SCM1100M E118037 SCM1101M SCM1103M SCM1104M SCM1104MF SCM1105MF SCM1106M - Datasheet Archive

 

SCM1100M Series High Voltage 3 Phase Motor Drivers Introduction The SCM1100M is a high voltage three-phase motor driver IC for 85

 

Product Information SCM1100M SCM1100M Series High Voltage 3 Phase Motor Drivers Introduction The SCM1100M SCM1100M is a high voltage three-phase motor driver IC for 85 to 253 VAC input, middle output power motor driver systems. IGBTs, diodes, and controller ICs are all housed in the proprietary SCM package (figure 1), and the protection circuits enhance system-level reliability. Features and benefits include the following: Each half-bridge circuit consists of a pre-driver circuit that is completely independent from the others Protection against simultaneous high- and low-side turn-on (STP) Bootstrap diodes with series resistors for suppressing inrush current are incorporated CMOS compatible input (3.3 to 5 V) Designed to minimize simultaneous current through both high- and low-side IGBTs by optimizing gate drive resistors UVLO protection with auto restart Overcurrent protection with off-time period adjustable by an external capacitor Fault (FO indicator) signal output at protection activation: UVLO (low side only), OCP, and STP Proprietary power DIP package UL Recognized Component (File No.: E118037 E118037) The product lineup for the SCM1100M SCM1100M series provides the following options for motor driving applications: Part Number IGBT Rating Remarks SCM1101M SCM1101M 600 V / 10 A Low saturation voltage SCM1103M SCM1103M 600 V / 5 A Low saturation voltage SCM1104M SCM1104M 600 V / 8 A Low saturation voltage SCM1104MF SCM1104MF 600 V / 8 A Low saturation voltage SCM1105MF SCM1105MF 600 V / 15 A Low saturation voltage SCM1106M SCM1106M 600 V / 10 A High speed SCM1106MF SCM1106MF 600 V / 10 A High speed SCM1110MF SCM1110MF 600 V / 15 A Figure 1. SCM1100M SCM1100M Series packages are fully molded DIPs, For 10 to 15 A (suffix F) variants, a copper heat dissipation pad is attached to the upper surface of the case.(left); for 5 to 10 A devices, the standard case is available (right). stands for inverter power module, a technology that has now become prominent in the marketplace, and for Sanken, it highlights a broad variety of high voltage, three-phase motor driver ICs targeted at the residential white goods (home appliance) and commercial three-phase motor market segments, such as: air conditioners, refrigerators, and washing machines. Sanken IPM devices are particularly well-suited to applications in variable speed control systems and power inverter systems. Sanken has developed a great deal of expertise in these markets, which have become mature in certain areas due to governmental regulations, and are emerging in many other marketplaces. Demand for these applications is expected to increase rapidly in the near future, due to commercial economic pressures and governmental regulations mandating the use of energy-conserving technologies. High speed Contents Energy-Conserving Technology The SCM1100M SCM1100M series is one of the expanding IPM product lines being offered by the Sanken Electric Company. IPM All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature of 25°C, unless otherwise stated. 38100, Rev. 3 Introduction Energy-Conserving Technology Rapid Redesign Support Robust Device Design Pin Functional Descriptions Protection Circuits Precautions Application Circuit Characteristic Performance Data Output Characteristic Performance Data 1 1 2 2 2 4 5 6 7 9 Rapid Redesign Support IPM type ICs are gradually becoming prevalent for controlling motors in residential and commercial laundry washing machines. In this application, the ICs replace several discrete components, thus saving application space and design effort. In many instances, IPM devices yield the lowest overall cost solution, especially in the current regulatory environment, which is forcing manufacturers to redesign their power management systems. Traditional discrete-device topologies are proving difficult to adapt to these applications, and manufacturers can take advantage of rapid design solutions using the highly integrated topologies offered by IPM types of devices. Sanken Electric IPMs optimally fulfill such market needs with products that integrate our latest technologies inside a single package. Simplified Design for Application Circuits The SCM1100M SCM1100M series supports the 3-shunt method, in which a shunt resistor is used in each phase. This enables small currents to be detected, and highly accurate inverter control to be achieved, thus contributing to low motor noise. In addition, each of the three phases contains an overcurrent protection circuit, and a function that prevents simultaneous turn-on of both the highside and low-side IGBTs. Overall, use of the SCM1100M SCM1100M series with the 3-shunt method allows a 15% reduction in the area of the application print circuit board used for the main circuit of the inverter, and a reduction in the quantity of components of about 50%. With these and many other designer-friendly features, the SCM1100M SCM1100M series allows a highly reliable inverter main circuit to be designed using only a small number of external components. allowing stable control to be achieved. It also avoids consecutive short-circuits when OCP protection mode is released. The OCP mode also features soft turn-off at power-down during an overcurrent event. This minimizes negative voltage impinging on the LS terminal, by restraining di/dt. This protects the IC from failure due to reverse voltage there and on the external current sense circuit. All three drive phases can be simultaneously brought to a complete stop (all three gates turned off) during protection modes. This can be implemented by connecting the 3 failure signal output terminals externally. The FO terminal is also used as an enable input. Failure signal output continues during protection modes: CMOS logic circuit operation continues, as well as UVLO during OCP and STP modes. Pin Functional Descriptions This section describes the features of the SCM1100M SCM1100M devices in order by pin function. Refer to figure 2 for a block diagram of the devices. U, V, and W. These pins are the outputs of the individual IC phases, and serve as the connection terminals to the 3 phase motor that is being driven. VB1, VB2, and VB3. Circuit main supply inputs that drive high-side IGBTs. Serve as terminals for the bootstrap capacitors, CBOOT, for each phase. The bootstrap circuits are floated during operation, thus each half-bridge circuit needs one bootstrap circuit, and it is recommended to place CBOOT as close to the IC as possible (see figure 2). Robust Device Design HS Several built-in features allow the SCM1100M SCM1100M series to support a more dependable overall application. VB A built-in high-voltage bootstrap diode is built-in, simplifying trace layout on the application PCB by reducing component count, and eliminating the corresponding adequate creepage distance. An in-rush current-absorbing resistor provides built-in protection (STP) circuit against high-sde/low-side simultaneous on (shoot-through). In addition, employing a pre-driver for each half-bridge, prevents high/low simultaneous ON due to erroneous command signal input or external noise. The embedded pre-driver for each half-bridge ensures short input dead-time. This optimizes the switching speed of high/low sides, VBB HO UV VCC Input Detect HIN Logic Level LIN & Drive Circuit Shift U, V, or W Shoot Through Prevention UV Detect COM FO O .C . Drive LS Protect CFO LO Circuit HVIC Figure 2. SCM1100M SCM1100M Series Phase Block Diagram. These devices support three phases, referred to as U, V, and W. One of three phases is shown in the diagram. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 2 At the beginning of operation, during the startup period, this capacitor needs to be fully charged by turning on the low-side IGBT. The capacitance of the individual capacitors can be calculated by the following formulas, and whichever resulting capacitance value is larger should be chosen: CBOOT (F) > 800 ×tLoff (s) , or CBOOT = 0.1 F , where TLoff is the maximum off-period of the low-side IGBT, in seconds, corresponding to the non-charging period of CBOOT. The gate driver circuit consumes current even if the high-side IGBT is not on, and the voltage across CBOOT goes down. Therefore, make sure that that sufficient voltage is maintained across CBOOT during low frequency operation, such as the startup period. In addition, capacitance tolerance needs to be taken into account in selecting the CBOOT value, and it is strongly recommended to optimize the value of CBOOT through actual board tests to make sure UVLO circuits for VB1, VB2 and VB3 are not activated. HS1, HS2, and HS3. These pins are internally connected to the U, V, and W pins. The negative node of corresponding CBOOT is connected to the pin. VCC1, VCC2, and VCC3. These pins are logic supply inputs. To prevent malfunctioning of operation from ripple voltage on supply voltage input, it is recommended to place a ceramic capacitor (> 0.01 F) as close to the pin as possible. COM1, COM2, and COM3. These are logic GND pins of the incorporated pre-driver chips. In order to drive and control the internal IGBTs properly, these should be connected as close to the LSx pins as possible. CBOOT VB VCC VBB Rboot VBB Dboot CBOOT U,V,W High Side & Low Side SCM1100 SCM1100 M 1 phase of 3 LS Figure 3. Bootstrap Circuit. Each of the three phases has an independent bootstrap circuit. The CBOOT circuit for one phase is shown above. HIN1, HIN2, HIN3, LIN1, LIN2, and LIN3. These are gate driver control pins, and are 5 V CMOS compatible, with Schmitt trigger circuits. These are active high, and have internal pulldown 100 kW resistors. In case of high noise interference or unstable input logic status, it is recommended to use external filter circuits or additional pull-down resistors. The equivalent circuits are shown in figure 5. VBB1, VBB2, and VBB3. These are the main supply inputs. Place bypass capacitors and also film capacitors for snubber circuits of approximately 0.1 F at each pin, in order to suppress surge voltage. In addition, it is recommended to shorten the PCB traces for those pins to a minimum. 25 33 Branded Side 24 1 Figure 4. SCM1100M SCM1100M Series Pin-out Diagram. The pin assignments are listed in the table below. Terminal List Table Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Number FO1 CFO1 LIN1 COM1 HIN1 VCC1 VB1 HS1 FO2 CFO2 LIN2 COM2 HIN2 VCC2 VB2 HS2 FO3 CFO3 LIN3 COM3 HIN3 VCC3 VB3 HS3 VBB W LS3 VBB V LS2 VBB U 33 LS1 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Function U phase fault output for overcurrent and UVLO detected Capacitor for U phase overcurrent protection hold time Signal input for low-side U phase (active high) Supply ground for U phase IC Signal input for high-side U phase (active high) Supply voltage for U phase IC High-side floating supply voltage for U phase High-side floating supply ground for U phase V phase fault output for overcurrent and UVLO detected Capacitor for V phase overcurrent protection hold time Signal input for low-side V phase (active high) Supply ground for V phase IC Signal input for high-side V phase (active high) Supply voltage for V phase IC High-side floating supply voltage for V phase High-side floating supply ground for V phase W phase fault output for overcurrent and UVLO detected Capacitor for W phase overcurrent protection hold time Signal input for low-side W phase (active high) Supply ground for W phase IC Signal input for high-side W phase (active high) Supply voltage for W phase IC High-side floating supply voltage for W phase High-side floating supply ground for W phase Positive DC bus supply voltage Output for W phase Negative DC bus supply ground for W phase Cut-pin ( positive DC bus supply voltage) Output for V phase Negative DC bus supply ground for V phase Cut-pin ( positive DC bus supply voltage) Output for U phase Negative DC bus supply ground for U phase 3 LS1, LS2, and LS3. These are inverter GND terminals and a shunt resistor for monitoring current should be placed between those pins and the COM pins. Trace length between the correpsonding current sensing resistor and LSx pin should be as short as possible, otherwise, malfunctioning may occur. CFO1, CFO2, and CFO3. In the event of the overcurrent protection enabling, both high- and low-side drivers are turned off. The overcurrent protection off-time period is adjusted by the external capacitors at those pins. See the Protection Circuits section for more details. FO. This pin is pulled down in the event of the protection circuits enabling; UVLO, OCP, or STP (Simultaneous high- and low-side turning on) being activated; or both high- and low-side IGBTs being turned off. Figure 6 shows the internal circuit of the FO pin, which must be pulled-up by an external pull-up resistor because of the open drain structure. The sink current is limited to 5 mA. In addition, the FO pin potential is monitored by the internal circuit and when its potential is pulled down externally, it shuts off the circuit. Therefore, by tying the three FO pins together, it can shut off all phases if even one of the phase protection circuits is activated. It is recommended to place a capacitor CN (