SG175/D MPC106A KMPE603E MPE603E MPE603R KMPC603E MPC603E MPC603R MPC740A - Datasheet Archive

 

REV 15 Networking and Computing Systems Group Networking & Communications Systems Division (NCSD) - Personal Computing

 

SG175/D SG175/D REV 15 Networking and Computing Systems Group Networking & Communications Systems Division (NCSD) - Personal Computing Systems Division (PCSD) Product Information First Quarter 2000 PowerPCTM CPUs and Integrated Communications Processors ColdFire® CPUs and Integrated Communications Processors 68K CPUs and Integrated Communications Processors Codecs, Transceiver and Modem Products Advanced Clock Drivers Networking Memory Products EM = Plastic Quad (Gull Wing) FC = Plastic Quad (Gull Wing) FE = Ceramic Quad (Gull Wing) FG = Plastic Quad Flat Pack (PQFP) FN = Plastic Quad Pack (PLCC) FT = Plastic Flat Pack (28 x 28 mm) FU = Plastic Quad Flat Pack (14x14 mm) PB = LQFP (10mm x 10mm) Plastic PU = Thin Quad Flat Pack 100-lead (Plastic) PV = TQFP (20x20 mm) 144-lead (Plastic) RC = Pin Grid Array, Gold Lead Finish RP = Plastic Pin Grid Array RX = CBGA without Lid ZC = GT PAC, 256 Lead ZP = Plastic Ball Grid Array, 357 Lead ZT= Plastic Ball Grid Array, 256 Lead ZU = Tape Ball Grid Array, 352 & 480 Lead 2 © MOTOROLA 1998 PowerPC, ColdFire and 68K CPUs and Integrated Processors 100, 600, and 700 Series PowerPC Processors & Chipsets Standard temp: 0° to +105°C Tj (junction temperature) Device No. Package Speeds Apps Modr Rev Process Voltage Core Voltage IO/tol. SOQ MPQ POQ 106 MPC106A MPC106A MPC106A MPC106A MPC106A MPC106A 304-Lead RX 304-Lead RX 304-Lead RX 66 83 66, 83 C D T G=4.0 G=4.0 G=4.0 HiP 1.4 HiP 1.4 HiP 1.4 3.3±5% 3.3±5% 3.3±5% 3.3/5.0 3.3/5.0 3.3/5.0 1 1 0 1 1 4 55 55 55 EC603e KMPE603E KMPE603E MPE603E MPE603E MPE603E MPE603E MPE603R MPE603R 240-Lead FE 240-Lead FE 255-Lead RX 255-Lead RX 100, 133 100, 133 100, 133 200, 266, 300 L L L L N=4.1 N=4.1 N=4.1 C=2.1 HiP 1.3 HiP 1.3 HiP 1.3 HiP 3.0 3.3±5% 3.3±5% 3.3±5% 2.5±5% 3.3/5.0 3.3/5.0 3.3/5.0 3.3/5.0 2 0 1 1 2 24 1 1 2 24 60 60 603e KMPC603E KMPC603E MPC603E MPC603E MPC603E MPC603E MPC603E MPC603E MPC603E MPC603E MPC603R MPC603R MPC603R MPC603R 240-Lead FE 240-Lead FE 240-Lead FE 255-Lead RX 255-Lead RX 255-Lead RX 255-Lead RX 100, 133 100, 133 100, 133 100, 133 100, 133 200, 266, 300 200, 266 L L T L T L T N=4.1 N=4.1 N=4.1 N=4.1 N=4.1 C=2.1 C=2.1 HiP 1.3 HiP 1.3 HiP 1.3 HiP 1.3 HiP 1.3 HiP 3.0 HiP 3.0 3.3±5% 3.3±5% 3.3±5% 3.3±5% 3.3±5% 2.5±5% 2.5±5% 3.3/5.0 3.3/5.0 3.3/5.0 3.3/5.0 3.3/5.0 3.3/5.0 3.3/5.0 2 0 0 1 0 1 1 2 24 24 1 60 1 1 2 24 24 60 60 60 60 740/750 MPC740A MPC740A MPC740A MPC740A MPC750A MPC750A MPC750A MPC750A XPC740P XPC740P XPC750P XPC750P XPC750P XPC750P XPC750P XPC750P 255-Lead RX 255-Lead RX 360-Lead RX 360-Lead RX 255-Lead RX 360-Lead RX 360-Lead RX 360-Lead RX 200, 233, 266 200, 266 200, 233, 266 200, 266 300, 333 300, 333 400 366 L T L T L L P R H=3.1 H=3.1 H=3.1 H=3.1 E=1.2 E=1.2 E=1.2 E=1.2 HiP 3.0 HiP 3.0 HiP 3.0 HiP 3.0 HiP 3.5 HiP 3.5 HiP 3.5 HiP 3.5 2.6±0.1 2.6±0.1 2.6±0.1 2.6±0.1 1.9±0.1 1.9±0.1 2.05±0.05 2.05±0.05 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 1 0 1 0 1 1 1 1 1 60 1 44 1 1 1 1 60 60 44 44 60 44 44 44 7400 XPC7400 XPC7400 XPC7400 XPC7400 360-Lead RX 360-Lead RX 350, 400, 450, 500 350, 400 P L K=2.9 K=2.9 HiP 5.6 HiP 5.6 2.15±0.05 1.8±0.1 3.3 3.3 1 1 1 1 44 44 KMPC/KXPC = Sample Description 60x to PCI bridge, multiple-processor support, L2 cache controller, memory controller with support for EDO/FPM, DRAM, SDRAM, ROM, and flash ROM. 32-bit PowerPC superscalar MPU (3 instructions per cycle) with dual 16k instruction and data caches, 32and 64-bit external data bus, 2.5- or 3.3-volt core and 3.3-volt I/O. (Not recommended for new designs.) 32-bit PowerPC superscalar MPU (3 instructions per cycle) with dual 16k instruction and data caches, single/double precision IEEE FPU, 32- and 64-bit external data bus, 2.5- or 3.3-volt core and 3.3-volt I/O. 32-bit PowerPC superscalar MPU (3 instructions per cycle) with dual 32k instruction and data caches, single/double precision IEEE FPU, and 64-bit external data bus. The PowerPC 750 also has external L2 cache interface (up to 1 meg) with integrated controller and cache tags. 32-bit PowerPC superscalar MPU (3 instructions per cycle) combined with 128-bit AltiVec technology vector processing implementation, dual 32k instruction and data caches, single/double precision IEEE FPU, and 64-bit external data bus and 32-bit address bus. The MPC 7400 also has external L2 cache interface (up to 2 MB) with integrated controller and cache tags. Apps mods: T = -40°C to 105°C Tj; N = 65°C; P = 65°C; R = 105°C MPC823 MPC823 Integrated PowerPC Microprocessors for Portable Systems Device No. Package Speeds Rev Device Name Temp SOQ MPQ POQ Description 823 XPC823 XPC823 XPC823 XPC823 XPC823E XPC823E 256-Lead ZT 256-Lead ZC 256-Lead ZT 66, 75, 81 66, 75, 81 66, 75 B2 B2 B2 Portable System MPU CZT 66 CZC 66 CZT 66 0 0 0 60 90 60 300 420 300 PowerPC MPU for mobile computing. For sample order-KXPC823ZT81B2, KXPC823ZC81B2 KXPC823ZC81B2, KXPC823EZT75B2 KXPC823EZT75B2 MPC850 MPC850 and MPC860 MPC860 Integrated PowerPC Communications Processors Device No. Package Speeds 850 XPC850 XPC850 XPC850DE XPC850DE XPC850SR XPC850SR 256-Lead ZT 256-Lead ZT 256-Lead ZT 50, 66, 80 50, 66, 80 50, 66, 80 Rev B B B Device Name Low-Cost Integrated PowerPC MPU Temp* (-40 to +85°C) CZT50 CZT50 - TBD SOQ MPQ POQ 0 0 0 60 60 60 300 300 300 Standard temp: 0° to +95°C Tj (junction temperature) BRICK Description Low cost, integrated PowerPC MPU with tailored Communication Processing Module (CPM) including Universal Serial Bus (USB). For sample order-KXPC850SRZT80B 855 XPC855T XPC855T XPC855T XPC855T 357-Lead ZP 357-Lead ZP 50, 66 80 D3 D3 Low-Cost Integrated PowerPC MPU CZP50 CZP50, 66 - 0 0 44 44 220 220 Low cost, integrated PowerPC MPU with tailored Communication Processing Module (CPM) including Fast Ethernet. For sample order-KXPC855TZP66D3, KXPC855TZP80D3 KXPC855TZP80D3 860 rev. B-C XPC860 XPC860 XPC860DC XPC860DC XPC860DE XPC860DE XPC860DH XPC860DH XPC860DT XPC860DT XPC860EN XPC860EN XPC860MH XPC860MH XPC860SR XPC860SR XPC860T XPC860T 357-Lead ZPZP 357-Lead ZPZP 357-Lead ZPZP 357-Lead ZPZP 357-Lead ZPZP 357-Lead ZPZP 357-Lead ZPZP 357-Lead ZPZP 357-Lead ZPZP 33, 50, 66 33, 50, 66 33, 50, 66 33, 50, 66 50 33, 50, 66 33, 50, 66 33, 50, 66 33, 50 C.1 C.1 C.1 C.1 B.3/B.5 C.1 C.1 C.1 B.3/B.5 PowerQUICCTM PowerPC MPU CZP 33, 50 CZP 33, 50 CZP 33, 50 CZP 33, 50 CZP 50 CZP 33, 50 CZP 33, 50 CZP 33, 50 CZP 33, 50 0 0 0 0 0 0 0 0 0 44 44 44 44 44 44 44 44 44 220 220 220 220 220 220 220 220 220 PowerQUICC family with embedded PowerPC superscalar MPU -with 4KB I-cache, 4 KB D-cache, and MMUs integrated with Communication Processing Module (CPM) of earlier generation 68360 QUICC.TM For sample order-KXPC860, KXPC860DC KXPC860DC, KXPC860DE KXPC860DE, KXPC860DH KXPC860DH, KXPC860DP KXPC860DP , KXPC860DT KXPC860DT, KXPC860EN KXPC860EN, KXPC860MH KXPC860MH, KXPC860P KXPC860P KXPC86SR KXPC86SR, KXPC860T KXPC860T. , 3 MPC850 MPC850 and MPC860 MPC860 Integrated PowerPC Communications Processors Device No. Package Speeds 860 rev. D XPC860DE XPC860DE XPC860DP XPC860DP XPC860DT XPC860DT XPC860EN XPC860EN XPC860P XPC860P XPC860SR XPC860SR XPC860T XPC860T 357-Lead ZP 357-Lead ZP 357-Lead ZP 357-Lead ZP 357-Lead ZP 357-Lead ZP 357-Lead ZP 50, 66, 80 50, 66, 80 50, 66, 80 50, 66, 80 50, 66, 80 50, 66, 80 50, 66, 80 Rev D.3 D.3 D.3 D.3 D.3 D.3 D.3 Temp* (-40 to +85°C) Device Name PowerQUICCTM PowerPC MPU Standard temp: 0° to +95°C Tj (junction temperature) SOQ MPQ POQ 0 0 0 0 0 0 0 44 44 44 44 44 44 44 220 220 220 220 220 220 220 CZP 50, 66 CZP 50, 66 CZP 50, 66 CZP 50, 66 CZP 50, 66 CZP 50, 66 CZP 50, 66 BRICK Description Revision D.3 of PowerQUICC family, including the 860P and 860 DP with 16K I-cache and 8K D-cache. For sample order-KXPC860PZP66D3, KXPC860PZP80D3 KXPC860PZP80D3, KXPC860TZP66D3 KXPC860TZP66D3, KXPC860TZP80D3 KXPC860TZP80D3. MPC850/MPC860 MPC850/MPC860 Processor Derivatives Device 850 850DE 850DE 850SR 850SR 860 860DC 860DC 860DE 860DE 860DH 860DH 860DP 860DP 860DT 860DT 860EN 860EN 860MH 860MH 860P 860SR 860SR 860T SCCs 1 2 2 4 2 2 2 2 2 4 4 4 4 4 Ethernet Yes Yes Yes - SCC1 Yes Yes 10/100 10/100 Yes Yes 10/100 Yes 10/100 ATM - - Yes - - - - Yes Yes (D.3) - - Yes Yes Yes (D.3) USB Yes Yes Yes - - - - - - - - - - - MHDLC - - Yes - - - Yes Yes Yes - Yes Yes Yes Yes PCMCIA 1 1 1 2 2 2 2 2 2 2 2 2 2 2 MPC8240 MPC8240 Integrated PowerPC Processors Standard temp: 0° to +105°C Tj (junction temperature) Device No. Package Speeds Apps Modr Rev Process Voltage Core Voltage IO/tol. 8240 XPC8240 XPC8240 XPC8240 XPC8240 KXPC8240 KXPC8240 KXPC8240 KXPC8240 352-Lead ZU 352-Lead ZU 352-Lead ZU 352-Lead ZU 200 250 200 250 L R L R C=1.1.1 C=1.1.1 C=1.1.1 C=1.1.1 HiP 3.0 HiP 3.0 HiP 3.0 HiP 3.0 2.5 ± 5% 2.625 ± .125 V 2.5 ± 5% 2.625 ± .125 V 3.3/5.0 3.3/5.0 3.3/5.0 3.3/5.0 KXPC = Sample SOQ MPQ POQ 0 0 2 2 24 24 2 2 Description 24 24 2 2 32-bit superscalar PowerPC processor core with integrated peripheral logic. Supports up to 100 MHz 64-bit memory interface and up to 66 MHz 32-bit PCI interface. Apps mods: L /R= 105°C Tj MPC8260 MPC8260 PowerQUICC IITM Integrated PowerPC Processors Device No. Package Speeds Rev Device Name Temp 8260 XPC8260 XPC8260 480-Lead ZU 133, 150, 166, 200 A PowerQUICC II PowerPC MPU - SOQ MPQ POQ Description 0 21 105 Next-generation of PowerQUICC product family For sample order-KXPC8260ZU133A, KXPC8260ZU150A KXPC8260ZU150A, KXPC8260ZU166A KXPC8260ZU166A, KXPC8260ZU200A KXPC8260ZU200A 68K Stand-Alone CPUs Device No. Package Speeds MC68EC000 MC68EC000 68-Lead FN 64-Lead FU 8, 10, 12, 16, 20 8, 10, 12, 16, 20 Rev Device Name Temp* (-40 to +85°C) MPQ POQ BRICK 0 0 8-/16-/32-Bit HCMOS Embedded MPU SOQ 18 84 1008 252 420 Description Low-cost embedded control MPU with 8-/16-bit selectable data bus. For FN, FU sample order-SPAKEC000FNXX, SPAKEC000FUXX SPAKEC000FUXX MC68HC000 MC68HC000 68-Lead FN, 68-Lead RC 8, 10, 12, 16, 20 8, 10, 12, 16 HCMOS 16-/32-Bit MPU CFN8, 10, 12, 16 CRC8, 10, 12, 16 5 0 0 5 78 21 160 780 210 Completely pin and timing MC68000-compatibility with a tenth of the power dissipation. For FC, FN, P RC sample order-SPAKHC000FCXX, SPAKHC000FNXX SPAKHC000FNXX, SPAKHC000PXX SPAKHC000PXX, , SPAKH000RCXX SPAKH000RCXX* MC68HC001 MC68HC001 68-Lead FN, 68-Lead RC 8, 10, 12, 16, 8, 10, 12, 16 Staticlly Switchable 8-/16-Bit Data Bus CFN8, 10 CRC8 MC68SEC000 MC68SEC000 64-Lead FU, 68-Lead PB 10, 16, 20 10, 16, 20 8-/16-/32-Bit Static HCMOS Embedded MPU 0 0 CFN8, 10 CRC8 18 21 1008 210 Functionally compatible with MC68000 MC68000 and MC68008 MC68008. For FN, RC sample order-SPAKHC001FNXX, SPAKHC001RCXX SPAKHC001RCXX* 0 1 84 1 252 1 Static version of the MC68EC000 MC68EC000. For FU sample order-SPAKSEC000FUXX 4 68K Stand-Alone CPUs (Continued) Device No. Package Speeds MC68020 MC68020 114-Lead RC 132-Lead FE 114-Lead RP 132-Lead FC 12, 16, 20, 25, 33 16, 20, 25, 33 16, 20, 25 16, 20, 25, 33 100-Lead FG 100-Lead RP Rev 16, 25 16, 25 E E E E Device Name Temp* (-40 to +85°C) 32-Bit MPU CRC16 CRC16, 20, 25 CRP16 CRP16 CFC16 CFC16, 25 SOQ MPQ POQ 1 0 1 0 1 36 1 36 14 180 13 144 BRICK 180 Description Complete 32-bit MPU. 5-Gbyte linear address space. Coprocessor interface. Instruction cache. Dynamic bus sizing. Excellent MPU for graphics control. On-chip cache speeds drawing algorithms. Bit field support for pixel manipulation. (RP and FE packages not recommended for new designs.) For FC, FE sample order-SPAK020FCXXE, SPAK020FEXXE SPAK020FEXXE, SPAK020RCXXE SPAK020RCXXE MC68EC020 MC68EC020 32-Bit Embedded MPU CFG16 CFG16 CRP25 CRP25 0 1 66 1 264 13 330 32-bit data bus MPU with 24-bit address bus. Instruction cache. Dynamic bus sizing. Coprocessor interface. Low-cost packaging. (RP packages not recommended for new designs.) For FG sample order-SPAKEC020FGXX MC68030 MC68030 128-Lead RC 124-Lead RP 132-Lead FE 16,20,25,33,40,50 16,20,25,33 16,20,25,33 C C C Enhanced 32-Bit MPU CRC25 CRC25,33 CRP16 CRP16,20,25,33 1 1 0 1 1 36 Complete 32-bit MPU with on-chip instruction and data caches, internal parallel buses, enhanced bus controller, and on-chip MMU. (RP packages not recommended for new designs.) 14 14 180 For FE sample order-SPAK030FEXXC, SPAK030RCXXC SPAK030RCXXC MC68EC030 MC68EC030 124-Lead RP 132-Lead FE 25, 40 25, 40 C C Embedded MPU MC68040 MC68040 179-Lead RC 184-Lead FE 25, 33, 40 25, 33, 40 32-Bit MPU MMU FPU MC68EC040 MC68EC040 179-Lead RC 184-Lead FE 20, 25, 33, 40 20, 25, 33, 40 CRP25 CRP25 Embedded 32-Bit High Performance Processor 1 1 1 36 14 180 32-bit MPU for embedded applications. On-chip instruction and data caches provide high-speed access for control routines and data. Utilizes low-cost DRAM bus interface. (RP packages not recommended for new designs.) For FE, PV sample order-SPAKEC030FEXXC, SPAKEC030PVXXC SPAKEC030PVXXC 1 0 1 24 10 96 Complete 32-bit MPU with on-chip instruction/data caches (4k bytes each). On-chip MMU. Full IEEE floating point, multiprocessing support with full M68000 M68000 Family compatibility. For FE sample order-SPAK040FEXX 1 0 1 24 10 96 120 High-performance 32-bit MPU with on-chip instruction and data cache provides high-speed access for control routines and data. Utilizes low-cost DRAM bus interface. For sample order-SPAK68EC040RCXX, SPAKEC040FEXX SPAKEC040FEXX, SPAKEC040FSXX SPAKEC040FSXX MC68LC040 MC68LC040 179-Lead RC 184-Lead FE 20, 25, 33, 40 20, 25, 33, 40 High Performance 32Bit Processor MC68040V MC68040V 179-Lead RC 184-Lead FE 25, 33,40 @ 3.3 V 25,33 @ 3.3 V 1 0 32-Bit MPU MMU, Low-Voltage 1 24 10 96 120 68040-compatible integer unit and MMU. Ideal solution for cost-sensitive computer or sophisticated embedded applications. For FE sample order-SPAKLC040FEXX 1 0 1 24 0 96 Low-voltage complete 32-bit MPU with on-chip instruction/ data caches (4k bytes each). On-chip MMU. Multiprocessing support. For FE sample order-SPAKEC040VFEXX, SPAKEC040VRCXX SPAKEC040VRCXX MC68060 MC68060 206-Lead RC 50, 60 Superscalar 32-Bit Processor 0 1 10 RISC hybrid superscalar MPU with full M68000 M68000 Family compatibility. Includes dual integer units, on-chip instruction/ data caches (8K bytes each), on-chip MMU, and full IEEE compliant FPU. For RC sample order-SPAK060RC60 MC68EC060 MC68EC060 206-Lead RC 304-Lead ZU 50, 66, 75 50, 66, 75 Superscalar 32-Bit Processor 0 1 1 27 10 27 RISC hybrid superscalar MPU with full M68000 M68000 Family compatibility. Includes dual integer units, on-chip instruction/data caches (8K bytes each). Ideal for high-performance embedded control applications. For RC sample order-SPAKEC060RC50, SPAKEC060RC60 SPAKEC060RC60, SPAKEC060RC75 SPAKEC060RC75 MC68LC060 MC68LC060 206-Lead RC 50, 66, 75 Superscalar 32-Bit Processor 0 1 10 RISC hybrid superscalar MPU with full M68000 M68000 Family compatibility. Includes dual integer units, on-chip instruction/data caches (8K bytes each) and on-chip MMU. For RC sample order-SPAKLC060RC50, SPAKLC060RC60 SPAKLC060RC60, SPAKLC060RC75 SPAKLC060RC75 MC68882 MC68882 68-Lead RC 68-Lead FN 16,20,25,33,40,50 16,20,25,33,40 A A Enhanced FloatingPoint Coprocessor (EFPCP) CRC16 CRC16,20,25,33 CFN16 CFN16,20,25,33 1 1 1 1 21 18 Pin-to-pin timing and software compatibility with MC68881 MC68881. Dual ported registers and increased pipelining allows 2-4 × performance of MC68881 MC68881. For RC sample order-SPAK68882RC16A, SPAK68882RC20A SPAK68882RC20A, SPAK68882RC25A SPAK68882RC25A, SPAK68882RC33A SPAK68882RC33A For CRC sample order-SPAK68882CRC16A, SPAK68882CRC20A SPAK68882CRC20A, SPAK68882CRC25A SPAK68882CRC25A, SPAK68882RC33A SPAK68882RC33A For CFN sample order-SPAK68882CFN16A, SPAK68882CFN20A SPAK68882CFN20A, SPAK68882CFN25A SPAK68882CFN25A, SPAK68882CFN33A SPAK68882CFN33A * Extended temperature devices with minimum order requirements. 5 68K General-Purpose Integrated Processors Device No. Package Speeds MC68306 MC68306 132-Lead FC 144-Lead PV 16, 20 16, 20 Rev B B Device Name Integrated EC000 EC000 Processor Temp* (-40 to +85°C) SOQ POQ Brick Description 0 0 CFC16 CFC16 MPQ 36 60 144 600 300 68000 CPU, 68681 DUART, DRAM control all in one chip. For FC, PV sample -SPAK306FCXXB -SPAK306FCXXB, SPAK306PVXXB SPAK306PVXXB MC68340 MC68340 MC68340V MC68340V 144-Lead FE 144-Lead PV 144-Lead FT 144-Lead FE 144-Lead PV 16, 25 16, 25 16, 25 16 @ 3.3V 16 @ 3.3V E E E E E Integrated Processor with DMA 0 0 0 0 0 CFE16 CFE16, CFE25 CFE25 CPV16 CPV16, CPV25 CPV25 CFT16 CFT16, CFT25 CFT25 24 60 24 24 60 96 60 96 96 60 120 300 120 CPU32 CPU32 core processor for data movement applications. Two channel DMA, two serial channels, two timers, chip selects, wait-state generation, and glue logic. MC68340V MC68340V is the 3.3 volt version of the MC68340 MC68340. (FE package not recommended for new designs.) For PV sample order-KMC68EN302PV25B Note: *Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid - consult factory to verify. 68K Integrated Communications Processors Device No. Package Speeds MC68302 MC68302 132-Lead RC 132-Lead FC 144-Lead PV 144-Lead PV 16, 20, 25 16, 20, 25 16, 20, 25, 33 16 @ 3.3V MC68302V MC68302V Rev Device Name Temp* (-40 to +85°C) C C C C Integrated Multiprotocol Processor (IMP) CRC16 CRC16, 20 CFC16 CFC16, 20 CPV16 CPV16 CPV16V CPV16V SOQ MPQ POQ Brick Description 0 0 0 0 14 36 60 60 14 144 300 300 180 300 300 68000 core with three high-performance multiprotocol serial channels also on-chip DMA, RAM, timers, I/O, chip select, and wait state interrupt controller. For FC, PV sample order-SPAK302FCXXC, SPAK302PVXXC SPAK302PVXXC MC68EN302 MC68EN302 XC68LC302 XC68LC302 XC68LC302V XC68LC302V 144-Lead PV 100-Lead PU 20, 25 16, 20, 25 @ 5V 16, 20 @ 3.3V B B B Integrated Multiprotocol Processor with Ethernet Controller Low-Cost Integrated Multiprotocol Processor 0 CPV20 CPV20 CPU16 CPU16, 20 CPU16V CPU16V 60 300 300 Full 68302, plus separate IEEC 802.3 ethernet MAC channel and full DRAM controller For PV sample order-KMC68EN302PV25B 0 84 420 420 Static EC000 EC000 Core Processor with two high-performance multiprotocol serial channels; also on-chip DMA, RAM, timers, I/O, chip selects, and wait state interrupt controller. For PU sample order-SPAKLC302PUXXB MC68QH302 MC68QH302 MC68360 MC68360 MC68360V MC68360V MC68EN360 MC68EN360 MC68EN360V MC68EN360V 144-Lead PV 240-Lead EM 357-Lead ZP 241-Lead RC 240-Lead EM 357-Lead ZP 240-Lead EM 357-Lead ZP 241-Lead RC 240-Lead EM 357-Lead ZP 16, 20, 25 25,33 @ 5.0V 25 @ 3.3V 25, 33 @ 5.0V 25 @ 3.3V C K K K L L K K K L L Quad-HDLC Integrated Multiprotocol Processor QUICCTM QUad Integrated Communications Controller 0 60 300 300 68302 derivative with support for up to four HDLC transparent channels. Pin compatible with 68302. For PV sample order-SPAKQH302PVXXC 0 0 0 0 0 0 0 0 0 0 CEM25 CEM25 CZP25 CZP25 CRC25 CRC25 CEM25 CEM25 CZP25 CZP25 CRC25 CRC25 24 44 10 24 44 24 44 10 24 44 120 220 10 120 220 120 220 10 120 220 CPU32 CPU32 + core with System Integration Module (SIM) and four high-performance SCCs support numerous protocols. Two SCCs support Ethernet on "EN" version. For EM sample order-SPAK360EMXXK, SPAKEN360EMXXK SPAKEN360EMXXK, SPAK360EM25VL SPAK360EM25VL, SPAKEN360EM25VL SPAKEN360EM25VL For ZP sample order-SPAK360ZPXXK, SPAKEN360ZPXXK SPAKEN360ZPXXK, SPAK360ZP25VL SPAK360ZP25VL, SPAKEN360ZP25VL SPAKEN360ZP25VL MC68MH360 MC68MH360 MC68MH360 MC68MH360 V 240-Lead EM 357-Lead ZP 241-Lead RC 240-Lead EM 357-Lead ZP 25,33@5.0V 25@3.3V K K K L L Multichannel HDLC Controller 0 0 0 0 0 CEM25 CEM25 CZP25 CZP25 CRC25 CRC25 24 44 10 24 44 120 220 10 120 220 One-chip integrated microprocessor and peripheral combination with four SCCs, two serial management controllers (SMCs) and one serial peripheral interface (SPI). For MH sample order-SPAKMH360EMXXK, SPAKMH360EMXXVL SPAKMH360EMXXVL, SPAKMH360RLXXK SPAKMH360RLXXK, SPAKMH360ZPXXK SPAKMH360ZPXXK, SPAKMH360ZPXXVL SPAKMH360ZPXXVL MC68606 MC68606 84-Lead FN 12, 16 C MC68824 MC68824 84-Lead FN 10, 12, 16 H 1 Token Bus Controller (TBC) 1 15 Implements CCITT Q.920/Q 920/Q.921 link access procedure (LAPB) specified at ISO level 2 for both signaling and data applications in an ISDN. 1 CFN12 CFN12, 16 1 15 Implements IEEE 802.4 Token Bus Media Access Control which GM MAP specifies in layer 2. Manages access to media, fault recovery, and frame formatting. Runs at speeds down to 10 Kb/s. Note: *Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid - consult factory to verify. 6 ColdFireTM Processors Device No. Package Speeds Rev Device Name MCF5102 MCF5102 144-Lead PV 20, 25, 33, 40 B MCF5202 MCF5202 100-Lead PU Embedded 68K/ColdFire MPU 16, 25, 33 B Embedded 68K/ColdFire MPU Temp* (-40 to +85°C)* SOQ MPQ POQ 0 60 BRICK Description 240 ColdFire microprocessor designed for cost-sensitive embedded control applications. In addition to executing ColdFire code, this first family member is designed with additional capabilities that allow it to execute existing M680x0 code. Processor includes on-chip instruction/data caches (2K/1K respectively). For PV sample order-SPAK5102PVXXB CPU25B CPU25B 0 90 420 ColdFire microprocessor designed for cost-sensitive embedded control applications. This member features a 2K unified cache. For PU sample order-SPAK5202PUXXA MCF5204 MCF5204 MCF5206 MCF5206 100-Lead PU 16, 25, 33 160-Lead FT 16, 25, 33 Embedded Integrated 68K/ColdFire MPU CPU25B CPU25B Embedded Integrated 68K/ColdFire MPU B 0 CFT16 CFT16 CFT25 CFT25 90 84 ColdFire microprocessor designed for cost-sensitive embedded control applications with UART, 2 timers. For PU sample order-SPAK5204PUXXA 0 24 120 ColdFire microprocessor designed for cost-sensitive embedded control applications with UART, 2 timers, DRAM controller. For FT sample order-SPAK5206FTXX XCF5206e 160-Lead FT 40, 54 Embedded Integrated 68K/ColdFire MPU CFT40 CFT40 24 24 120 Enhanced, pin-compatible version of 5206 with larger caches and SRAM, 2 UARTs, 2 timers, DMA, MAC, HW Divide. 3.3V with 5V-tolerant I/O. For sample order - SPAK5206EFTXX SPAK5206EFTXX, SPAK5206ECFT40 SPAK5206ECFT40 XCF5307 XCF5307 208-Lead FT 66, 90 B Embedded Integrated 68K/ColdFire MPU CFT66 CFT66 0 90 120 ColdFire Version 3 microprocessor with Multiply-Accumulate (MAC) unit, SDRAM Controller, DMA Controller, 2 UARTs, and 2 timers. For FT sample order - SPAK5307FTXX SPAK5307FTXX * Extended temperature devices with minimum order requirements. Communications Application-Specific Standard Products (CASSP) ADSL - CopperGoldTM Asymmetric Digital Subscriber Line System Device Description Leads-Package Samples Production Document # Now Note 1 MC145650 MC145650 ADSL Transceiver 144-Lead CQFP 144-Lead BGA , Now MC145660 MC145660 ADSL Transceiver with Integrated ATM TC 193-Lead BGA 1Q 2000 2Q 2000 Note 1 MS143462SK MS143462SK V.90/G.lite Modem Chipset N/A Now Now Note 1 Note 1. For details or preliminary document, contact your NCSD regional marketing representative. Note 2. Information is available from the CTAS website at http://www.motorola.com/ctasd Analog Modem Chipset Description Leads-Package Samples Production Document # MS143450SK MS143450SK External/Embedded Modem N/A Now Now MS143450SKPP/D MS143450SKPP/D MS143455SK MS143455SK PCI Controller-less Modem N/A Now Now MS143455SKPP/D MS143455SKPP/D Device Description Leads-Package Samples Production Document # MC14LC5447 MC14LC5447 Calling Line I.D. Receiver with Ring Detector 16-Lead PDIP 16-Lead SOG , Now Now MC14LC5447/D MC14LC5447/D Calling Line I.D. DTMF Transceiver Device Description Leads-Package Samples Production Document # MC145740 MC145740 DTMF Transceiver 20-SOEIAJ 20-SOEIAJ Now Now MC145740/D MC145740/D 7 Interface Device Description Leads-Package Samples Production Document # MC145403 MC145403 EIA-232/V EIA-232/V.28 CMOS Driver/Receiver, 3 x 5 20-Lead PDIP 20-Lead SOG , Now Now MC145403/D MC145403/D MC145404 MC145404 EIA-232/V EIA-232/V.28 CMOS Driver/Receiver, 4 x 4 20-Lead PDIP 20-Lead SOG , Now Now MC145403/D MC145403/D MC145405 MC145405 EIA-232/V EIA-232/V.28 CMOS Driver/Receiver, 5 x 3 20-Lead PDIP 20-Lead SOG , Now Now MC145403/D MC145403/D MC145406 MC145406 EIA-232/V EIA-232/V.28 CMOS Driver/Receiver, 3 x 3 16-Lead PDIP 16-Lead SOG, 16-Lead SSOP , Now Now MC145406/D MC145406/D MC145407 MC145407 EIA-232/V EIA-232/V.28 CMOS Driver/Receiver, 5 V Only, 3 x 3 20-Lead PDIP 20-Lead SOG , Now Now MC145407/D MC145407/D MC145408 MC145408 EIA-232/V EIA-232/V.28 CMOS Driver/Receiver, 5 x 5 24-Lead SOG Now Now MC145403/D MC145403/D MC145583 MC145583 3.3 V ­ 5.0 V EIA-232/V EIA-232/V.28 CMOS Transceiver, 3 x 5 28-Lead SSOP Now Now MC145583/D MC145583/D Device Description Leads-Package Samples Production Document # MC14LC5472 MC14LC5472 ISDN U-Interface Transceiver (NRFND) 68-Lead CQFP 68-Lead PQFP , Now Now MC145472/D MC145472/D MC145572 MC145572 ISDN U-Interface Transceiver II 44-Lead PLCC, 44-Lead TQFP Now Now MC145572/D MC145572/D MC145572A MC145572A ISDN U-Interface Transceiver II with Micro Interruptions Feature 44-Lead PLCC, 44-Lead TQFP Now Now Note 1 MC145574A MC145574A ISDN S/T-Interface Transceiver II 28-Lead SOG, 32-Lead TQFP Now Now MC145574/D MC145574/D MC145576 MC145576 ISDN Single-Chip NT1 44-Lead TQFP Now Now Note 2 ISDN Note 1. For details or preliminary document, contact your NCSD regional marketing representative. Note 2. Information is available from the CTAS website at http://www.motorola.com/ctasd Modem Functions Device Description Leads-Package Samples Production Document # MC145442 MC145442 300-Baud CCITT V.21 Single-Chip Modem 20-Lead PDIP 20-Lead SOG , Now Now MC145442/D MC145442/D MC145443 MC145443 300-Baud Bell 103 Single-Chip Modem 20-Lead PDIP 20-Lead SOG , Now Now MC145442/D MC145442/D MC145744 MC145744 Dual Mode 300-/1200-Baud V.21/V.23 Single-Chip Modem with DTMF Transceiver 28-Lead SOG Now Now Note 1 28-Lead SOG Now Now MC145745/D MC145745/D 44-Lead LQFP Now Now Note 1 MC145745 MC145745 MC145746 MC145746 Low-Voltage Dual Mode 300-/1200-Baud V.21/V.23 Single-Chip Modem with DTMF Transceiver Note 1. For details or preliminary document, contact your NCSD regional marketing representative. Note 2. Information is available from the CTAS website at http://www.motorola.com/ctasd Multi-Channel Infrastructure Modems (MIMs) Device Description Leads-Package Samples MS143457SK MS143457SK Multichannel Infrastructure Modem N/A Call Marc Davidson (N. America) at 512-934-7676 OR Bruce Given (Europe) at 44 1355 565 226. Note 1. For details or preliminary document, contact your NCSD regional marketing representative. Production Document # Note 1 Note 2. Information is available from the CTAS website at http://www.motorola.com/ctasd Universal Digital Loop Transceivers Device Description Leads-Package Samples Production Document # MC145421 MC145421 Provides synchronous full-duplex 160 Kbps voice and data communication in a 2B+2D format for ISDN compatibility on a single twisted pair up to 1 km. Single 5 V power supply, protocol independent. 24-Lead PDIP 24-Lead SOG , Now Now MC145421/D MC145421/D Now Now MC145421/D MC145421/D Provides synchronous full-duplex 80 Kbps voice and data communication in a 1B+1D format on a single twisted pair up to 2 km. Single 5 V power supply, protocol independent. 22-Lead PDIP 24-Lead SOG , Now Now MC145422/D MC145422/D Now Now MC145422/D MC145422/D MC145425 MC145425 MC145422 MC145422 MC145426 MC145426 8 Voice and Data Coding Device Description Leads-Package Samples Production Document # MC143416 MC143416 Dual 16-Bit Linear Codec-Filter 44-Lead TQFP Now Now MC143416/D MC143416/D MC14LC5480 MC14LC5480 5 V PCM Codec-Filter 20-Lead PDIP 20-Lead SOG, , 20-Lead SSOP 20-Lead TSSOP , Now Now MC14LC5480/D MC14LC5480/D MC145481 MC145481 3 V PCM Codec-Filter 20-Lead SOG, 20-Lead SSOP , 20-Lead TSSOP Now Now MC145481/D MC145481/D MC145482 MC145482 5 V Linear Codec-Filter Now Now MC145482/D MC145482/D MC145483 MC145483 3 V Linear Codec-Filter Now Now MC145483/D MC145483/D MC145484 MC145484 5 V PCM Codec-Filter Now Now MC145484/D MC145484/D MC145502 MC145502 PCM Codec-Filter 28-Lead PQCC, 22-Lead PDIP Now Now MC145500/D MC145500/D MC145503 MC145503 PCM Codec-Filter 16-Lead SOG, 16-Lead PDIP Now Now MC145500/D MC145500/D MC145500/D MC145500/D MC145505 MC145505 MC145506 MC145506 PCM Mono-Circuit 16-Lead PDIP Now Now Note 1 MC14LC5540 MC14LC5540 3 V ADPCM (MC145540 MC145540 Replacement) 28-Lead PDIP 28-Lead SOG, 32-Lead QFP , Now Now Note 1 (see MC145540/D MC145540/D) MC145554 MC145554 PCM Codec-Filter (TP3054 TP3054 Compatible) 16-Lead SOG, 16-Lead PDIP Now Now MC145554/D MC145554/D MC145557 MC145557 PCM Codec-Filter (TP3057 TP3057 Compatible) 16-Lead SOG, 16-Lead PDIP Now Now MC145554/D MC145554/D MC145564 MC145564 PCM Codec-Filter (TP3064 TP3064 Compatible) 20-Lead SOG, 20-Lead PDIP Now Now MC145554/D MC145554/D MC145567 MC145567 PCM Codec-Filter (TP3067 TP3067 Compatible) 20-Lead SOG, 20-Lead PDIP Now Now MC145554/D MC145554/D MS140131KT MS140131KT Short Loop Dual PCM Codec-Filter/SLIC Chipset with GCI N/A Now Now MS140131KT/D MS140131KT/D MS140132KT MS140132KT Short Loop Dual PCM Codec-Filter/SLIC Chipset with SPI N/A 1Q 2000 2Q 2000 Note 1 Note 1. For details or preliminary document, contact your NCSD regional marketing representative. Note 2. Information is available from the CTAS website at http://www.motorola.com/ctasd Communications Application-Specific Standard Products (CASSP) System Development Tools Device MC143450RDK1 MC143450RDK1 MC143450RDK2 MC143450RDK2 MC143455RDK1 MC143455RDK1 MC143455RDK2 MC143455RDK2 MC143462RDK MC143462RDK MC145460EVK MC145460EVK Description Key Device Calling Line I.D. Receiver Evaluation Kit Note 2 Now Note 2 Now Note 1 MC14LC5447 MC14LC5447 CopperGold Lite Reference Design Kit Note 2 Now MC143462SK MC143462SK PCI Controller-less Modem Reference Design Kit (Europe) Note 2 Now MS143455SK MS143455SK PCI Controller-less Modem Reference Design Kit (North America) MS143450SK MS143450SK MS143455SK MS143455SK External/Embedded Modem Reference Design Kit (Europe) Document # Now MS143450SK MS143450SK External/Embedded Modem Reference Design Kit (North America) Production Now MC145460EVK/D MC145460EVK/D MC14LC5480EVK/D MC14LC5480EVK/D MC14LC5480EVK MC14LC5480EVK PCM Codec-Filter Evaluation Kit MC14LC5480 MC14LC5480, MC145481 MC145481, MC145482 MC145482, MC145483 MC145483, MC145484 MC145484 Now MC145537EVK MC145537EVK ADPCM Codec Evaluation Kit MC14LC5540 MC14LC5540 Now MC145537EVK/D MC145537EVK/D MC145572EVK MC145572EVK ISDN U-Interface Transceiver Evaluation Kit MC145572 MC145572 Now Note 1 MC145574EVK MC145574EVK ISDN S/T-Interface Transceiver Evaluation Kit MC145574 MC145574 Now Note 1 MC145576EVK MC145576EVK ISDN Single-Chip NT1 Evaluation Kit MC145576 MC145576 Now Note 1 MC145576DRV MC145576DRV Driving Board for the MC145576EVK MC145576EVK for Smart NT1 Evaluation MC145576 MC145576 Now Note 1 MC145650EVS MC145650EVS ADSL Evaluation System MC145650 MC145650 Now Note 1 MC145650RDK5 MC145650RDK5 ADSL System Developer's Kit MC145650 MC145650 Now Note 1 MC145650CSW MC145650CSW ADSL Control Software MC145650 MC145650 Now Note 1 HipsterTM Hipster Reference Design for SOHO Router MC145572 MC145572, MC145574 MC145574, MPC850DH MPC850DH Now Note 1 Note 1. For details or preliminary document, contact your NCSD regional marketing representative. Note 2. Information is available from the CTAS website at http://www.motorola.com/ctasd 9 Timing Solutions Advanced Clock Driver Products Device No. Description Output Level Max. Output to Output Skew* Max. Output (MHz) Q Output Q' Output Packages Status MC88915FN55 MC88915FN55 Low Skew CMOS PLL Clock Driver CMOS 0.5 13.75, 27.5, 55 7 1 28 PLCC NOW MC88915FN70 MC88915FN70 Low Skew CMOS PLL Clock Driver CMOS 0.5 17.5, 35, 70 7 1 28 PLCC NOW MC88915T MC88915T Low Skew CMOS PLL Clock Drivers, 3-State CMOS 0.5 33, 66, 133, 160 7 1 28 PLCC NOW MC88916 MC88916 Low Skew CMOS PLL Clock Driver With Processor Reset CMOS 0.5 20, 40, 80 5 1 20 SOIC NOW MC88920 MC88920 Low Skew CMOS PLL Clock Driver With Power Down/Up CMOS 0.5 12.5, 25, 50 5 1 20 SOIC NOW MC88921 MC88921 Low Skew CMOS PLL Clock Driver With Power Down/Up CMOS 0.5 80 2 1 20 SOIC NOW MC88LV915T MC88LV915T Low Voltage Low Skew CMOS PLL Clock Driver 3-State LVCMOS 0.5 100 7 1 28 PLCC NOW MC88LV926 MC88LV926 Low Skew CMOS PLL 68060 Clock Driver LVCMOS 0.5 66 4 1 20 SOIC NOW MPC905 MPC905 1:6 PCI Clock Generator/Fanout Buffer LVCMOS 0.4 66 6 - 16 SOIC NOW MPC930/931 MPC930/931 Low Voltage PLL Clock Driver LVCMOS 0.5 125 5 - 32 LQFP NOW MPC932 MPC932 Low Voltage PLL Clock Driver LVCMOS 0.6 120 6 - 32 LQFP NOW MPC940L MPC940L Low Voltage 1:18 Clock Distribution Chip LVCMOS 0.25 200 18 - 32 LQFP NOW MPC941 MPC941 Low Voltage 1:27 Clock Distribution Chip LVCMOS 0.25 200 27 - 48 LQFP 2Q00 MPC942C MPC942C Low Voltage Fan Out Buffer LVCMOS 0.25 250 ps 18 - 52 QFP NOW MPC942P MPC942P Low Voltage Fan Out Buffer LVCMOS 0.25 250 ps 18 - 52 QFP NOW MPC947 MPC947 Low Voltage 1:9 Clock Distribution Chip LVCMOS 0.5 100 9 - 32 LQFP NOW MPC948 MPC948 Low Voltage 1:12 PECL To CMOS Clock Driver LVCMOS 0.35 150 12 - 32 LQFP NOW MPC948L MPC948L Low Voltage 1:12 PECL To CMOS Clock Driver LVCMOS 0.35 150 12 - 32 LQFP NOW MPC949 MPC949 Low Voltage 1:15 PECL To CMOS Clock Driver LVCMOS 0.35 150 15 - 52 LQFP NOW MPC950/951 MPC950/951 Low Voltage PLL Clock Driver LVCMOS 0.35 200 9 - 32 TQFP NOW MPC952 MPC952 Low Voltage PLL Clock Driver LVCMOS 0.35 180 11 - 32 TQFP NOW MPC953 MPC953 Low Skew PLL Zero Delay Buffer LVCMOS 0.15 120 9 - 32 LQFP NOW MPC954 MPC954 Low Voltage CMOS Zero Delay Buffer LVCMOS 0.2 120 11 - 24 TSSOP 1Q00 MPC958 MPC958 Low Skew PLL Zero Delay Buffer LVCMOS 0.2 200 11 - 32 QFP 1Q00 MPC961C MPC961C Low Skew CMOS Zero Delay Buffer LVCMOS 0.15 200 18 - 32 QFP 1Q00 MPC961P MPC961P Low Skew CMOS Zero Delay Buffer LVCMOS 0.15 200 18 - 32 QFP 1Q00 MPC972/973 MPC972/973 Low Voltage PLL Clock Driver LVCMOS 0.35 180 14 - 52 TQFP NOW MPC974 MPC974 Low Voltage PLL Clock Driver LVCMOS 0.35 125 15 - 52 LQFP NOW MPC980 MPC980 Dual 3.3V Clock Generator LVCMOS 0.5 66 10 - 52 LQFP NOW MPC990/991 MPC990/991 Low Voltage PLL Clock Driver ECL/PECL 0.1 400 diff 14/pairs - 52 TQFP NOW MPC992 MPC992 Low Voltage PECL PLL Clock Driver ECL/PECL 0.1 100 diff 7/pairs - 32 LQFP NOW MPC993 MPC993 Dynamic Switch PLL Clock Driver LVPECL .10 240 diff 5/pairs - 32 TQFP NOW MPC9109 MPC9109 1:18 LVCMOS Fanout Buffer LVCMOS .20 100 18 - 32 TQFP NOW MPC9140 MPC9140 1:18 LVCMOS Fanout Buffer - Bx Intel Desktop LVCMOS .25 100 18 - 48 SSOP NOW MC12429 MC12429 High Frequency PLL Clock Generator LVPECL - 400 diff 1/pair - 28 PLCC NOW MC12430 MC12430 High Frequency PLL Clock Generator LVPECL - 800 diff 1/pair - 28 PLCC NOW MC12439 MC12439 High Frequency PLL Clock Generator LVPECL - 800 diff 1/pair - 28 PLCC NOW PC100EP221 PC100EP221 Low Voltage 1:20 Diff ECL/PECL Clock Driver LVPECL 0.05 1500 diff 20/pairs - 52 LQFP 1Q00 PC100EP223 PC100EP223 Low Voltage 1:22 Diff PECL/HSTL Clock Driver LVPECL 0.05 250 diff 22/pairs - 64 LQFP 1Q00 XC100EP111 XC100EP111 Low Voltage 1:10 Diff ECL/PECL/HSTL Clock Driver LVPECL 0.035 1500 diff 10/pairs - 32 LQFP 1Q00 XC100EP210 XC100EP210 Low Voltage 1:5 Diff ECL/PECL Clock Driver LVPECL 0.035 1500 diff 5/pairs - 32 LQFP 1Q00 10 Network Memory Products BurstRAMs (Synchronous) Category Organization VDD Device No. Pin Count Package Speeds Prod. Status Description 8M 512K x 18 3.3V MCM63P919 MCM63P919 100 119 (TQ) TQFP (ZP) PBGA 225 / 200 / 166 MHz 1Q00 2.5 V/3.3 V I/O pipelined MCM63F919 MCM63F919 100 119 (TQ) TQFP (ZP) PBGA 7.0 / 8.0 / 8.5 ns 1Q00 2.5 V/3.3V I/O flow-through MCM63P837 MCM63P837 100 119 (TQ) TQFP (ZP) PBGA 225 / 200 / 166 MHz 1Q00 2.5 V/3.3 V I/O pipelined MCM63F837 MCM63F837 100 119 (TQ) TQFP (ZP) PBGA 7.0 / 8.0 / 8.5 ns 1Q00 2.5 V/3.3 V I/O flow-through MCM69P819 MCM69P819 100 119 (TQ) TQFP (ZP) PBGA 3.5 / 3.8 / 4 ns Now 2.5 V/3.3 V I/O pipelined. Being replaced by MCM63P819K MCM63P819K. MCM69F819 MCM69F819 100 119 (TQ) TQFP (ZP) PBGA 7.5 / 8.0 / 8.5 / 11.0 ns Now 2.5 V/3.3 V I/O flow­through. Being replaced by MCM63F819K MCM63F819K. MCM63P819K MCM63P819K 100 119 (TQ) TQFP (ZP) PBGA 166 / 150 / 133 MHz 1Q00 2.5V/3.3V I/O pipelined Replaces MCM69P819 MCM69P819. MCM63F819K MCM63F819K 100 119 (TQ) TQFP (ZP) PBGA 8.5 / 9.0 / 11.0 ns 1Q00 2.5 V/3.3 V I/O flow­through. Replaces MCM69F819 MCM69F819. MCM63P819A MCM63P819A 100 119 (TQ) TQFP (ZP) PBGA 250 / 225 / 200 MHz 1Q00 2.5 V/3.3 V I/O pipelined for higher performance applications. MCM63F819A MCM63F819A 100 119 (TQ) TQFP (ZP) PBGA 6.5 / 7.0 / 8.0 ns 1Q00 2.5 V/3.3 V I/O flow­through for higher performance applications. MCM64P819 MCM64P819 100 119 (TQ) TQFP (ZP) PBGA 250 / 225 / 200 MHz 1Q00 2.5 V I/O pipelined for high speed low-power applications. MCM64F819 MCM64F819 100 119 (TQ) TQFP (ZP) PBGA 6.5 / 7.0 / 8.0 ns 1Q00 2.5 V I/O flow­through for high speed low-power applications. MCM65P819 MCM65P819 100 119 (TQ) TQFP (ZP) PBGA 250 / 225 / 200 MHz 1Q00 1.8 V I/O or pipelined for high-speed low-power applications. MCM65F819 MCM65F819 100 119 (TQ) TQFP (ZP) PBGA 6.5 / 7.0 / 8.0 ns 1Q00 1.8 V I/O flow­through for high speed low-power applications. MCM69P737 MCM69P737 100 119 (TQ) TQFP (ZP) PBGA 3.0 / 3.2 / 3.5 / 3.8 / 4.0 ns Now 2.5 V/3.3 V I/O pipelined. Being replaced by MCM63P737K MCM63P737K. MCM69F737 MCM69F737 100 119 (TQ) TQFP (ZP) PBGA 7.5 / 8.0 / 8.5 / 11 ns Now 2.5 V/3.3 V I/O flow­through. Being replaced by MCM63F737K MCM63F737K. MCM63P737K MCM63P737K 100 119 (TQ) TQFP (ZP) PBGA 166 / 150 / 133 MHz 1Q00 2.5 V/3.3 V I/O pipelined. Replaces MCM69P737 MCM69P737. MCM63F737K MCM63F737K 100 119 (TQ) TQFP (ZP) PBGA 8.5 / 9.0 / 11.0 ns 1Q00 2.5 V/3.3 V I/O flow­through. Replaces MCM69F737 MCM69F737. MCM63P737A MCM63P737A 100 119 (TQ) TQFP (ZP) PBGA 250 / 225 / 200 MHz 1Q00 2.5 V/3.3V I/O pipelined for higher performance applications. MCM63F737A MCM63F737A 100 119 (TQ) TQFP (ZP) PBGA 6.5 / 7.0 / 8.0 ns 1Q00 2.5 V/3.3V I/O flow­through for higher performance applications. MCM64P737 MCM64P737 100 119 (TQ) TQFP (ZP) PBGA 250 / 225 / 200 MHz 1Q00 2.5 V I/O pipelined for high speed low power applications. MCM64F737 MCM64F737 100 119 (TQ) TQFP (ZP) PBGA 6.5 / 7.0 / 8.0 ns 1Q00 2.5 V I/O flow­through for high speed low power applications. MCM65P737 MCM65P737 100 119 (TQ) TQFP (ZP) PBGA 250 / 225 / 200 MHz 1Q00 1.8 V I/O pipelined for high speed low-power applications. MCM65F737 MCM65F737 100 119 (TQ) TQFP (ZP) PBGA 6.5 / 7.0 / 8.0 ns 1Q00 1.8 V I/O flow­through for high speed low power applications. MCM63P733A MCM63P733A 100 (TQ) TQFP 150 / 133 / 117 / 100 / 90 MHz Now 2.5 V/3.3V I/O pipelined. Being replaced by MCM63F733K MCM63F733K. MCM63F733A MCM63F733A 100 (TQ) TQFP 8.5 / 9.0 / 10.0 / 11.0 ns Now 2.5 V/3.3V I/O flow­through. Being replaced by MCM63P733K MCM63P733K. MCM63P733K MCM63P733K 100 (TQ) TQFP 150 / 133 / 117 / 100 / 90 MHz 1Q00 2.5 V/3.3V I/O pipelined. Replaces MCM63P733A MCM63P733A. MCM63F733K MCM63F733K 100 (TQ) TQFP 8.5 / 9.0 / 10.0 / 11.0 ns 1Q00 2.5 V/3.3V I/O flow­through. Replaces MCM63P733A MCM63P733A. MCM63P733B MCM63P733B 100 (TQ) TQFP 250 / 225 / 200 MHz 1Q00 2.5 V/3.3V I/O pipelined for higher performance applications. MCM63F733B MCM63F733B 100 (TQ) TQFP 6.5 / 7.0 / 8.0 ns 1Q00 2.5 V/3.3V I/O flow­through for higher performance applications. 256K x 36 4M 256K x 18 3.3V 3.3V 2.5V 1.8V 128K x 36 3.3V 2.5V 1.8V 128K x 32 3.3V 2.5V 100 (TQ) TQFP 250 / 225 / 200 MHz 1Q00 2.5 V I/O pipelined for high-speed, low-power applications. MCM64F733 MCM64F733 1.8V MCM64P733 MCM64P733 100 (TQ) TQFP 6.5 / 7.0 / 8.0 ns 1Q00 2.5 V I/O flow­through for high-speed, low-power applications. MCM65P733 MCM65P733 100 (TQ) TQFP 250 / 225 / 200 MHz 1Q00 1.8 V I/O pipelined for high-speed, low-power applications. MCM65F733 MCM65F733 100 (TQ) TQFP 6.5 / 7.0 / 8.0 ns 1Q00 1.8 V I/O flow­through for high-speed, low power applications. 11 BurstRAMs (Synchronous) (Continued) Category Organization VDD Device No. Pin Count Package Speeds Prod. Status Description 1M 64K x 18 3.3V MCM69F618C MCM69F618C 100 (TQ) TQFP 7.5 / 8.0 / 8.5 / 9.0 /10.0 / 12.0 ns Now Flow­through BurstRAM, 5 V tolerant on all pins. MCM69P618C MCM69P618C 100 (TQ) TQFP 4.0 / 4.5 / 5.0 / 6.0 / 7.0 ns Now Pipelined BurstRAM, 5 V tolerant on all pins. MCM67B618A MCM67B618A 52 (FN) PLCC 8.5 / 9.0 / 10.0 / 12.0 ns Now Not recommended for new designs. Use MCM67B618B MCM67B618B. MCM67B618B MCM67B618B 52 (FN) PLCC 9.0 ns Now Flow­through BurstRAM for PentiumTM, MIPS. MCM67M618A MCM67M618A 52 (FN) PLCC 9.0 / 10.0 / 12.0 ns Now Not recommended for new designs. Use MCM67M618B MCM67M618B. MCM67M618B MCM67M618B 52 (FN) PLCC 9.0 ns Now Flow­through BurstRAM for PowerPCTM. MCM69F536C MCM69F536C 100 (TQ) TQFP 7.5 / 8.0 / 8.5 / 9.0 /10.0 / 12.0 ns Now Flow­through BurstRAM, 5 V tolerant on all pins. MCM69P536C MCM69P536C 100 (TQ) TQFP 4.0 / 4.5 / 5.0 / 6.0 / 7.0 ns Now Pipelined BurstRAM, 5 V tolerant on all pins. 5V 32K x 36 3.3V ZBT® (Zero Bus Turnaround®) RAMs (Synchronous) Category Organization VDD Device No. Pin Count Package Speeds Prod. Status Description 8M 512K x 18 3.3V MCM63Z918 MCM63Z918 100 119 (TQ) TQFP (ZP) PBGA 7.0 / 8.0 / 8.5 ns Latency 1Q00 2.5V/3.3V I/O. Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM63Z916 MCM63Z916 100 119 (TQ) TQFP (ZP) PBGA 10.0 / 11.0 / 15.0 ns Latency 1Q00 2.5V/3.3V I/O. Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM64Z918 MCM64Z918 100 119 (TQ) TQFP (ZP) PBGA 7.0 / 8.0 / 8.5 ns Latency 1Q00 Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM64Z916 MCM64Z916 100 119 (TQ) TQFP (ZP) PBGA 10.0 / 11.0 / 15.0 ns Latency 1Q00 Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM63Z836 MCM63Z836 100 119 (TQ) TQFP (ZP) PBGA 7.0 / 8.0 / 8.5 ns Latency 1Q00 2.5V/3.3V I/O. Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM63Z834 MCM63Z834 100 119 (TQ) TQFP (ZP) PBGA 10.0 / 11.0 / 15.0 ns Latency 1Q00 2.5V/3.3V I/O. Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM64Z836 MCM64Z836 100 119 (TQ) TQFP (ZP) PBGA 7.0 / 8.0 / 8.5 ns Latency 1Q00 Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM64Z834 MCM64Z834 100 119 (TQ) TQFP (ZP) PBGA 10.0 / 11.0 / 15.0 ns Latency 1Q00 Pipelined or flow­through with back­to­back read/write write/read cycles. Sampling 4Q99. MCM63Z818 MCM63Z818 100 (TQ) TQFP 143 / 133 / 100 MHz Now Pipelined with back­to­back read/write write/read cycles. Being replaced by MCM63Z818K MCM63Z818K. MCM63Z819 MCM63Z819 100 (TQ) TQFP 10.0 / 11.0 / 15.0 ns Now Flow­through with back­to­back read/write write/read cycles. Being replaced by MCM63Z819K MCM63Z819K. MCM63Z818K MCM63Z818K 100 (TQ) TQFP 143 / 133 / 100 MHz 1Q00 Pipelined with back­to­back read/write write/read cycles. Replaces MCM63Z818 MCM63Z818. MCM63Z819K MCM63Z819K 100 (TQ) TQFP 10.0 / 11.0 / 15.0 ns 1Q00 Flow­through with back­to­back read/write write/read cycles. Replaces MCM63Z819 MCM63Z819. MCM64Z818K MCM64Z818K 100 (TQ) TQFP 143 / 133 / 100 MHz 1Q00 Pipelined with back­to­back read/write write/read cycles. For low power applications. MCM64Z819K MCM64Z819K 100 (TQ) TQFP 10.0 / 11.0 / 15.0 ns 1Q00 Flow­through with back­to­back read/write write/read cycles. For low power applications. MCM63Z736 MCM63Z736 100 (TQ) TQFP 143 / 133 / 100 MHz Now Pipelined with back­to­back read/write write/read cycles. Being replaced by MCM63Z736K MCM63Z736K. MCM63Z737 MCM63Z737 100 (TQ) TQFP 10.0 / 11.0 / 15.0 ns Now Flow­through with back­to­back read/write write/read cycles. Being replaced by MCM63Z737K MCM63Z737K. MCM63Z736K MCM63Z736K 100 (TQ) TQFP 143 / 133 / 100 MHz 1Q00 Pipelined with back­to­back read/write write/read cycles. Replaces MCM63Z736 MCM63Z736. MCM63Z737K MCM63Z737K 100 (TQ) TQFP 10.0 / 11.0 / 15.0 ns 1Q00 Flow­through with back­to­back read/write write/read cycles. Replaces MCM63Z737 MCM63Z737. MCM64Z736K MCM64Z736K 100 (TQ) TQFP 143 / 133 / 100 MHz 1Q00 Pipelined with back­to­back read/write write/read cycles. For low power applications. MCM64Z737K MCM64Z737K 100 (TQ) TQFP 10.0 / 11.0 / 15.0 ns 1Q00 Flow­through with back­to­back read/write write/read cycles. For low pwer applications. 2.5V 256K x 36 3.3V 2.5V 4M 256K x 18 3.3V 2.5V 128K x 36 3.3V 2.5V 12 ZBT® (Zero Bus Turnaround®) RAMs (Synchronous) (Continued) VDD Package Speeds Prod. Status Description MCM69C432 MCM69C432 100 (TQ) TQFP 20 ns Now Content addressable memory for communication applications. 16K connections. 180 ns match time. 100 (TQ) TQFP 15 ns Now 66 MHz for PowerQUICC II applications. 240 ns match time. MCM69C232 MCM69C232 100 (TQ) TQFP 20 ns Now Content addressable memory for communication applications. 4K connections. 160 ns match time. MCM69C233 MCM69C233 Organization Pin Count MCM69C433 MCM69C433 Category 100 (TQ) TQFP 15 ns Now 66 MHz for PowerQUICC II applications. 210 ns match time. MCM69T618 MCM69T618 100 (TQ) TQFP 5 ns Now 100 MHz Data/Tag RAM. For MIPS R5000 R5000, Pentium Pro, and graphics accelerators applications. Not recommended for new designs. MPC2605 MPC2605 241 (ZP) PBGA 83 / 66 MHz Now Integrated L2 cache for PowerPC processors.One component for 256KB 256KB, two for 512KB 512KB, and four for 1MB L2 cache solution. Device No. CAMs (Content Addressable Memory) CAMs 16K x 64 3.3V 4K x 64 3.3V Tag RAMs Tag RAMs 64K x 18 3.3V Integrated Cache Solutions Integrated Cache Solutions 32K x 72 3.3V Separate and Dual I/O Devices 4M 5V MCM67Q909 MCM67Q909 86 (ZP) PBGA 10.0 / 12.0 ns Now General synchronous separate I/O with write pass through. 3.3 V output levels. Not recommended for new designs. 128K x 36 3.3V MCM63D736 MCM63D736 176 (TQ) TQFP 4 / 5 ns 1Q00 Dual address, Dual I/O NetRAM pipelined per port chip enable. 128K x 9 5V MCM67Q709A MCM67Q709A 86 (ZP) PBGA 10.0 ns Now General synchronous separate I/O with write pass through. 3.3 V output levels. Not recommended for new designs. 32K x 36 3.3V MCM69D536 MCM69D536 176 (TQ) TQFP 6.0 / 8.0 ns Now Dual address, dual I/O. NetRAM. 64K x 18 1M 512K x 9 3.3V MCM69D618 MCM69D618 100 (TQ) TQFP 6.0 / 8.0 ns Now Dual address, dual I/O. NetRAM. Asynchronous RAMs Category Organization VDD Device No. Pin Count Package and Width in mils Speeds Prod. Status Description 4M 512K x 8 3.3V MCM6946 MCM6946 36 44 400 (YJ) SOJ (TS) TSOP 10.0 / 12.0 / 15.0 ns Now Not recommended for new designs. EOL status. 256K x 16 3.3V MCM6343 MCM6343 44 400 (YJ) SOJ (TS) TSOP 11.0 / 12.0 / 15.0 ns Now Not recommended for new designs. EOL status. 1M x 4 3.3V MCM6949 MCM6949 32 400 (YJ) SOJ 10.0 / 12.0 / 15.0 ns Now Not recommended for new designs. EOL status. 3M 128K x 24 3.3V MCM6341 MCM6341 119 (ZP) PBGA 10.0 / 11.0 / 12.0 / 15.0 ns Now DSP applications for base stations and other communication applications. Industrial temperature available. 1M 64K x 18 5V MCM67A618A MCM67A618A 52 (FN) PLCC 10.0 / 12.0 / 15.0 ns Now Not recommended for new designs. Use MCM67A618B MCM67A618B. MCM67A618B MCM67A618B 52 (FN) PLCC 10 ns Now General asynchronous, latched address and data 128K x 8 3.3V MCM6926A MCM6926A 32 400 (WJ) SOJ 8.0 / 10.0 / 12.0 / 15.0 ns Now EOL Status ­ Last Purchase January 2000. 256K x 4 3.3V MCM6929A MCM6929A 32 400 (WJ) SOJ 8.0 / 10.0 / 12.0 / 15.0 ns Now EOL Status ­ Last Purchase January 2000. 13 End-of-Life Devices Device Last Buy Last Ship Replacement XPC105 XPC105 8/5/00 2/05/01 XPC107 XPC107 KXPE603P KXPE603P XPE603P XPE603P 7/30/00 7/30/00 1/30/01 1/30/01 MPC603R MPC603R, MPC740 MPC740 MPC603R MPC603R, MPC740 MPC740 KXPC603P KXPC603P XPC603P XPC603P 7/30/00 7/30/00 1/30/01 1/30/01 MPC603R MPC603R, MPC740 MPC740 MPC603R MPC603R, MPC740 MPC740 XPC604R XPC604R 1/21/00 7/21/00 MPC740 MPC740, MPC750 MPC750, MPC7400 MPC7400 MPC801 MPC801 6/30/00 12/31/00 MPC823 MPC823, MPC850 MPC850, MPC860 MPC860 MC68020 MC68020 (RP package) MC68EC020 MC68EC020 (RP package) MC68030 MC68030 (RP package) MC68EC030 MC68EC030 (RP package) 12/31/00 12/31/00 12/31/00 12/31/00 6/30/01 6/30/01 6/30/01 6/30/01 MC68020 MC68020 (RC package) MC68EC020 MC68EC020 (FE package) MC68030 MC68030 (RC package) MC68EC030 MC68EC030 (FE package) MC68349 MC68349 MC68330 MC68330 MC68330V MC68330V 6/30/99 6/30/99 6/30/99 4/30/00 4/30/00 4/30/00 MCF5206e, MCF5307 MCF5307 MCF5206e, MCF5307 MCF5307 MCF5206e, MCF5307 MCF5307 12/07/00 9/14/00 9/14/00 1/30/00 1/30/00 6/07/01 3/14/01 3/14/01 7/30/00 7/30/00 N/A N/A N/A N/A N/A PowerPC Processors 68K Processors Network Memory MCM6343 MCM6343 MCM6946 MCM6946 MCM6949 MCM6949 MCM6926A MCM6926A MCM6929A MCM6929A Documentation World Wide Web To download documentation for Motorola MPC/PowerPC 10x, 60x, 7xx, 7xxx, and 8240 CPUs: /. Motorola PowerPC home page: http://motorola.com/PowerPC/ MPC/PowerPC 10x, 60x, 7xx, 7xxx, and 8240 CPUs: / chips.html To download documentation for MPC8xx, MPC8xxx, and 68K integrated communications controllers: http://motorola.com/SPS/RISC/netcomm/docs/pubs/. To download documentation for 68K/ColdFire processors: . AltiVecTM Technology http://motorola.com/AltiVec/ Networking & Communications (NetComm) home page: http://motorola.com/netcomm/ To download documentation for Motorola timing solutions: . For printed documentation for NSD and PCSD devices: http://www.design-net.com/home2/lit_ord.html. Development Tools For information on third-party tools for PowerPC 1xx, 6xx and 7xx CPUs: http://motorola.com/PowerPC/3rdparty/. To download freeware tools for MPC8xx, MPC8xxx, and 68K integrated communications controllers, point your browser to: http://motorola.com/SPS/RISC/netcomm/tools/. For information on third-party tools for 68K/ColdFire processors: . MPC801 MPC801, MPC821 MPC821, MPC823 MPC823, MPC850 MPC850, MPC860 MPC860, MPC8260 MPC8260 and 68K communications controllers: 68K/ColdFire Processors home page: http://motorola.com/ColdFire/ Motorola Communication Transmission & Access Systems home page: http://motorola.com/ctasd/ Motorola timing solutions home page: http://www.design-net.com/logic/ Motorola FSRAM products home page: http://motorola.com/fastrams/ SPS Customer Response Center: http://www.design-net.com/home2/cust_serv.html General product information on other devices: http://motorola.com/SPS/General/chips.html Information on other Motorola products: http://motorola.com/General/prodport.html Comments on other Motorola products: http://motorola.com/cgi-bin/web-comments2 14 Microprocessor Part Number Schemes PowerPC 1xx, 6xx & 7xx Processor Part Numbering Scheme MPC 603 R RX 300 L Revision Application Modifier Bus Ratio C 2:1 (106 only) D 5:2 (106 only) L Full spec all modes Temp/Spec N 65 °C, 2. V 1 P 65 °C, 2.05 V (750); 2. 5 V (7400) 1 R 105°, 2.05 V T ext. temp. (-40° to 105° Tj) Frequency 2-3 digits Package 100, 600, or 700 Series Device Product Code (see page 2) (106, 107 603, 740, 750, 7400) , PPC Sample XPC XC qualified MPC Qualified Part/Module Modifier PPE EC-Sample A 106/107/740/750 Alpha (original) XPE XC qualified EC CPU E 603 Enhanced Performance MPE Qualified EC CPU P 740/750 Enhanced and Lower Voltage R 603e in HiP3 process (Not used for 7400) C MPC8xx PowerPC Processor Part Numbering Scheme MPC Product Code PPC Prototype Sample KXPC Sample Pack (2-10) KMPC Sample Pack (2-10) XPC Engineering Production MPC Qualified 860 EN C ZP Part/Module Modifier DC Dual Channel (Enet on SCC1) DE Dual Channel (w/Enet) DH Dual Channel (w/Enet, Multi-HDLC) None Four Channel (no Enet) EN Four Channel (w/Enet) MH Four Channel (w/Enet, Multi-HDLC) SC Single Ethernet SR Four Channel (w/Enet, Multi-HDLC, ATM) T Four Channel (10/100, Multi-HDLC) 66 Package (see page 2) Temp. Range - 0 to +95 Tj C -40 to +95 Tj 800 Series Device (801, 850, 860) Frequency 2 digits L Die Mask Revision MPC8xxx PowerPC Processor Part Numbering Scheme XPC Product Code PPC Prototype Sample KXPC Sample Pack (2-10) KMPC Sample Pack (2-10) XPC Engineering Production MPC Qualified 8240 L ZU Core Volt/Temp Spec (opt.) - 0 to +95 Tj C -40 to +95 Tj L 105°C Tj T ext. temp. (-40° to 105° Tj) R 2.5 - 2.75 V, 105°C 8xxx Series Device (8240, 8260) 200 C Package (see page 2) Frequency 2-3 digits Die Mask Revision 680x0 Series Processor Part Numbering Scheme MC68 Product Code MC68 Full Spec. Product XC68 Eng. Product SPAK Sample Pack (2-10) EC 000 C Part/Module Modifier - Full CPU EC No FPU or MMU HC HCMOS LC No FPU SEC Static Embbeded 680x0 Series Device (000, 020, 040, 060) Temp. Range - 0 to +70 C -40 to +85 FN 16 Package (see page 2) Frequency 2 digits PV 25 Package (see page 2) Frequency 2 digits V - V Voltage 5 volts 3.3 volts B Die Mask Revision 683xx Series Processor Part Numbering Scheme MC68 Product Code MC68 Full Spec. Product XC68 Eng. Product PC68 Eng. Sample SPAK Sample Pack (2-10) KXC Sample Pack (2-10) KMC Sample Pack (2-10) EN 302 C 683xx Series Device Part/Module Modifier (302, 306, 307 330, , DP Data Pump 340, 360) EC Embedded Controller EN Ethernet LC Low Cost MH Multi-HDLC QH Quad HDLC Temp. Range - 0 to +70 I 0 to +80 C -40 to +85 V - V Voltage 5 volts 3.3 volts B Die Mask Revision ColdFire Processor Part Numbering Scheme MCF Product Code MCF Full Spec. Product XCF Eng. Product PCF Eng. Sample SPAK Sample Pack (2-10) 5206 E C ColdFire Device (5102, 5202, 5204, 5206, 5307) Part/Module Modifier E Enhanced 15 Temp. Range - 0 to +70 C -40 to +85 FT 33 A Package (see page 2) Frequency 2 digits Die Mask Revision Motorola Literature Distribution Centers: USA/EUROPE: Motorola Literature Distribution; P .O.Box 5405, Denver Colorado 80217 Tel.: 1-800-441-2447 (in U.S.) or 1-303-675-2140 WWW: http://ldc.nmd.com/ JAPAN: Nippon Motorola Ltd. SPD, Strategic Planning Office 4-32-1, Nishi-Gotanda Shinagawa-ku, Tokyo 141, Japan Tel.: 81-3-5487-8488 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd. Silicon Harbour Centre 2, Dai King Street, Tai Po Industrial Estate Tai Po, New Territories, Hong Kong MfaxTM: RMFAX0@email.sps.mot.com; TOUCHTONE: 1-602-244-6609 US & Canada ONLY: 1-800-774-1848 WWW: http://sps.motorola.com/mfax INTERNET: http://motorola.com/sps/ Technical Information: Motorola, Inc. SPS Customer Support ­ Technical Information Center 1-800-521-6274 Email: crc@wmkmail.sps.mot.com Document Comments: FAX 1-512-895-2638 Attn: NCSD Marketing Communications Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. PowerPC, the PowerPC logo, PowerPC 603e, PowerPC 740, PowerPC750 are trademarks of International Business Machines Corporation and are used by Motorola, Inc. under license therefrom. Motorola, the Motorola logo, ColdFire are registered trademarks, and DigitalDNA, the DigitalDNA logo, Mfax, EC603e, AltiVec, CopperGold, and Hipster are trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. SG175/D SG175/D