) 1/2W J-±5% G-±2% F-±1% TN-Lead Free &Paper Tape 4 Digits e.g , Type RL12 L 3.10 ±0.20 W 1.55 ±0.10 C 0.90 ±0.30 d 0.50 ±0.20 t 0.50 ±0.10 5 TA-I Technology
Original
TRL-12OS011D JIS-5202 IEC60115 JIS-C5201

TA-I RESISTOR

Abstract: ) Solderability JIS-C5202-6.11 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 At least 95 , -20OS012B 8/10 11. Recommend IR ­ Reflow profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 ) Peak , 245 5 solder, 2 0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 ± ± Vincent Limits : ± , ) 3/4W J- 5% ± G-±2% F-±1% EN-Lead Free & Embossed Tape N-Lead Free 4 Digits e.g.,: (E24 , ±0.20 C 1.70 ±0.30 d 0.50 ±0.25 t 0.55 ±0.10 5. Electrical characteristics : Characteristics Power
TA-I Technology
Original
TA-I RESISTOR TRL-20OS012B

HL832nxa

Abstract: VPP1552BFG KE1250LKDS Substrate: HL832-NX/AUS 308 HL832NXA (EX) HL832NXA (EX) Solder Balls: Sn96.5/Ag3.0/Cu0.5 Page 2 of 3 Sn96.5/Ag3.0/C Sn96.5/Ag3.0/Cu0 u0.5 .5 Integrated Device Technology
Integrated Device Technology
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A1004-04 FPBGA-324 VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX HL832-NX-A HL832 VPP1552BFG8 LBGA-167

X23-7772-4

Abstract: U8439-1 Balls: Sn96.5/Ag3.0/Cu0.5 Sn96.5/Ag3.0/Cu0.5 Page 2 of 4 Integrated Device Technology, Inc. 6024 , -7772-4_2 Adhesive: Ablestik I/AMC723_1.5 DCL-5 DCL-5 Die bump: 95Pb5Sn 95Pb5Sn Underfill: Namics U8439
Integrated Device Technology
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A0904-03 X23-7772-4 X23-7772 namics U8439-1 X2377 underfill namics FCBGA-324 E679FGBR/ABF-GX3/AUS703 P08-11-05 80KSW0001AR
Abstract: alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat Lead free, RoHS (Sn96.5/Ag3.0/Cu0.5) , 12mil diameter, BGA termination (Gnd-Signal-Gnd) ï'·ï'  ï'·ï'  ï'·ï'  Tightly , ±0.002 inches Solder Volume per Pad ~865 cu. mils Recommended Reflow Limits (Sn96.5/Ag3.0/Cu0.5, RoHS , Transmission line structure 50 ± 5% DC to 10GHz < 1dB insertion loss Return Loss DC to 5GHz Thin Film Technology
Original
XO02M610 XOB1208F100S

GE100LFCS

Abstract: HL832nxa Substrate: Aus308 HL832-NX-A Solder Balls: Sn96.5/Ag3.0/Cu0.5 (Green) Solder Balls: Sn96.5/Ag3.0/Cu0.5
Integrated Device Technology
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BFG81 Ablestik 2000 aus308 AUS-308 HL832 nx-a SPIL mold compound A1008-05 82V2082BFG 82V2082BFG8 CABGA-81 FPBGA-289

fortune year date Code

Abstract: , 2±0.5 sec dwell. JIS-C5201-4.17 Solder : Sn96.5 / Ag3.0 / Cu0.5 At least 95% of surface area of , (2512 ) 5.7~6.5 7.6~8.6 11. Recommend IR ­ Reflow profile : ( Lead-Free solder : Sn96.5 / Ag3 , solder, 2 0.5 sec dwell. Changed to 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 7 , 20-2010(5025) 25-2512(6432) 3/4W 1W J-±5% G-±2% F-±1% EN-Lead Free & Embossed Tape N-Lead Free , 0.50 ±0.25 0.50 ±0.25 t 0.55 ±0.10 0.55 ±0.10 5. Electrical characteristics : Characteristics RL20
TA-I Technology
Original
fortune year date Code TRL-XX0S008B

jis-c5201

Abstract: / Ag3.0 / Cu0.5 At least 95% of surface area of electrode shall be covered with new solder , . Recommend IR ­ Reflow profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 ) Peak : 250 5 , 5 sec 0 , solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3.0 / Cu0.5 7. 8.2 Reel Specifications: Jul.12.2006 A B , 20-2010(5025) 25-2512(6432) 3/4W 1W J-±5% G-±2% F-±1% EN-Lead Free & Embossed Tape N-Lead Free , 0.50 ±0.25 0.50 ±0.25 t 0.55 ±0.10 0.55 ±0.10 5. Electrical characteristics : Characteristics RL20
TA-I Technology
Original
TRL-XX0S008D
Abstract: alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat Lead free, RoHS (Sn96.5/Ag3.0/Cu0.5) , 12mil diameter, BGA termination (Gnd-Signal-Gnd) ï'·ï'  ï'·ï'  Tightly controlled 50 , Reflow Limits (Sn96.5/Ag3.0/Cu0.5, RoHS compliant / Lead Free solder finish) Max. Temperature Max , Transmission line structure 50 ± 5% DC to 10GHz < 1dB insertion loss 10 to 20GHz < 2dB insertion loss Return Loss DC to 5GHz Thin Film Technology
Original
B1208F200S

RM12FTN

Abstract: RM12FTN3003 sec dwell. Solder : Sn96.5/Ag3/Cu0.5 At least 95% of surface area of electrode shall be covered , 1.2~1.8 RH 12 (1206 ) 4.4~5.0 11. Recommend IR ­ Reflow profile : (solder : Sn96.5 / Ag3 , / Ag3.0 / Cu0.5 4. 8.2 Reel Specifications: A 180+0 / -3.0 changed 178 ±2.0 B 60 min changed 60.0±1.0 T , Nominal Resistance 12-1206(3216) 1/4W J- ±5% G- ±2% F- ±1% TN-Lead Free & Paper Tape e.g., 4993=499k , 1% 106=10M2% ,5% TA-I TECHNOLOGY CO., LTD Thick Film High Voltage Chip Resistors(for
TA-I Technology
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RM12FTN RM12FTN3003 RH12FTN TAI 40 TRH-120S002D

105A702723

Abstract: solder. Solderability JIS-C5202 - 6.11 245±5 solder, 2±0.5 sec dwell. Solder : Sn96.5 / Ag3 , ­ Reflow profile : ( Lead-Free solder : Sn96.5 / Ag3 / Cu0.5 ) Peak : 250 Pre ­ heat Zone , . Solder : Sn96.5 / Ag3.0 / Cu0.5 Resistance to Dry Heat Test Limits : ± 3%+0.005 changed 1%: ± , - ±5% G- ±2% F- ±1% TN-Lead Free &Paper Tape 3 Digits e.g., (E24) 010=0.1 TA-I TECHNOLOGY CO , 0.45 ±0.10 5.Ratings & Characteristics : Characteristics Power Ratings (W) Resistance Value (m
TA-I Technology
Original
105A702723 TRL-060S002B 1/10W
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