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LT1030CS#TR Linear Technology IC LINE DRIVER QUAD LP 14SOIC visit Linear Technology - Now Part of Analog Devices
LT1236BILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LT1236AILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2246HLX#PBF Linear Technology LTC2246H - 14-Bit, 25Msps 125°C ADC In LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2226HLX#PBF Linear Technology LTC2226H - 12-Bit, 25Msps 125°C ADC in LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C visit Linear Technology - Now Part of Analog Devices Buy
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SN63 PB37 PROFILES

Catalog Datasheet MFG & Type PDF Document Tags

Recommended Solder Reflow Profile for Caddock Surface Mount Resistors

Abstract: SN62 PB36 ag2 seconds, depending on the mass of assembly. 100°C Recommended Solders: Sn62/Pb36/Ag2 or Sn63/Pb37 , products are NOT recommended for common â'Lead-Freeâ' SMT reflow soldering profiles that have peak
Caddock Electronics
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wafer level package

Abstract: SN63 PB37 PROFILES flux than gold. The solder alloy should be the same as the solder bumps (Sn63 Pb37) and of type 3 or , uniform joint. A standard reflow profile for Sn63 Pb37 (Figure 9) consists of four zones: 1 , Time (sec) 180 240 300 Figure 9 Typical reflow profile for Sn63 Pb37 If a cleaning , be assembled using existing processes and standard reflow profiles. However, procedures and
International Rectifier
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MA4PH611

Abstract: Diode V1 Assembly Recommendations â'¢ Devices may be soldered using standard Sn63/Pb37 or any , be used to mount MELF packages to circuit boards. Alloys such as Sn63/Pb37 or any RoHS compliant , optimum connection. â'¢ For recommended Sn/Pb and RoHS soldering time/temperature profiles. See
M/A-COM
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Abstract: ) Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 230 200 183 150 , 2.4 Recommended Solder Reflow Profiles 245°C liquidus 221°C solidus solder alloy is used in the Mercury Electronics
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Abstract: . Temperature (°C) Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 , 3 Pad 4 MERCURY 2.4 Recommended Solder Reflow Profiles 240°C liquidus 235°C solidus Mercury Electronics
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Abstract: : -W = Nickel/solder coated (Sn63, Pb37) Packaging C o d e , TERMINATION: Nickel/Solder coated (Sn63, Pb37) compatible with auto­ matic soldering technologies: reflow , ® 9 Accu-L® SM D High-Q RF Inductor Recommended Soldering Profiles IR Reflow Wave Soldering -
OCR Scan

MADP-000504-10720T

Abstract: Diode V1 Assembly Recommendations â'¢ Devices may be soldered using standard Sn63/Pb37 or any , optimum connection. â'¢ For recommended Sn/Pb and RoHS soldering time/temperature profiles. See , soldering or reflow techniques may be used to mount MELF packages to circuit boards. Alloys such as Sn63/Pb37 or any RoHS compliant solder may be used. For more information visit the M/A-COM Tech website
M/A-COM
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73494

Abstract: NXR-1400 for tin-lead (Sn63/Pb37) solder paste Peak temperature: 215 °C Time above 183 °C: 54 seconds Soak , were selected. Varieties of reflow profiles used are ramp-to-spike (RTS), ramp-soakspike (RSS), and , parameters: reflow profile and stencil aperture (c) Experiment with three different reflow profiles and , reflow profile using a 5-mil stencil. PROCESS PARAMETERS: a. Reflow profiles: Selection criteria: 1 , time. Details of different profiles used in this experiment are shown in figures 1 through 3 for lead
Vishay Siliconix
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MADS-001317-1500

Abstract: Schottky diode Die flip chip . Solder Die Attach: This device can be mounted with Sn63/Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M/A-Com application note M538, " Surface Mounting Instructions" which can be
M/A-COM
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Abstract: and Sn63 Pb37 alloy. 250 230 200 183 150 Peak Temperature. Topside temperature of board to be , view. 0.01 uF decoupling capacitor is built-in. Recommended Solder Reflow Profiles 245°C liquidus Mercury Electronics
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Abstract: . Temperature (°C) Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 , Outputs Since 1973 Recommended Solder Reflow Profiles 245°C liquidus 221°C solidus solder alloy Mercury Electronics
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Abstract: be mounted with Sn63/Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M M/A-COM
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Abstract: temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 230 200 183 150 Peak , â'Fâ' Family PECL Outputs Since 1973 Recommended Solder Reflow Profiles 245°C liquidus 221 Mercury Electronics
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Crystal oscillator MEC 12 MHz

Abstract: mec oscillator . Temperature (°C) Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 , decoupling capacitor is built-in. Recommended Solder Reflow Profiles 245°C liquidus 221°C solidus solder
Mercury Electronics
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Abstract: ) Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 230 200 183 150 , Since 1973 Recommended Solder Reflow Profiles 245°C liquidus 221°C solidus solder alloy is used in Mercury Electronics
Original
Abstract: ) Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 230 200 183 150 , 1973 Recommended Solder Reflow Profiles 245°C liquidus 221°C solidus solder alloy is used in the Mercury Electronics
Original

Crystal oscillator MEC 12 MHz

Abstract: Crystal oscillator MEC 1 MHz temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 230 200 183 150 Peak , Solder Reflow Profiles 245°C liquidus 221°C solidus alloy solder is used in the assembly of VMW57P
Mercury Electronics
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Crystal oscillator MEC 12 MHz Crystal oscillator MEC 1 MHz Crystal oscillator MEC 10 MHz Crystal oscillator MEC 18 MHz mec oscillator WAVE SN63 PB37 PROFILES
Abstract: conductive epoxy or with solder. Solder Die Attach: This device can be mounted with Sn63/Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M/A-Com application note M538, â' Surface M/A-COM
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MADS-001317-1500 MADS-001317 MADS-001317-1500AG MADS-001317-1500AP
Abstract: be mounted with Sn63/Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M M/A-COM
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MAVR-000120-1411 MAVR000120-1411

mavr

Abstract: conductive epoxy or with solder. Solder Die Attach: This device can be mounted with Sn63/Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M/A-Com application note M538, " Surface Mounting
M/A-COM
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mavr MAVR-000120-14110P MAVR-000120-14110G
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