SN74CBTLV3257 SCDS040I A114-A A115-A SN74CBTLV3257RGYR SN74CBTLV3257D - Datasheet Archive

 

LOWVOLTAGE 4BIT 1OF2 FET MULTIPLEXER/DEMULTIPLEXER SCDS040I - DECEMBER 1997 - REVISED OCTOBER 2003 D 5- Switch Connection Between

 

SN74CBTLV3257 SN74CBTLV3257 LOWVOLTAGE 4BIT 1OF2 FET MULTIPLEXER/DEMULTIPLEXER SCDS040I SCDS040I - DECEMBER 1997 - REVISED OCTOBER 2003 D 5- Switch Connection Between Two Ports D Rail-to-Rail Switching on Data I/O Ports D Ioff Supports Partial-Power-Down Mode - 2000-V Human-Body Model (A114-A A114-A) - 200-V Machine Model (A115-A A115-A) Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 S 1 1 VCC OE 4B1 4B2 4A 3B1 3B2 3A 1B1 1B2 1A 2B1 2B2 2A 16 15 OE 14 4B1 2 3 13 4B2 12 4A 4 5 11 3B1 10 3B2 6 7 8 9 GND S 1B1 1B2 1A 2B1 2B2 2A GND VCC RGY PACKAGE (TOP VIEW) D, DBQ, DGV, OR PW PACKAGE (TOP VIEW) 3A D D ESD Protection Exceeds JESD 22 description/ordering information The SN74CBTLV3257 SN74CBTLV3257 is a 4-bit 1-of-2 high-speed FET multiplexer/demultiplexer. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The select (S) input controls the data flow. The FET multiplexers/demultiplexers are disabled when the output-enable (OE) input is high. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE TA QFN - RGY TOP-SIDE MARKING Tape and reel SN74CBTLV3257RGYR SN74CBTLV3257RGYR Tube SN74CBTLV3257D SN74CBTLV3257D Tape and reel SN74CBTLV3257DR SN74CBTLV3257DR SSOP (QSOP) - DBQ Tape and reel SN74CBTLV3257DBQR SN74CBTLV3257DBQR CL257 CL257 TSSOP - PW Tape and reel SN74CBTLV3257PWR SN74CBTLV3257PWR CL257 CL257 SOIC - D -40°C to 85°C CL257 CL257 CBTLV3257 CBTLV3257 TVSOP - DGV Tape and reel SN74CBTLV3257DGVR SN74CBTLV3257DGVR CL257 CL257 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1 SN74CBTLV3257 SN74CBTLV3257 LOWVOLTAGE 4BIT 1OF2 FET MULTIPLEXER/DEMULTIPLEXER SCDS040I SCDS040I - DECEMBER 1997 - REVISED OCTOBER 2003 FUNCTION TABLE INPUTS OE FUNCTION S L L A port = B1 port L H A port = B2 port H X Disconnect logic diagram (positive logic) 2 4 1A 1B1 SW 3 1B2 SW 5 7 2A 2B1 SW 6 2B2 SW 3A 11 9 SW 3B1 10 3B2 SW 14 12 4A 4B1 SW 13 SW 1 S 15 OE 2 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 4B2 SN74CBTLV3257 SN74CBTLV3257 LOWVOLTAGE 4BIT 1OF2 FET MULTIPLEXER/DEMULTIPLEXER SCDS040I SCDS040I - DECEMBER 1997 - REVISED OCTOBER 2003 simplified schematic, each FET switch A B (OE) absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 4.6 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W (see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W (see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W (see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W (see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 3. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 4) MIN VCC VIH High-level control input voltage VIL Low-level control input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V MAX 2.3 Supply voltage 3.6 UNIT V 1.7 V 2 0.7 0.8 V TA Operating free-air temperature -40 85 °C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004 SCBA004. POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 3 SN74CBTLV3257 SN74CBTLV3257 LOWVOLTAGE 4BIT 1OF2 FET MULTIPLEXER/DEMULTIPLEXER SCDS040I SCDS040I - DECEMBER 1997 - REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP VCC = 3 V, VCC = 3.6 V, II = -18 mA VI = VCC or GND Ioff ICC VCC = 0, VCC = 3.6 V, VI or VO = 0 to 3.6 V IO = 0, VI = VCC or GND One input at 3 V, Other inputs at VCC or GND ICC Control inputs Ci Control inputs VCC = 3.6 V, VI = 3 V or 0 V ±1 µA µA 10 µA 300 µA 3 pF 10.5 VO = 3 V or 0, OE = VCC VCC = 2.3 V, TYP at VCC = 2.5 V B port UNIT 15 A port Cio(OFF) MAX -1.2 VIK II VI = 0 ron§ VI = 1.7 V, VI = 0 VCC = 3 V pF 5.5 II = 64 mA II = 24 mA 5 8 5 8 II = 15 mA II = 64 mA 27 40 5 7 II = 24 mA 5 7 VI = 2.4 V, II = 15 mA 10 15 All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND. § Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V FROM (INPUT) TO (OUTPUT) A or B¶ B or A S A or B 1.8 6.1 1.8 5.3 ten S A or B 1.7 6.1 1.7 5.3 ns tdis S A or B 1 4.8 1 4.5 ns ten OE A or B 1.9 5.6 2 5 ns tdis OE A or B 1 5.5 1.6 5.5 ns PARAMETER tpd MIN MAX MIN 0.15 UNIT MAX 0.25 ns ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). 4 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 SN74CBTLV3257 SN74CBTLV3257 LOWVOLTAGE 4BIT 1OF2 FET MULTIPLEXER/DEMULTIPLEXER SCDS040I SCDS040I - DECEMBER 1997 - REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC RL From Output Under Test S1 TEST GND CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open 2 × VCC GND RL CL LOAD CIRCUIT V 0.15 V 0.3 V RL 30 pF 50 pF VCC 2.5 V ± 0.2 V 3.3 V ± 0.3 V 500 500 VCC Timing Input VCC/2 0V tw tsu th VCC VCC/2 Input VCC/2 VCC VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL VOH Output VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 Output Waveform 2 S1 at GND (see Note B) VCC/2 0V t Output PZL Waveform 1 S1 at 2 × VCC (see Note B) tPLH tPHL VCC Output Control tPLZ VCC VCC/2 VOL + V VOL tPHZ tPZH VCC/2 VOH - V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2 ns, tf 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 8-Jun-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 74CBTLV3257DBQRE4 74CBTLV3257DBQRE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM 74CBTLV3257DGVRE4 74CBTLV3257DGVRE4 ACTIVE TVSOP DGV 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM 74CBTLV3257PWRE4 74CBTLV3257PWRE4 ACTIVE TSSOP PW 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM 74CBTLV3257PWRG4 74CBTLV3257PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3257D SN74CBTLV3257D ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3257DBQR SN74CBTLV3257DBQR ACTIVE SSOP/ QSOP DBQ 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3257DE4 SN74CBTLV3257DE4 ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3257DGVR SN74CBTLV3257DGVR ACTIVE TVSOP DGV 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CBTLV3257DR SN74CBTLV3257DR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3257DRE4 SN74CBTLV3257DRE4 ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74CBTLV3257PW SN74CBTLV3257PW ACTIVE TSSOP PW 16 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CBTLV3257PWG4 SN74CBTLV3257PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3257PWR SN74CBTLV3257PWR ACTIVE TSSOP PW 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CBTLV3257RGYR SN74CBTLV3257RGYR ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 8-Jun-2005 incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C MPDS006C ­ FEBRUARY 1996 ­ REVISED AUGUST 2000 DGV (R-PDSO-G*) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°­8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS * 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins ­ MO-153 MO-153 14/16/20/56 Pins ­ MO-194 MO-194 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C MTSS001C ­ JANUARY 1995 ­ REVISED FEBRUARY 1999 PW (R-PDSO-G*) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°­ 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS * 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 MO-153 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated