I0118J SC275 S1025 - Datasheet Archive

 

SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 (157) Wafer flat alligned with side b of the die a (14 ± 0.4) C d b D 0.35

 

Bulletin I0118J I0118J rev. D 03/07 SC275 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 (157) Wafer flat alligned with side b of the die a (14 ± 0.4) C d b D 0.35 ± 0.01 c A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) NOT TO SCALE 4. SAWING: Recommended Blade SEMITEC S1025 S1025 QS00 Blade Sawing Street 0.05 ± 0.005 (2 ± 0.2) 5. DIMENSIONS AND TOLERANCES Device TJ Max. VR # (°C) (V) SC275R015x5x 125 15 n.a. contact factory SC275 SC275 S020x5x 150 20 n.a. contact factory SC275 SC275 S030x5x 150 30 SC275 SC275 S045x5x 150 45 SC275 SC275 S060x5x 150 60 n.a. contact factory SC275H045x5x 175 45 n.a. contact factory SC275H100x5x 175 100 SC275H150x5x 175 150 Document Number: 93871 A B C D 6.98 +0, -0.01 6.98 +0, -0.01 6.48 +0, -0.01 6.48 +0, -0.01 (275 +0, -0.4) (275 +0, -0.4) (269 +0, -0.4) (269 +0, -0.4) n.a. contact factory 6.98 +0, -0.01 6.98 +0, -0.01 6.48 +0, -0.01 6.48 +0, -0.01 (275 +0, -0.4) (275 +0, -0.4) (269 +0, -0.4) (269 +0, -0.4) n.a. contact factory diameter 1.5 ± 0.2 60 ± 8 1.5 ± 0.2 60 ± 8 www.vishay.com 1 SC275 SC275.5. Series Bulletin I0118J I0118J rev. D 03/07 Electrical Characteristics Device TJ Max. VR Typ. IR @ 25°C # (°C) (V) (A) Typ. IR @ 125°C Max. VF @ IF @ 25°C SC275R015x5x 125 15 n.a. contact factory SC275S020x5x 150 20 n.a. contact factory SC275S030x5x 150 30 SC275S045x5x 150 45 n.a. contact factory SC275S060x5x 150 60 n.a. contact factory SC275H045x5x 175 45 n.a. contact factory SC275H100x5x 175 100 SC275H150x5x 175 150 (mA) 1350 550 100 81 Package (V) Style 0.55 @ 150A TO-249AA 0.77 @ 60A - n.a. contact factory Mechanical Data Device # Metal Thickness Front Metal Metal Thickness Back Metal SC275xxxxA5x Bondable - Al (1% Si) 30 kÅ - Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ SC275xxxxS5x Solderable Ti 2 kÅ Ni 1 kÅ Ag 35 kÅ Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months. Packaging Device # Description Minimum Order Quantity Die in Sale Package SC275xxxxx5B Inked Probed Unawn Wafer (Wafer in Box) 180 SC275xxxxx5R Probed Die in Tape & Reel n.a. SC275xxxxx5P Probed Die in Waffle Pack 366 SC275xxxxx5F Inked Probed Sawn Wafer on Film 180 www.vishay.com 2 Document Number: 93871 SC275 SC275.5. Series Bulletin I0118J I0118J rev. D 03/07 Ordering Information Table Device Code SC 275 1 2 S 030 S 5 B 3 4 5 6 7 1 - Schottky Die 2 - Die Size Code 3 - Process (see Electrical Characteristics Table) 4 - Voltage code: Code = V RRM 5 - Chip surface metallization (see Mechanical Data Table) 6 - Wafer Diameter in inches 7 - Packaging (see Packaging Table) H = 830 Process R = OR'ing Process S = Standard Process Wafer on Film STEEL FRAME Document Number: 93871 www.vishay.com 3 SC275 SC275.5. Series Bulletin I0118J I0118J rev. D 03/07 Wafer in Box ROUND CONTAINER TYVEK DISK FOAM DISK Die in Waffle Pack CHIP TRAY POCKET www.vishay.com 4 Document Number: 93871 SC275 SC275.5. Series Bulletin I0118J I0118J rev. D 03/07 Data and specifications subject to change without notice. This product has been designed for Industrial Level. Qualification Standards can be found on IR's Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7309 Visit us at www.irf.com for sales contact information. 03/07 Document Number: 93871 www.vishay.com 5 Legal Disclaimer Notice Vishay Notice The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of International Rectifier's Power Control Systems (PCS) business, which closed in April 2007. Specifications of the products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below. Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. International Rectifier®, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN® are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product names noted herein may be trademarks of their respective owners. Document Number: 99901 Revision: 12-Mar-07 www.vishay.com 1