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| Part Number | Manufacturer | Description | ||||||
| 1. | Micro Electronics | Semiconductor Device Data Book | 48.43 Kb | 1 Pg. | ||||
| 2. | Micro Electronics | Misc. Data Book Scans 1975/76 | 28.97 Kb | 1 Pg. | ||||
| 3. | Micro Electronics | Bridge Rectifiers / Rectifiers | 98.5 Kb | 1 Pg. | ||||
| 4. | Para Light Electronics Co., Ltd. | LCD Back Light Tab Type (8.0x64.0mm L-6S4VY2C) | 122.94 Kb | 1 Pg. | ||||
| 5. | Para Light Electronics Co., Ltd. | LCD Back Light Tab Type (8.0x123.2mm L-6S4VY2C) | 122.94 Kb | 1 Pg. | ||||
| 6. | Para Light Electronics Co., Ltd. | LCD Back Light Tab Type (21.0x78.0mm L-454VY2C) | 113.15 Kb | 1 Pg. | ||||
| 7. | Para Light Electronics Co., Ltd. | LCD Back Light Tab Type (21.0x152.0mm L-454VY2C) | 113.15 Kb | 1 Pg. | ||||
| 8. | Cooper Bussmann | Fuse: 250mA: 125V: Solderable: Plug | 19.81 Kb | 1 Pg. | ||||
| 9. | Electro-Optical Systems, Inc. | VIS-NIR PHOTODIODE | 100.01 Kb | 1 Pg. | ||||
| 10. | Electro-Optical Systems, Inc. | Receiver Module | 112.34 Kb | 1 Pg. |
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| 1. | 196.94 Kb • 1 Pages |
Abstract: ... S02/5/10. Maximum Junction Temperature Range Tj. T(STG) 85.0. 1151. Maximum I 2T for Fusing 8.3ms I 2 T. Volt. Unit. Amp. Amp. OC. OC. A2/S 5523. -40 to +125. -40 to +150. μA. Thermal Resistance (Junction to Case) ... Labels: S02 |
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| 2. | 196.95 Kb • 1 Pages |
Abstract: ... S02/5/10. Maximum Junction Temperature Range Tj. T(STG) 70.0. 730. Maximum I 2T for Fusing 8.3ms I 2 T. Volt. Unit. Amp. Amp. OC. OC. A2/S 2240. -40 to +125. -40 to +150. μA. Thermal Resistance (Junction to Case) ELECTRICAL ... Labels: S02 |
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| 3. | 104.78 Kb • 2 Pages |
Abstract: ... Option S02 consists of devices which are selected to two Iv categories. All color bins of the base parts (yellow and green devices) fulfill the color requirements of these products. Option S22 ... Labels: S02 |
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| 4. | 196.94 Kb • 1 Pages |
Abstract: ... S02/5/10. Maximum Junction Temperature Range Tj. T(STG) 40.0. 420. Maximum I 2T for Fusing 8.3ms I 2 T. Volt. Unit. Amp. Amp. OC. OC. A2/S 730. -40 to +125. -40 to +150. μA. Thermal Resistance (Junction to Case) ELECTRICAL ... Labels: S02 |
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| 5. | 85.22 Kb • 2 Pages |
Abstract: ... Option S02 consists of devices which are selected to two Iv categories. All color bins of the base parts (yellow and green devices) fulfill the color require-ments of these products. Option S20 ... Labels: S02 |
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| 6. | 17.01 Kb • 3 Pages |
Abstract: ... 7 - t rr code: S02 = 60 nsec 6. 8 - CB = Probed Uncut Die (wafer in box) None = Probed Die in chip carrier. 4. Device Code. Ordering Information Table. 5 67. Outline Table. All dimensions are in microns (mils) ... Labels: S02 |
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| 7. | 48.63 Kb • 3 Pages |
Abstract: ... 7 - T rr code: S02 = 200 nsec 8 - CB = Probed Uncut Die (wafer in box) None = Probed Die in chip carrier. 4. Device Code. Ordering Information Table. 5 67. Outline Table. All dimensions are in microns. Available ... Labels: S02 |
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| 8. | 15.85 Kb • 3 Pages |
Abstract: ... 7 - T rr code: S02 = 200 nsec 8 - CB = Probed Uncut Die (wafer in box) None = Probed Die in chip carrier. 4. Device Code. Ordering Information Table. 5 67. Outline Table. All dimensions are in microns. Available ... Labels: S02 |
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| 9. | 16.55 Kb • 3 Pages |
Abstract: ... 7 - t rr code: S02 = 55 nsec 6. 8 - CB = Probed Uncut Die (wafer in box) None = Probed Die in chip carrier. 4. Device Code. Ordering Information Table. 5 67 8. Preliminary Data Sheet I0127J 09/97. Outline Table ... Labels: S02 |
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| 10. | 120.79 Kb • 3 Pages |
Abstract: ... H2S (3ppm) and S02 (10ppm) 40° 75% RH. Application. Examples. Pay Television. Electronic Purse Value Checkers & Balance Reader. EFTPoS Pin Pads. Hand Held Data Collection Terminals. ... Labels: S02 |
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