SG1015Q22006 SG1015-2 SG1015-3 CH370

Quarter 2, 2006 SG1015Q22006 Rev 0 Platform SoC OVERVIEW FREESCALE DESIGN SERVICES Freescale Semiconductor offers highly

Platform SoC Quarter 2, 2006 SG1015Q22006 SG1015Q22006 Rev 0 Platform SoC OVERVIEW FREESCALE DESIGN SERVICES Freescale Semiconductor offers highly integrated, customized System - on - Chip (SoC) solutions for the printing and imaging, broadband, network and multimedia markets. The Application Specific Products operation develops platform SoC products built on a foundation of standard Freescale processor cores and proven peripheral intellectual property (IP). The offering is designed to provide customers with the benefits of scalable performance, fast time to market, low system cost and flexible, System - on - Chip platforms that allow easy migration to next - generation system designs. Freescale platform SoC Design Services offer a flexible customer engagement model for the designer utilizing industry - leading 3rd party tools and providing design handoffs at the RTL (Register - Transfer Level), Gate - Level and COT (Customer Owned Tooling) Sign - Off level at our worldwide design center locations. PLATFORM SoC DESIGN OPTIONS Freescale Semiconductor offers options for customers who are designing platform SoC devices that enable them to meet maximum performance, differentiation, and high levels of integration requirements. · · · · Industry required IP Design services for system analysis, integration and connectivity State of the art process technology Package options covering low - cost solutions to high - end flip - chip BGAs FREESCALE COMPREHENSIVE IP PORTFOLIO Freescale provides industry standard and cutting edge IP to the platform SoC designer. Where possible, the following IP portfolio is developed in high - level behavioral languages to facilitate the porting of Freescale technologies to future processes. · · · · · · · · · · · · Processor cores PQ family comm engines DSP cores External buses General communication peripherals System fabric IP Networking interconnect IP Encryption accelerators Mixed signal IP Memory controllers System integration IP Industry standard integration structures · RTL Sign - off-Freescale offers RTL sign - off service to customers who choose to have Freescale handle both synthesis and layout. · Gate - Level Sign - off-Customers complete the synthesis and then deliver gate - level netlists to Freescale for layout. · COT-A COT service is available for select customers who choose to do the entire design themselves. Customers deliver the designs in GDSII database format. Additional design services that are available include: · · · · · · Floor planning Placement - based synthesis Timing analysis Test structure insertion Clock tree insertion Test pattern generation LEADING EDGE PROCESS TECHNOLOGY Freescale's manufacturing capabilities include advanced CMOS (complementary metal oxide semiconductor) and related technologies such as silicon - on - insulator (SOI) as well as specialty technologies such as SiGe. These capabilities offer designers the following: · Process technology available today: 0.18 - micron, 130 nm and 90 nm in bulk and SOI with a roadmap to 65 nm and 45 nm · Proven experience in multiple generations of high - performance SOI, low - k dielectrics, and multi - layer copper metallization SG1015-2 SG1015-2 SG1015Q22006 SG1015Q22006 LEADING EDGE PROCESS TECHNOLOGY (continued) The following table lists some examples of production capable packaging solutions. · High - performance BiCMOS process featuring a low - noise SiGe:C HBT for mixed - signal needs across all markets · Partner on 300 mm CMOS process technology · Relationships with external foundries Process 0.18 µm 0.13 µm 0.13 µm 90 nm 90 nm SOI Core Voltage 1.8 V 1.5 V 1.2 V 1.0 V 1.0 V I/O Voltage (max) 3.3 V 2.5/3.3 V 2.5/3.3 V 1.8/2.5/3.3 V 2.5 V Metal AlCu Cu Cu Cu Cu PACKAGE AND ASSEMBLY TECHNOLOGY Freescale offers an assembly package portfolio that covers a wide range of packaging alternatives for the platform SoC customer. Packaging technology available: · · · · · · · · · FCPBGA-Flip Chip Plastic Ball Grid Array MAPBGA-Molded Array Process Ball Grid Array PBGA-Plastic Ball Grid Array QFP-Quad Flat Pack SBGA-Stacked Ball Grid Array SiP-System in Package TBGA-Tape Ball Grid Array TEPBGA-Thermally Enhanced Plastic Ball Grid Array TQFP-Thin Quad Flat Pack Performance (MHz) Thermal Performance @ 455C TA (Watts) MAPBGA Freescale Process Technologies Package Style 100-400 1.25-1.75 0.5-1.0 16-480 8-19 4 Lyr PBGA 100-400 2.25-2.5 1.0-1.27 144-900 17-40 TEPBGA-2 100-400 2.5-2.75 1.0-1.27 144-900 17-40 SBGA 100-1000 2.75-4.0 1.0-1.27 256-900 23-45 TBGA 25-125 2.75-4.5 1.0-1.27 276-1036 23-45 1000-10000 2.0-60.0 0.5-1.27 119-1500 16-35 Flip Chip with HS Package Pitch (mm) Ball Count Body Size (mm) SUMMARY Use Freescale platform SoC solutions to get: · · · · Benefits of scalable performance Fast time - to - market Flexible customer engagement model Easy migration to next - generation system designs · Leading edge process technology · Broad IP portfolio · Expertise in systems engineering and architectures · Global design centers For more information on platform SoC solutions, go to: http://www.freescale.com Assembly Interconnects available: · Flip Chip Bump-225 µm or 185 µm bump pitch and 1 mm or 0.8 mm ball pitch · In - line Wire Bond-Pitch down to 44 µm · Staggered Wire Bond-Pitch down to 35/70 µm SG1015-3 SG1015-3 SG1015Q22006 SG1015Q22006 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0063 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. SG1015Q22006 SG1015Q22006 Rev 0 4/2006 For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com