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Part : 3SAC1055A2 Supplier : TE Connectivity Manufacturer : Onlinecomponentscom Stock : - Best Price : $2,819.8899 Price Each : $2,819.8899
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SAC105 Datasheet

Part Manufacturer Description PDF Type
SAC10/51 Vishay DIODE TVS SINGLE UNI-DIR 10V 500W 2DO-15 BULK Original
SAC10/54 Vishay DIODE TVS SINGLE UNI-DIR 10V 500W 2DO-15 REEL Original

SAC105

Catalog Datasheet MFG & Type PDF Document Tags

MT46H32M16LFBF

Abstract: MT46H32M16LFBF-6 in Figure 2. Both the x16 (60-ball) and the x32 (90-ball) packages for the 78nm product use SAC105 solder ball composition. This aligns with the industry trend toward SAC105 composition for enhanced drop test performance. The surface mount conditions for SAC105 are the same as for SAC305. In addition , .42 on Ø0.4 SMD ball pads. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu) Substrate
Micron Technology
Original
MT46H16M32LFCM-6 MT46H32M16LFCK-6 MT46H32M16LFCK-75 MT46H32M16LFBF-6 MT46H32M16LFBF MT46H32M16LFCK lp-ddr2 TN-46-16 MT46H16M32LFCM-75

SAC1205

Abstract: IPC-A-600G % fail) 3.8 x 3.8 81 SMD SAC105 14-mil 5.52 436.61 SAC105 16-mil 6.63 344.44 SAC1205 14-mil 13.05 360.38 SAC105 14-mil 6.76 650.01 3.0 x 3.0 49 SMD SAC105 SMD 621.47 7.28 619.26 SAC105 14-mil 5.43 762.00 16-mil 7.76 863.39 SAC1205 25 4.53 14-mil SAC105 2.2 x 2.2 16-mil SAC1205 14-mil 7.65 , ) 3.8 x 3.8 81 SMD SAC105 0.356 30 0 / 30 3.0 x 3.0 49 SMD SAC105 0.356
Freescale Semiconductor
Original
AN3846 IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 IPC-6016

MT29F2G16AB

Abstract: MT29C4G48 -Ball VFBGA (Package Code: JG) Seating plane 0.08 A 168X Ø0.33 Solder ball material: SAC105. , (Package Code: JI) 0.75 ±0.1 Seating plane 0.08 A 168X Ø0.33 Solder ball material: SAC105. , ) Seating plane 0.08 A 0.43 ±0.05 A 168X Ø0.34 Solder ball material: SAC105. Dimensions apply
Micron Technology
Original
MT29F2G16AB MT29C4G48 MT29C2G24MAKLAJG-6 JW256 mt29f4g16ab MT29C2G48MAKLCJI-6 168-B MT29C 137-B

MT29C1G12

Abstract: mt29c1g12ma Ø0.45 Solder ball material: SAC105. Dimensions apply to solder balls postreflow on Ø0.35 SMD ball , material: SAC105. Dimensions apply to solder balls postreflow on Ø0.35 SMD ball pads. 21 20 19 18 17 16 , ) Seating plane A 0.12 A 0.75 ±0.1 152X Ø0.45 Solder ball material: SAC105. Dimensions apply to solder
Micron Technology
Original
MT29C1G12 mt29c1g12ma MT29C1G12M smd code AA5 MT29C1G SMD MARKING CODE b21 152-B

MT29F1G08ABCHC

Abstract: mt29c .45 Solder ball material: SAC105. Dimensions apply to solder balls postreflow on Ø0.35 SMD ball pads , ±0.1 0.1 A 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder balls , ) Seating plane A 0.75 ±0.1 0.12 A 152X Ø0.45 Solder ball material: SAC105. Dimensions apply
Micron Technology
Original
MT29F1G08ABCHC MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29F2G16ABDHC MT29F1G16ABCHC-ET

MT46H64M32

Abstract: MT46H128 ball material: SAC105. Dimensions apply to solder balls postreflow on Ø0.35 SMD ball pads. Ball , 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder balls postreflow on Ø0.35 SMD
Micron Technology
Original
128M32 MT46H64M32 MT46H128 MT46H64M32L2CG-6 MT46H128M 152-Ball lpddr MT46H 64M32 32M32 16M32

MT29C2G24MAKLAJG-75 IT

Abstract: MT29C2G24MAKLAjg 0.08 A 168X Ø0.33 Solder ball material: SAC105. Dimensions apply to solder balls postreflow on à , plane 0.08 A 168X Ø0.33 Solder ball material: SAC105. Dimensions apply to solder balls postreflow
Micron Technology
Original
MT29C2G24MAKLAJG-75 IT MT29C2G24MAKLAjg

ISP1763

Abstract: ISP1568 contain solder ball material SAC105 · ISP1582 PCI evaluation kit · HVQFN56 (SOT684-1) ISP1583
ST-Ericsson
Original
ISP1161A1 ISP1763 ISP1568 TFBGA128 USB Hub Controllers PXA255 USB Controllers ISP1160/01 PXA25 QFP64 ISP1161 HVQFN64

SAC387

Abstract: IPC-7525 solder balls, while the thin WLCSP uses SAC105 solder terminations. SAC381 and SAC105 liquefy at
Fairchild Semiconductor
Original
FDZ191P SAC387 IPC-7525 pcb warpage in ipc standard land pattern for WLCSP ROSIN FLUX TYPE ROL0 AN-6084 FDZ1905PZ FDZ192NZ FDZ193P FDZ197PZ

MT29C2G24m

Abstract: SMD MARKING CODE h23 -Ball VFBGA (Package Code: JG) Seating plane 0.08 A 168X Ø0.33 Solder ball material: SAC105. Dimensions , ) 0.75 ±0.1 Seating plane 0.08 A 168X Ø0.33 Solder ball material: SAC105. Dimensions apply to solder
Micron Technology
Original
MT29C2G24m SMD MARKING CODE h23 MT29C4G48M MT29C2G48 MT29F4G16ABC MCP LPDDR 1Gb 512Mb 83071038/PDF

CSN-11

Abstract: MT46H64M32L2KQ Seating plane 0.08 A A 0.43 ±0.05 168X Ø0.34 Solder ball material: SAC105. Dimensions apply to solder
Micron Technology
Original
CSN-11 MT46H64M32L2KQ Marking Code TI OMAP micron marking code information smd code marking CK micron lpddr

SAC405

Abstract: IPC-9702 handheld applications may use SAC105 (98.5Sn1Ag0.5Cu) Some parts may contain 96.5Sn3.5Ag SAC405 PBGA , ) Liquidus (ºC) 217 98.5Sn1.0Ag0.5Cu 96.5Sn3.5Ag 62Sn36Pb2Ag 63Sn37Pb (SAC105) 215 221 179
Freescale Semiconductor
Original
IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch BGA PACKAGE thermal resistance Freescale Service Manual smd rework station bga thermal cycling reliability JESD51 JESD5112

SAC266

Abstract: SAC405 Application Note 71 MATERIAL PROPERTY SAC405 SAC305 SAC266 SAC105 Sn 95.5% 96.5% 96.8
Summit Microelectronics
Original
J-STD-012 BGA Solder Ball compressive force IPC-6012A IPC-4101 LATTICE SEMICONDUCTOR Tape and Reel Specification WLCSP smt

D9KG

Abstract: marking aa5 Seating plane A 0.1 A 0.6 ±0.1 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder
Micron Technology
Original
D9KG marking aa5 marking code micron label M2P20 d9kh MT46H32M32LFCG

R/marvell ethernet switch mi

Abstract: marvell alaska program interface ±0.05 Seating plane 0.08 A A Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu) 12 ±0.15 6 ±0.08
MARVELL
Original
R/marvell ethernet switch mi marvell alaska program interface Marvell PXA168 MV-S501140-00

marking k22 SMD

Abstract: pop 168 Seating plane A 0.12 A 152X Ø0.45 Solder ball material: SAC105. Dimensions apply to solder balls , (14mm x 14mm), Package Code: KZ Seating plane A 0.1 A 152X Ø0.46 Solder ball material: SAC105. , .34 Solder ball material: SAC105. Dimensions apply to solder balls postreflow on Ø0.28 SMD ball pads. Ball , Seating plane 0.08 A A 0.43 ±0.05 168X Ø0.34 Solder ball material: SAC105. Dimensions apply to solder , material: SAC105. Dimensions apply to solder balls postreflow on Ø0.28 SMD ball pads. Ball A1 ID Ball A1
Micron Technology
Original
marking k22 SMD pop 168 AB22-AB23 AC18-AC19 AA23 U22-T23 128M16 64M16

MT46H128M16LF

Abstract: MT46H128M32L2 . Pre-reflow ball is Ø0.3 on Ø0.27 SMD ball pads. A Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5
Micron Technology
Original
MT46H128M16LF MT46H64M32LF MT46H128M32L2 MT46H256M32L4 MT46H128M16 MT46H256M32 MTG-626

smd marking K23

Abstract: lpddr Code: CA 0.46 ±0.1 Seating plane A 0.12 A 152X Ø0.45 Solder ball material: SAC105. , Seating plane A 0.78 ±0.1 0.1 A 152X Ø0.46 Solder ball material: SAC105. Dimensions apply S , Seating plane 0.08 A 0.68 ±0.05 A 168X Ø0.34 Solder ball material: SAC105. Dimensions , Seating plane 0.08 A 0.43 ±0.05 A 168X Ø0.34 Solder ball material: SAC105. Dimensions , Seating plane 0.08 A 0.38 ±0.05 A 168X Ø0.34 Solder ball material: SAC105. Dimensions
Micron Technology
Original
smd marking K23 SMD transistor MARKING CODE g23 168-ball LPDDR LPDDR Pop smd transistor ab2 E23 SMD Transistor A1

A1833

Abstract: -Ball TFBGA 0.85 ±0.1 Seating plane 0.12 A A 137X Ø0.45 Solder ball material: SAC105. Dimensions apply
Micron Technology
Original
A1833 MT46H256M16L2
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