NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
SC5650 E39531-002 VSC410 ICES-003 S5520HC/S5500HCV/S5520SC S5500BC 240VA P9-P12 - Datasheet Archive
Technical Product Specification E39531-002 Revision 1.0 January, 2009 Enterprise Platforms and Services Marketing Intel
Intel® Server Chassis SC5650 SC5650 Technical Product Specification E39531-002 E39531-002 Revision 1.0 January, 2009 Enterprise Platforms and Services Marketing Intel Confidential Revision History Intel® Server Chassis SC5650 SC5650 Revision History Date January, 2009 Revision Number 1.0 Modifications Initial release Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design. The Intel® Server Chassis SC5650 SC5650 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel's own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation. *Other brands and names may be claimed as the property of others. Copyright © Intel Corporation 2009. ii Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Table of Contents Table of Contents 1. Product Overview. 1 1.1 1.2 Chassis Views . 3 1.3 System Color . 7 1.4 Chassis Security . 7 1.5 I/O Panel. 7 1.6 Rack and Cabinet Mounting Option. 7 1.7 Front Bezel Features . 8 1.8 2. Intel® Server Chassis SC5650 SC5650 Design Features . 1 Peripheral Bays . 8 Power Sub-system . 9 2.1 DP 600-Watt Power Supply . 9 2.1.1 Mechanical Overview. 10 2.1.2 Airflow and Temperature . 11 2.1.3 Output Cable Harness . 11 2.1.4 AC Input Requirements . 16 2.1.5 DC Output Specifications. 19 2.1.6 Protection Circuits. 26 2.1.7 Current Limit (OCP) . 26 2.1.8 FRU Data. 30 2.2 600-W 1+1 Power Supply Module . 31 2.2.1 Mechanical Overview. 31 2.2.2 AC Input Requirements . 33 2.2.3 DC Output Specification . 38 2.2.4 Protection Circuits. 46 2.2.5 Control and Indicator Functions. 47 2.2.6 PMBus Monitoring Interface . 51 2.3 600-W Power Distribution Board (PDB). 53 2.3.1 Mechanical Overview. 54 2.3.2 DC Output Specification . 60 2.3.3 Protection Circuits. 66 2.3.4 Control and Indicator Functions (Hard-wired). 67 2.3.5 PMBus . 70 Revision 1.0 Intel Confidential iii Table of Contents 2.4 Intel® Server Chassis SC5650 SC5650 TPS 1000-W Power Supply . 71 2.4.1 2.4.2 Airflow Requirements. 74 2.4.3 Acoustic Requirements. 74 2.4.4 Temperature Requirements . 74 2.4.5 AC Input Voltage Requirements . 75 2.4.6 DC Output Specification . 81 2.4.7 Power Connectors . 81 2.4.8 DC Output Specifications. 85 2.4.9 3. Mechanical Overview. 72 Control and Indicator Functions. 94 Chassis Cooling . 97 3.1 3.2 Server Board Fan Control . 97 3.3 4. Fan Configuration . 97 Cooling Solution. 98 Peripheral and Hard Drive Support. 100 4.1 3.5-inch Peripheral Drive Bay . 100 4.2 5.25-inch Peripheral Drive Bays . 101 4.3 Hot Swap Hard Disk Drive Bays . 101 4.3.1 Fixed Hard Drive Bay. 101 4.3.2 Intel® Server Chassis SC5650 SC5650 6HDD Passive SAS/SATA Hot Swap Back Plane (HSBP) Overview . 102 4.3.3 4.3.4 External Memory Device. 108 4.3.6 LEDs . 108 4.3.7 SAS/SATA Drive Connectors . 109 4.3.8 Power Connectors . 109 4.3.9 Clock Generation and Distribution . 110 4.3.10 7-Pin SAS/SATA Host Connectors . 110 4.3.11 IPMB Header - IPMB . 110 4.3.12 SGPIO Header - SGPIO . 111 4.3.13 SES Header - SES . 111 4.3.14 Passive Hot Swap Backplane (HSBP) Cables Explained. 112 4.3.15 iv General Purpose Input/Output (GPIO) . 106 4.3.5 5. Server Board and Storage Management Controller VSC410 VSC410*. 103 Connector Specifications . 114 Standard Control Panel . 115 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 5.1 6. Control Panel . 115 Intel® Local Control Panel. 117 6.1 7. Table of Contents Internal Control Panel Headers . 118 System Interconnection. 119 7.1 Signal Definitions . 119 7.2 Chassis Internal Cables. 119 7.2.1 Control Panel Cable. 119 7.2.2 USB Cable . 119 7.2.3 Fan Connector . 119 7.2.4 Chassis Intrusion Cable. 119 7.3 Server Board Internal Cables . 119 7.4 Accessory Cables . 120 7.5 I/O Panel Connectors . 120 7.6 Spares and Accessories . 120 8. Supported Intel® Server Boards. 122 9. Regulatory, Environmentals, and Specifications . 123 9.1 Product Regulatory Compliance . 123 9.1.1 Product Safety Compliance . 123 9.1.2 Product EMC Compliance Class A Compliance . 123 9.1.3 Product Ecology Requirements . 124 9.1.4 Certifications / Registrations / Declarations . 124 9.1.5 Product Regulatory Compliance Markings . 125 9.2 Electromagnetic Compatibility Notices . 126 9.2.1 FCC Verification Statement (USA) . 126 9.2.2 ICES-003 ICES-003 (Canada) . 127 9.2.3 Europe (CE Declaration of Conformity) . 127 9.2.4 Japan EMC Compatibility . 127 9.2.5 BSMI (Taiwan) . 127 9.2.6 RRL (Korea). 128 9.2.7 CNCA (CCC-China) . 128 9.3 Regulated Specified Components . 128 9.4 End of Life / Product Recycling. 129 9.5 Restriction of Hazardous Substances (RoHS) Compliance. 129 9.6 Replacing the Back up Battery . 129 9.7 System-level Environmental Limits . 130 Revision 1.0 Intel Confidential v Table of Contents Intel® Server Chassis SC5650 SC5650 TPS 9.8 9.9 vi Serviceability and Availability. 131 Calculated MTBF . 131 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS List of Figures List of Figures Figure 1. Front Closed Chassis View of Intel® Server Chassis SC5650 SC5650. 3 Figure 2. Rear Closed Chassis View of Intel® Server Chassis SC5650 SC5650 . 4 Figure 3. Front Internal Chassis View of Intel® Server Chassis SC5650 SC5650 (DP/WS/BRP configuration shown) . 5 Figure 4. Rear Internal Chassis View of Intel® Server Chassis SC5650 SC5650 with Optional Hot-swap Drive Bay. 6 Figure 5. ATX 2.2 I/O Aperture . 7 Figure 6. Mechanical Drawing for Power Supply Enclosure . 10 Figure 7. Output Cable Harness for 600-W Power Supply . 12 Figure 8. Output Voltage Timing . 24 Figure 9. Turn On/Off Timing (Power Supply Signals). 26 Figure 10. PSON# Required Signal Characteristics . 29 Figure 11. Power Supply Enclosure - Dimensional Drawing . 31 Figure 12. Output Voltage Timing . 43 Figure 13. Turn On/Off Timing (Power Supply Signals). 45 Figure 14. Mechanical Drawing for Dual (1+1 Configuration) Power Supply Enclosure. 55 Figure 15. Output Voltage Timing . 64 Figure 16. Turn On/Off Timing (Power Supply Signals). 65 Figure 17. Mechanical Drawing of the 1000-W Power Supply Enclosure. 73 Figure 18. LED Markings . 75 Figure 19. Output Voltage Timing . 90 Figure 20. Turn On/Off Timing (Power Supply Signals). 92 Figure 21. Cooling Fan Configuration for Intel® Server Boards S5520HC/S5500HCV/S5520SC S5520HC/S5500HCV/S5520SC above and S5500BC S5500BC below. 98 Figure 22. Drive Bay Locations for Intel® Server Chassis SC5650 SC5650 (DP/WS/BRP configuration shown). 100 Figure 23. 6HDD Passive SAS/SATA HSBP Block Diagram. 103 Figure 24. Passive SAS/SATA HSBP I2C Bus Connection Diagram . 104 Figure 25. Intel® Server Chassis SC5650 SC5650 6HDD Passive SAS/SATA HSBP Board Layout . 113 Figure 26. Panel Controls and Indicators. 115 Figure 27. SKU3 - Pedestal Server Application . 117 Figure 28. Local Control Panel Components . 117 Revision 1.0 Intel Confidential vii List of Tables Intel® Server Chassis SC5650 SC5650 TPS List of Tables Table 1. Intel® Server Chassis SC5650 SC5650 DP, BRP, and WS Features. 2 Table 2. Thermal Environmental Requirements . 11 Table 3. Cable Lengths. 13 Table 4. P1 Baseboard Power Connector . 13 Table 5. P2 Processor 0 Power Connector. 14 Table 6. P3 Processor 1 Power Connector. 14 Table 7. P4 Power Singal Connectors . 15 Table 8. P5-P8 Peripheral Power Connector. 15 Table 9. P9 Right-angle SATA Power Connector . 16 Table 10. P10 SATA Power Connector . 16 Table 11. AC Input Rating. 17 Table 12. AC Line Sag Transient Performance . 18 Table 13. AC Line Surge Transient Performance . 19 Table 14. Load Ratings. 20 Table 15. Voltage Regulation Limits . 21 Table 16. Transient Load Requirements. 22 Table 17. Capacitive Loading Conditions . 22 Table 18. Ripple and Noise. 23 Table 19. Output Voltage Timing . 24 Table 20. Turn On / Off Timing . 25 Table 21. Over Current Protection (OCP) . 27 Table 22. Over Voltage Protection Limits . 27 Table 23. PSON# Signal Characteristics . 28 Table 24. PWOK Signal Characteristics . 29 Table 25. Acoustic Requirements . 32 Table 26. Thermal Requirements . 33 Table 27. Efficiency. 34 Table 28. AC Input Rating. 34 Table 29. AC Line Sag Transient Performance . 35 Table 30. AC Line Surge Transient Performance . 35 Table 31. Performance Criteria. 36 Table 32. Holdup Requirements . 37 viii Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS List of Tables Table 33. Edge Finger Power Supply Connector Pin-out . 39 Table 34. Power Supply Module Load Ratings. 40 Table 35. Voltage Regulation Limits . 41 Table 36. Transient Load Requirements. 41 Table 37. Capacitive Loading Conditions . 41 Table 38. Ripple and Noise. 42 Table 39. Output Voltage Timing . 43 Table 40. Turn On / Off Timing . 44 Table 41. Over-current Protection (OCP) . 46 Table 42. Over-voltage Protection Limits. 47 Table 43. PSON# Signal Characteristic. 48 Table 44. PSKILL Signal Characteristics . 48 Table 45. PWOK Signal Characteristics . 49 Table 46. LED Indicators . 51 Table 47. Environmental Requirements. 56 Table 48. Cable Lengths. 56 Table 49. P1 Baseboard Power Connector . 57 Table 50. P2 Processor 0 Power Connector. 58 Table 51. P3 Processor 1 Power Connector. 58 Table 52. P5, P6, P7, and P8 Peripheral Power Connectors . 59 Table 53. P9 Right-angle SATA Power Connector . 59 Table 54. P10 SATA Power Connector . 60 Table 55. +12V Outputs Load Ratings. 60 Table 56. DC/DC Converters Load Ratings . 61 Table 57. Voltage Regulation Limits . 61 Table 58. Transient Load Requirements. 62 Table 59. Capacitive Loading Conditions . 62 Table 60. Ripple and Noise. 63 Table 61. Output Voltage Timing . 63 Table 62. Turn On / Off Timing . 64 Table 63. Over-current Protection Limits / 240VA 240VA Protection . 66 Table 64. Over-voltage Protection (OVP) Limits . 67 Table 65. PSON# Signal Characteristics . 68 Table 66. PWOK Signal Characteristics . 69 Table 67. SMBAlert# Signal Characteristics . 70 Revision 1.0 Intel Confidential ix List of Tables Intel® Server Chassis SC5650 SC5650 TPS Table 68. Sound Power Requirement. 74 Table 69. Thermal Requirements . 74 Table 70. AC Input Rating. 75 Table 71. AC Line Sag Transient Performance . 76 Table 72. AC Line Surge Transient Performance . 76 Table 73. Performance Criteria. 77 Table 74. AC Line Dropout / Holdup . 78 Table 75. Efficiency. 80 Table 76. Cable Lengths. 81 Table 77. P1 Baseboard Power Connector . 81 Table 78. P2 Processor 1 Power Connector. 82 Table 79. P3 Processor 2 Power Connector. 83 Table 80. P4 Power Signal Connector. 83 Table 81. P5 PCI Express Connector . 83 Table 82. P6 PCI Express Connector . 84 Table 83. P9-P12 P9-P12 Peripheral Power Connectors . 84 Table 84. P13 Right-angle SATA Power Connector . 84 Table 85. P14 SATA Power Connector . 85 Table 86. Load Ratings. 85 Table 87. Pre-set Lighter Load . 86 Table 88. Pre-set Lighter Voltage Regulation Limits. 86 Table 89. Voltage Regulation Limits . 88 Table 90. Transient Load Requirements. 88 Table 91. Capacitive Loading Conditions . 89 Table 92. Ripple and Noise. 89 Table 93. Output Voltage Timing . 90 Table 94. Turn On / Off Timing . 91 Table 95. Over-current Protection (OCP) 240VA 240VA. 93 Table 96. Over-voltage Protection Limits. 93 Table 97. PSON# Signal Characteristic. 94 Table 98. PWOK Signal Characteristics . 95 Table 99. LED Indicators . 95 Table 100. I2C Bus Addressing . 105 Table 101. 6HDD I2C Bus Loading . 105 Table 102. 6HDD VSC410 VSC410* Controller GPIO Assignment . 106 x Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS List of Tables Table 103. LED Function . 108 Table 104. 22-pin SAS/SATA Connector Pin-out . 109 Table 105. Power Connector Pin-out. 110 Table 106. 7-pin SAS/SATA Connector Pin-out . 110 Table 107. IPMB Header Pin-out . 111 Table 108. SGPIO Header Pin-out . 111 Table 109. SES Header Pin-out. 111 Table 110. 6HDD Passive SAS/SATA Hot Swap Backplane Connector Specifications . 114 Table 111. Control Panel LED Functions. 116 Table 112. IPMI Header. 118 Table 113. System Office Environment Summary . 130 Table 114. Mean Time To Repair Estimate . 131 Table 115. Intel® Server Chassis SC5650 SC5650 Component MTBF. 132 Revision 1.0 Intel Confidential xi Intel® Server Chassis SC5650 SC5650 TPS 1. Product Overview Product Overview The Intel® Server Chassis SC5650 SC5650 is a 5.2U pedestal chassis designed to support the Intel® Server Boards S5500BC S5500BC, S5520HC/S5500HCV S5520HC/S5500HCV, and S5520SC S5520SC. This chapter provides a highlevel overview of the chassis features. Greater detail for each major chassis component or feature is provided in the following chapters. 1.1 Intel® Server Chassis SC5650 SC5650 Design Features The Intel® Server Chassis SC5650 SC5650 addresses the value server market with three power factor correction (PFC) power supply unit (PSU) configurations: SC5650DP SC5650DP 600-W fixed PSU for dual-processor server boards SC5650WS SC5650WS 1000-W fixed PSU for dual-processor workstation boards SC5650BRP SC5650BRP 600-W 1+0 redundant PSU for dual-processor server boards The DP and WS power supply configurations each include an Intel validated PSU with an integrated cooling fan and one AC line input. The BRP power supply configuration includes (1 of 2) redundant Intel validated PSU (full redundancy requires an additional 600-W module) with an integrated cooling fan and two AC line inputs. The cooling sub-system in the Intel® Server Chassis SC5650 SC5650 consists of one 120-mm system fan, one 120-mm PCI fan and a 92-mm drive bay fan. A 92-mm drive bay fan is also included with the optional hot swap drive bay mounting bracket kit. A removable access cover provides entry to the interior of the chassis. The rear I/O panel conforms to the Advanced Technology Extended (ATX) Specification, Revision 2.2. The chassis supports six full-length expansion cards. There are two front USB port connections, and one rear knock-out location for an optional rear mounted serial port. A control panel board designed for Server Standards Infrastructure (SSI) Entry E-Bay (EEB) 3.61-compliant server boards is also provided with the server chassis. The Intel® Server Chassis SC5650 SC5650 supports up to six hard drives in all three configurations. Two 5.25-inch, half-height drive bays are available for peripherals, such as CD/DVD-ROM drives and tape drives. An optional hot-swap SAS non-expander/SAS expander drive bay kit provides an upgrade path to allow the Intel® Server Chassis SC5650 SC5650 to support up to six hot-swap drives. Refer to the Drive Cage Upgrade Kit Installation Guide for the Intel® Server Chassis SC5650 SC5650 for complete hot swap drive cage installation instructions. When installed, the hot-swap drive bay replaces the fixed hard drive bay. The Intel® Server Chassis SC5650 SC5650 makes extensive use of tool-less hardware features that support tool-less installation and removal of fans, fixed and hot swap hard drives, fixed and hot swap drive bays, PCI cards, hot swap PSU modules, fixed PSU, floppy drives, and CD/DVD ROM drives. This specification details the key features of the product. Reference documents listed at the back of this document provide additional product specification details for the server boards, backplanes, and power supplies validated for use with this chassis. Check the compatibility Revision 1.0 Intel Confidential 1 Product Overview Intel® Server Chassis SC5650 SC5650 TPS section on the support website for more details: /. The following table summarizes the features for all chassis combinations. Table 1. Intel® Server Chassis SC5650 SC5650 DP, BRP, and WS Features Configuration ® Intel Server Board Support SC5650DP SC5650DP SC5650BRP SC5650BRP ® Intel Server Board S5500BC S5500BC ® Intel Server Board S5520HC/ S5520HC/ ® Intel Server Board S5500HCV S5500HCV ® Intel Server Board S5500BC S5500BC SC5650WS SC5650WS ® Intel Server Board S5520SC S5520SC ® Intel Server Board ® S5520HC/ S5520HC/ Intel Server Board S5500HCV S5500HCV 600-W PFC Intel validated PSU with integrated cooling fan. You can add one additional 600-W PSU for redundancy. 1000-W PFC Intel validated PSU with integrated cooling fan. Power Delivery 600-W PFC Intel validated PSU with integrated cooling fan. System Cooling One tool-less, 120-mm chassis fan. One tool-less 120-mm PCI fan. One tool-less 92-mm drive bay fan. Peripheral Bays Two tool-less, multi-mount 5.25-inch peripheral bays. One standard 3.5-inch removable media peripheral bay. Drive Bays Includes one tool-less fixed drive bay for up to six fixed drives. PCI Slots Seven slots, six full-length, full-height PCI slots with tail card guide and one half length PCI slot. Form Factor 5.2U tower, convertible to 6U rack mount. Front Panel LEDs for NIC1, NIC2, HDD activity, power status, and system fault status. Switches for power, NMI, and reset. Integrated temperature sensor for fan speed management. External Front Connectors Two USB ports Color Black Construction 1.0-mm, zinc-plated sheet metal, meets Intel Cosmetic Spec # C25432 C25432 Chassis ABS Fire-retardant, non-brominated, PC-ABS Dimensions Pedestal 17.8 in (45.2 cm) x 9.256 in (23.5 cm) x 19 in (48.3 cm) Dimensions Rack 9.256 in (23.5 cm) x 17.6 in (44.7 cm) x 19 in (48.3 cm) 2 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 1.2 Product Overview Chassis Views A. B. C. D. E. Control panel controls and indicators Two half-height 5.25-inch peripheral drive bays Internal hard drive bay cage (behind door) Security lock USB ports Figure 1. Front Closed Chassis View of Intel® Server Chassis SC5650 SC5650 Revision 1.0 Intel Confidential 3 Product Overview Intel® Server Chassis SC5650 SC5650 TPS A. B. C. D. E. F. G. H. I. J. Power supply (fixed power supply shown) AC input power connector I/O Ports Expansion slot covers Alternate external SCSI knockout 120-mm system fan Serial B port knockout Location to install padlock loop External SCSI knockout Alternate Serial B port knockout Figure 2. Rear Closed Chassis View of Intel® Server Chassis SC5650 SC5650 4 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Product Overview Figure 3. Front Internal Chassis View of Intel® Server Chassis SC5650 SC5650 (DP/WS/BRP configuration shown) Revision 1.0 Intel Confidential 5 Product Overview Intel® Server Chassis SC5650 SC5650 TPS Figure 4. Rear Internal Chassis View of Intel® Server Chassis SC5650 SC5650 with Optional Hot-swap Drive Bay 6 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 1.3 Product Overview System Color The Intel® Server Chassis SC5650 SC5650 is offered in one color: Black (GE701 GE701) 1.4 Chassis Security A variety of chassis security options are provided at the system level: A removable padlock loop at the rear of the system access cover can be used to prevent access to the microprocessors, memory, and add-in cards. A variety of lock sizes can be accommodated by the 0.270-inch diameter loop. A two-position key lock/switch will unlock the front bezel for DP, WS, and BRP configurations. A chassis intrusion switch is provided, allowing server management software to detect unauthorized access to the system side cover. Note: See the technical product specification appropriate to the server board for a description of BIOS and management security features for each specific supported platform. You can find technical product specifications at: http://support.intel.com. 1.5 I/O Panel All input/output (I/O) connectors are accessible from the rear of the chassis. The SSI E-bay 3.61-compliant chassis provides an ATX 2.2-compatible cutout for I/O shield installation. Boxed Intel® server boards provide the required I/O shield for installation in the cutout. The I/O cutout dimensions are shown in the following figure for reference. R 0.039 MAX, TYP 0.100 Min keepout around opening 1.750 ± 0.008 (0.150) Baseboard I/O Aperture 6.250 ± 0.008 5.196 ± 0.010 Datum 0,0 (0.650) Figure 5. ATX 2.2 I/O Aperture 1.6 Rack and Cabinet Mounting Option ® The Intel Server Chassis SC5650 SC5650 supports a rack mount configuration. The rack mount kit includes the chassis slide rails, rack handle, rack orientation label, screws, and manual. This rack mount kit is designed to meet the EIA-310-D EIA-310-D enclosure specification. General rack compatibility is further described in the Server Rack Cabinet Compatibility Guide found at http://support.intel.com. Revision 1.0 Intel Confidential 7 Product Overview 1.7 Intel® Server Chassis SC5650 SC5650 TPS Front Bezel Features The bezel is constructed of molded plastic and attaches to the front of the chassis with three clips on the right side and two snaps on the left. The snaps at the left attach behind the access cover, thereby preventing accidental removal of the bezel. The bezel can only be removed by first removing the server access cover. This provides additional security to the hard drive and peripheral bay area. The bezel also includes a key-locking door that covers the drive cage area and allows access to hot swap drives when a hot swap drive bay is installed. The peripheral bays are covered with plastic snap-in cosmetic pieces that must be removed to add peripherals to the system. Control panel buttons and lights are located along the right side of the peripheral bays. 1.8 Peripheral Bays Two 5.25-inch, half-height drive bays are available for CD/DVD-ROM or tape drives as well as one 3.5-inch removable media drive bay. Drive installation is tool-less and requires no screws. 8 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system 2. Power Sub-system 2.1 DP 600-Watt Power Supply The 600-W power supply specification defines a non-redundant power supply that supports DP Intel® Xeon® rack mount server systems. The 600-W power supply has eight outputs: 3.3V, 5V, 12V1, 12V2, 12V3, 12V4, -12V, and 5VSB. The form factor fits into a pedestal system and provides a wire harness output to the system. An IEC connector is provided on the external face for AC input to the power supply. The power supply incorporates a Power Factor Correction circuit. The power supply is tested as described in EN 61000-3-2: Electromagnetic Compatibility (EMC) Part 3: Limits-Section 2: Limits for Harmonic Current Emissions, and meets the harmonic current emissions limits specified for ITE equipment. The power supply is tested as described in the JEIDA MITI Guideline for Suppression of High Harmonics in Appliances and General-Use Equipment and meets the harmonic current emissions limits specified for ITE equipment. Revision 1.0 Intel Confidential 9 Power Sub-system 2.1.1 Intel® Server Chassis SC5650 SC5650 TPS Mechanical Overview Figure 6. Mechanical Drawing for Power Supply Enclosure 10 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 2.1.2 Power Sub-system Airflow and Temperature The power supply incorporates one 80-mm fan for self and system cooling. The fan provides no less than 14 CFM of airflow through the power supply when installed in the system. The cooling air enters the power module from the non-AC side. The power supply operates within all specified limits over the Top temperature range. Table 2. Thermal Environmental Requirements ITEM DESCRIPTION MIN Specification UNITS Top Operating temperature range. 0 50 °C Tnon-op Non-operating temperature range. -40 70 °C Altitude Maximum operating altitude 1500 m The power supply meets UL enclosure requirements for temperature rise limits. With the exception of the air exhaust side, all sides of the power supply are classified as "Handle, knobs, grips, etc. held for short periods of time only." 2.1.3 Output Cable Harness Listed or recognized component appliance wiring material (AVLV2), CN, rated min 105°C, 300Vdc is used for all output wiring. Revision 1.0 Intel Confidential 11 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS Figure 7. Output Cable Harness for 600-W Power Supply NOTES: 1. ALL DIMENSIONS ARE IN MM 2. ALL TOLERANCES ARE +10 MM / -0 MM 3. INSTALL 1 TIE WRAP WITHIN 12MM OF THE PSU CAGE 4. MARK REFERENCE DESIGNATOR ON EACH CONNECTOR 5. TIE WRAP EACH HARNESS AT APPROX. MID POINT 6. TIE WRAP P1 WITH 2 TIES AT APPROXIMATELY 15M SPACING. 12 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 3. Cable Lengths To Connector # From Power Supply cover exit hole P1 (mm) 850 To Connector # From Length Number of Pins Description 24 Length (mm) Baseboard Power Connector Number of Pins Description Power Supply cover exit hole P2 400 8 Processor 0 Power Connector Power Supply cover exit hole P3 400 8 Processor 1 Power Connector Power Supply cover exit hole P4 350 5 Power PSMI Connector Power Supply cover exit hole P5 350 4 Peripheral Power Connector Extension P6 100 4 Peripheral Power Connector Power Supply cover exit hole P7 800 4 Peripheral Power Connector Extension P8 75 4 Peripheral Power Connector Power Supply cover exit hole P9 5 Right-angle SATA Power Connector Extension P10 5 SATA Power Connector 2.1.3.1 800 75 P1 Baseboard Power Connector Connector housing: 24-pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent Contact: Molex* 39-00-0059, or equivalent; Molex* 44476-1111 for P10 & P11 Table 4. P1 Baseboard Power Connector Pin Signal 18 AWG Color Pin Signal 18 AWG Color 1 +3.3 VDC Orange 13 +3.3 VDC Orange 2 +3.3 VDC Orange 14 -12 VDC Blue 3 COM Black 15 COM Black Revision 1.0 Intel Confidential 13 Power Sub-system Pin Signal Intel® Server Chassis SC5650 SC5650 TPS 18 AWG Color Pin Signal 18 AWG Color 4 +5 VDC Red 16 PSON# Green 5 COM Black 17 COM Black 6 +5 VDC Red 18 COM Black 7 COM Black 19 COM Black 8 PWR OK Gray 20 Reserved N.C. 9 5VSB Purple 21 +5 VDC Red 10 +12V3 Yellow 22 +5 VDC Red 11 +12V2 Yellow 23 +5 VDC Red 12 +3.3 VDC Orange 24 COM Black 2.1.3.2 P2 Processor 0 Power Connector Connector housing: 8-pin Molex* 39-01-2085 or equivalent Contact: Molex* 39-00-0059 or equivalent Table 5. P2 Processor 0 Power Connector Pin Signal 18 AWG Color Pin Signal 18 AWG Color 1 COM Black 5 +12V1 White 2 COM Black 6 +12V1 White 3 COM Black 7 +12V1 Brown 4 COM Black 8 +12V1 Brown 2.1.3.3 P3 Processor 1 Power Connector Connector housing: 8-pin Molex* 39-01-2085 or equivalent Contact: Molex* 39-00-0059 or equivalent Table 6. P3 Processor 1 Power Connector Pin Signal 18 AWG Color Pin Signal 18 AWG Color 1 Black 5 +12V1 Brown 2 COM Black 6 +12V1 Brown 3 14 COM COM Black 7 +12V1 White Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 4 COM 2.1.3.4 Power Sub-system Black 8 +12V1 White P4 Power Signal Connectors Connector housing: 5-pin Molex* 50-57-9405 or equivalent Contacts: Molex* 16-02-0087 or equivalent Table 7. P4 Power Singal Connectors Pin Signal 2 24 AWG Color 1 I C Clock White 2 I2C Data Yellow 3 Reserved N.C. 4 COM Black 5 3.3RS Orange 2.1.3.5 P5-P8 Peripheral Power Connector Connector housing: AMP* 770827-1 or equivalent Contact: AMP* 61117-4, or equivalent Table 8. P5-P8 Peripheral Power Connector Pin Signal 18 AWG Color 1 +12V4 Blue/White Stripe 2 COM Black 3 COM Black 4 +5Vdc RED 2.1.3.6 P9 Right-angle SATA Power Connector Connector Housing: JWT* F6002HS0-5P-18 F6002HS0-5P-18 or equivalent Contact: N/A Revision 1.0 Intel Confidential 15 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS Table 9. P9 Right-angle SATA Power Connector Pin 18 AWG Color 1 +3.3V Orange 2 Ground Black 3 +5V Red 4 Ground Black 5 2.1.3.7 Signal +12V4 Green P10 SATA Power Connector Connector Housing: 5-pin Molex* 67926-0011 or equivalent Contact: Molex* 67926-0041 or equivalent Table 10. P10 SATA Power Connector Pin 18 AWG Color 1 +3.3V Orange 2 COM Black 3 +5V Red 4 COM Black 5 2.1.4 Signal +12V2 Blue/White AC Input Requirements The power supply operates within all specified limits over the following input voltage range, shown in the following table. Harmonic distortion of up to 10% of the rated line voltage must not cause the power supply to go out of specified limits. If the AC input is less than 75VAC 75VAC +/-5VAC range, the power supply does power off. If the AC input is greater than 85VAC 85VAC +/-4VAC, the power supply starts up. Application of an input voltage below 85VAC 85VAC does not cause damage to the power supply, including a fuse blow. 16 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 11. AC Input Rating PARAMETER MIN Rated MAX Max Input Current Voltage (110) 90 Vrms 100-127 Vrms 140 Vrms 10 A1,3 Voltage (220) 180 Vrms 200-240 Vrms 264 Vrms 47 Hz 50/60Hz 85Vac +/4Vac Power Off VAC 5 A2,3 Frequency Start up VAC 75Vac +/5Vac 63 Hz Notes: 1 Maximum input current at low input voltage range should measured at 90VAC 90VAC, at max load. 2 Maximum input current at high input voltage range should be measured at 180VAC 180VAC, at max load. 3 Do not use this requirement for determining agency input current markings. 2.1.4.1 AC Inlet Connector The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 10A / 250VAC 250VAC. 2.1.4.2 Efficiency The power supply has a recommended efficiency of 68% at maximum load and over the specified AC voltage. 2.1.4.3 AC Line Dropout / Holdup An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout of one cycle or less the power supply meets dynamic voltage regulation requirements over the rated load. An AC line dropout of one cycle or less (20ms min) does not cause any tripping of control signals or protection circuits. If the AC dropout lasts longer than one cycle, the power recovers and meets all turn-on requirements. The power supply meets the AC dropout requirement over rated AC voltages, frequencies, and output loading conditions. Any dropout of the AC line does not cause damage to the power supply. 2.1.4.3.1 AC Line 5VSB Holdup The 5VSB output voltage stays in regulation under its full load (static or dynamic) during an AC dropout of 70ms min (=5VSB holdup time) whether the power supply is in the ON or OFF state (PSON asserted or de-asserted). 2.1.4.4 AC Line Fuse The power supply has a single line fuse on the Line (Hot) wire of the AC input. The line fusing is acceptable for all safety agency requirements. The input fuse is a slow blow type. AC inrush current does not cause the AC line fuse to blow under any conditions. All protection circuits in the power supply do not cause the AC fuse to blow unless a component in the power supply failed. This includes DC output load short conditions. Revision 1.0 Intel Confidential 17 Power Sub-system 2.1.4.5 Intel® Server Chassis SC5650 SC5650 TPS AC In-rush AC line in-rush current does not exceed a 50 A peak, cold start @ 20 degrees C and no damage at hot start for up to one-quarter of the AC cycle, after which, the input current is no more than the specified maximum input current at 264 Vac input. The peak in-rush current is less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device). The power supply meets the in-rush requirements for any rated AC voltage during turn on at any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any duration, and over the specified temperature range (Top). 2.1.4.6 AC Line Surge The power supply is tested with the system for immunity to AC Ringwave and AC Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992. Pass criteria includes: No unsafe operation allowed under any conditions; all power supply output voltage levels must stay within proper specification levels; no change in operating state or loss of data during and after the test profile; no component damage under any conditions. 2.1.4.7 AC Line Transient Specification AC line transient conditions are defined as "sag" and "surge" conditions. "Sag" conditions are also commonly referred to as "brownout," and defined as AC line voltage drops below nominal voltage conditions. "Surge" is defined as AC line voltage rises above nominal voltage conditions. The power supply meets requirements under the following AC line sag and surge conditions. Table 12. AC Line Sag Transient Performance Duration Sag Operating AC Voltage Line Frequency Continuous 10% Nominal AC Voltage ranges 50/60Hz 0 to 1 AC cycle 95% Nominal AC Voltage ranges 50/60Hz > 1 AC cycle >30% Nominal AC Voltage ranges 50/60Hz 18 Intel Confidential Performance Criteria No loss of function or performance No loss of function or performance Loss of function acceptable, self recoverable Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 13. AC Line Surge Transient Performance Duration Surge Operating AC Voltage Line Frequency Performance Criteria No loss of function or performance Continuous 10% Nominal AC Voltages 50/60Hz 0 to ½ AC cycle 30% Mid-point of nominal AC Voltages 50/60Hz 2.1.4.8 No loss of function or performance AC Line Fast Transient (EFT) Specification The power supply meets the EN 61000-4-5 directive and any additional requirements in IEC1000-4-5 IEC1000-4-5:1995 and the Level 3 requirements for surge-withstand capability with the following conditions and exceptions: · These input transients do not cause any out-of-regulation conditions, such as overshoot and undershoot, nor do they cause any nuisance trips of any of the power supply protection circuits. · The surge-withstand test does not produce damage to the power supply. · The power supply meets surge-withstand test conditions under maximum and minimum DC-output load conditions. 2.1.4.9 AC Line Leakage Current The maximum leakage current to ground for each power supply is 3.5 mA when tested at 240 VAC. 2.1.5 DC Output Specifications 2.1.5.1 Grounding The ground of the pins of the power supply output connector provides the power return path. The output connector ground pins are connected to the safety ground (power supply enclosure). 2.1.5.2 Standby Output The 5 VSB output is present when an AC input greater than the power supply turn-on voltage is applied. 2.1.5.3 Fanless Operation Fanless operation is the power supply's ability to work indefinitely in standby mode with power on, power supply off, and the 5 VSB at full load (=2A) under environmental conditions Revision 1.0 Intel Confidential 19 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS (temperature, humidity, and altitude). In this mode, the components' maximum temperature should follow the same guidelines. 2.1.5.4 Remote Sense The power supply has remote sense return (ReturnS) to regulate out ground drops for all output voltages: +3.3V, +5V, +12V1, +12V2, +12V3, +12V4, -12V, and 5VSB. The power supply uses remote sense to regulate out drops in the system for the +3.3V, +5V, and +12V1 output. The +5V, +12V1, +12V2, +12V3, +12V4, 12V, and 5VSB outputs only use remote sense referenced to the ReturnS signal. The remote sense input impedance to the power supply is greater than 200. This is the value of the resistor connecting the remote sense to the output voltage internal to the power supply. Remote sense can regulate out a minimum of 200mV drop. The remote sense return (ReturnS) can regulate out a minimum of 200 mV drop in the power ground return. The current in any remote sense line is less than 5mA to prevent voltage sensing errors. The power supply operates within specification over the full range of voltage drops from the power supply's output connector to the remote sense points. 2.1.5.5 Power Module Output Power / Currents The following table defines power and current ratings for this 600-W power supply. The combined output power of all outputs does not exceed the rated output power. The following are load ranges for each of the two power supply power levels. The power supply meets both static and dynamic voltage regulation requirements for the minimum loading conditions. Table 14. Load Ratings Load Range 1 (Maximum System Loading) Voltage Minimum Continuous Load Maximum Continuous Load1, 3 +3.3V6 1.5 A 20 A +5V6 5.0 A 24 A +12V1 1.5 A 15 A 18 A +12V2 1.5 A 15 A 18 A +12V3 1.5 A 16 A 18 A +12V4 1.5 A 16 A 18 A -12V 0A 0.5 A +5VSB 0.1 A 2.0 A Peak Load2, 4, 5 Load Range 2 (Light System Loading) 20 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Peak Load5 Voltage Minimum Continuous Load Maximum Continuous Load +3.3V6 0.5 A 9.0 A +5V6 2.0 A 7.0 A +12V1 0.5 A 5.0 A 7.0 A +12V2 0.5 A 5.0 A 7.0 A +12V3 2.0 A 6.0 A +12V4 0.5 A 5.0 A -12V 0A 0.5 A +5VSB 0.1 A 2.0 A Notes: 1. 2. 3. 4. 5. 6. 2.1.5.6 Maximum continuous total DC output power should not exceed 600 W. Peak load on the combined 12-V output should not exceed 48 A. Maximum continuous load on the combined 12-V output should not exceed 43 A. Peak total DC output power should not exceed 660 W. Peak power and peak current loading should be supported for a minimum of 12 seconds. Combined 3.3 V/5 V power should not exceed 140 W. Voltage Regulation The power supply output voltages are within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise. All outputs are measured with reference to the return remote sense signal (ReturnS). The +12V3, +12V4, 12V, and 5VSB outputs are measured at the power supply connectors referenced to ReturnS. The +3.3V, +5V, +12V1, and +12V2 are measured at the remote sense signal located at the signal connector. Table 15. Voltage Regulation Limits Parameter Tolerance MIN NOM MAX Units + 3.3V - 5% / +5% +3.14 +3.30 +3.46 Vrms + 5V - 5% / +5% +4.75 +5.00 +5.25 Vrms + 12V1 - 5% / +5% +11.40 +12.00 +12.60 Vrms + 12V2 - 5% / +5% +11.40 +12.00 +12.60 Vrms +12V3 - 5% / +5% +11.40 +12.00 +12.60 Vrms +12V4 - 5% / +5% +11.40 +12.00 +12.60 Vrms Revision 1.0 Intel Confidential 21 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS - 12V -11.40 -12.00 -13.08 Vrms + 5VSB 2.1.5.7 - 5% / +9% - 5% / +5% +4.75 +5.00 +5.25 Vrms Dynamic Loading The output voltages are within the limits specified for the step loading and capacitive loading requirements specified in the following table. The load transient repetition rate is tested between 50 Hz and 5 kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The step load may occur anywhere within the MIN load and MAX load conditions. Table 16. Transient Load Requirements Step Load Size 1, 2 Output Load Slew Rate Test Capacitive Load +3.3 V 0.25 A/µsec 4700 µF +5 V 7.0 A 0.25 A/µsec 1000 µF +12 V 25 A 0.25 A/µsec 2700 µF +5 VSB 2.1.5.8 7.0 A 0.5 A 0.25 A/µsec 20 µF Capacitive Loading The power supply is stable and meets all requirements with the following capacitive loading ranges. Table 17. Capacitive Loading Conditions Output MAX Units +3.3V 10 12,000 µF +5V 10 12,000 µF +12V(1, 2, 3) 500 each 11,000 µF +12V4 10 500 µF -12V 1 350 µF +5VSB 22 MIN 20 350 µF Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 2.1.5.9 Power Sub-system Closed Loop Stability The power supply is unconditionally stable under all line/load/transient load conditions including capacitive load ranges in Section 2.1.5.8. A minimum of a 45-degree phase margin and -10dBgain margin is required. Closed-loop stability is ensured at the maximum and minimum loads as applicable. 2.1.5.10 Residual Voltage Immunity in Standby Mode The power supply is immune to any residual voltage placed on its outputs (typically a leakage voltage through the system from standby output) up to 500mV. There is neither additional heat generated nor stressing of any internal components with this voltage applied to any individual output or all outputs simultaneously. Residual voltage also does not trip the protection circuits during turn on/off. The residual voltage at the power supply outputs for a no-load condition does not exceed 100 mV when AC voltage is applied. 2.1.5.11 Common Mode Noise The Common Mode noise on any output does not exceed 350mV pk-pk over the frequency band of 10Hz to 30MHz.The measurement is made across a 100 resistor between each of the DC outputs including ground at the DC power connector and chassis ground (power subsystem enclosure). The test set-up uses an FET probe, such as a Tektronix* P6046 P6046, or equivalent. 2.1.5.12 Ripple / Noise The maximum allowed ripple/noise output of the power supply is defined in the following table. This is measured over a bandwidth of 10 Hz to 20 MHz at the power supply output connectors. A 10µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor is placed at the point of measurement. Table 18. Ripple and Noise +3.3V +12V(1,2,3,4) -12V +5VSB 50mVp-p 2.1.5.13 +5V 50mVp-p 120mVp-p 120mVp-p 50mVp-p Timing Requirements The timing requirements for power supply operation are as follows. The output voltages must rise from 10% to within regulation limits (Tvout_rise) within 5 to 70ms, except for 5VSB which is allowed to rise from 1.0 to 25ms. The +3.3V, +5V and +12V output voltages start to rise at approximately the same time. All outputs must rise monotonically. The 5V output must be greater than the +3.3V output during any point of the voltage rise. The +5V output must never be greater than the +3.3V output by more than 2.25V. Each output voltage reaches regulation within 50 ms (Tvout_on) of each other during turn on of the power supply. Each output voltage falls out of regulation within 400msec (Tvout_off) of each other during turn off. The following table Revision 1.0 Intel Confidential 23 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS shows the timing requirements for the power supply being turned on and off via the AC input with PSON held low and the PSON signal with the AC input applied. Table 19. Output Voltage Timing Item Description Tvout_rise Output voltage rise time from each main output. Tvout_on T vout_off Minimum 5.0* Maximum Units 70* msec All main outputs must be within regulation of each other within this time. 50 msec All main outputs must leave regulation within this time. 400 msec * The 5VSB output voltage rise time should be from 1.0 ms to 25 ms. Vout V1 10% Vout V2 V3 V4 Tvout rise Tvout_off Tvout_on Figure 8. Output Voltage Timing 24 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 20. Turn On / Off Timing Item Description Minimum Maximum Units Tsb_on_delay Delay from AC being applied to 5VSB being within regulation. 1500 msec Tac_on_delay Delay from AC being applied to all output voltages being within regulation. 2500 msec Tvout_holdup Time all output voltages stay within regulation after loss of AC. 21 msec Tpwok_holdup Delay from loss of AC to de-assertion of PWOK. 20 msec Tpson_on_delay Delay from PSON active to output voltages within regulation limits. Tpson_pwok Delay from PSON deactive to PWOK being de-asserted. Tpwok_on Delay from output voltages within regulation limits to PWOK asserted at turn on. Tpwok_off Delay from PWOK de-asserted to output voltages (3.3 V, 5 V, 12 V, and -12 V) dropping out of regulation limits. Tpwok_low Duration of PWOK being in the de-asserted state during an off/on cycle using AC or the PSON signal. 100 Tsb_vout Delay from 5 VSB being in regulation to O/Ps being in regulation at AC turn on. 50 T5VSB_holdup Time the 5 VSB output voltage stays within regulation after loss of AC. 70 Revision 1.0 # 5 400 msec 50 msec 100 1000 msec 1 200 msec # Intel Confidential msec 1000 msec msec 25 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS AC Input Tvout_holdup Vout Tpwok_low TAC_on_delay Tsb_on_delay Tpwok_on PWOK 5VSB Tpwok_off Tsb_on_delay Tpwok_on Tpwok_off Tpson_pwok Tpwok_holdup Tsb_vout T5VSB_holdup Tpson_on_delay PSON AC turn on/off cycle PSON turn on/off cycle Figure 9. Turn On/Off Timing (Power Supply Signals) 2.1.6 Protection Circuits Protection circuits inside the power supply cause only the power supply's main outputs to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds and a PSON# cycle HIGH for 1 second resets the power supply. 2.1.7 Current Limit (OCP) The power supply has a current limit to prevent the +3.3V, +5V, and +12V outputs from exceeding the values shown in the following table. If the current limits are exceeded, the power supply shuts down and latches off. The latch is cleared by either toggling the PSON# signal or by an AC power interruption. The power supply is not damaged from repeated power cycling in this condition. -12 V and 5 VSB are protected under over current or shorted conditions so no damage occurs to the power supply. 5 VSB will auto-recover after the OCP limit is removed. 26 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 21. Over Current Protection (OCP) VOLTAGE OVER CURRENT LIMIT Min +3.3 V 26.4 A 36 A +5 V 26.4 A 36 A +12 V1 18 A 20 A +12 V2 18 A 20 A +12 V3 18 A 20 A +12 V4 18 A 20 A -12 V 0.625 A 4A 5 VSB 2.1.7.1 Max N/A 8A Over Voltage Protection (OVP) The power supply over voltage protection is locally sensed. After an over-voltage condition occurs, the power supply shuts down and latches off. You can clear this latch by toggling the PSON# signal or by an AC power interruption. The following table contains the over voltage limits. The values are measured at the output of the power supply's pins. The voltage never exceeds the maximum levels when measured at the power pins of the power supply connector during any single point of fail. The voltage will not trip any lower than the minimum levels when measured at the power pins of the power supply connector. After the OVP condition is removed, +5 VSB will auto-recover. Table 22. Over Voltage Protection Limits Output Voltage MAX (V) +3.3 V 3.9 V 4.5 V +5 V 5.7 V 6.5 V +12 V1,2,3,4 13.3 V 14.5 V -12 V -13.3 V -16 V +5 VSB Revision 1.0 MIN (V) 5.7 V 6.5 V Intel Confidential 27 Power Sub-system 2.1.7.2 Intel® Server Chassis SC5650 SC5650 TPS Over Temperature Protection (OTP) The power supply is protected against over temperature conditions caused by loss of fan cooling or excessive ambient temperature. In an OTP condition, the power supply shuts down. When the power supply temperature drops to within specified limits, the power supply restores power automatically, while the 5 VSB will always remain on. The OTP circuit has a built-in hysteresis such that the power supply will not oscillate on and off due to a temperature recovering condition. The OTP trip level has a minimum of 4°C of ambient temperature hysteresis. 2.1.7.3 PSON# Input Signal # The PSON signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +3.3V, +5V, +12V, and -12V power rails. When this signal is not pulled low by the system or left open, the outputs (except the +5VSB) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply. Refer to the following table and figure for PSON# signal characteristics. Table 23. PSON# Signal Characteristics Signal Type Accepts an open collector/drain input from the system. Pull-up to 5 V located in power supply. PSON# = Low ON PSON# = High or Open OFF MIN Logic level low (power supply ON) Logic level high (power supply OFF) MAX 0V 1.0V 2.1V 5.25V Source current, Vpson = low Power up delay: PWOK delay: 28 Tpson_on_delay 4mA 5 msec T pson_pwok 400 msec 50 msec Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Figure 10. PSON# Required Signal Characteristics Disabled 0.3V Hysterisis 1.0V In 1.0-2.0V input voltages range is required 1.0 V PS is enabled 2.0 V PS is disabled Enabled 0V 2.1.7.4 1.0V 2.0V 5.25V PWOK (Power OK) Output Signal PWOK is a power OK signal and is pulled HIGH by the power supply to indicate all the outputs are within the regulation limits of the power supply. When any output voltage falls below regulation limits or when AC power is removed for a time sufficiently long so the power supply operation is no longer guaranteed, PWOK is de-asserted to a LOW state. The start of the PWOK delay time is inhibited as long as any power supply output is within current limit. Table 24. PWOK Signal Characteristics Open collector/drain output from power supply. Pull-up to VSB located in system. Signal Type PWOK = High Power OK PWOK = Low Power Not OK MIN 0V Logic level low voltage, Isink=4mA Logic level high voltage, Isource=200µA MAX 0.4 V 2.4 V 5.25 V Sink current, PWOK = low 4m A Source current, PWOK = high 2m A PWOK delay: Tpwok_on 100 ms PWOK rise and fall time Power down delay: T pwok_off Revision 1.0 1000 ms 100µsec 1 ms Intel Confidential 200 msec 29 Power Sub-system 2.1.8 Intel® Server Chassis SC5650 SC5650 TPS FRU Data The FRU data format is compliant with the IPMI, version 1.0 (per rev.1.1 from Sept.25, 1999) specification. The current version of these specifications is available at: . 2.1.8.1 Device Address Locations The power supply device address location is as follows: Power Supply FRU Device 30 A0h Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 2.2 Power Sub-system 600-W 1+1 Power Supply Module The 600-W power supply module specification defines a 1+1 power supply module that supports pedestal server systems. It defines a 600-W power supply with 2 outputs: +12Vdc and +5Vsb. A separate cage (including power distribution board) is designed to plug directly to the output connector of the PS module and provide additional power converters to produce other required voltages. An IEC connector is provided on the external face for AC input to the power supply. The power supply contains cooling fans, while meeting acoustic requirements. 2.2.1 Mechanical Overview The 1+1 configuration of 600-W power supply enclosure dimensional drawing is shown: Figure 11. Power Supply Enclosure - Dimensional Drawing 2.2.1.1 Handle and Retention Mechanism The power supply has a handle to provide a place to grip the power supply for removal and insertion. The power supply has a simple retention mechanism to retain the power supply once it is inserted. This mechanism withstands the specified mechanical shock and vibration Revision 1.0 Intel Confidential 31 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS requirements. The tab on the retention mechanism is green to indicate it is a hot-swap touch point. The latch mechanism is designed in such a way as to prevent inserting the power supply with the power cord plugged in. This aid in the hot swapping procedure: on removal, the power cord is unplugged first, then the power supply is removed; on insertion, the power supply is inserted first and then the power cord is plugged in. The handle protects the operator from any burn hazard. You can use a metal handle only if the temperature remains less than 55 degrees when running at maximum load under maximum ambient temperature conditions. A plastic handle is molded from the following material: Material GE 2800 BAYER FR2000 FR2000 2.2.1.2 Color Green Green Designation GN3058 GN3058 3200 Acoustic and Fan Speed Control Requirements Sound power levels emitted by the power supply meet the requirements shown in the following table. Sound power is measured as described in ISO7779 ISO7779. Under a condition where inlet air temperature exceeds the limit, sound power level may exceed the limit. The power supply incorporates a variable speed fan. The fan speed varies linearly based on output loading and ambient temperature. The declared sound power levels (LwAd) of the power supply unit (PSU) meet the requirements shown in the following table. Sound power is measured according to ECMA 74 (www.ecma-international.org) and reported according to ISO 9296. The acoustic measurement of the power supply is performed with the power supply fan operating at the RPM corresponding to the operating conditions shown in the following table. The PSU acoustic test report should include at a minimum the following information: power supply dimensions, picture, fan model and size, fan voltage (or duty cycle), and RPM and PSU sound power level at each operating condition. The proper RPM thermally sustainable is determined through PSU thermal testing and should be submitted as an appendix to the acoustic test report. The cage should be tested in a 1+0 non-redundant configuration and a 1+1 redundant configuration. Table 25. Acoustic Requirements Operating Conditions Inlet Temperature Condition % of Single module Maximum Loading Condition LwAd (BA) Maximum (1+0 & 1+1) 100% < 6.5 Operating (1+0 & 1+1) 32 45ºC 40°C 60% < 5.2 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Idle (1+0 & 1+1) 2.2.1.3 Power Sub-system 40% 35°C < 4.0 Temperature Requirements The power supply operates within all specified limits over the Top temperature range described in the following table. The average air temperature difference (Tps) from the inlet to the outlet of the power supply does not exceed 20 degrees C. All airflow passes through the power supply and not over the exterior surfaces of the power supply. Table 26. Thermal Requirements Item Description MIN Top Operating temperature range Tnon-op Non-operating temperature range Altitude Max Units 0 45 °C -40 70 °C 1524 (5,000) m (ft) Maximum operating altitude The power supply meets UL enclosure requirements for temperature rise limits. All sides of the power supply, with exception of the air exhaust side, are classified as "Handle, knobs, grips, etc., held for short periods of time only." You must pay special attention to the fan case temperature; it cannot be exceeded under any conditions. 2.2.1.4 LED Marking and Identification The LED is green or amber when lit. 2.2.2 AC Input Requirements The 600-W power supply incorporates a universal power input with active power factor correction, which reduces line harmonics in accordance with the EN61000-3-2 EN61000-3-2 and JEIDA MITI standards. 2.2.2.1 AC Inlet Connector The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 10A/250VAC. 2.2.2.2 Efficiency The following table provides the required minimum efficiency level at four loading conditions: 100%, 50%, 20% and 10%. Efficiency is tested at the AC input voltage 230VAC 230VAC. Revision 1.0 Intel Confidential 33 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS Table 27. Efficiency Loading 100% of Maximum 50% of Maximum 20% of Maximum 10% of Maximum Efficiency 85% 89% 85% 75% Power Factor > 0.9 > 0.9 > 0.85 > 0.75 2.2.2.3 AC Input Voltage Specification The power supply operates within all specified limits over the following input voltage range, as shown in the following table. Harmonic distortion of up to 10% of rated AC input voltage will not cause the power supply to go out of specified limits. The power supply powers off at or below 75 VAC +/-5 VAC range. The power supply starts up at or above 85 VAC +/-4VAC. Application of an input voltage below 85 VAC does not cause damage to the power supply, including a fuse blow. Table 28. AC Input Rating Parameter MIN Rated MAX Line Voltage (110) 90 Vrms 100-127 Vrms 140 Vrms Line Voltage (220) 180 Vrms 200-240 Vrms 47 Hz 50/60Hz 85Vac +/4Vac Power Off VAC 264 Vrms Frequency Start up VAC 75Vac +/5Vac Max Input Current Max Rated Input AC Current TBD Arms1,3 TBD Arms4 TBD Arms2,3 TBD Arms4 63 Hz Notes: 1 2 3 4 2.2.2.4 Maximum input current at low input voltage range should be measured at 90Vac at max load. Maximum input current at high input voltage range should be measured at 180VAC 180VAC at max load. This is not to be used for determining agency input current markings. Maximum rated input current is measured at 100 VAC and 200 VAC. AC Line Transient Specification AC line transient conditions are defined as "sag" and "surge" conditions. "Sag" conditions are also commonly referred to as "brownout" and defined as AC line voltage drops below nominal voltage conditions. "Surge" is defined as AC line voltage rises above nominal voltage conditions. The power supply meets requirements under the following AC line sag and surge conditions. 34 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 29. AC Line Sag Transient Performance Duration Sag Operating AC Voltage Line Frequency Loading Continuous 10% Nominal AC Voltage ranges 50/60 Hz 100% 0 to 1 AC cycle 100% Nominal AC Voltage ranges 50/60 Hz 75% > 1 AC cycle >10% Nominal AC Voltage ranges 50/60 Hz 100% Performance Criteria No loss of function or performance No loss of function or performance Loss of function acceptable, self recoverable Table 30. AC Line Surge Transient Performance Duration Surge Operating AC Voltage Line Frequency Performance Criteria No loss of function or performance Continuous 10% Nominal AC Voltages 50/60 Hz 0 to ½ AC cycle 30% Mid-point of nominal AC Voltages 50/60 Hz 2.2.2.5 No loss of function or performance AC Line Fuse The power supply has a single line fuse on the Line (Hot) wire of the AC input. The line fusing is acceptable for all safety agency requirements. The input fuse is a slow blow type. AC inrush current will not cause the AC line fuse to blow under any conditions. All protection circuits in the power supply will not cause the AC fuse to blow unless a component in the power supply failed. This includes DC output load short conditions. 2.2.2.6 AC In-rush AC line in-rush current does not exceed 55A peak for up to one-quarter of the AC cycle, after which the input current is no more than the specified maximum input current. The peak in-rush current is less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device). The power supply meets the in-rush requirements for any rated AC voltage, during turn on at any phase of AC voltage, during a single cycle AC dropout condition, as well as upon recovery after AC dropout of any duration, and over the specified temperature range (Top). 2.2.2.7 Susceptibility Requirements The power supply meets the following electrical immunity requirements when connected to a cage with an external EMI filter that meets the criteria defined in the SSI document EPS Power Supply Specification. For further information on Intel standards, please request a copy of the Intel Environmental Standards Handbook. Revision 1.0 Intel Confidential 35 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS Table 31. Performance Criteria Level Description A B The apparatus should continue to operate as intended. No degradation of performance beyond spec limits. C 2.2.2.7.1 The apparatus should continue to operate as intended. No degradation of performance. Temporary loss of function is allowed provided the function is self-recoverable or restorable by the operation of the controls. Electrostatic Discharge Susceptibility The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-42:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.2.2.7.2 Fast Transient/Burst The power supply complies with the limits defined in EN55024 EN55024: 1998 using the IEC 61000-44:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.2.2.7.3 Radiated Immunity The power supply complies with the limits defined in EN55024 EN55024: 1998 using the IEC 61000-43:1995 test standard and performance criteria A defined in Annex B of CISPR 24. 2.2.2.7.4 Surge Immunity The power supply was tested with the system for immunity to AC Ringwave and AC Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992. The pass criteria included: No unsafe operation allowed under any condition; all power supply output voltage levels remain within proper spec levels; no change in operating state or loss of data during and after the test profile; no component damage under any condition. The power supply complies with the limits defined in EN55024 EN55024: 1998 using the IEC 61000-45:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.2.2.8 AC Line Dropout / Holdup The following are the AC dropout requirements. 36 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 32. Holdup Requirements Loading Holdup Time 100% 12 msec 60% 20 msec An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout condition, the power supply meets dynamic voltage regulation requirements. An AC line dropout of any duration will not cause tripping of control signals or protection circuits. If the AC dropout lasts longer than the hold-up time, the power supply recovers and meets all turn-on requirements. The power supply meets the AC dropout requirement over rated AC voltages and frequencies. A dropout of the AC line for any duration will not cause damage to the power supply. 2.2.2.8.1 AC Line 5VSB Holdup The 5 VSB output voltage stays in regulation under its full load (static or dynamic) during an AC dropout of 70 ms min (=5VSB holdup time) whether the power supply is in an ON or OFF state (PSON asserted or de-asserted). 2.2.2.9 AC Line Fast Transient (EFT) Specification The power supply meets the EN61000-4-5 EN61000-4-5 directive and any additional requirements in IEC1000-4-5 IEC1000-4-5: 1995 and the Level 3 requirements for surge-withstand capability, with the following conditions and exceptions: These input transients do not cause any out-of-regulation conditions, such as overshoot and undershoot, nor do they cause any nuisance trips of any of the power supply protection circuits. The surge-withstand test must not produce damage to the power supply. The supply meets surge-withstand conditions under maximum and minimum DC-output load conditions. 2.2.2.10 AC Line Leakage Current The maximum leakage current to ground for each power supply should not be more then 3.5mA when tested at 240 VAC. 2.2.2.11 Power Recovery The power supply recovers automatically after an AC power failure. AC power failure is defined to be any loss of AC power that exceeds the dropout criteria. 2.2.2.11.1 Voltage Brown Out The power supply complies with the limits defined in EN55024 EN55024: 1998 using the IEC 61000-411:1995 test standard and performance criteria C defined in Annex B of CISPR 24. Revision 1.0 Intel Confidential 37 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS In addition, the power supply meets the following Intel Requirement: o 2.2.2.11.2 A continuous input voltage below the nominal input range should not damage the power supply or cause overstress to any power supply component. The power supply must be able to return to normal power up state after a brownout condition. Maximum input current under a continuous brownout should not blow the fuse. The power supply should tolerate a 3-minute ramp from 90 VAC voltage to 0 VAC after the components have reached a steady state condition. Voltage Interruptions The power supply complies with the limits defined in EN55024 EN55024: 1998 using the IEC 61000-411:1995 test standard and performance criteria C defined in Annex B of CISPR 24. 2.2.2.12 AC Line Isolation Requirements The power supply meets all safety agency requirements for dielectric strength. Transformers' isolation between primary and secondary windings complies with the 3000 Vac (4242Vdc) dielectric strength criteria. If the working voltage between primary and secondary dictates a higher di-electric strength test voltage, the highest test voltage is used. In addition, the insulation system complies with reinforced insulation per safety standard IEC 950. Separation between the primary and secondary circuits, and primary to ground circuits, complies with the IEC 950 spacing requirements. 2.2.2.13 Power Factor Correction The power supply incorporates a power factor correction circuit. The power supply was tested as described in the EN 61000-3-2: Electromagnetic Compatibility (EMC) Part 3: Limits- Section 2: Limits for harmonic current emissions, and meets the harmonic current emissions limits specified for ITE equipment. The power factor must be higher than 0.85 at 20% load and 230VAC 230VAC. The power supply was tested as described in the JEIDA MITI Guideline for Suppression of High Harmonics in Appliances and General-Use Equipment and meets the harmonic current emissions limits specified for ITE equipment. 2.2.3 DC Output Specification 2.2.3.1 Connector The power supply provides card edge fingers, which mate to a connector located inside the system. It is a blind-mating type of connector that connects the power supply's output voltages and signals. The card edge finger pin assignments are defined in the following table. 38 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system Table 33. Edge Finger Power Supply Connector Pin-out Connector Upper Side Pin No Top. Pin No. Bottom Bottom Side +12 V +12 V +12 V 3 4 +12 V +12 V 5 6 +12 V 7 8 +12 V +12 V 9 10 +12 V +12 V 11 12 +12 V +12 V 13 14 +12 V +12 V 15 16 +12 V +12 V 17 18 +12 V +12 V Return 19 20 +12 V Return +12 V Return 21 22 +12 V Return +12 V Return 23 24 +12 V Return +12 V Return 25 26 +12 V Return +12 V Return 27 28 +12 V Return +12 V Return 29 30 +12 V Return +12 V Return 31 32 +12 V Return +12 V Return 33 34 +12 V Return +12 V Return 35 36 +12 V Return +12 V Return 37 38 +12 V Return 5 VSB 39 40 ALERT 5 VSB 41 42 +12 V Sharing +15 VCC 43 44 POK PS_KILL 45 46 -PS_Present PS_ON_CTL 47 48 A0 SCL Revision 1.0 2 +12 V Gold finger edge connector: 2X25 1 49 50 -OVER_TEMP Intel Confidential 39 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS Signals that are defined as low true or high true use the following convention: Signal# = low true Reserved pins are reserved for future use. 2.2.3.2 Grounding The ground of the pins of the power supply output connector provides the power return path. The output connector ground pins are connected to safety ground (power supply enclosure). This grounding is well-designed to ensure passing the maximum allowed Common Mode Noise levels. A reliable protective earth ground is provided on the power supply. All secondary circuits are connected to protective earth ground. Resistance of the ground returns to chassis does not exceed 1.0 m. This path may be used to carry DC current. 2.2.3.3 Remote Sense No remote sense and remote sense return signal is required on this power supply. The power supply operates within specification over the full range of voltages at the power supply's output connector. 2.2.3.4 Output Power / Currents The following table defines power and current ratings for the 600-W continuous power supply in a 1+0 or 1+1 redundant configuration. The combined output power of both outputs does not exceed the rated output power. The power supply meets both static and dynamic voltage regulation requirements for the minimum loading conditions. Also, the power supply supplies the listed peak currents and power for a minimum of 10 seconds. Outputs are not required to be peak loaded simultaneously. Table 34. Power Supply Module Load Ratings Voltage 600-W Min Max Peak +12 V 49 A 54 A +5 VSB 2.2.3.5 0.6 A 0.1 A 3.0 A 3.5 A Standby Output The 5VSB output is present when an AC input greater than the power supply turn-on voltage is applied. 40 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS 2.2.3.6 Power Sub-system Voltage Regulation The power supply output voltages stay within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise specified in the Voltage Regulation Limits table. All outputs are measured with reference to the GND. The +12V and +5VSB outputs are measured at the power distribution board output harness connector. Table 35. Voltage Regulation Limits Parameter Tolerance MIN NOM MAX Units + 12V - 5% / +5% +11.40 +12.00 +12.60 Vrms + 5VSB - 5% / +5% +4.75 +5.00 +5.25 Vrms 2.2.3.7 Dynamic Loading The output voltages remain within limits specified for the step loading and capacitive loading presented in the following table. The load transient repetition rate was tested between 5 Hz and 5 kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The step load may occur anywhere between the MIN load and MAX load defined in the following table. Table 36. Transient Load Requirements Output Max Step Load Size Max Load Slew Rate Test Capacitive Load 12 V 32.0 A 1 0.5 A/µs 2200 µF +5 VSB 0.5 A 0.5 A/µs 20 µF Note: 1. Step loads on each 12V output may happen simultaneously. 2. The +12V should be tested with 2200 µF evenly split between the three +12V rails. 2.2.3.8 Capacitive Loading The power supply is stable and meets all requirements with the following capacitive loading ranges. Minimum capacitive loading applies to static load only. Table 37. Capacitive Loading Conditions Output +12V Revision 1.0 MIN MAX Units 2000 11,000 µF Intel Confidential 41 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS Output MIN 2.2.3.9 Units 1 +5VSB MAX 350 µF Closed Loop Stability The power supply is unconditionally stable under all line/load/transient load conditions, including capacitive load ranges. A minimum 45-degree phase margin and -10dB-gain margin is met. Closed-loop stability is ensured at the maximum and minimum loads, as applicable. 2.2.3.10 Common Mode Noise The Common Mode Noise on any output does not exceed 350mV pk-pk over the frequency band of 10 Hz to 20 MHz. 2.2.3.11 Ripple / Noise The maximum ripple/noise output of the power supply is defined in the following table. This is measured over a bandwidth of 0Hz to 20MHz at the power supply output connectors. A 10µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor is placed at the point of measurement. Table 38. Ripple and Noise +12V Output 120mVp-p 2.2.3.12 +5VSB Output 50mVp-p Forced Load Sharing The +12V output has forced load sharing. The output shares within 10% at full load. All current sharing functions are implemented internal to the power supply by making use of the 12LS signal. The power distribution board connects the 12LS signal between the two power supplies. The failure of a power supply does not affect the load sharing or output voltages of the other supplies still operating. The supplies are able to load share with up to two power supplies in parallel and can operate in a hot-swap / redundant 1+1 configuration. The 5Vsb output is not required to actively share current between power supplies (passive sharing). The 5Vsb outputs of the power supplies are connected together in the system so that a failure or hot swap of a redundant power supply does not cause these outputs to go out of regulation in the system. 2.2.3.13 Timing Requirements The timing requirements for power supply operation are as follows. The output voltages must rise from 10% to within regulation limits (Tvout_rise) within 5 to 70 ms except for 5VSB, which is 42 Intel Confidential Revision 1.0 Intel® Server Chassis SC5650 SC5650 TPS Power Sub-system allowed to rise from 1.0 to 25 ms. All outputs rise monotonically. The following figure shows the timing requirements for the power supply being turned on and off via the AC input, with PSON held low and the PSON signal with the AC input applied. Table 39. Output Voltage Timing Item Description Tvout_rise Output voltage rise time from each main output. Tvout_on T vout_off Minimum 5.0* Maximum Units 70* msec All main outputs must be within regulation of each other within this time. 50 msec All main outputs must leave regulation within this time. 400 msec * The 5VSB output voltage rise time should be from 1.0 ms to 25.0 ms. Vout V1 10% Vout V2 V3 V4 Tvout rise Tvout_off Tvout_on Figure 12. Output Voltage Timing Revision 1.0 Intel Confidential 43 Power Sub-system Intel® Server Chassis SC5650 SC5650 TPS Table 40. Turn On / Off Timing Item Description Minimum Maximum Tsb_on_delay Delay from AC being applied to 5 VSB being within regulation. 1500 Tac_on_delay Delay from AC being applied to all output voltages being within regulation. 2500 Tvout_holdup Time all output voltages stay within regulation after loss o