SLE-9070CW40-CG-Q5 DATE08-20-09

SPECIFICATION FOR APPROVAL Part No.SLE-9070CW40-CG-Q5(COOL WHITE) Package Dimensions Part NO. Chip Material Lens Color Emission

SHARLIGHT ELECTRONICS CO., LTD. SPECIFICATION FOR APPROVAL Part No.SLE-9070CW40-CG-Q5 SLE-9070CW40-CG-Q5(COOL WHITE) Package Dimensions Part NO. Chip Material Lens Color Emission Color SLE-9070CW40-CG-Q5 SLE-9070CW40-CG-Q5 CREE Water Clear White LISTER 08-20-09 EDITOR 08-20-09 DATE08-20-09 DATE08-20-09 REVA SHARLIGHT ELECTRONICS CO., LTD. SPECIFICATION FOR APPROVAL Part No.SLE-9070CW40-CG-Q5 SLE-9070CW40-CG-Q5(COOL WHITE) Flux Characteristics (T= 25°C) Parameter Symbol Luminous Flux Correlated Min. Typ. Flux Color Temperature CRI CCT Max. 5000 Test Condition lm IF = 350mA K IF = 350mA - 107 Unit IF = 350mA 10000 Ra 75 Characteristics Parameter Thermal resistance, junction to solder point Unit Min. Typ. Max. °C/W 8 deg 90 Temperature coefficient of voltage mV/°C -4.0 DC forward current-white5000k mA 1000 Reverse voltage V 5 DC Pulse Current (@ 1 kHz, 10% duty cycle) A 1.8 Forward voltage (@ 350 mA) V 3.3 Forward voltage (@ 700 mA) V 3.5 Forward Voltage (@ 1000 mA) - white 5000 K V 3.7 LED junction temperature °C Viewing Angle 3.9 150 Relative Spectral Power Distribution LISTER 08-20-09 EDITOR 08-20-09 DATE08-20-09 DATE08-20-09 REVA SHARLIGHT ELECTRONICS CO., LTD. SPECIFICATION FOR APPROVAL Part No.SLE-9070CW40-CG-Q5 SLE-9070CW40-CG-Q5(COOL WHITE) Relative Flux vs. Junction Temperature (I= 350 mA) Electrical Characteristics (T= 25°C) LISTER 08-20-09 EDITOR 08-20-09 DATE08-20-09 DATE08-20-09 REVA SHARLIGHT ELECTRONICS CO., LTD. SPECIFICATION FOR APPROVAL Part No.SLE-9070CW40-CG-Q5 SLE-9070CW40-CG-Q5(COOL WHITE) Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. Given an existing thermal resistance of 8°C/W between the junction and the solder point, it is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in or- der to optimize lamp life and optical characteristics. Relative Flux vs. Current (T= 25°C) Typical Spatial Distribution LISTER 08-20-09 EDITOR 08-20-09 DATE08-20-09 DATE08-20-09 REVA SHARLIGHT ELECTRONICS CO., LTD. SPECIFICATION FOR APPROVAL Part No.SLE-9070CW40-CG-Q5 SLE-9070CW40-CG-Q5(COOL WHITE) Reflow Soldering Characteristics Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Parameter Time Maintained Above: Time (t L) Peak/Classification Temperature (Tp) Time Within 5°C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25°C to Peak Temperature Lead-Free Solder 3°C/second max. 100°C 150°C 60-120 seconds 183°C 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 215°C 10-30 seconds 60-150 seconds 260°C 20-40 seconds 6°C/second max. Average Ramp-Up Rate (Tsmax to Tp) Preheat: Temperature Min (Tsmin) Preheat: Temperature Max (Tsmax) Preheat: Time (ts min to ts max ) Time Maintained Above: Temperature (TL ) Lead-Based Solder 6°C/second max 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. LISTER 08-20-09 EDITOR 08-20-09 DATE08-20-09 DATE08-20-09 REVA