SN74HCU7204 SCLS700 SN74HCU7204PS SN74HCU7204PW SN74HCU7204PWR HU7204 - Datasheet Archive

 

DUAL INVERTERS www.ti.com SCLS700 ­ MAY 2006 FEATURES · · · · · · · Wide

 

SN74HCU7204 SN74HCU7204 DUAL INVERTERS www.ti.com SCLS700 SCLS700 ­ MAY 2006 FEATURES · · · · · · · Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive up to 10 LSTTL Loads Low Power Consumption, 20-µA Max ICC Typical tpd = 7 ns ±4-mA Output Drive at 5 V Low Input Current of 1 µA Max Unbuffered Outputs PS OR PW PACKAGE (TOP VIEW) NC 1 8 VCC 1A 2 7 2A 1Y 3 6 2Y GND 4 5 NC DESCRIPTION/ORDERING INFORMATION The SN74HCU7204 SN74HCU7204 contains two independent unbuffered inverters. The device performs the Boolean function Y = A in positive logic. ORDERING INFORMATION PACKAGE (1) TA SOP ­ PS ORDERABLE PART NUMBER SN74HCU7204PS SN74HCU7204PS (1) SN74HCU7204PW SN74HCU7204PW Reel of 2000 SN74HCU7204PWR SN74HCU7204PWR Reel of 250 TSSOP ­ PW HU7204 HU7204 SN74HCU7204PSR SN74HCU7204PSR Tube of 90 ­40°C to 85°C Reel of 2000 TOP-SIDE MARKING SN74HCU7204PWT SN74HCU7204PWT HU7204 HU7204 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (EACH INVERTER) INPUT A OUTPUT Y H L L H LOGIC DIAGRAM (POSITIVE LOGIC) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated SN74HCU7204 SN74HCU7204 DUAL INVERTERS www.ti.com SCLS700 SCLS700 ­ MAY 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX ­0.5 7 UNIT VCC Supply voltage range IIK Input clamp current (2) VI < 0 or VI > VCC ±20 mA IOK Output clamp current (2) VO < 0 or VO > VCC ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA Continuous current through VCC or GND JA Tstg PS package TBD PW package Package thermal impedance (3) TBD Storage temperature range (1) (2) (3) ­65 V °C/W °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MIN NOM MAX VCC Supply voltage VIH High-level input voltage 2 VCC = 2 V 3.6 VCC = 6 V V VI 0.8 1.1 Input voltage VO 0.3 VCC = 4.5 V VCC = 6 V Low-level input voltage Output voltage IOH High-level output current IOL Low-level output current 0 V VCC 0 VCC = 4.5 V V ­4 VCC = 6 V mA ­5.2 VCC = 4.5 V 4 VCC = 6 V mA 5.2 TA (1) 2 0 1000 VCC = 4.5 V 0 500 VCC = 6 V Transition time V VCC VCC = 2 V tt V 4.8 VCC = 2 V VIL UNIT 6 1.7 VCC = 4.5 V 5 0 400 ­40 85 Operating free-air temperature All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004 SCBA004. Submit Documentation Feedback ns °C SN74HCU7204 SN74HCU7204 DUAL INVERTERS www.ti.com SCLS700 SCLS700 ­ MAY 2006 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25°C VCC MIN 2V IOH = ­20 µA VOH MIN TYP MAX 1.8 4.5 V 4 5.5 3.86 3.76 6V IOH = ­5.2 mA 4 5.5 4.5 V IOH = ­4 mA 5.36 V 5.26 2V 0.2 0.2 IOL = 20 µA 4.5 V 0.5 0.5 6V 0.5 0.5 IOL = 4 mA VOL 4.5 V 0.32 0.37 VI = VCC or GND IOL = 5.2 mA II V IO = 0 0.32 0.37 6V VI = VCC or 0, 6V VI = VCC or 0 ICC UNIT 1.8 6V VI = VCC or GND MAX ±100 ±1000 nA 2 20 µA 10 10 pF 6V Ci 2 V to 6 V 3 Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25°C PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 40 80 100 tpd A Y 4.5 V 8 16 20 6V 7 14 17 2V 38 75 95 4.5 V 8 15 19 6V 6 13 16 tr/tf Y MIN TYP MAX MIN MAX UNIT ns ns Operating Characteristics TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per inverter No load Submit Documentation Feedback TYP 20 UNIT pF 3 SN74HCU7204 SN74HCU7204 DUAL INVERTERS www.ti.com SCLS700 SCLS700 ­ MAY 2006 PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Input CL = 50 pF (see Note A) VCC 50% 50% 0V tPLH In-Phase Output LOAD CIRCUIT tPHL 90% 50% 10% 90% tr tPHL Input 50% 10% 90% 90% tr VCC 50% 10% 0 V Out-of-Phase Output 90% tPLH 50% 10% tf tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 50% 10% VOL tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time, with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HCU7204PW SN74HCU7204PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWE4 SN74HCU7204PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWG4 SN74HCU7204PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWR SN74HCU7204PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWRE4 SN74HCU7204PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWRG4 SN74HCU7204PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWT SN74HCU7204PWT ACTIVE TSSOP PW 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWTE4 SN74HCU7204PWTE4 ACTIVE TSSOP PW 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCU7204PWTG4 SN74HCU7204PWTG4 ACTIVE TSSOP PW 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74HCU7204PWR SN74HCU7204PWR Package Package Pins Type Drawing TSSOP PW 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 7.0 3.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCU7204PWR SN74HCU7204PWR TSSOP PW 8 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C MTSS001C ­ JANUARY 1995 ­ REVISED FEBRUARY 1999 PW (R-PDSO-G*) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°­ 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS * 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 MO-153 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. 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