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SM120 SM160 DS-222610 DO-213AB MIL-STD-19500 UL94-V0 MIL-STD-750 SM140 SM150 - Datasheet Archive
MELF Schottky Barrier Rectifier SM120 THRU SM160 List List. 1 Package
Formosa MS MELF Schottky Barrier Rectifier SM120 SM120 THRU SM160 SM160 List List. 1 Package outline. 2 Features. 2 Mechanical data. 2 Maximum ratings . 2 Rating and characteristic curves. 3 Pinning information. 4 Marking. 4 Suggested solder pad layout. 4 Packing information. 5 Reel packing. 6 Suggested thermal profiles for soldering processes. 6 High reliability test capabilities.7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 Issued Date DS-222610 DS-222610 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS MELF Schottky Barrier Rectifier SM120 SM120 THRU SM160 SM160 1A Surface Mount Schottky Barrier Rectifiers - 20V-60V Package outline Features DO-213AB DO-213AB · Low profile surface mounted application in order to optimize board space. · Low power loss, high efficiency. · High current capability, low forward voltage drop. · High surge capability. · Guardring for overvoltage protection. · Ultra high-speed switching. · Silicon epitaxial planar chip, metal silicon junction. · Lead-free parts meet environmental standards of .205(5.2) .190(4.8) SOLDERABLE ENDS .024(.60) .018(.46) .105(2.7) .095(2.4) MIL-STD-19500 MIL-STD-19500 /228 Mechanical data · Epoxy : UL94-V0 UL94-V0 rated flame retardant · Case : Molded plastic, MELF / DO-213AB DO-213AB · Terminals :Plated terminals, solderable per MIL-STD-750 MIL-STD-750, Dimensions in inches and (millimeters) Method 2026 · Mounting Position : Any · Weight : Approximated 0.02 gram Maximum ratings (AT T A=25 oC unless otherwise noted) PARAMETER Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T A = 25 OC Reverse current UNIT 1.0 A I FSM 40 A Symbol Junction to ambient Diode junction capacitance f=1MHz and applied 4V DC reverse voltage *3 VR (V) SM120 SM120 20 14 30 21 30 SM140 SM140 40 28 50 35 60 42 60 0.50 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 mA CJ O 110 pF +175 -65 C/W O C -55 to +125 50 SM160 SM160 Operating temperature T J, ( OC) 40 SM150 SM150 *4 VF (V) 20 SM130 SM130 1.0 10 50 T STG V RMS*2 (V) TYP. R èJA Storage temperature *1 V RRM (V) MIN. IR V R = V RRM T A = 125 OC Thermal resistance SYMBOLS MAX. IO CONDITIONS *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 0.70 -55 to +150 *4 Maximum forward voltage Document ID Page 2 Issued Date DS-222610 DS-222610 2008/02/10 Revised Date - Revision Page. A 7 Rating and characteristic curves (SM120 SM120 THRU SM160 SM160) FIG.2-TYPICAL FORWARD FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE 50 16 SM 0 0 14 SM 0.2 0 20 40 60 80 100 120 140 160 180 200 AMBIENT TEMPERATURE ( C) PEAK FORWAARD SURGE CURRENT,(A) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 0 3.0 0 0~ 0~ 0.4 10 SM 12 0~ SM 14 15 SM 0.6 SM 15 0~ SM 16 0.8 INSTANTANEOUS FORWARD CURRENT,(A) 1.0 12 SM AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 1.2 1.0 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 50 .01 40 .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLT AGE,(V) 30 8.3ms Single Half TJ=25 C Sine Wave 20 JEDEC method 10 FIG.5 - TYPICAL REVERSE 0 CHARACTERISTICS 1 5 50 10 100 100 NUMBER OF CYCLES AT 60Hz REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE,(pF) 350 300 250 200 150 100 10 1.0 TJ=75 C .1 TJ=25 C 50 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 .01 0 20 40 60 80 100 120 140 PERCENTAGE RATED PEAK REVERSE VOL TAGE Document ID Page 3 Issued Date DS-222610 DS-222610 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS MELF Schottky Barrier Rectifier SM120 SM120 THRU SM160 SM160 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code SM120 SM120 SM130 SM130 SM140 SM140 SM150 SM150 SM160 SM160 - Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C MELF 0.118 (3.00) 0.079 (2.00) 0.130 (3.30) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 Issued Date DS-222610 DS-222610 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS MELF Schottky Barrier Rectifier SM120 SM120 THRU SM160 SM160 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance MELF Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.00 5.33 3.00 1.50 330 50 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 Issued Date DS-222610 DS-222610 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS MELF Schottky Barrier Rectifier SM120 SM120 THRU SM160 SM160 Reel packing PACKAGE REEL SIZE 13" MELF REEL (pcs) COMPONENT SPACING (m/m) 5000 4.0 BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON APPROX. GROSS WEIGHT (pcs) (kg) 10,000 337*337*37 330 360*360*220 50,000 11.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP )