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PC29420VKD0 Freescale Semiconductor ARGON+ DEV SEC 17X17 ri Buy
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Catalog Datasheet Results Type PDF Document Tags
Abstract: ) 54-FBGA 54-FBGA 8K 1.8V K4X51163PE-(1)(2)(3)(4) 60-FBGA 60-FBGA 8K 1.8V K4X51163PG-(1)(2)(3)(4 , ) 152-FBGA 152-FBGA 8K 1.8V K4X1G323PD-(1)(2)(3)(4) 90-FBGA 90-FBGA 8K 1.8V K4X1G323PQ-(1)(2)(3)(4) 32M x32 1.8V K4X1G323PC-(1)(2)(3)(4) 1Gb 1.8V 8K K4X1G163PQ-(1)(2)(3)(4) MMSDDDR 4K 60-FBGA 60-FBGA K4X1G163PC-(1)(2)(3)(4) 64M x16 54-FBGA 54-FBGA K4X1G153PE-(1)(2)(3)(4) 152-FBGA 152-FBGA , ) 90-FBGA 90-FBGA 8K 1.8V K4X51323PE-(1)(2)(3)(4) 54-FBGA 54-FBGA 8K D RAM Type 1.8V MMSDDDR ... Original
datasheet

36 pages,
919.98 Kb

K9KAG08U0M K9GAG08U0M K9lbG08U0M-PCB0 K9WBG08U1M-PIB0 K9GAG08U0M-PCB0 K9F1G08U0B-PCB0 K9KAG08U0M-PIB0 K9F1G08R0B-JIB0 K9G8G08U0B k9g8g08u0a K9G4G08U0B K9F1G08U0C-PCB0 K9WBG08U1M datasheet abstract
datasheet frame
Abstract: Color Options 3, 7: GaP HER 4, 8: GaP Yellow (except K4xx series) 5, 9: GaP Green 6: GaP Emerald Green , 105°C Max. Pre-heat Time Peak Temperature Dwell Time 60 sec Max. 250°C Max. 3 sec Max. Diagonal , 0.043 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) Manual Solder Dipping ­ ­ 260°C Max. 5 sec Max. , (maximum peak temperature = 250°C) Dwell time: 1.5 sec ­ 3.0 sec (maximum = 3sec) 150 100 Note , temperature = 250°C) Dwell time: 1.5 sec ­ 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be ... Original
datasheet

12 pages,
628.43 Kb

HLMP-3707 HLMP-3907 HLMP-3750 HLMP-3850 HLMP-3950 HLMP-3960 HLMP-3390 HLMP-3490 HLMP-3590 HLMP-1340 HLMP-1440 HLMP-1540 HLMP-K640 T-13/4 HLMP-3707 abstract
datasheet frame
Abstract: Table Color Options 3: GaP HER 4: GaP Yellow (except K4xx Series) 5: GaP Green 6: GaP Emerald Green Package Options 1: T-1 (3 mm) K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx) Absolute , sec Pulse) 500 500 500 mA LED Junction Temperature 110 110 110 °C , Temperature 105 °C Max. ­ Pre-heat Time 30 sec Max. ­ Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max. TEMPERATURE ­ C FLUXING 100 PREHEAT 10 20 ... Original
datasheet

13 pages,
1731.82 Kb

HLMP-K600 HLMP-K401 HLMP-1503 HLMP-1401 HLMP-1301 AN1027 245C 100C HLMP-1301 abstract
datasheet frame
Abstract: Table Color Options 3: GaP HER 4: GaP Yellow (except K4xx Series) 5: GaP Green 6: GaP Emerald Green Package Options 1: T-1 (3 mm) K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx) 3 Absolute , Temperature Dwell Time TEMPERATURE ­ °C Manual Solder Dipping ­ ­ 260 °C Max. 5 sec Max. , body (encapsulant epoxy) for those parts without standoff. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. · Wave soldering parameter must be set and maintained according to ... Original
datasheet

14 pages,
249.58 Kb

SN63 HLMP-K600 HLMP-K401 HLMP-1503 HLMP-1401 HLMP-1301 AN1027 HLMP-1301 abstract
datasheet frame
Abstract: 3: GaP HER 4: GaP Yellow (except K4xx Series) 5: GaP Green 6: GaP Emerald Green Package Options 1: T-1 (3 mm) K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx) 3 Absolute Maximum Ratings , 30 sec Max. ­ ­ Peak Temperature Dwell Time 250 °C Max. 3 sec Max. 0.646 mm (0.025 , °C Max. 5 sec Max. 250 BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED ... Original
datasheet

14 pages,
434.29 Kb

SN63 HLMP-K600 HLMP-K401 HLMP-1503 HLMP-1401 HLMP-1301 AN1027 Avago HLMP-1301 HLMP-1301 abstract
datasheet frame
Abstract: refer to the Iv Bin Table Color Options 3: GaP HER 4: GaP Yellow (except K4xx Series) 5: GaP Green 6: GaP Emerald Green Package Options 1: T-1 (3 mm) K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx , Current[1] DC Current[2] everse Voltage (IR = 100 A) Transient Forward Current[4] (10 sec Pulse) LED , Solder Dipping Pre-heat Temperature 105 °C Max. Pre-heat Time Peak Temperature Dwell Time 30 sec Max. 250 °C Max. 3 sec Max. ­ ­ 260 °C Max. 5 sec Max. Diagonal 0.636 mm (0.025 in) 0.919 mm (0.036 in ... Original
datasheet

13 pages,
1327.51 Kb

HLMP-1301 HLMP-1401 HLMP-1503 HLMP-K401 HLMP-K600 HLMP-1301 abstract
datasheet frame
Abstract: reconduction will be caused for 10 minutes for thermal cutoffs. K4X 127 123� AC DC K13X 133 , Cutoff time[sec] Percent rated load[] 100 60 40 F5K鬃譐14 F5K鬃譐13 91 96 20 120 , Fusing-off time T4 T9 T16 Fusing-off time - max. sec. at 25 T4 T9 T16 T25 1 40 90 55 1 , �000 cycle sec sec RoHS Thermal Cutoff/Resistor Assemblies series(Conform with RoHS Directive , �5 Short time overload Power rating �, for 5 sec. �+0.05 265� 10 sec. �+0.05 ... Original
datasheet

21 pages,
283.62 Kb

H13F thermal cutoff T4F fuse V5F fuse F5K3R f5k0 F5K3R3J14 hu4x P110a Thermal Cutoff RESISTOR F5K150J14 E73591 F5K330J14 F5K4R7J14 datasheet abstract
datasheet frame
Abstract: (except K4xx series) 5, 9: GaP Green 6: GaP Emerald Green Package Option 1, K: T-1 (3 mm) 3, D , sec Max. ­ Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec ... Original
datasheet

10 pages,
802.71 Kb

HLMP-3960 BJ 919 HLMP-1340 HLMP-3390 HLMP-3490 HLMP-3590 HLMP-3707 HLMP-3750 HLMP-3807 HLMP-3850 HLMP-3907 HLMP-3950 AN1027 HLMP-1440 HLMP-3707 abstract
datasheet frame
Abstract: the Iv Bin Table Color Options 3, 7: GaP HER 4, 8: GaP Yellow (except K4xx series) 5, 9: GaP Green 6 , without standoff. · Recommended soldering conditions: Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. Manual Solder Dipping ­ ­ 260 °C Max. 5 sec Max. · Wave soldering parameter must be set ... Original
datasheet

11 pages,
248.84 Kb

HLMP-3707 T-13/4 HLMP-3750 HLMP-3390 HLMP-1340 HLMP-D640 HLMP-K640 HLMP-3707 abstract
datasheet frame
Abstract: , 8: GaP Yellow (except K4xx series) 5, 9: GaP Green 6: GaP Emerald Green Package Option 1, K: T-1 , 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 · Proper handling , process to prevent damage to LED component. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. · Wave soldering parameter must be set and maintained according to recommended ... Original
datasheet

11 pages,
251.6 Kb

Ultra Bright LED Lamp HLMP-3750 HLMP-D640 HLMP-K640 HLMP-3390 HLMP-1340 lambda IC 101 led 25000 mcd new led circuits SEC k4x HLMP-3707 3MM LED RED LAMBDA A SERIES HLMP-3707 abstract
datasheet frame

Datasheet Content (non pdf)

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www.datasheetarchive.com/files/motorola/design-n/dsp/home/bub/96000.hqx
Motorola 16/09/1996 210.31 Kb HQX 96000.hqx
No abstract text available
www.datasheetarchive.com/download/61553818-996606ZC/xchkr_hp.tar
Xilinx 20/01/1997 496 Kb TAR xchkr_hp.tar
(This file must be converted with BinHex 4.0) :' +) ` % -
www.datasheetarchive.com/files/motorola/design-n/sps/hpesd/aesop/68k/mmtg_ana.hqx
Motorola 13/09/1996 1290.04 Kb HQX mmtg_ana.hqx
begin 644 hlp.zip ? . [ MU-X%?*>^TKPE"2Z"?UOJNT?_R^+3@\*P4G^:FE;
www.datasheetarchive.com/files/siemens/cdrom/3rdtools/keil/www/root
No abstract text available
www.datasheetarchive.com/download/32843250-960428ZC/4kefixhp.uue
Xilinx 05/09/1996 1743.89 Kb UUE 4kefixhp.uue
(This file must be converted with BinHex 4.0) :# # + && [ !
www.datasheetarchive.com/files/motorola/design-n/sps/hpesd/aesop/mpc8xx/821/821um/821umsea.hqx
Motorola 17/09/1996 5807.31 Kb HQX 821umsea.hqx
(This file must be converted with BinHex 4.0) :& [ * $ $ " [!!" !!
www.datasheetarchive.com/files/kaleidoscope/cad/mccad - schematics - pcb-st/mac/mccad_eds_for_macos.hqx
Kaleidoscope 10/04/2005 22278.99 Kb HQX mccad_eds_for_macos.hqx
(This file must be converted with BinHex 4.0) :% !!! !! # !!! !!!!!!!!!!!!!!!!X,!!!!)!%"!3!!!!!!!!!!!%!!"Q3!2rrrrm!!!!!rrrrr`! !!!!!!!!$!!!#3`!!!!%!!!QB!!!+X!!!,#3!!!!"!!!!!!!!!!!!!!!!!!!!!!! !! !!!!!!!!!!!!
www.datasheetarchive.com/files/kaleidoscope/cad/capilano - designworks 4.3.1/mac/dwm_installer.hqx
Kaleidoscope 10/04/2005 16069.24 Kb HQX dwm_installer.hqx
No abstract text available
www.datasheetarchive.com/download/43392718-960537ZC/ver_ex.uu
Xilinx 05/09/1996 4001.98 Kb UU ver_ex.uu
No abstract text available
www.datasheetarchive.com/download/18416238-958267ZC/ver_ex.uu
Xilinx 08/07/1996 4001.98 Kb UU ver_ex.uu