SA56203S HTSSOP56 SA56203STW 143E36T MO-153 AN01026 - Datasheet Archive

 

One-chip motor driver Rev. 01 - 31 January 2005 Preliminary data sheet 1. General description The SA56203S is a one-chip motor

 

SA56203S SA56203S One-chip motor driver Rev. 01 - 31 January 2005 Preliminary data sheet 1. General description The SA56203S SA56203S is a one-chip motor driver IC that is capable of driving all motors of CD or DVD systems e.g. spindle, sled and loading motors and actuators on the optical pick-up unit. The driver intended for the 3-phase, brushless, Hall-commutated spindle motor uses True-Silent PWM. This proprietary technology ensures that all 3-phase motor currents are sinusoidal resulting in an optimally silent driver. Internal regeneration of the back EMF of the spindle motor enables the driver to operate in current-steering mode without using external power-dissipating sense resistors. The driver for the 2-phase sled stepper motor operates in current-steering PWM mode. In addition the IC contains four full-bridge linear channels that can be used to drive a loading motor and 3D actuators (focus, tracking and tilt). The SA56203S SA56203S is available in an exposed die pad HTSSOP56 HTSSOP56 package. 2. Features s True-Silent PWM spindle motor driver s Low heat generation due to power-efficient direct full-bridge switching of spindle motor driver s Controlled spindle motor current during acceleration and brake s Reverse torque brake function (full bridge) s Adjustable spindle motor current limiter s Internal regeneration for EMF of spindle motor s Current-steering PWM controlled stepper motor driver for sled s Four class-AB linear channels for loading motor and 3D actuators (focus, tracking and tilt) s Tracking actuator driver with back EMF amplifier s Loading motor driver with transresistance amplifier for loading current s Low on-resistance D-MOSFET output power stages s Built-in thermal shutdown and thermal warning s Interfaces to 3 V and 5 V logic s Package with low thermal resistance to heatsink (reflowable die pad) s Lead free package. SA56203S SA56203S Philips Semiconductors One-chip motor driver 3. Applications s s s s DVD+RW, DVD-RW and DVD-RAM Combi CD-RW Other compact disc media. 4. Ordering information Table 1: Ordering information Type number Package Name SA56203STW SA56203STW Description Version HTSSOP56 HTSSOP56 plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad SOT793-1 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 2 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 5. Block diagram HU+ HU- HV+ HV- HW+ HW- HBIAS 1 REVERSE DETECTION 2 3 HALL AMP 4 FG 56 OSCILLATOR THERMAL SHUTDOWN 5 55 54 53 52 51 50 49 6 7 HALL BIAS 47 k RREF REMF RLIM VSS1(SPN) U VDD1(SPN) V VSS2(SPN) W VDD2(SPN) FG VSSA VINSPN VINREF 8 9 10 VINREF CURRENT REFERENCE VINREF CP1 CP2 CP3 48 47 LEVEL SHIFT 46 45 12 44 43 47 k 13 14 SPINDLE LOGIC VINREF LEVEL SHIFT 42 15 41 47 k 16 VINREF 17 18 LEVEL SHIFT 40 39 38 SA56203S SA56203S FG 19 37 20 21 ADC VINREF 500 k VDDA LEVEL SHIFT 47 k 11 36 35 SLED LOGIC 34 22 33 23 24 25 32 CHARGE PUMP 31 47 k CTL1 CTL2 TEMP 26 27 MUTE/ STANDBY FUNCTIONS 28 COSC 30 VINLD VINTRK VINFCS VINTLT VDD(LD) VDD(TRK) LDO+ LDO- TRKO+ TRKO- VSS(ACT) VDD(ACT) FCSO+ FCSO- TLTO+ TLTO- VDD(SLD) RSLD1 SLDO1+ SLDO1- RSLD2 SLDO2+ SLDO2- VSS(SLD) VLDTRK VINSLD2 VINREF 47 k 29 VINSLD1 VINREF 001aac121 Fig 1. Block diagram 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 3 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 6. Pinning information 6.1 Pinning HU+ 1 56 COSC HU- 2 55 VINLD HV+ 3 54 VINTRK HV- 4 53 VINFCS HW+ 5 52 VINTLT HW- 6 HBIAS 7 51 VDD(LD) 50 VDD(TRK) RREF 8 49 LDO+ REMF 9 48 LDO- RLIM 10 47 TRKO+ VSS1(SPN) 11 46 TRKO- U 12 45 VSS(ACT) 44 VDD(ACT) VDD1(SPN) 13 V 14 VSS2(SPN) 15 43 FCSO+ SA56203STW SA56203STW 42 FCSO- W 16 41 TLTO+ VDD2(SPN) 17 40 TLTO- FG 18 39 VDD(SLD) 38 RSLD1 VSSA 19 VINSPN 20 37 SLDO1+ VINREF 21 36 SLDO1- VDDA 22 35 RSLD2 CP1 23 34 SLDO2+ CP2 24 33 SLDO2- CP3 25 32 VSS(SLD) CTL1 26 31 VLDTRK CTL2 27 30 VINSLD2 TEMP 28 29 VINSLD1 001aac122 Fig 2. Pin configuration 6.2 Pin description Table 2: Pin description Symbol Pin Description HU+ 1 Hall input U positive HU- 2 Hall input U negative HV+ 3 Hall input V positive HV- 4 Hall input V negative HW+ 5 Hall input W positive HW- 6 Hall input W negative HBIAS 7 Hall element bias RREF 8 external resistor for current reference 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 4 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 2: Pin description .continued Symbol Pin Description REMF 9 external resistor for EMF regeneration RLIM 10 external resistor for current limit VSS1(SPN) 11 spindle driver ground 1 U 12 spindle driver output U VDD1(SPN) 13 spindle driver supply voltage 1 V 14 spindle driver output V VSS2(SPN) 15 spindle driver ground 2 W 16 spindle driver output W VDD2(SPN) 17 spindle driver supply voltage 2 FG 18 frequency generator output VSSA 19 analog ground VINSPN 20 spindle driver input voltage for spindle motor current VINREF 21 reference input voltage for all motor drivers VDDA 22 analog supply voltage CP1 23 charge pump capacitor connection 1 CP2 24 charge pump capacitor connection 2 CP3 25 charge pump capacitor connection 3 CTL1 26 driver logic control input 1 CTL2 27 driver logic control input 2 TEMP 28 thermal warning VINSLD1 29 sled driver 1 input for sled motor current VINSLD2 30 sled driver 2 input for sled motor current VLDTRK 31 voltage output loader/track VSS(SLD) 32 sled driver ground SLDO2- 33 sled driver output 2 negative SLDO2+ 34 sled driver output 2 positive RSLD2 35 sled driver 2 current sense SLDO1- 36 sled driver output 1 negative SLDO1+ 37 sled driver output 1 positive RSLD1 38 sled driver 1 current sense VDD(SLD) 39 sled driver sense supply voltage TLTO- 40 tilting driver output negative TLTO+ 41 tilting driver output positive FCSO- 42 focus driver output negative FCSO+ 43 focus driver output positive VDD(ACT) 44 focus/tilt drivers supply voltage VSS(ACT) 45 actuator drivers ground TRKO- 46 tracking driver output negative TRKO+ 47 tracking driver output positive LDO- 48 loading driver output negative LDO+ 49 loading driver output positive 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 5 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 2: Pin description .continued Symbol Pin Description VDD(TRK) 50 tracking driver supply voltage VDD(LD) 51 loading driver supply voltage VINTLT 52 tilting driver input for tilt actuator driver VINFCS 53 focus driver input for focus actuator voltage VINTRK 54 tracking driver input for tracking actuator voltage VINLD 55 loading driver input for loading motor voltage COSC 56 external capacitor for internal oscillator 7. Functional description 7.1 Spindle motor control The control input voltage on pin VINSPN is converted into a digital value by the ADC where the voltage on pin VINREF is the midpoint reference. The transconductance gain from input voltage VVINSPN to output motor current IMOT is: I LIM I MOT g m ( SPN ) = - = -( V VINSPN ­ V VINREF ) V VINREF where ILIM can be programmed by means of external resistor RLIM. The motor current is described by Figure 3. ILIM IMOT forward torque 0 VVINREF 2VVINREF reverse torque brake -ILIM VVINSPN 001aaa431 Fig 3. Spindle motor current as a function of control input voltage VINSPN For VINSPN voltages larger than VVINREF the motor will accelerate with forward torque control. For VINSPN voltages smaller than VVINREF the motor will brake with reverse torque control. 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 6 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 7.2 Spindle brake Because the U, V and W half-bridges of the spindle motor driver use a direct PWM full-bridge switching scheme, the motor current can also be controlled and limited during brake. It should be noted that because of this active brake mechanism energy of the motor can be recuperated back to the supply. Especially at large speeds, this can result in currents delivered back to the supply. If the supply and / or other circuits than the motor driver do not use this recuperated current, then the supply voltage can rise to unacceptable values. In this event it is recommended to lower the spindle current during brake by means of the VINSPN setting. The SA56203S SA56203S has a clamp incorporated on the spindle driver supply voltage for protecting the IC against this overvoltage. Upon detection of reverse rotation all U, V and W driver outputs are connected to VDD(SPN). This short brake prevents the motor from spinning backwards. 7.3 Internal regeneration of back EMF spindle motor The spindle motor driver uses the information from the Hall sensors to internally regenerate the back EMF of the motor (see Figure 4). ANALOG DOMAIN VINSPN torque control signal RLIM maximum motor current REMF motor k-factor DIGITAL DOMAIN VRI = Rm × Im A VMOT = VRI + VEMF PWM D U V W spindle motor VEMF = × k A D SPEED Hall U Hall V Hall W A D 001aaa438 Fig 4. Regeneration of back EMF voltage spindle motor Rotational speed is derived from the Hall event frequency. Multiplying with the k-factor of the motor gives the back EMF voltage VEMF. This VEMF is added to the current-limited scaled spindle input voltage VVINSPN. This sum VMOT steers the PWM outputs U, V and W. The result is that the input voltage VVINSPN represents the current through the motor. This explains how the SA56203S SA56203S spindle motor driver exhibits a current control transfer function without using external sense resistors. The simplified motor schematic in Figure 5 shows the series resistance and back EMF voltage of the motor. 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 7 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver VM1 VRM VEMF 2 VEMF 2 VRM VM2 001aaa450 Fig 5. Simplified spindle motor schematic Figure 6 shows the motor voltages VM1 and VM2 during accelerating and braking. The back EMF voltage is part of these motor voltages. VM1 VDD(SPN) VEMF 2 VRM VM2 VDD(SPN) 2 0 k max VEMF 2 VRM 0 VM1 VM2 0 accelerating braking 001aaa432 Fig 6. Motor voltages when accelerating and braking with constant motor current 7.4 Sine generation using True-Silent signals For the phase relation between the Hall inputs and the spindle outputs in forward rotation, see Figure 7. These are the signal shapes in sine mode using our True-Silent PWM technology. The particular shape of the 120° symmetrical U, V and W steering voltages are because of improved drive strength and improved power efficiency. The drive strength is improved because with this signal shape a 15 % larger sine can be fit within the supply rails compared to direct-written sine signals. Also the power efficiency is improved because this signal shape has 33 % less switching losses compared to a direct-written sine. The result is that the motor currents (and motor torques) are pure sine waves generated in such a way that the motor is driven optimally silent, optimally power efficient and with maximum driving strength. 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 8 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver HALL U HALL W HALL V U(V) U U(I) V(V) V V(I) W(V) W W(I) 001aaa433 Fig 7. Phase relation between Hall input signals and spindle motor driver output voltages U(V), V(V), W(V) and motor currents U(I), V(I), W(I) in forward rotation mode 7.5 Programming RLIM If the supply is connected between the terminals of a non-running spindle motor, then usually a current will flow that is too large. The motor current can be limited to a value ILIM. ILIM can be programmed by means of RLIM. In order to calculate the required RLIM first a typical maximum motor current IMAX needs to be determined: V DD ( SPN ) I MAX = -R motor + R switches + R wiring 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 9 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver ILIM can be chosen to be a fraction of this maximum current IMAX. By making the ratio between RLIM and RREF this same fraction, ILIM is programmed as expressed in the R LIM following formula: I LIM = - × I MAX R REF Figure 8 shows the limit current as a function of RLIM with RREF = 47 k. 001aaa434 100 ILIM (% of IMAX) 80 60 40 20 0 0 10 20 30 40 50 R LIM (k) Fig 8. Limit current ILIM as a function of external resistor RLIM During accelerating and braking the motor current will not exceed ILIM. ILIM also sets the I LIM transconductance gain, g m = - of the spindle driver. V VINREF 7.6 Programming REMF The back EMF voltage is internally regenerated. The ratio between REMF and RREF is used to scale the internal EMF regeneration. The value of external resistor REMF depends on the type of motor (k-factor and number of pole pairs NPP) and the motor supply voltage VDD(SPN). The following formula should be used to determine the REMF resistor: 3 k × 2.6 × 10 × R REF R EMF = - with k in units Nm/A. N PP × V DD ( SPN ) 7.7 Frequency generator The raw zero-crossings of the Hall sensors are first filtered and debounced before being passed to the Frequency generator (FG). The FG toggles its output at every filtered Hall zero-crossing. For three Hall sensors this means that the motor frequency is linked to the FG FG frequency by: f motor = -3 × N PP where NPP indicates the number of pole pairs of the motor. The FG has an open-drain output for easy interfacing to 3 V and 5 V logic. 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 10 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 7.8 Sled motor driver Two current steering channels are available to drive a stepper motor. Per channel an external sense resistor Rsense is used that is connected to VDD(SLD). A peak-current control loop is implemented that modulates the duty cycle of the PWM signal (see Figure 9). Rsense VDD(SLD) RSLD 47 k VINSLD 47 k + A - IRSLD SLDO+ R Q S LOGIC DRIVE DRIVER M SLDO- VVINREF input amplifier CLOCK IO 001aab483 VSS(SLD) Fig 9. Peak-current control architecture of sled motor driver f osc The clock generator has a nominal frequency of - = 70 kHz. See Figure 10, transfer 256 function from input voltage VVINSLD to output current at a typical Rsense of 0.5 . Input-to-output transconductance gain can be scaled down by connecting external resistor Rext in series with the input VINSLD. IOUT (A) 1A dead zone VVINSLD - VVINREF (V) -30 mV +1 A/V 30 mV +1 A/V -1 A 001aaa436 Fig 10. Transfer function of sled motor driver Both limiting current and transconductance gain are related to Rsense in the following way: Io 1 Transconductance gain: g m = - = -V in 2 × R sense 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 11 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 1 Limiting current: I LIM = -2 × R sense 7.9 Loading motor driver One of the linear channels is available to drive a DC loading motor. Pin VDD(LD) is used to set the supply voltage for the loading motor driver. The following voltage-steering bridge topology is implemented in the SA56203S SA56203S. 188 k 47 k 47 k LDO- 47 k 47 k VINLD 188 k R 23.5 k VDD(LD) 188 k R 47 k VINREF LDO+ 47 k 188 k 001aab246 Fig 11. Voltage steering bridge topology of linear driver 7.10 Actuator motor drivers Three linear channels are available to drive 3D actuators: focus, tracking and tilt. Pin VDD(ACT) is used to set the supply voltage for the focus and tilt actuators (maximum 5.5 V). A separate pin VDD(TRK) sets the supply voltage for the tracking actuator (maximum 14 V). The voltage-steering bridge topology is the same as depicted in Figure 11. 7.11 Charge pump The on-board charge pump generates a voltage of typically 18.2 V by using the VDD(SPN) supply voltage. This boosted voltage is used to turn on the upper n-type DMOS transistors of the output stages of the spindle driver, sled driver, loading driver and actuator drivers. Recommended values for the pump and hold capacitor are 10 nF and 22 nF respectively (see default settings). The charge pump should not be loaded with other components or circuitry other than these capacitors. 7.12 Thermal protection If the junction temperature of the SA56203S SA56203S exceeds 150 °C, then a thermal warning signal is given at pin TEMP. Pin TEMP has an active-LOW open-drain output for easy interfacing to the 3 V and 5 V logic. The temperature hysteresis for the thermal warning is 20 °C. If the junction temperature of the IC rises to 160 °C, then a thermal shutdown is activated that sets all power outputs in 3-state. The temperature hysteresis for the thermal 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 12 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver shutdown is 30 °C. As soon as the thermal shutdown deactivates at 130 °C, all motor drivers continue normal operation. At the same time the thermal warning signal is deactivated. 7.13 Oscillator The RC oscillator uses two external components (RREF and COSC) to fix its frequency at 18 MHz. RREF is used to generate a reference current. This reference current is used to charge and discharge COSC. The nominal oscillation frequency fosc is 18 MHz with RREF = 47 k (2 % tolerance) and COSC = 70 pF (5 % tolerance). These values are fixed. The oscillator can be overruled by applying an 18 MHz clock to pin COSC. The reference current derived from RREF is also used for RLIM and REMF. RREF should always be connected. 7.14 Muting Functions Pins CTL1 and CTL2 are used to mute certain parts of the IC; see Table 3. Table 3: Muting functions [1] CTL1 CTL2 Loading motor Sled motor Focus tilt Tracking Spindle motor Special L L off off off off off standby L H on off off off off FG and Hall bias on; pin VLDTRK for loader motor H L off on off off on all actuators off; pin VLDTRK for tracking actuator H H off on on on on spindle, sled and all actuators on [1] Off equals 3-state. 8. Internal circuitry Table 4: Symbol Internal circuitry Pin Equivalent circuit Hall amplifiers HU+ 1 HU- 2 HV+ 4 HW+ 5 HW- 6 VSSA 2, 4, 6 3 HV- 1, 3, 5 19 19 001aab696 Hall bias HBIAS 7 VSSA 19 7 off when standby (CTL1 and CTL2 = LOW) 19 9397 750 14192 Preliminary data sheet 001aab697 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 13 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 4: Symbol Internal circuitry .continued Pin Equivalent circuit Current reference RREF 8 REMF 9 RLIM 10 VSSA 19 VDDA 22 22 1.65 V 8 9 10 19 001aab698 Spindle motor driver VSS1(SPN) 11 U 12 VDD1(SPN) 13 V 14 VSS2(SPN) 15 W 16 VDD2(SPN) 17 13, 17 12 14 11, 15 16 001aab699 Frequency generator FG 18 VSSA 19 18 19 001aab700 Spindle input VSSA 19 VINSPN 20 VINREF 21 20 21 500 k 19 001aab701 Charge pump VDD1(SPN) 13 VDD2(SPN) 17 VSSA 19 CP1 23 CP2 24 CP3 25 13, 17 24 23 170 k 12 k 19 9397 750 14192 Preliminary data sheet 25 001aab702 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 14 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 4: Internal circuitry .continued Symbol Pin Equivalent circuit Control VSSA 19 CTL1 26 CTL2 27 to mute table 26 27 19 001aab703 Temperature warning VSSA 19 TEMP 28 28 temperature above 150 °C 19 001aab704 Sled inputs VSSA 19 VINREF 21 VINSLD1 29 VINSLD2 30 47 k 47 k 29, 30 21 19 001aab705 VLDTRK output VSSA 19 VDDA 22 VLDTRK 31 22 150 31 19 001aab706 Sled motor driver VSS(SLD) 32 SLDO2- 33 SLDO2+ 34 RSLD2 35 SLDO1- 36 SLDO1+ 37 RSLD1 38 35 38 33 32 34 001aab707 36 32 37 001aab708 Linear motor drivers TLTO- 40 TLTO+ 41 FCSO- 42 FCSO+ 43 VDD(ACT) 44 VSS(ACT) 45 44 44 40 45 41 001aab709 9397 750 14192 Preliminary data sheet 42 45 43 001aab710 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 15 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 4: Internal circuitry .continued Symbol Pin VSS(ACT) 45 TRKO- 46 TRKO+ 47 LDO- 48 LDO+ 49 VDD(TRK) 50 VDD(LD) Equivalent circuit 51 50 51 47 46 45 48 45 001aab711 49 001aab712 Linear inputs VSSA 19 VINREF 21 VINTLT 52 VINFCS 53 VINTRK 54 VINLD 55 47 k 47 k 52, 53, 54, 55 21 19 001aab713 Oscillator VSSA 19 VDDA 22 COSC 56 22 56 19 001aab714 9. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD1(SPN), VDD2(SPN) Conditions Min Max Unit spindle driver supply voltage -0.5 +16 V VDD(SLD) sled driver sense supply -0.5 +16 V VDD(LD) loading driver supply voltage -0.5 +16 V VDD(TRK) tracking driver supply voltage -0.5 +16 V VDD(ACT) focus/tilt drivers supply voltage -0.5 +6.5 V VDDA analog supply voltage -0.5 +6.5 V Tstg storage temperature -55 +150 °C Tamb operating temperature range -40 +85 °C Tj junction temperature -40 +160 °C IO(SPN) spindle output current, pins 12, 14 and 16 - 2.1 A 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 16 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 5: Limiting values .continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter IO(SLD) Conditions Min Max Unit sled output current, pins 33, 34, 35, 36, 37 and 38 - 1.2 A IO(ACT) loading/actuator drivers output current, pins 40, 41, 42, 43, 46, 47, 48 and 49 - 2.0 A IHall Hall current on pins 1, 2, 3, 4, 5 and 6 -1 +1 mA IHBIAS Hall bias current on pin HBIAS -1 +100 mA IRPROG current on external resistor pins 8, 9 and 10 -1 +1 mA IO(n) current on pins 18, 28 and 31 -1 +10 mA IDIG driver logic control current on pins 26 and 27 -1 +1 mA ICPUMP charge pump current on pins 23, 24 and 25 -20 +20 mA ISTEER steering current on pins 20, 21, 29, 30, 52, 53, 54 and 55 -1 +1 mA ICOSC current on pin COSC -20 +20 mA Vesd electrostatic discharge voltage human body model - 1000 V machine model - 100 V human body model - 2000 V machine model - 200 V pins 23, 40 to 44 and 51 all other pins 10. Recommended operating conditions Table 6: Recommended operating conditions Symbol Parameter VDD1(SPN), VDD2(SPN) Conditions Min Typ Max Unit spindle driver supply VDD1(SPN) = voltage VDD2(SPN) 4.5 12 14 V VDDA analog supply voltage 4.5 5.0 5.5 V VDD(SLD) sled driver sense supply 4.5 12 14 V VDD(ACT) focus/tilt drivers supply voltage 4.5 5 5.5 V VDD(TRK) tracking driver supply voltage 4.5 12 14 V VDD(LD) loading driver supply voltage 4.5 12 14 V 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 17 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 11. Thermal characteristics Table 7: Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; multilayer printed-circuit board 33 K/W 001aaa428 4 P (W) 3 2 1 0 0 50 100 150 Tamb (°C) Fig 12. Maximum power dissipation as a function of ambient temperature 12. Characteristics Table 8: Characteristics VDDA = 5 V; VDD1(SPN) = VDD2(SPN) = 12 V; VDD(SLD) = 12 V; VDD(TRK) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; Tamb = 25 °C; all characteristics are specified for the default settings (see Table 9); all voltages are referenced to VSS; positive currents flow into the device; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 2 3 5 mA Supplies: pins VDD1(SPN), VDD2(SPN), VDDA, VDD(ACT), VDD(SLD), VDD(LD), VDD(TRK) IDD(SPN) spindle driver supply current IDD1(SPN) + IDD2(SPN) IDDA analog supply current 14 16 18 mA IDD(SLD) sled driver supply current - 1 1.5 mA IDD(ACT) focus/tilt drivers supply current - 19 26 mA IDD(TRK) tracking driver supply current 2 4 6 mA IDD(LD) loading driver supply current CTL2 = H 2 4 6 mA Istb(tot) total standby current CTL1 = CTL2 = L - 6 9 mA VDDA(POR) power-on reset voltage on VDDA - 3.5 - V 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 18 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 8: Characteristics .continued VDDA = 5 V; VDD1(SPN) = VDD2(SPN) = 12 V; VDD(SLD) = 12 V; VDD(TRK) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; Tamb = 25 °C; all characteristics are specified for the default settings (see Table 9); all voltages are referenced to VSS; positive currents flow into the device; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - 18.7 - V Charge pump: pin CP3 VO output voltage Spindle motor driver: pins HU+, HV+, HW+ HU-, HV-, HW-, HBIAS, RREF, REMF, RLIM, U, V, W FG, VINSPN, VINREF and COSC -3.5 - +3.5 mV 0 - VDDA V - 0.6 - V - 18 - MHz PWM frequency on pins U, V and W - 70 - kHz Rds(on) D-MOSFET on-resistance I = 100 mA (high or low) - 0.35 - VVINREF input voltage range on reference pin VINREF 1.2 1.65 2.5 V VVINSPN input voltage range on torque control pin VINSPN 0 - VDDA V IU, IV, IW spindle motor current limit see Figure 3; Rswitches + Rmotor + Rwiring = 2.5 ; VVINSPN = 0 V and 3.3 V [2] - 2.0 - A gm(SPN) transconductance gain spindle [3] - 1.24 - A/V VIO input offset voltage Hall amplifier Vi voltage on pin HBIAS fosc oscillator frequency on pin COSC fPWM [1] input voltage range Hall amplifier VHBIAS VHU- = VHV- = VHW- = 1.65 V IHBIAS = 32 mA see Figure 3; Rswitches + Rmotor + Rwiring= 2.5 ; VVINSPN = 0 V and 3.3 V Sled motor driver: pins RSLD1, SLDO1+, SLDO1-, RSLD2, SLDO2+, SLDO2-, VINSLD2 and VINSLD1 ISLDO motor current limit fPWM PWM frequency on pins SLDO1+, SLDO1-, SLDO2+ and SLDO2- Vi(trip) Rsense = 0.5 ; VVINSLD = 0 V and 3.3 V input dead zone trip level - [4] [5] gm transconductance gain Rds(on) D-MOSFET on-resistance I = 100 mA; VVINSLD = 0 V (high or low) and 3.3 V - A - [4] 1.0 70 - kHz 15 30 45 mV 0.60 0.75 0.90 A/V - 1.0 - 0.85 1.0 1.5 A -100 0 +100 mV 17.2 18.0 18.8 dB - 0.7 1.0 Loading motor driver: pins VINLD, LDO+ and LDO- ILDO current limit (high or low) CTL1 = L; RL = 4 ; VVINLD = 0 V and 3.3 V VOO output offset voltage CTL1 = L; no load GV voltage gain CTL1 = L; no load Rds(on) D-MOSFET on-resistance CTL1 = L; I = 100 mA; VVINLD = 0 V (high or low) and 3.3 V 9397 750 14192 Preliminary data sheet [6] © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 19 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 8: Characteristics .continued VDDA = 5 V; VDD1(SPN) = VDD2(SPN) = 12 V; VDD(SLD) = 12 V; VDD(TRK) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; Tamb = 25 °C; all characteristics are specified for the default settings (see Table 9); all voltages are referenced to VSS; positive currents flow into the device; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1.0 1.5 2.0 A -70 0 +70 mV 17.2 18.0 18.8 dB - 0.7 1.0 Tracking actuator driver: pins VINTRK, TRKO+ and TRKO- ITRKO current limit RL = 4 ; VVINTRK = 0 V and 3.3 V VOO output offset voltage no load [7] GV voltage gain tracking driver Rds(on) D-MOSFET on-resistance I = 100 mA; VVINTRK = 0 V or 3.3 V (high or low) Focus and tilt actuator drivers: pins VINFCS, VINTLT, FCSO+, FCSO-, TLTO+ and TLTO- IFCSO, ITLTO current limit VOO output offset voltage RL = 4 ; VVINFCS = 0 V or 3.3 V; VVINTLT = 0 V or 3.3 V 1.0 1.5 2.0 A -55 GV voltage gain focus/tilt drivers [7] Gv(m) gain mismatch between focus and tilt drivers [8] Rds(on) MOSFET on-resistance (high or low) I = 100 mA; VVINFCS = 0 V or 3.3 V; VVINTLT = 0 V or 3.3 V 0 +55 mV 11.2 12 12.8 dB 0 - 5 % - no load 0.6 0.9 Voltage output loader/tracking actuator: pin VLDTRK GR transresistance gain of current loading motor CTL1 = L; ILDO = 250 mA; RL = 4 1.3 1.5 1.7 V/A VOO output offset transresistance amplifier CTL1 = L; no load -100 0 +100 mV GV voltage gain of back EMF voltage tracking actuator CTL2 = L 29.2 30.0 30.8 dB VOO output offset back EMF amplifier CTL2 = L; RL = 4 -250 0 +250 mV VO(CM) common mode output voltage - VVINREF - V RO output resistance [9] - 150 - - I = 0.1 mA IO(source/sink) source and sink current drive capability - 0.3 mA Digital inputs and outputs Inputs: pins CTL1 and CTL2 VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.8 V - - 0.5 V Outputs: pins FG and TEMP VOL LOW-level output voltage I = 2 mA 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 20 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 8: Characteristics .continued VDDA = 5 V; VDD1(SPN) = VDD2(SPN) = 12 V; VDD(SLD) = 12 V; VDD(TRK) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; Tamb = 25 °C; all characteristics are specified for the default settings (see Table 9); all voltages are referenced to VSS; positive currents flow into the device; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Temperature protection: pin TEMP TTEMP thermal warning temperature - 150 - °C Thys(TEMP) thermal warning hysteresis - 20 - °C TSD thermal shutdown temperature - 160 - °C Thys(SD) thermal shutdown hysteresis - 30 - °C [1] The recommended minimum Hall amplifier differential input voltage is 25 mV (p-p). [2] The motor current limit of the spindle is tested by applying VINSPN = 0 V and 3.3 V, measuring the duty cycles on the U, V and W spindle driver outputs and calculating the corresponding motor currents with the applied 12 V supply voltage and the 2.5 motor, switches and wiring resistance. [3] The transconductance gain of the spindle is tested by applying VINSPN = 0 V and 3.3 V and calculating the corresponding motor currents (see Table note 2) and determining the slope (see Figure 3). [4] The sled motor is tested loaded with RL = 4 in series with LL = 1 mH. [5] The transconductance gain of the sled motor driver is tested as: gm = {(ISLDO- at VVINSLD = 1.85 V) - (ISLDO- at VVINSLD = 1.45 V)}/0.4 V. [6] The voltage gain of the loading motor driver is tested as: GV = {(VLDO+ - VLDO- at VVINLD = 2.4 V) - (VLDO+ - VLDO- at VVINLD = 0.9 V)}/1.5 V. [7] The voltage gain of the actuator driver is tested as: GV = {(VACTO+ - VACTO- at VVINACT = 2.4 V) - (VACTO+ - VACTO- at VVINACT = 0.9 V)}/1.5 V. [8] The gain mismatch is related to the absolute gain; an absolute gain of 8 (18 dB) corresponds with a maximum mismatch of 0.4 (5 %) and an absolute gain of 4 (12 dB) corresponds with a maximum mismatch of 0.2 (5 %). [9] The voltage gain of the back EMF voltage tracking actuator is tested as: GV = {(VVLDTRK at VTRKO+ = 1.03 V and VTRKO- = 1.00 V) - (VVLDTRK at VTRKO+ = 1.00 V and VTRKO- = 1.03 V)}/0.06 V. Table 9: Default settings Pin Default setting HU+, HV+ 5V HW+ ground HU-, HV-, HW- 1.650 V HBIAS open-circuit RREF 47 k to VSS, fixed value, should not be changed REMF 12 k to VSS RLIM 20 k to VSS VSS1(SPN), VSS2(SPN) ground U, V, W open-circuit VDD1(SPN), VDD2(SPN) 12 V supply FG open-circuit VSSA ground VINSPN, VINREF 1.65 V VDDA 5 V supply 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 21 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver Table 9: Default settings .continued Pin Default setting CP1, CP2 10 nF between CP1 and CP2 CP3 22 nF to ground CTL1, CTL2 5V TEMP open-circuit COSC 70 pF to ground, fixed value, should not be changed VINLD, VINTRK, VINFCS, VINTLT 1.65 V VDD(LD), VDD(TRK) 12 V supply LDO+, LDO-, TRKO+, TRKO- open-circuit VSS(ACT) ground VDD(ACT) 5 V supply FCSO+, FCSO-, TLTO+, TLTO- open-circuit VDD(SLD) 12 V supply RSLD1 0.5 sense resistor to VDD(SLD) SLDO1+, SLDO1- open-circuit RSLD2 0.5 sense resistor to VDD(SLD) SLDO2+, SLDO2- open-circuit VSS(SLD) ground VLDTRK open-circuit VINSLD2, VINSLD1 1.65 V 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 22 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 13. Application information 5V 150 1 HALL U REVERSE DETECTION 2 3 HALL V HALL AMP 4 FG 56 OSCILLATOR 55 54 53 52 51 50 49 6 7 0 V RREF(1) 47 k HALL BIAS 47 k LEVEL SHIFT 8 REMF (2) 9 10 RLIM 0V VINREF CURRENT REFERENCE 12 V 45 0V LEVEL SHIFT VINREF 47 k 3.3 V 0V spindle input 1.65 V 18 VINREF 12 V 38 SA56203S SA56203S FG sled motor 37 20 M ADC VINREF 36 35 SLED LOGIC 34 22 33 23 10 nF 24 22 nF 25 32 CHARGE PUMP 31 47 k 26 MUTE/ SELECT 27 47 k MUTE/ STANDBY FUNCTIONS 30 0V VLDTRK sled in2 VINREF 28 3.3 V tilt actuator 40 39 500 k 5V LEVEL SHIFT 19 21 focus actuator 41 47 k 17 5V 42 15 16 12 V 0V 43 47 k SPINDLE LOGIC loading motor tracking actuator 46 44 14 tilt in 12 V 12 V 47 LEVEL SHIFT VINREF 13 focus in M 12 spindle motor loading motor in tracking in 48 47 k 11 0V THERMAL SHUTDOWN 5 HALL W 70 pF 47 k 29 sled in1 VINREF 001aac123 (1) For REMF values see Section 7.6. (2) For RLIM values see Section 7.5. Fig 13. Application diagram 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 23 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 14. Package outline HTSSOP56 HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad D SOT793-1 A E X c y exposed die pad v M A HE Dh Z 56 29 (A 3) A A2 Eh A1 pin 1 index Lp L detail X 1 28 w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) Dh E (2) Eh e HE L Lp v w y Z (1) mm 1.2 0.15 0.05 1.05 0.80 0.25 0.27 0.17 0.20 0.09 14.1 13.9 4.3 4.1 6.2 6.0 4.3 4.1 0.5 8.3 7.9 1 0.8 0.4 0.2 0.08 0.1 0.4 0.1 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT793-1 143E36T 143E36T MO-153 MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 03-03-04 Fig 14. Package outline SOT793-1 (HTSSOP56 HTSSOP56) 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 24 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 15. Soldering 15.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 15.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: · below 225 °C (SnPb process) or below 245 °C (Pb-free process) ­ for all BGA, HTSSON.T and SSOP.T packages ­ for packages with a thickness 2.5 mm ­ for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. · below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 15.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: · Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. · For packages with leads on two sides and a pitch (e): ­ larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 25 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver ­ smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. · For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 15.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 15.5 Package related soldering information Table 10: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON.T [3], LBGA, LFBGA, SQFP, SSOP.T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN.L [8], PMFP [9], WQCCN.L [8] not suitable LQFP, QFP, TQFP not suitable [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026 AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 26 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 27 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 16. Revision history Table 11: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes SA56203S SA56203S_1 20050131 Preliminary data sheet - 9397 750 14192 - 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 28 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 17. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 18. Definitions 19. Disclaimers Short-form specification - The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support - These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition - Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information - Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes - Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 14192 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 31 January 2005 29 of 30 SA56203S SA56203S Philips Semiconductors One-chip motor driver 21. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 15.5 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Spindle motor control . . . . . . . . . . . . . . . . . . . . 6 Spindle brake . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Internal regeneration of back EMF spindle motor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Sine generation using True-Silent signals. . . . . 8 Programming RLIM . . . . . . . . . . . . . . . . . . . . . . 9 Programming REMF . . . . . . . . . . . . . . . . . . . . . 10 Frequency generator. . . . . . . . . . . . . . . . . . . . 10 Sled motor driver . . . . . . . . . . . . . . . . . . . . . . 11 Loading motor driver. . . . . . . . . . . . . . . . . . . . 12 Actuator motor drivers . . . . . . . . . . . . . . . . . . 12 Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal protection . . . . . . . . . . . . . . . . . . . . . 12 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Muting Functions . . . . . . . . . . . . . . . . . . . . . . 13 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16 Recommended operating conditions. . . . . . . 17 Thermal characteristics. . . . . . . . . . . . . . . . . . 18 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 18 Application information. . . . . . . . . . . . . . . . . . 23 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 25 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 26 Package related soldering information . . . . . . 26 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 29 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Contact information . . . . . . . . . . . . . . . . . . . . 29 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 31 January 2005 Document number: 9397 750 14192 Published in The Netherlands