SL1ICS3101 SL1ICS3101U SL1ICS3101W MGU434 MGW340 SL1IC3101 MIL-STD-883D - Datasheet Archive

 

DATA SHEET SL1ICS3101 I-CODE1 Label IC (97 pF) Product specification Supersedes data of 2000 Jul 01 2002 May 23 Philips

 

INTEGRATED CIRCUITS DATA SHEET SL1ICS3101 SL1ICS3101 I-CODE1 Label IC (97 pF) Product specification Supersedes data of 2000 Jul 01 2002 May 23 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 CONTENTS 1 3 PINNING 7 FUNCTIONAL DESCRIPTION 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 General Memory organization Serial number Write access conditions Special functions Family code and application identifier User data 8 LIMITING VALUES 9 QUALITY ASSURANCE 9.1 9.2 9.2.1 9.2.2 Electrical acceptance test Visual inspection After wafer final test After sawing (film frame carrier) 10 HANDLING INSTRUCTIONS 11 ELECTRICAL CHARACTERISTICS 12 MECHANICAL CHARACTERISTICS 12.1 12.2 Die specifications Wafer specifications 13 APPLICATION INFORMATION 13.1 13.2 13.3 13.4 13.5 13.6 Protection against visible light Protection against UV light Resistance to X-rays Characterisation of inlet and label Final test of the inlet and label Coil specification 2002 May 23 2 REFERENCE DOCUMENTS DATA SHEET STATUS DEFINITIONS 18 BLOCK DIAGRAM 6 17 ORDERING INFORMATION 5 16 GENERAL DESCRIPTION 4 Configuration of delivered ICs Packing Documentation Delivery documentation Fail-die identification Wafer mapping 15 APPLICATIONS DELIVERY 14.1 14.2 14.3 14.3.1 14.3.2 14.3.3 FEATURES 2 14 DISCLAIMERS Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 1 SL1ICS3101 SL1ICS3101 FEATURES · Operating frequency of 13.56 MHz · 512-bit read/write memory · Operating range up to 1.5 m with Electronic Article Surveillance (EAS) detection and up to 1.2 m for memory read and write · Anticollision: simultaneous operation of several labels · Reliable EAS detection avoids false alarms 3 · Data retention of 10 years The I-CODE1 label IC is a dedicated chip for intelligent label applications for logistics and retail (including EAS) and for baggage and parcel identification in airline business and mail services. · Operating temperature from -25 to +70 °C · In accordance with standards of the Federal Communications Commission (FCC 15 part 3) and European Telecommunications Standards Institute (ETSI EN 300 330 and EN 300 683) The I-CODE system offers the possibility of operating labels simultaneously in the field of the reader antenna (anticollision). It is designed for long range applications. · Open communication protocol Whenever connected to a very simple and cheap type of antenna (due to the 13.56 MHz carrier frequency) made out of a few windings printed, wound, etched or punched coil, the SL1ICS3101 SL1ICS3101 operates without line of sight up to a distance of 1.5 m (gate width). · Application identifier saves time. 2 GENERAL DESCRIPTION APPLICATIONS · I-CODE(1) system labels. (1) I-CODE - is a trademark of Koninklijke Philips Electronics N.V. 4 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION SL1ICS3101U SL1ICS3101U wafer unsawn wafer; 150 µm; inked and mapped - SL1ICS3101W SL1ICS3101W wafer sawn wafer on foil (FFC); 150 µm; inked and mapped - 2002 May 23 3 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 5 SL1ICS3101 SL1ICS3101 BLOCK DIAGRAM handbook, full pagewidth ANALOG RF INTERFACE LA LB Cres DEMODULATOR MODULATOR POWER SUPPLY VDD CLOCK DATA IN DATA OUT CLOCK DIGITAL CONTROL ANTICOLLISION READ/WRITE CONTROL ACCESS CONTROL EEPROM INTERFACE CONTROL RF INTERFACE CONTROL TEST EEPROM 512 bits VSS SL1ICS3101 SL1ICS3101 MGU434 MGU434 Fig.1 Block diagram. 6 PINNING SYMBOL DESCRIPTION LA bond pad for antenna coil connection A LB bond pad for antenna coil connection B TEST test pad; this test pad is electrically neutral at sawn wafers VSS handbook, halfpage electrical connection of the substrate pad; the pad is electrically neutral at sawn wafers TEST LA LB VSS MGW340 MGW340 Fig.2 Pad locations. 2002 May 23 4 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 7 SL1ICS3101 SL1ICS3101 FUNCTIONAL DESCRIPTION 7.2 This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on Film Frame Carrier (FFC) of the SL1ICS3101 SL1ICS3101 on a Philips 6C15 IDFW process and is the base for delivery of tested label ICs. The EEPROM has a memory capacity of 512 bits and is organised in 16 blocks consisting of 4 bytes each (see Table 1). A block is the smallest access unit. Each block consists of 4 bytes (1 block = 32 bits). General recommendations are given for storage, handling, and processing of wafers and for the assembly of labels. Bit 0 in each byte represents the Least Significant Bit (LSB) and bit 7 the Most Significant Bit (MSB), respectively. This product specification is valid for VCOL1V0 from mask revision NK:O and MB:B. 7.1 Memory organization The higher 12 blocks contain user data and the lowest 4 blocks contain the serial number, the write access conditions and some configuration bits. General The label requires no internal power supply (see Fig.1). Its contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the reader. The values (in hexadecimal notation) are stored in the EEPROM after the wafer production process. The contents of blocks marked with `X' in Table 1 are not defined at delivery. The interface also demodulates data which is transmitted from the reader to the label IC, and modulates the electromagnetic field for data transmission from the label IC to the reader. Data is stored in a non-volatile memory (EEPROM). Table 1 EEPROM memory organization BLOCK NUMBER BYTE 0 BYTE 1 BYTE 2 BYTE 3 0 SNR0 SNR1 SNR2 SNR3 serial number (lower bytes) 1 SNR4 SNR5 SNR6 SNR7 serial number (higher bytes) 2 F0 FF FF FF write access conditions 3 X X X X special functions (EAS and QUIET) 4 X X X X family code, application identifier and user data 5 X X X X user data 6 X X X X user data 7 X X X X user data 8 X X X X user data FUNCTION 9 X X X X user data 10 X X X X user data 11 X X X X user data 12 X X X X user data 13 X X X X user data 14 X X X X user data 15 X X X X user data 2002 May 23 5 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 7.2.1 SL1ICS3101 SL1ICS3101 SERIAL NUMBER The unique 64-bit serial number is stored in blocks 0 and 1 and is programmed during the production process. Byte SNR0 in the table represents the least significant byte and byte SNR7 the most significant byte, respectively. Table 2 Block 0 with serial number (lower bytes) BYTE 0 MSB Block 0 LSB MSB SNR0 BYTE 3 LSB MSB LSB SNR2 SNR3 BYTE 2 BYTE 3 Block 1 with serial number (higher bytes) MSB BYTE 1 LSB MSB LSB MSB LSB MSB LSB X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Name 7.2.2 LSB MSB SNR1 BYTE 0 Block 1 BYTE 2 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Name Table 3 BYTE 1 SNR4 SNR5 SNR6 SNR7 WRITE ACCESS CONDITIONS The write access conditions in block 2 determine the write access for each of the 16 blocks. These bits can only be set to logic 0 (and never be changed to logic 1): therefore, already write protected blocks can never be written to from this moment on. This is also true for block 2. If this block is set into the write protected state by clearing of bits 5 and 4 at byte 0, no further changes in write access conditions are possible. The `ones' (11) in the 16 pairs of bits have to be cleared together if the corresponding block is wanted to be write protected forever: (11) for write access enabled and (00) write access disabled. Writing of bit pairs (10) or (01) to block 2 is not allowed. Remarks: It is extremely important to be particularly careful when clearing the write access bits in block 2, as you can lose write access to all of the blocks in case of a mistake. Of course, this feature can be used to put the SL1IC3101 SL1IC3101 into a hardware write protected state. Table 4 Block 2 with write access conditions for all blocks BYTE 0 MSB Block 2 Write access for block number BYTE 1 LSB MSB BYTE 2 LSB MSB BYTE 3 LSB MSB LSB 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 3 2002 May 23 2 1 0 7 6 5 4 6 11 10 9 8 15 14 13 12 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 7.2.3 SL1ICS3101 SL1ICS3101 SPECIAL FUNCTIONS The special functions block 3 (see Table 5) holds the two bits E (EAS mode) and two bits Q (QUIET mode). The remaining 28 bits (marked X) are reserved for future use. If the electronic article surveillance mode is active (bits EE = 11), then the label answers at an EAS command. If the QUIET mode is enabled (setting bits QQ = 11), then the label is permanently disabled but can be activated again with the command RESET QUIET BIT. The label can be activated also by disabling the QUIET mode by setting bits QQ = 00. The state of the QUIET mode does not influence the functionality of the EAS command. Writing of bit pairs 10 or 01 to block 3 is not allowed. Remarks: Changing of the write access control or configuration must be done in a secure environment by reading the current value of the block and masking in the new values for bit positions that may be changed. The label must not be moved out of the communication field of the antenna during writing! We recommend to put the label close to the antenna and not to remove it during operation. Table 5 Block 3 with special functions BYTE 0 BYTE 1 MSB Block 3 Name 7.2.4 LSB MSB X X X X Q not used BYTE 2 LSB MSB BYTE 3 LSB MSB LSB Q E E X X X X X X X X X X X X X X X X X X X X X X X QUIET EAS not used not used X not used FAMILY CODE AND APPLICATION IDENTIFIER The I-CODE system offers the feature to use (independently) family codes and/or application identifiers with some reader commands. This allows for example the creation of `label families'. These two 8-bit values are located at the beginning of block 4 and are only evaluated if the bytes at the reader commands are unequal to zero. Only if both corresponding parameter bytes at the reader commands ANTICOLLISION/SELECT, EAS and UNSELECTED READ respectively, are set to logic 0, then block 4 can be used for user data without restriction. Bytes 2 and 3 are for customer usage. Table 6 Block 4 with family code and application ID BYTE 0 MSB Block 4 LSB MSB BYTE 2 LSB MSB BYTE 3 LSB MSB LSB X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Name 7.2.5 BYTE 1 family code application ID user data USER DATA The remaining blocks 5 to 15 are for customer usage. 2002 May 23 7 user data Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); notes 1 and 2. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Tstg storage temperature -55 - +140 °C Tj junction temperature -55 - +140 °C Vesd electrostatic discharge voltage note 3 -2 - +2 kV Ii(LA-LB)(p) input current (peak value) note 4 -80 - +80 mA Notes 1. Stresses above those listed in this table may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in Chapter 11 is not implied. 2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. 3. Human Body Model (HBM) in accordance with "MIL-STD-883D MIL-STD-883D Method 3015.7". 4. At 13.56 MHz including current via resonant capacitor. 9 QUALITY ASSURANCE 9.1 10 HANDLING INSTRUCTIONS Please refer to Philips "General specification for 6" wafer" for the following items: Electrical acceptance test The electrical acceptance test is performed in line (`sampling on the fly') according to the test specifications. Sampling plan: · Sawing · Die attach · According to document "General quality specification". 9.2 9.2.1 · Wire bonding. Visual inspection AFTER WAFER FINAL TEST Performed according to document "SNW-FQ-627 SNW-FQ-627". Sampling plan: · According to document "General quality specification". 9.2.2 AFTER SAWING (FILM FRAME CARRIER) Performed according to document "PICTOH-QS007 PICTOH-QS007". Sampling plan (3 wafers per lot): · Accept 0 to 3. 2002 May 23 8 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 11 ELECTRICAL CHARACTERISTICS Tamb = -25 to +70 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP.(1) MAX. UNIT General Tamb ambient temperature -25 - +70 °C Tj junction temperature -25 - +85 °C Supply minimum operating power VLA-LB = 2 V (RMS); note 2 - 450 - µW Cres capacitance between pads LA and LB VLA-LB = 2 V (RMS); note 3 92 97 102 pF Rmod modulator-on resistance 50 115 250 Ii(LA-LB)(rms) input current (RMS value) note 4 - - 50 mA Vi(LA-LB)(p) minimum input voltage (peak value) standard mode; note 5 read and EAS - 3.1 3.7 V write Pmin Inputs - 3.6 4.1 V fast mode; note 5; read, EAS and write - 5.2 6.5 V Modulation mmin minimum modulation index of RF voltage for demodulator response note 6 - 10 14 % mmax maximum modulation index of RF voltage for demodulator response note 6 30 - - % foper operating frequency note 7 13.553 13.560 13.567 MHz tPW modulation start-pulse length of RF voltage m 10%; note 8 3.54 5.31(9) 9.44 µs 15.34 17.11(9) 20.06 µs Timing standard mode fast mode demodulator response time m 10% 0.1 0.8 2.4 µs tret EEPROM data retention time Tamb 55 °C 10 - - years nwrite EEPROM write endurance 100000 - - cycles tD EEPROM Notes 1. Typical ratings are not guaranteed. These values listed are at Tamb = 25 °C. 2. Including losses in resonant capacitor and rectifier. 3. Measured with an HP4285A HP4285A LCR meter at 13.56 MHz. 4. Including current via resonant capacitor. 5. The voltage between pads LA and LB is limited by the on-chip voltage limitation circuitry, corresponding to parameter Ii(LA-LB). 2002 May 23 9 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 V max ­ V min 6. Definition: m = -V max + V min 7. Bandwidth limitation (±7 kHz) according to ISM band regulations. 8. The given values are derived from the 13.56 MHz system frequency. 9. Recommended values for pulse duration generated at the read/write device. 12 MECHANICAL CHARACTERISTICS 12.1 Die specifications PARAMETER VALUE Designation VCOL1V0; visible on each die (see Fig.3) Bond pad location see Fig.3 Bond pad size: LA and LB 130 × 150 µm Test pad size: TEST and VSS 90 × 90 µm Bond pad metallization material AlSiCu Metallization thickness 1.4 µm Die dimensions (including 80 µm scribe line) 1460 × 1490 µm Die dimensions (excluding scribe line) 1380 × 1410 µm Tolerances for sawn dies 25 µm Pad identification see Fig.2 Top side passivation material oxynitride; notes 1 and 2 Passivation thickness 1.6 µm Notes 1. The passivation is a protection of active areas against dust (particles), humidity, and general contamination (whole surface of the chip except for the bond pads). 2. Due to the glass-like physical properties careful handling and processing is required. 2002 May 23 10 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 handbook, full pagewidth 90 130 144.7 150 90 96.5 TEST LA 139.7 VCOL1V0 582.5 1490 (1) 1410 233.7 90 141.4 VSS 90 LB 282.1 150 145 130 1380 1460 (1) MGW341 MGW341 Dimensions in µm. (1) Including 80 µm scribe line. Fig.3 Die dimensions. 2002 May 23 11 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 12.2 Wafer specifications For further information, please refer to the Philips documents: "Dicing process for thin wafers" and "General specification for 6" wafer". In case of doubt or inconsistency the mentioned wafer specifications are applicable. PARAMETER VALUE Designation each wafer is laser scribed with batch and wafer number Wafer diameter 150 ± 0.3 mm (150 mm = 6") Die separation lane width 80 µm (scribe line) Electrical connection of substrate VSS potential Geometrically complete dies per wafer approximately 7400 Orientation of dies relatively to wafer flat see Fig.5 Position of test structures see Fig.5 Wafer layout see Fig.5 Batch size 24 wafers Process 6C15 IDFW Backside treatment note 1 Wafer status note 2 Notes 1. Wafers can be delivered with a thickness of 525 µm (untreated) or with 150 ± 15 µm (approximately 6 mil) ground and etched backside. 2. There are two wafer status: unsawn and sawn on FCC; both tested. Minimum yield per lot is 30%. 2002 May 23 12 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 handbook, full pagewidth 13.41 13.14 MGW342 MGW342 Dimensions in mm. Fig.4 Cluster plan. 2002 May 23 13 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 handbook, full pagewidth MGW358 MGW358 Dimensions in mm. The three black areas show the position of the Process Control Module (PCM) structures on the 6 inch wafer. Fig.5 Cluster map. 2002 May 23 14 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 13 APPLICATION INFORMATION 13.4 13.1 The parameters recommended to be characterised for the inlet and label are given in Table 7. Protection against visible light As a result of the ultra low power design of the SL1ICS3101 SL1ICS3101 some analog circuits on the chip are light sensitive. This means that common sunlight can impact the operation of the label if the chip is not protected against visible light radiation. Characterisation of inlet and label For more detailed information on inlet and label characterization, please refer to Philips application note "I-CODE1 Label IC, Coil Design Guide" 13.5 Measurements have shown that a maximum radiation of E = 60 W/m2 (spectrum: 400 to 1000 nm) causes a reduced operating range of the plain chip. Final test of the inlet and label Basic flow for production and test: · Production of wafer Measurements of direct sunlight in summer deliver values up to 260 W/m2. · Testing of dies on wafer To ensure proper operation an expected minimum 260 radiation reduction factor of approximately 2 × - = 8.7 60 (round 9) must be provided by the encapsulation. That means special care has to be taken to ensure a sufficient light protection of the SL1ICS3101 SL1ICS3101 (e.g. non translucent encapsulation or underfiller) according to application requirements. · Sawing of wafer 13.2 · Writing of serial numbers and pre-configuration · Assembly of inlets and labels · Final test of inlets and labels · Writing of customer data. To detect damage of EEPROM cells during production of inlets and labels a final test of the EEPROM after assembly of the inlet or label is recommended. This is necessary to achieve lowest failure rates. Protection against UV light 13.6 An EEPROM memory, as used in the SL1ICS3001 SL1ICS3001, has some principle sensitivity to UV light (applies to EEPROM technology in general). The SL1ICS3101 SL1ICS3101 has to be connected at pads LA and LB to a coil characterised by its electrical parameters according to Philips application note "I-CODE1 Label IC, Coil Design Guide". Thus strong UV light exposure in the production of inlets or labels has to be avoided. UV light protection has to be ensured using appropriate assembly methods. 13.3 Coil specification Resistance to X-rays X-ray exposure on comparable Philips ICs (with even smaller feature size) caused neither a long term influence on the behaviour of the ICs nor on the data retention of the EEPROMs. Table 7 Inlet and label parameters SYMBOL PARAMETER CONDITIONS fres resonant frequency at Tamb = 22 °C and HTH; note 1 HTH threshold value for the field strength for command UNSELECTED READ (standard mode) command UNSELECTED READ is OK HWR threshold value for the field strength for command WRITE (standard mode) command WRITE (and verifying read) is OK Note 1. If no command is transmitted to the inlet or label, then the label generates no response and there is no modulation. 2002 May 23 15 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 14 DELIVERY 14.3.2 14.1 · Serial number is unique and read only Every die is electrically tested according to the data sheet. Identification of the chips which do not confirm with the electrical parameters of the data sheet is done by inking and/or wafer mapping (all dies at wafer periphery are identified by `FAIL'). · Write access conditions allow to change all blocks (with the exception of both serial number blocks) 14.3.3 Configuration of delivered ICs The SL1ICS3101 SL1ICS3101 is delivered with the following configuration by Philips: · Status of the EAS mode is not defined · Family code and application identifier are not defined Remark: The wafer map refers to unsawn wafers. At sawn wafers (on FFC) additional ICs might be inked (marked as `FAIL') if damaged during the sawing process (compared to wafer map). · User data memory is not defined. Remark: As the status of the QUIET mode is not defined at delivery, the first command to be executed on the SL1ICS3101 SL1ICS3101 should be the command RESET QUIET BIT. See Fig.6 for an example of the screen shot of a wafer map. Packing The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips "General Specification for 6" wafer". 14.3 14.3.1 Documentation DELIVERY DOCUMENTATION Each wafer container and each larger shipment container is individually marked with the identification information as follows. · Diffusion batch number (wafer lot number) · Part designation (type) with revision number · Ordering code · Date code of lot acceptance · Good die quantity. The print out of the final test results is attached to the packing and contains the good die quantity related to every wafer number. 2002 May 23 WAFER MAPPING Wafer mapping for failed die identification is available on floppy-disk (format 3.5", Electroglas ESC-ASCEND). · Status of the QUIET mode is not defined 14.2 FAIL-DIE IDENTIFICATION 16 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 handbook, full pagewidth MGW359 MGW359 Fig.6 Screen shot of wafer map. 2002 May 23 17 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) Table 8 SL1ICS3101 SL1ICS3101 Map file of this example ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE COPYRIGHT ASCEND LOT DEVICE PRODUCT WAFER READER XSTEP YSTEP XREF YREF XDELTA YDELTA FLAT XFRST YFRST PRQUAD COQUAD DIAM DATE TIME OPERATOR SET-UP FILE TEST SYSTEM TEST DATA PROBE CARD PROBER 09397 VCOL1HE2 VCOL\4020 05 09397-05-B6 09397-05-B6 575 UNITS 587 UNITS 16891 UNITS -261 UNITS 0 0 0 21 50 1 1 6000 UNITS 2000-01-23 15:30:00 4020 M:\SET\VCOL1HE2.SET SYS VCOL\4020 (0.1)MIL (0.1)MIL (0.1)MIL (0.1)MIL MIL : : :### shortening of the : : 3 X40Y3 X40Y3 5 X41Y3 X41Y3 5 X42Y3 X42Y3 5 X43Y3 X43Y3 5 X44Y3 X44Y3 5 X45Y3 X45Y3 5 X46Y3 X46Y3 5 X47Y3 X47Y3 2 X48Y3 X48Y3 2 X49Y3 X49Y3 2 X50Y3 X50Y3 5 X51Y3 X51Y3 5 X52Y3 X52Y3 5 X53Y3 X53Y3 5 X54Y3 X54Y3 5 : : :### shortening of the : : EDATE ETIME PC PIWP105 PIWP105 15 REFERENCE DOCUMENTS CATEGORY NUMBER OR TITLE Standard "MIL-STD 883D Method 3023" Standard "MIL-STD-883D MIL-STD-883D Method 3015.7" MISD standard "SNW-FQ-627 SNW-FQ-627" "PICTOH-QS007 PICTOH-QS007" MISD standard "General quality specification" Data sheet "General Specification for 6" Wafer" Application note "I-CODE1 Label IC, Coil Design Guide" Application note "Dicing process for thin wafers" 2002 May 23 18 file ### 0 1 1 1 1 1 1 1 0 0 0 1 1 1 1 1 file ### Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 SL1ICS3101 16 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 17 DEFINITIONS 18 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2002 May 23 19 Philips Semiconductors ­ a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA74 SCA74 © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613502/02/pp20 Date of release: 2002 May 23 Document order number: 9397 750 08397