PC1678G/1678GV/1679G PC2708T 2710T PC2762T/2763T PC2771T/2776T P12152EJ3V0AN00 - Datasheet Archive

 

Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology

 

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. 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Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. Application Note USAGE AND APPLICATION OF SILICON MEDIUMPOWER HIGH-FREQUENCY AMPLIFIER MMIC µPC1678G/1678GV/1679G PC1678G/1678GV/1679G µPC2708T PC2708T to 2710T 2710T µPC2762T/2763T PC2762T/2763T µPC2771T/2776T PC2771T/2776T Document No. P12152EJ3V0AN00 P12152EJ3V0AN00 (3rd edition) Date Published May 2000 N CP(K) © Printed in Japan 1997, 2000 [MEMO] 2 Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 The information in this document will be updated without notice. This document introduces general applications of the products in this series. The application circuits and circuit constants in this document are examples and not intended for use in actual mass production design. In addition, please take note that restrictions of the application circuit or standardization of the application circuit characteristics are not intended. Especially, characteristics of high-frequency ICs change depending on the external components and mounting pattern. Therefore, the external circuit constants should be determined based on the required characteristics on your planned system referring to this document and characteristics should be checked before using these ICs. · The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. · No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. · NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. · Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. · While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. · NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8 The mark shows major revised points. Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 3 [MEMO] 4 Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 CONTENTS ìï ,1752'8&7,21 ïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï æ ëï 352'8&7 /,1(ð83ïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï 2.1 Characteristics . 2.2 Test Circuit . æ 7 9 êï 7+(25(7,&$/ '(6&5,37,21 ïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï 3.1 Description of Internal Circuit . 3.2 External Circuit Description . 3.3 Temperature Condition. ìë 12 13 14 éï 6$03/( $33/,&$7,21 &+$5$&7(5,67,&6ïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï 4.1 P PC1678G PC1678G, P PC1679G PC1679G. 4.2 P PC2709T PC2709T. 4.3 P PC2776T PC2776T. 4.4 P PC2762T PC2762T, P PC2763T PC2763T. 4.5 P PC2771T PC2771T. ìè 17 18 20 21 23 èï $33/,&$7,216 ïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï ëé çï 6800$5< ïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï ëé æï $)7(5:25'ïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï ëé òëèq&ôïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïïï q ëè $33(1',;ï 6 3$5$0(7(5 5()(5(1&( õ7$ Precautions for design-ins (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC pin. (4) The inductor must be attached between VCC pin and output pin. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be each attached to the input and output pins. (6) You should apply voltage to VCC pin and output pin. You must not apply voltage to input pin nor regulate input pin voltage (e.g. direct DC pull-down). (7) External components cannot modify the IC's internal circuit feedback. Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 5 [MEMO] 6 Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 1. INTRODUCTION The application for high-frequency devices has recently grown to include not only TV/VCR tuners and cable TV converters but also DBS, cellular phones, pagers, and GPSs. In response to these diverse needs, NEC has developed an abundant line-up of high-frequency amplifier ICs. This application note is intended to assist user in selecting the product that best suits their applications among NEC's line-up of silicon medium-power high-frequency amplifier ICs and as a reference for designing external circuits that unleash the products' characteristic. See the data sheet of each product for the product ratings and specifications. 2. PRODUCT LINE-UP 2.1 Characteristics The part numbers of NEC's silicon medium-power high-frequency amplifier ICs are PPC1678/1679 PPC1678/1679, PPC2708 PPC2708 to 2710, PPC2762/2763 PPC2762/2763, and PPC2771/2776 PPC2771/2776. Table 2-1 lists the characteristics of these products as measured with an NEC test circuit. Table 2-1. Characteristics List of Silicon Medium-Power High-Frequency IC Data Sheet (TA = +25qC, VCC = Vout, ZS = ZL = 50 :) q VCC (V) fu (GHz) PO(sat) (dBm) GP (dB) NF (dB) ICC (mA) 4.5 to 5.5 2.0 +17.5 23 6 49 Part number õGLVFUHWH SDUW QXPEHUô PPC1678G PPC1678G PPC1678GV PPC1678GV 3DFNDJH 8-pin plastic SOP (5.72 mm (225) 0DUNLQJ 1678 8-pin plastic SSOP (4.45 mm (175) PPC1679G PPC1679G 4.5 to 5.5 1.8 +15.5 21.5 6 40 8-pin plastic SOP (5.72 mm (225) 1679 PPC2708T PPC2708T 4.5 to 5.5 2.9 +10.0 15 6.5 26 6-pin minimold C1D PPC2709T PPC2709T 4.5 to 5.5 2.6 +11.5 23 5 25 6-pin minimold C1E PPC2710T PPC2710T 4.5 to 5.5 1.2 +13.5 33 3.5 22 6-pin minimold C1F PPC2762T PPC2762T 2.7 to 3.3 2.9 +9.0 13 6.5 26.5 6-pin minimold C1Z PPC2763T PPC2763T 2.7 to 3.3 2.4 +11.0 20 5.5 27 6-pin minimold C2A PPC2771T PPC2771T 2.7 to 3.3 2.1 +12.5 21 6 36 6-pin minimold C2H PPC2776T PPC2776T 4.5 to 5.5 2.7 +8.5 23 6 25 6-pin minimold C2L Remark The above values are typical values for major characteristics. Refer to the data sheet of each product for rating conditions. The line-up features two power supply voltage ranges, 5 V and 3 V, and includes various power gains and output levels. 8-pin SOP, SSOP, and size 2915-size 6-pin minimold are available for packages. Figure 2-1 shows the package dimensions. The part number is used for the marking in 8-pin packages but a three-character abbreviation is used for the marking in the 6-pin minimold package due to limited printing space. Each abbreviation corresponds to a product. Due to space limitation, the pin 1 mark is printed on the rear side in the minimold package. Figure 2-2 shows a marking example of the 6-pin minimold package. Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 7 The alphabetical characters suffixed to the part number (discrete part number) are the code that indicates the package. GV corresponds to 4.45 mm (175) SSOP, G to the conventional SOP, and T to the minimold. If two package codes exist for the same part number, such as the P PC1678 PC1678, this means that the same product is available in two different packages. Since the marking is the same on both package types, the products should be distinguished by their package size. Taping is available as the supply medium for all products except DIP packages. Two taping codes are used according to the IC insertion orientation, `E1' for SOP and SSOP and `E3' for minimold. The order code should be "Discrete part number - taping code" (for example, P PC2776T-E3 PC2776T-E3). For details, refer to the data sheet of each discrete part. Figure 2-1. Package Drawings of Silicon Medium-Power High-Frequency Amplifier ICs 8-pin plastic SOP (5.72 mm (225) 8 8-pin plastic SSOP (4.45 mm (175) 8 5 5 detail of lead end detail of lead end +7° +7° 3°­3° 3°­3° 4 1 4 1 5.2 ± 0.2 3.00 MAX 4.94 ± 0.2 6.5 ± 0.3 1.57 ± 0.2 4.4 ± 0.15 1.1 ± 0.2 1.49 0.85 MAX. 1.27 +0.08 0.42 ­0.07 1.8 MAX 3.2 ± 0.1 1.5 ± 0.1 0.575 MAX. 0.6 ± 0.2 0.10 +0.08 0.17 ­0.07 0.65 +0.10 0.3 ­0.05 0.12 M 0.1 ± 0.1 0.1 ± 0.1 6-pin minimold 0 to 0.1 0.95 0.95 1.9 2.9±0.2 8 0.13±0.1 1.5+0.2 -0.1 2.8+0.2 -0.3 0.3+0.1 -0.05 0.8 1.1+0.2 -0.1 Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 0.5 ± 0.2 +0.10 0.15 ­0.05 0.10 M 0.87 ± 0.2 0.15 Figure 2-2. Marking Example 3 2 1 C1D (Top View) (Bottom View) 4 4 3 5 5 2 6 6 1 Remark The marking example in the above figure is that of the P PC2708T PC2708T. 2.2 Test Circuit The test circuit is shown in Figure 2-3. Note that the characteristics listed in the data sheets were obtained while the products were set to wide band and that different practical characteristics and conditions apply in the narrow band. Measurement Method Common conditions Use feedthrough capacitor for the bypass capacitor A network analyzer is used for the following parameters. (Voltage is applied to an output pin via Bias-T) Power gain S21 of IC after compensating for effect of input/output lines of jig Isolation S12 of IC after compensating for effect of input/output lines of jig Input Return Loss S11 of IC after compensating for effect of input/output lines of jig Output Return Loss S22 of IC after compensating for effect of input/output lines of jig An NF meter is used for the following parameters. Noise figure NF including jig NF (Cable loss is compensated.) A signal generator and spectrum analyzer are used for the following items. Input/Output power characteristics These characteristics include jig-related effects, and frequency conditions that minimize jig influence should be set. The frequency conditions shall be set to obtain a wide band power gain. (Cable loss is compensated.) A power supply and ampere meter are used for the following items. Circuit current The output inductor is measured mainly via Bias-T and the inductor DC resistance is compensated. Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 9 Figure 2-3. Test Circuit Power supply µ PC1678G PC1678G, 1679G 1679G: A manually wound coil and capacitor µ PC2708T PC2708T to 2776T 2776T: Bias-tee µ PC1678GV PC1678GV: An inductor Note with lead and capacitor DC cable 1000 pF (Feedthrough capacitor) Measuring instrument High VCC line frequency cable Input DC cut L VCC Output DUT GND Measuring instrument High frequency cable DC cut Zs = 50 ZL = 50 Note Refer to Table 4-1 Test Board for P PC1678G PC1678G and 1679G 1679G 1 µ PC1678G/79G PC1678G/79G IN Vcc OUT Test Board for P PC1678GV PC1678GV 1 µ PC1678GV PC1678GV IN 10 Vcc OUT Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 Test Board Common to 6-Pin Minimold (AMP1) Part numbers µPC2708T PC2708T to 2710T 2710T µPC2762T/2763T/2771T/2776T PC2762T/2763T/2771T/2776T IN OUT 65 4 1D C 12 3 Top View (Marking surface) IC orientation Sample marking of µ PC2708T PC2708T VCC Notes on printed boards · Board material. The following board materials are used to minimize board-related losses when measuring the intrinsic characteristics of ICs. µ PC1678G PC1678G, µ PC1679G PC1679G, µ PC1678GV PC1678GV, AMP1: Polyimide double-sided copper-clad board · Back side . Whole surface is GND. Through holes keep the GND characteristics of the IC mounting side. · Specifications. µ PC1678G PC1678G, µ PC1679G PC1679G, µ PC1678GV PC1678GV board dimensions: 50 × 50 × 0.4 mm, 35 µm thick copper patterning on both sides AMP1 board dimensions: 30 × 30 × 0.4 mm, 35 µm thick copper patterning on both sides Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 11 3. THEORETICAL DESCRIPTION 3.1 Description of Internal Circuit The products in this series incorporate 50 : matching circuits formed by resistors on the input side. A multiple negative feedback circuit is provided to offset the variations between hFE and resistance. To obtain desired RF characteristics, a two-stage configuration is employed. Products in this series use the Darlington collector output type for the internal output stage. This output stage collector is ended as an output pin that enables current supply from this pin so that a medium output can be obtained. For the test environment, Bias-T is mainly used to verify the characteristics in the wide band because the frequency characteristics are not affected. On the other hand, by using an inductor with the minimum required value, the gain in the high-frequency range increases by the amount that the gain in the low-frequency decreases and the band shifts to high-frequency. The gain change varies depending on the effect of the two-stage peaking capacitance that is connected to the internal equivalent circuit output port. The circuit constant differs depending on the product. However, the products can be classified into five types, P PC1678/1679 PC1678/1679, P PC2708 PC2708 to 2710, P PC2762/2763/2771 PC2762/2763/2771, and P PC2776 PC2776, based on the internal circuit type. An internal equivalent circuit is shown in Figure 3-1. Figure 3-1. Silicon Medium-Power Amplifier IC Internal Equivalent Circuit PPC1678/1679 PPC1678/1679 PPC2708 PPC2708 to 2710 VCC VCC OUT OUT IN IN GND GND 2, 3, 4, 6, and 7 are shorted by a lead frame GND PPC2762/2763 PPC2762/2763 GND PPC2771 PPC2771 VCC VCC OUT OUT IN IN GND GND µPC2762 PC2762 does not have this capacitance 12 Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 GND GND PPC2776 PPC2776 VCC OUT IN GND GND 3.2 External Circuit Description The ICs in this series are designed to supply large current for an internal output stage transistor to obtain higher output. Therefore, RF characteristics are guaranteed by connecting an external element that offers no resistance to DC current and has high impedance in the high-frequency range. Bias-tee type test circuits are most commonly used to simplify testing and obtain reproducibility. In actual use, you should externally connect an inductor between the output pin and VCC pin. By using the external inductor, output port can keep the applied voltage and the impedance at used frequency without dropping both parameters. In addition, by using a wire-wound inductor with a self-resonance frequency close to the used frequency, the return loss on the output side may be improved. For the electrical characteristics test circuit, a bias-tee of approximately 1000nH is used so that high impedance is maintained even in low frequency. If the impedance in the used frequency or above is kept high, the required gain can be obtained even if the inductance value is small. Therefore, the used frequency is allowed to be higher than the self-resonance frequency. The following shows a calculation example for the used frequency f and inductance value L. Zinductor = 2 S fL 1 ZL = 1 Znext + 1 1 Zinductor = 1 Znext + 1 2 S fL Here, the gain is rapidly decreased at the frequency where the Zinductor is smaller than the next stage impedance Znext (50 : for example), and a large gain is obtained at the frequency where the Zinductor is larger than the next stage impedance. Accordingly, the relation between the used frequency and the minimum required inductor is as follows. 2 S fL > 50 (when Znext = 50 :) For example, the calculation of L such that L > 8 nH produces f > 1 GHz. Therefore, to obtain a flat gain for 1 GHz or higher, the inductance value must be larger than 8 nH. Because band is limited by the input/output DC cut capacitor value, determine the capacitance value C based on the following calculation. Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 13 C = 1 2 S x Z x fC When using the IC in the low frequency band, C should be large value, and when using the IC in the high frequency band, C should be small value to secure the gain. 3.3 Temperature Condition The maximum ratings of storage and operating temperatures of ICs are regulated in terms of ambient temperature. The package material is plastic so the thermal conductivity is lower than metal leads, and for this reason, the thermal resistance is defined by junction to ambient (Rth(j-A), rather than case to ambient, which is meaningless in this case. Because the highly heat conductive metal leads (thermal resistance value between the junction and the lead is 30qC/W or smaller) are the determining factor with regard to thermal conductivity, the maximum junction temperature TjMAX becomes equal to the maximum rating of the storage ambient temperature TSTG and the maximum ambient temperature TAMAX becomes equal to the maximum value of the operating ambient temperature TA (The storage temperature in this section means the non-biased temperature where the case temperature and ambient temperature are equal.). The relation between the power dissipation P D and thermal resistance is as follows. Rth (j-A) = TjMAX ð TAMAX (qC) PD@TAMAX (W) The thermal resistance can be calculated since the maximum operating ambient temperature, maximum junction temperature, and power dissipation (at maximum operating ambient temperature) are defined based on the junctionto-ambient thermal resistance listed in the individual data sheet of each product. The PPC1678G/GV PPC1678G/GV have a large circuit current so that they experience temperature rise (heat production) due to IC current loss. This condition can be applied to the above expression. Taking the P PC1678G/GV PC1678G/GV as an example, the thermal resistance value becomes Rth (j-A) = 180qC/W (when mounting IC on 50 u 50 u 1.6 mm double-sided epoxy glass copper-clad board). Because the circuit current is 60 mA MAX. when the small signal input at VCC = 5.0 V: Tj = TA + PD u Rth (j-A) = TA + 5.0 (V) u 0.060 (A) u 180 (qC/W) = TA + 54 (qC) Since to Tj d 150 (qC), TA + 54 (qC) d 150 (qC) ? TA d 96 qC Therefore, the operating ambient temperature, TA = +85qC represents a margin of +11qC taking into account IC heating under these conditions. 14 Application Note P12152EJ3V0AN00 P12152EJ3V0AN00 Figure 3-2. PPC1678G/GV PPC1678G/GV Power Dissipation vs. Ambient Temperature µPC1678G/GV PC1678G/GV (Rth (j-A) = 180°C/W) Power Dissipation PD (mW) 360 Recommended operation range 0 -45 0 +85 +25 +150 Operating Ambient Temperature TA (°C) 4. SAMPLE APPLICATION CHARACTERISTICS Table 4-1 lists sample specifications and characteristics of inductors used for evaluation of application circuits. In this evaluation, evaluation boards with the same dimensions were used to test all the inductors within a product group (Table 4-2). The AMP1 board enables easy calibration using a network analyzer and S parameter measurement that is not affected by the jig input/output line because the input/output line is straight. Table 4-1. Specifications of Inductors Used for Application Evaluation 3URGXFW ,QGXFWDQFH 4 '& UHVLVWDQFH Self-resonance frequency Permissible current 0XUDWD 0IJï &Rïñ /WGï /41ëì$ìí1- ìí Q+ çí 7