SN74LS670 SN74LS670DR2 SN74LS670D SN74LS670N SN74LS670/D - Datasheet Archive

 

4 x 4 Register File with 3-State Outputs The TTL/MSI SN74LS670 is a high-speed, low-power 4 x 4 Register File organized as four

 

SN74LS670 SN74LS670 4 x 4 Register File with 3-State Outputs The TTL/MSI SN74LS670 SN74LS670 is a high-speed, low-power 4 x 4 Register File organized as four words by four bits. Separate read and write inputs, both address and enable, allow simultaneous read and write operation. The 3-state outputs make it possible to connect up to 128 outputs to increase the word capacity up to 512 words. Any number of these devices can be operated in parallel to generate an n-bit length. · · · · · http://onsemi.com LOW POWER SCHOTTKY Simultaneous Read/Write Operation Expandable to 512 Words by n-Bits Typical Access Time to 20 ns 3-State Outputs for Expansion Typical Power Dissipation of 125 mW GUARANTEED OPERATING RANGES Symbol VCC Parameter Supply Voltage Min Typ Max 4.75 5.0 5.25 V 0 25 70 16 Unit °C TA Operating Ambient Temperature Range IOH Output Current ­ High ­2.6 Output Current ­ Low 24 PLASTIC N SUFFIX CASE 648 mA IOL 1 mA 16 1 SOIC D SUFFIX CASE 751B ORDERING INFORMATION Device 2000 Units/Box SOIC­16 38 Units/Rail SN74LS670DR2 SN74LS670DR2 1 16 Pin DIP SN74LS670D SN74LS670D October, 2001 ­ Rev. 7 Shipping SN74LS670N SN74LS670N © Semiconductor Components Industries, LLC, 2001 Package SOIC­16 2500/Tape & Reel Publication Order Number: SN74LS670/D SN74LS670/D SN74LS670 SN74LS670 CONNECTION DIAGRAM DIP (TOP VIEW) D1 15 VCC 16 WA 14 WB 13 EW 12 ER 11 Q1 10 Q2 9 NOTE: The Flatpak version has the same pinouts (Connection Diagram) as the Dual InLine Package. 1 D2 2 D3 3 D4 4 RB 5 RA 6 Q4 7 Q3 8 GND LOADING (Note a) HIGH D1 - D4 WA, WB EW RA, RB ER Q1 - Q4 Data Inputs Write Address Inputs Write Enable (Active LOW) Input Read Address Inputs Read Enable (Active LOW) Input Outputs NOTES: a) 1 TTL Unit Load (U.L.) = 40 mA HIGH/1.6 mA LOW. LOGIC SYMBOL 12 14 13 5 4 15 1 2 3 WA EW D1 D2 D3 D4 WB RA RB ER Q1 Q2 Q3 Q4 11 10 9 7 6 VCC = PIN 16 GND = PIN 8 http://onsemi.com 2 LOW 0.5 U.L. 0.5 U.L. 1.0 U.L. 0.5 U.L. 1.5 U.L. 65 U.L. PIN NAMES 0.25 U.L. 0.25 U.L. 0.5 U.L. 0.25 U.L. 0.75 U.L. 15 U.L. SN74LS670 SN74LS670 LOGIC DIAGRAM D4 EW WB WA D3 3 12 D2 2 D1 1 15 13 14 G D G Q G D G Q G D G Q D G Q D G Q D G Q Q D G Q D G Q D WORD 0 WORD 1 D Q D G Q D WORD 2 Q WORD 3 G D G Q RB D G Q D G Q D Q 4 11 ER RA 5 6 7 Q4 Q3 VCC = PIN 16 GND = PIN 8 = PIN NUMBERS http://onsemi.com 3 9 Q2 10 Q1 SN74LS670 SN74LS670 DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified) Limits Symbol Parameter VIH Input HIGH Voltage VIL Input Clamp Diode Voltage VOH Output HIGH Voltage VOL Max Unit Guaranteed Input HIGH Voltage for All Inputs V Guaranteed Input LOW Voltage for All Inputs V VCC = MIN, IIN = ­18 mA V 2.0 0.8 ­0.65 2.4 Test Conditions V VCC = MIN, IOH = MAX, VIN = VIH or VIL per Truth Table Output LOW Voltage IOZH Typ Input LOW Voltage VIK Min ­1.5 3.1 VCC = VCC MIN, VIN = VIL or VIH per Truth Table 0.25 0.4 V IOL = 12 mA 0.35 0.5 V IOL = 24 mA Output Off Current HIGH 20 µA VCC = MAX, VO = 2.7 V IOZL Output Off Current LOW ­20 µA VCC = MAX, VO = 0.4 V 20 40 60 µA VCC = MAX, VIN = 2.7 V IIH Input HIGH Current D, R, W EW ER mA VCC = MAX, VIN = 7.0 V mA VCC = MAX, VIN = 0.4 V mA VCC = MAX D, R, W EW ER IIL Input LOW Current D, R, W EW ER IOS Short Circuit Current (Note 1) 0.1 0.2 0.3 ­0.4 ­0.8 ­1.2 ­30 ­130 ICC Power Supply Current 50 mA VCC = MAX Note 1: Not more than one output should be shorted at a time, nor for more than 1 second. http://onsemi.com 4 SN74LS670 SN74LS670 AC CHARACTERISTICS (TA = 25°C) Limits Typ Max Unit tPLH tPHL Propagation Delay, RA or RB to Output 23 25 40 45 ns tPLH tPHL Propagation Delay, EW to Output 26 28 45 50 ns tPLH tPHL Propagation Delay, Data to Output 25 23 45 40 ns tPZH tPZL Output Enable Time 15 22 35 40 ns tPLZ tPHZ Output Disable Time 16 30 35 50 ns CL = 5.0 pF Max Unit Test Conditions Symbol Min Parameter Test Conditions VCC = 5.0 V, CL = 45 pF AC SETUP REQUIREMENTS (TA = 25°C) Limits Symbol Min Parameter Typ tW Pulse Width 25 ns ts Setup Time, (D) 10 ns ts Setup Time, (W) 15 ns th Hold Time, (D) 15 ns th Hold Time, (W) 5.0 ns trec Recovery Time 25 ns VCC = 5 0 V 5.0 AC WAVEFORMS D, EW 1.3 V 1.3 V tPHL RA, RB 1.3 V tPHL tPLH 1.3 V 1.3 V Q 1.3 V tPLH 1.3 V Q Figure 2. Figure 1. WA, WB 1.3 V 1.3 V ts th 1.3 V 1.3 V D tW EW 1.3 V ts th 1.3 V Figure 3. http://onsemi.com 5 1.3 V SN74LS670 SN74LS670 PACKAGE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 648­08 ISSUE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. ­A­ 16 9 1 8 B F C L S ­T­ SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 6 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SN74LS670 SN74LS670 PACKAGE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751B­05 ISSUE J ­A­ 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. ­B­ P 8 PL 0.25 (0.010) M B S G R K F X 45 _ C ­T­ SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 7 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 SN74LS670 SN74LS670 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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